CN102427918B - 剃刀刀片涂层 - Google Patents

剃刀刀片涂层 Download PDF

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Publication number
CN102427918B
CN102427918B CN201080021152.XA CN201080021152A CN102427918B CN 102427918 B CN102427918 B CN 102427918B CN 201080021152 A CN201080021152 A CN 201080021152A CN 102427918 B CN102427918 B CN 102427918B
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China
Prior art keywords
film
nitride
dusts
matrix
razor blade
Prior art date
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Expired - Fee Related
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CN201080021152.XA
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English (en)
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CN102427918A (zh
Inventor
K·J·斯克罗比斯
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Gillette Co LLC
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Gillette Co LLC
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26BHAND-HELD CUTTING TOOLS NOT OTHERWISE PROVIDED FOR
    • B26B21/00Razors of the open or knife type; Safety razors or other shaving implements of the planing type; Hair-trimming devices involving a razor-blade; Equipment therefor
    • B26B21/54Razor-blades
    • B26B21/58Razor-blades characterised by the material
    • B26B21/60Razor-blades characterised by the material by the coating material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26BHAND-HELD CUTTING TOOLS NOT OTHERWISE PROVIDED FOR
    • B26B21/00Razors of the open or knife type; Safety razors or other shaving implements of the planing type; Hair-trimming devices involving a razor-blade; Equipment therefor
    • B26B21/40Details or accessories
    • B26B21/4068Mounting devices; Manufacture of razors or cartridges
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
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    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/16Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
