CN102427656A - Composite circuit board - Google Patents
Composite circuit board Download PDFInfo
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- CN102427656A CN102427656A CN2011102586273A CN201110258627A CN102427656A CN 102427656 A CN102427656 A CN 102427656A CN 2011102586273 A CN2011102586273 A CN 2011102586273A CN 201110258627 A CN201110258627 A CN 201110258627A CN 102427656 A CN102427656 A CN 102427656A
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- light source
- pcb board
- erecting bed
- sheet
- metal layers
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Abstract
The invention relates to the semiconductor lighting technology and especially relates to a composite circuit board used in an LED light source module. The composite circuit board possesses a double layer structure which comprises: a PCB plate layer located on a surface layer and a metal plate layer located on a bottom layer. The PCB plate layer is provided with a circuit. The PCB plate layer possesses several hollowed-out holes. And the metal plate layer correspondingly possesses several prominent light source mounting tables. The light source mounting tables pass through the holes and extend to the surface of the PCB plate layer. The invention provides a heat (path) electric (path) separated composite circuit board with a good heat dissipation effect and also provides a preparation method of the circuit board.
Description
Technical field
The present invention relates to the semiconductor lighting technology, relate in particular to a kind of compound circuit plate that is exclusively used in the led light source module.
Background technology
The LED light fixture has the characteristics that the life-span is long, economize electric power, is applied to lighting field more and more widely.
In the prior art, the LED package module mostly adopts the aluminium base technology, and aluminium base promptly is that circuit board is again a heating panel.Like Chinese patent document CN201448627U in disclosed a kind of led light source module on May 5th, 2010; Comprise aluminium base and be arranged on the individual particle led chip on the aluminium base, the individual particle led chip is packaged into sheet integral body to the led light source module on the aluminium base evenly being arranged in through light transmission package.Light transmission package comprises four sides plastic cement frame, and plastic cement frame opening bottom surface, four sides places on the aluminium base, and the individual particle led chip covers in the frame on the aluminium base evenly being arranged in, and four sides plastic cement frame open top face is sealed by epoxy resin layer.For the ease of heat radiation, on aluminium base, have the thermal conductance chute of deriving the LED heat.This integrated form light source module is convenient in lighting, install, and the scope of application is wide.This great power LED die set light source can satisfy power from 1W to 90W, and the light that it sent can be concentrated and form certain direction irradiation, and the illumination good evenness can avoid plane of illumination to form spot, shadow and ghost image.
The same with aforementioned patented technology, aluminium base of the prior art promptly as heating panel, again as circuit board, need be provided with insulating barrier and circuit on the surface; On the one hand, its material cost is high, complex process, and because of the existence of insulating barrier, radiating effect is undesirable on the other hand.
Summary of the invention
The objective of the invention is to overcome the weak point of above-mentioned prior art and a kind of low compound circuit plate of simple cost for preparing is provided.
Another object of the present invention is to overcome the weak point of above-mentioned prior art and compound circuit plate that a kind of good heat dissipation effect is provided.
Another object of the present invention is to overcome the weak point of above-mentioned prior art and a kind of preparation method who prepares the compound circuit plate of the low and/or good heat dissipation effect of simple cost is provided.
The object of the invention can be realized through following technical scheme:
A kind of compound circuit plate is exclusively used in the led light source module, it is characterized in that: this compound circuit plate has double-decker, promptly is positioned at the pcb board layer and the sheet-metal layers that is positioned at bottom on top layer; The pcb board layer is provided with circuit; The pcb board layer has the hole of some hollow outs, and sheet-metal layers has the light source erecting bed of several projections accordingly, and said light source erecting bed is arranged in said hole and extends to the surface of pcb board layer.
The compound circuit plate is characterized in that: said hole is a circular port, or the linear slotted hole, or long arc-shaped holes, or square opening, and the shape of said light source erecting bed and the shape in hole are complementary.
The compound circuit plate is characterized in that: be provided with tack coat between said pcb board layer and the said sheet-metal layers; Or connect through securing member between said pcb board layer and the said sheet-metal layers.
The compound circuit plate is characterized in that: said light source erecting bed is arranged in said hole with interference fit, and the height of said light source erecting bed equals the thickness of said pcb board.
The compound circuit plate is characterized in that: a side of this compound circuit sheetmetal flaggy also is provided with heat abstractor.
The compound circuit plate is characterized in that: said heat abstractor comprises that one is vertically installed in the heat radiation wing of sheet-metal layers.
The compound circuit plate; It is characterized in that: said heat abstractor also comprises the heat pipe that is communicated with sheet-metal layers and heat radiation wing tail end; One end of heat pipe is welded in the faying face of said sheet-metal layers and said heat radiation wing, and heat pipe is perpendicular to the heat radiation wing, and the heat pipe other end vertically is arranged in heat radiation wing tail end.
The compound circuit plate is characterized in that: said pcb board is a multi-layer sheet.
The compound circuit plate is characterized in that: said hole is a circular port, or the linear slotted hole, or long arc-shaped holes, or square opening, and the shape of said light source erecting bed and the shape in hole are complementary; Be provided with tack coat between said pcb board layer and the said sheet-metal layers; Or connect through securing member between said pcb board layer and the said sheet-metal layers; Said light source erecting bed is arranged in said hole with interference fit; One side of this compound circuit sheetmetal flaggy also is provided with heat abstractor; Said heat abstractor comprises that one is vertically installed in the heat radiation wing of sheet-metal layers; Said heat abstractor also comprises