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    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
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    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58After-treatment
    • C23C14/5846Reactive treatment
    • C23C14/586Nitriding
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    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
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    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
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    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
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    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
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    • C23C28/34Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
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    • C23C8/00Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/06Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
    • C23C8/08Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
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Abstract

本发明公开了一种包括具有切刃的基质的剃刀刀片,所述基质包括:(a)设置在所述基质上的第一材料薄膜,所述薄膜具有小于1μm的厚度;(b)设置在所述薄膜的表面和所述基质的表面处或附近的氮化物-薄膜间混区;和(c)邻近所述氮化物-薄膜间混区设置的氮化物区。

Description

剃刀刀片涂层
技术领域
本发明涉及用于涂覆剃刀刀片的改进方案。
背景技术
为了改善基质的化学和机械特性例如硬度、抗磨损性、耐腐蚀性和抗疲劳性,一般实施是用金属对基质进行电镀,并且随后在电镀基质上形成氮化物区。然而,这些方法中的大多数在基质的表面上产生厚涂层并且不渗入到基质中。这导致基质表面粗糙以及脆性明显,因为形成了副产品生长或小丘。在剃刀刀片上利用这些方法实际上不增大剃刀刀片的强度,而是产生脆的切刃。如果切刃在剃刀刀片上折断,则余下的剃刀刀片将产生极不舒适的剃刮。
存在着对于克服这些缺点的改进的涂覆剃刀刀片和用于涂覆剃刀刀片的方法的需求。因此,本发明有利地允许第一材料的种类、组成和厚度容易被改变和控制,其加强下面的剃刀刀片并降低其脆性。本文所述的方法将极大地减小或消除在剃刀刀片表面上的严重粗化和/或副产品生长。此外,这些方法允许氮化处理集中在特定区域中或整个剃刀刀片。继而,这些方法也提供更可控的和更深氮化处理的剃刀刀片(垂直地和横向地),以及更平缓的氮化梯度,从而导致剃刀刀片具有光滑的切刃,表现出增大的硬度、强度和耐久性。
发明内容
在一方面,本发明涉及一种包括具有切刃的基质的剃刀刀片,所述基质包括:(a)设置在所述基质上的第一材料薄膜,所述薄膜具有小于1μm的厚度;(b)设置在薄膜的表面和基质的表面处或附近的氮化物-薄膜间混区;和(c)邻近氮化物-薄膜间混区设置的氮化物区。
在另一方面,本发明涉及一种用于涂覆剃刀刀片的方法,所述方法包括以下步骤:(a)提供包括切刃的基质;(b)通过薄膜工艺在所述基质上施用第一材料薄膜,其中所述薄膜在被施用后具有小于1μm的厚度;(c)用含氮气体或等离子体氮化处理所述薄膜和所述基质以形成(1)设置在薄膜表面和基质表面处或附近的氮化物-薄膜间混区,和(2)邻近氮化物-薄膜间混区设置的氮化物区。
通过该说明书和附图并通过所述权利要求书,本发明的其它特征和优点将显而易见。所述附图因此是艺术概念上的再现,它们未按比例绘制,而是以将展示正在讨论的特征的方式进行绘制。
附图说明
图1是根据本发明的具有包括所施用的第一材料薄膜的切刃的剃刀刀片的图解视图;
图2是根据本发明的还包括氮化物-薄膜间混区、氮化物区和氮化物-基质间混区的图1的剃刀刀片的图解视图;
图3是根据本发明的还包括第二材料的图2的剃刀刀片的图解视图;
图4是根据本发明的还包括含氟聚合物涂层的图2的剃刀刀片的图解视图;
图5是根据本发明的还包括含氟聚合物涂层的图3的剃刀刀片的图解视图;
图6是根据本发明的用于施用第一材料、第二材料和/或含氟聚合物涂层的一种示例性设备的图解视图。
具体实施方式
如本文所用,术语“涂层”是指包括自由膜、浸渍等的覆盖物,其被施用到物体或基质上,使得覆盖物可为连续的、不连续的,可具有单一的厚度或可变的厚度,或可存在于单个平面中或多个平面中。
如本文所用,术语“薄膜”是指在被施用后具有小于1μm厚度的材料涂层。可通过薄膜工艺将薄膜施用到基质上。如本文所用,术语“薄膜工艺”是描述多种工艺例如纳米涂层工艺、陶瓷涂层工艺、物理气相沉积(PVD)工艺、化学气相沉积(CVD)工艺、离子辅助涂层工艺、旋涂工艺、浸渍工艺、涂装工艺、外延生长工艺等,但不包括电沉积、电化学镀层、电镀和电化学沉积,因为后面的这些工艺产生厚得多的涂层并且在氮化处理时不允许氮化物扩散或渗透进基质中。
图1-6显示包括具有切刃(12)的基质(10)的剃刀刀片(8)。在一个实施方案中,基质(10)可包括诸如不锈钢、铝、钛或其它合适的基质材料的材料。AISI 440是特别适合的不锈钢基质材料。本发明并不限于剃刀刀片(8)。例如,基质(10)可表现为钻头、刀具、铣刀、刀头、外科器械等形式。
在图1中,基质(10)包括通过薄膜工艺设置在基质(10)上一般在切刃(12)上的第一材料薄膜(14),使得所述薄膜(14)在被施用后具有小于1μm的厚度。例如,薄膜(14)可具有从约10、20、50、75、90、110、125、140、155、170、185、195、200、215、225或235埃至约265、280、295、310、325、340、355、370、385、400、425、450、475、500、550、600、750、800、850、900、1000、1200、1500、2000、4000、6000、8000或9999埃的厚度。在一个特定实施方案中,薄膜(14)具有约250埃的厚度。一般来讲,在切刃(12)上的涂覆的材料越薄,切削力越低并且切割特性越好。具有较低切削力的切刃结构的实例描述于美国发明专利5,295,305;5,232,568;4,933,058;5,032,243;5,497,550;5,940,975;5,669,144;5,217,010和5,142,785中。
第一材料可包括选自由下列组成的组的材料:金属、金属合金、金属碳化物、金属氧化物、金属氮化物、它们的衍生物以及组合。例如,金属可选自由下列组成的组:Ta、Ru、Ni、V、Ti、Pt、Cr、Nb、Hf、W、Zr、Ag、Re、Pd、Fe、以及它们的组合。
薄膜(14)可通过如上所述的薄膜工艺来施用。例如,薄膜(14)可通过采用直流偏压溅镀(比约-50伏特更大的负值,甚至比约-200伏特更大的负值)和约2毫托氩的压力来施用。
参见图2,基质(10)也包括设置在薄膜(14)的表面和基质(10)的表面处或附近的氮化物-薄膜间混区(15)。氮化物区(16)也被邻近氮化物-薄膜间混区(15)设置,例如设置在其上面或在顶部上。因为采用薄膜工艺可施用不连续的薄膜(14),因此当氮化处理时,也可形成氮化物-基质间混区(17)。这种氮化物-基质间混区(17)给基质(10)提供附加的强度并被邻近氮化物-薄膜间混区(15)设置,例如设置在下方,在基质(10)的表面之下。一般来讲,氮化物-薄膜间混区(15)、氮化物区(16)和/或氮化物-基质间混区(17)通过用含氮气体或等离子体氮化处理薄膜(14)和下面的基质(10)二者而形成。也可采用本领域已知的其它氮化处理方法。
在一个实例中,氮化物-薄膜间混区(15)、氮化物区(16)和/或氮化物-基质间混区(17)由含氮等离子体即等离子体氮化处理而形成。等离子体氮化处理是一种利用氮原子和/或离子的先进的表面硬化工艺。根据该工艺,其在包含氮气的处理室中执行,在薄膜(14)、一般靠近切刃(12)的基质(10)和电极之间建立了强静电场。由于静电场,氮气被雾化和/或离子化,其引起氮原子和/或离子朝向薄膜(14)和/或基质(10)加速并接触它们以形成氮化物-薄膜间混区(15)和/或氮化物区(16)。氮原子和/或离子也可直接(16)或间接渗透或扩散过基质(10)的表面之下的薄膜(14),或透过薄膜和基质以形成氮化物-基质间混区(17),如图2所示。
参见图3,第二材料涂层(18)可被设置在氮化物-薄膜间混区(15)、氮化物区(16)或二者之上。第二材料涂层(18)一般提供改进的强度和耐腐蚀性。第二材料涂层(18)也改善剃刮能力以及降低切刃(12)尖端的圆度。第二材料可包括选自由下列组成的组的材料:金属、金属合金、金属碳化物、金属氧化物、金属氮化物、金刚石、非晶金刚石、类金刚石碳、硼、氮化硼、它们的衍生物以及组合。例如,金属可选自由下列组成的组:Ta、Ru、Ni、V、Ti、Pt、Cr、Nb、Hf、W、Zr、Ag、Re、Pd、Fe、以及它们的组合。
如“Handbook of Physical Vapor Deposition(PVD)”中所述,DLC为非晶碳材料,其显示具有金刚石的许多期望的性质但不具有金刚石的晶体结构。用于第二材料的适用材料的实例诸如含铌和铬材料、纯净或掺杂的含碳材料(例如,金刚石、非晶金刚石或DLC)、氮化物(例如,氮化硼、氮化铌或氮化钛)、碳化物(例如,碳化硅)、氧化物(例如,氧化铝、氧化锆)或其它陶瓷材料描述于美国专利公开5,295,305和6,684,513中。美国专利公开5,232,568也描述了适用的DLC层和沉积那些层的方法。
与薄膜(14)类似,第二材料涂层(18)可通过采用直流偏压溅镀(比约-50伏特更大的负值,甚至比约-200伏特更大的负值)和约2毫托氩的压力来施用。不受理论的限制,负偏压增大提高了在第二材料涂层(18)中的压应力(与拉应力相反)。
作为另外一种选择,薄膜(14)和/或第二材料涂层(18)可通过将负压以脉冲施加到材料由它们的相应材料生成离子来施用,如共同拥有并转让给The Gillette Company的美国专利申请11/881,288中所述。在一个实施方案中,第二材料涂层(18)可包括铬并且厚度介于约100和约700埃之间。例如,第二材料涂层(18)可具有从约100、125、150、175、200、225、250或275埃至约325、350、375、400、450、500、550、600、650或700埃的厚度。在一个特定实施方案中,第二材料涂层(18)具有约300埃的厚度。
在一个实施方案中,切刃(12)包括楔形尖端,所述楔形尖端具有小于三十度的夹角和小于约1,000埃的尖端半径。一般来讲,在施用第二材料涂层(18)之后,通过SEM测得的尖端半径可介于约200和约500埃之间。例如,尖端半径可介于约100、125、150、175、200、225、240、250、265、275、290埃至约310、325、340、355、375、400、450、500埃之间。在一个特定实施方案中,尖端半径为约300埃。
如图4所示,含氟聚合物涂层(20)可被直接施用在氮化物-薄膜间混区(15)、氮化物区(16)或二者之上。一般来讲,含氟聚合物涂层(20)减小其表面的摩擦并包括聚四氟乙烯(PTFE),或者称为调聚物。众所周知,当施用大致连续的调聚物涂层时,调聚物涂层的厚度减小可提供改进的第一剃刮结果。作为另外一种选择,含氟聚合物涂层(20)可被施用在第二材料涂层(18)之上,如图5所示。一般来讲,第二材料涂层(18)有利于将含氟聚合物涂层(20)结合到基质(10)。
KrytoxLW 1200(其得自DuPont)是一种适用的含氟聚合物材料,即PTFE,可将其用作含氟聚合物涂层(20)。KrytoxLW 1200是非燃烧的和稳定的干润滑剂,其由产生稳定弥散的小颗粒构成。它以按重量计含20%固体物的水分散液来供给并可通过浸渍、喷射或刷涂来施用,并且可接着进行空气干燥或熔融涂覆。例如,含氟涂层(20)可通过在氩气的中性气氛中加热基质(10)并提供粘附的和减摩的固体PTFE的聚合物涂层来形成,如美国专利公开5,295,305和3,518,110中所述。利用前述专利中所述的技术导致含氟涂层(20)一般具有约1000埃、1100埃、1200埃、1300埃、1400埃、1500埃、1600埃、1700埃、1750埃、1800埃、1850埃、1900埃、1950埃或1975埃至约2025埃、2050埃、2100埃、2150埃、2200埃、2600埃、3000埃或5000埃的厚度。在一个特定实施方案中,含氟聚合物涂层(20)具有约2000埃的厚度。作为另外一种选择,美国专利公开5,263,256和5,985,459描述了可用来减小所施用的调聚物层厚度的其它技术。利用这些其它技术,含氟聚合物涂层(20)可具有约100埃、120埃、140埃、150埃、165埃、175埃、185埃或190埃至约210埃、225埃、250埃、275埃、300埃、350埃、400埃、500埃、600埃、800埃、1000埃、1200埃或1500埃的厚度。在一个特定实施方案中,含氟聚合物涂层(20)具有约200埃的厚度。
本发明也涉及一种用于涂覆剃刀刀片的方法,所述方法包括以下步骤:(a)提供包括切刃的基质;(b)通过薄膜工艺在所述基质上施用第一材料薄膜,其中所述薄膜在被施用后具有小于1μm的厚度;(c)用含氮气体或等离子体氮化处理所述薄膜和所述基质以形成(1)设置在薄膜表面和基质表面处或附近的氮化物-薄膜间混区,和(2)邻近氮化物-薄膜间混区设置的氮化物区。
基质可包括诸如不锈钢、铝、钛或其它适用基质材料的材料。AISI440是一种特别适合的不锈钢基质材料。在一个实施方案中,切刃可包括楔形尖端,所述楔形尖端具有小于三十度的夹角和小于约1,000埃的尖端半径,诸如图1-5中所描绘的那些。例如,尖端半径可为约100埃、125埃、150埃、175埃、200埃、225埃、240埃、250埃、265埃、275埃或290埃至约310埃、325埃、340埃、355埃、375埃、400埃、450埃、500埃、600埃、700埃、800埃、900埃或999埃。在一个特定实施方案中,尖端半径为约300埃。
薄膜可通过如上所述的薄膜工艺来施用。薄膜可具有从约10埃、20埃、50埃、100埃、150埃、170埃、180埃、190埃、200埃、210埃、220埃、230埃或240埃至约260埃、270埃、280埃、290埃、300埃、325埃、350埃、400埃、500埃、600埃、800埃、1000埃、1500埃、2000埃、3000埃、4000埃、5000埃或8000埃的厚度。在一个特定实施方案中,薄膜具有约250埃的厚度。第一材料可包括选自由下列组成的组的材料:金属、金属合金、金属碳化物、金属氧化物、金属氮化物、它们的衍生物以及组合。例如,用于第一材料的金属可选自由下列组成的组:Ta、Ru、Ni、V、Ti、Pt、Cr、Nb、Hf、W、Zr、Ag、Re、Pd、Fe、以及它们的组合。
为提供附加的强度,在步骤(c)期间,氮原子和/或离子也可直接地和/或间接地渗透或扩散到下面的基质中(在如前所述的下面基质的表面之下)以形成氮化物-基质间混区。第二材料的涂层也可被施用在氮化物-薄膜间混区、氮化物区、或它们二者之上。第二材料可包括选自由下列组成的组的材料:金属、金属合金、金属碳化物、金属氧化物、金属氮化物、金刚石、非晶金刚石、类金刚石碳、硼、氮化硼、它们的衍生物以及组合。例如,金属可选自由下列组成的组:Ta、Ru、Ni、V、Ti、Pt、Cr、Nb、Hf、W、Zr、Ag、Re、Pd、Fe、以及它们的组合。如上所述,含氟聚合物涂层还可被施用在第二材料之上,或者在不存在第二材料时直接施用在氮化物-薄膜间混区、氮化物区、或它们二者之上。
图6显示用于施用薄膜(14)、第二材料(18)和/或含氟聚合物涂层(20)的一种示例性的设备,如图1-5所示。所述设备包括由科罗拉多州Boulder的Vac Tec Systems公司制造的直流平面磁控管溅镀系统,所述系统具有不锈钢室(74),所述不锈钢室具有壁结构(80)、门(82)和基座结构(84)。在不锈钢室中形成了耦接到合适的真空系统(未示出)的孔口(86)。安装在室(74)中的是具有直立支撑构件(90)的转盘式支撑件(88),在其上可设置一叠基质(10),通常让基质的切刃(12)成一直线并从支撑构件(90)向外朝向。
同样设置在室(74)中的是分别用于例如为第一材料、第二材料和/或含氟聚合物材料的靶标(96)的支撑结构(76)。用于另一个靶标(98)的附加支撑结构(78)也可被设置在室(74)中。靶标(96、98)为垂直设置的平板,每个约十二厘米宽和约三十七厘米长。支撑结构(76、78和88)与室(74)电绝缘并且提供了电连接以将基质(10)通过开关(102)连接到射频电源(100)以及通过开关(106)连接到直流电源(104)。靶标(96、98)也分别通过开关(108、110)连接到直流磁控管电源(112)。将遮板结构(114、116)分别邻近靶标(96、98)设置以便在打开位置和遮掩相邻的靶标的位置之间移动。
转盘式支撑件(88)可支撑基质(10)并可与相对的靶板(96、98)相隔约七厘米。转盘式支撑件(88)可围绕介于基质(10)可处于与图4所示的靶标(96)反向对准的第一位置和基质(10)可处于与另一个靶标(98)反向对准的第二位置之间的垂直轴线转动。
在一个示例性的加工序列中,基质(10)被固定在支撑件(90)上,室(74)被排空并且靶标(96、98)用直流溅镀净化五分钟。开关(102)接着被闭合,并且以十毫托的压力、200sccm的氩气流量(标准立方厘米每分钟)和1.5千瓦的功率将基质(10)在氩环境中射频净化五分钟。接着在室(74)中在2.0毫托的压力下,将氩气流量减小到150sccm。闭合开关(106)以将-25伏特的直流偏压施加在基质(10)上,并且闭合开关(108)以一千瓦功率开始溅镀。靶标(96)前面的遮板(114)被打开三十秒以将相应的材料沉积在基质(10)上。
室(74)中的压力可在两毫托与150sccm的氩气流量下被另外保持。闭合开关(110)以在750瓦下溅镀另一个靶标(98),同时闭合开关(102)以将八百瓦的13.56MHz射频偏压(-420伏特直流自给偏压)施加在基质(10)上。在一个实例中,遮板(116)也可被打开二十分钟以将约2,000埃厚的第二材料(18)沉积在氮化物-薄膜间混区(15)、氮化物区(16)或二者上。此外,含氟聚合物涂层(20)接着可通过在氩气的中性气氛中加热基质(10)和施用含氟聚合物材料被施用在第二材料涂层(18)之上。
本文所公开的量纲和值不旨在被理解为严格地限于所引用的精确值。相反,除非另外指明,每个这样的量纲旨在表示所引用的数值和围绕该数值的功能上等同的范围。例如,公开为“40mm”的量纲旨在表示“约40mm”。
除非明确排除或换句话讲有所限制,本文中引用的每个文件,包括任何交叉引用或相关专利或专利申请,均据此以引用方式全文并入本文。对任何文献的引用均不是承认其为本文公开的或受权利要求书保护的任何发明的现有技术、或承认其独立地或以与任何其它一个或多个参考文献的任何组合的方式提出、建议或公开任何此类发明。此外,如果此文献中术语的任何含义或定义与任何以引用方式并入本文的文献中相同术语的任何含义或定义相冲突,将以此文献中赋予那个术语的含义或定义为准。
虽然已经举例说明和描述了本发明的具体实施方案,但是对于那些本领域技术人员来说显而易见的是,在不背离本发明实质和范围的情况下可以做出多个其它改变和变型。因此,其旨在在附加的权利要求书中涵盖属于本发明范围内的所有此类变化和修改。

Claims (14)

1.一种剃刀刀片,所述剃刀刀片包括具有切刃的基质,所述基质包括:
a.设置在所述基质上的第一材料薄膜,所述薄膜具有小于1μm的厚度;
b.设置在所述薄膜的表面和所述基质的表面处的氮化物-薄膜间混区;和
c.邻近所述氮化物-薄膜间混区设置的氮化物区;
其中所述基质还包括邻近所述氮化物-薄膜间混区设置在所述基质表面之下的氮化物-基质间混区。
2.如权利要求1所述的剃刀刀片,其中所述第一材料包括选自由下列组成的组的材料:金属、金属合金、金属碳化物、金属氧化物、金属氮化物、它们的衍生物以及组合。
3.如权利要求2所述的剃刀刀片,其中所述金属选自由下列组成的组:Ta、Ru、Ni、V、Ti、Pt、Cr、Nb、Hf、W、Zr、Ag、Re、Pd、Fe、以及它们的组合。
4.如权利要求1所述的剃刀刀片,所述剃刀刀片还包括设置在所述氮化物-薄膜间混区、所述氮化物区、或它们二者之上的第二材料的涂层。
5.如权利要求4所述的剃刀刀片,其中所述第二材料包括选自由下列组成的组的材料:金属、金属合金、金属碳化物、金属氧化物、金属氮化物、金刚石、类金刚石碳、硼、氮化硼、它们的衍生物以及组合。
6.如权利要求5所述的剃刀刀片,其中所述金属选自由下列组成的组:Ta、Ru、Ni、V、Ti、Pt、Cr、Nb、Hf、W、Zr、Ag、Re、Pd、Fe以及它们的组合。
7.如权利要求4所述的剃刀刀片,所述剃刀刀片还包括在所述第二材料之上的含氟聚合物涂层。
8.如权利要求1所述的剃刀刀片,所述剃刀刀片还包括在所述氮化物-薄膜间混区、所述氮化物区、或它们二者之上的含氟聚合物涂层。
9.如权利要求1所述的剃刀刀片,其中所述切刃包括具有小于三十度夹角和小于1,000埃的尖端半径的楔形尖端。
10.一种用于涂覆剃刀刀片的方法,所述方法包括以下步骤:
a.提供包括切刃的基质;
b.通过薄膜工艺将第一材料薄膜施用在所述基质上,其中所述薄膜在被施用后具有小于1μm的厚度;
c.用含氮气体或等离子体氮化处理所述薄膜和所述基质以形成
1)设置在所述薄膜的表面和所述基质的表面处或附近的氮化物-薄膜间混区,和
2)邻近所述氮化物-薄膜间混区设置的氮化物区。
11.如权利要求10所述的方法,其中步骤(c)还形成邻近所述氮化物-薄膜间混区设置在所述基质表面之下的氮化物-基质间混区。
12.如权利要求10所述的方法,所述方法还包括以下步骤(d):将含氟聚合物涂层施用在氮化物-薄膜间混区、所述氮化物区、或它们二者之上。
13.如权利要求10所述的方法,所述方法还包括以下步骤(d):将第二材料的涂层施用在所述氮化物-薄膜间混区、所述氮化物区、或它们二者之上。
14.如权利要求13所述的方法,所述方法还包括以下步骤(e):将含氟聚合物涂层施用在所述第二材料涂层之上。
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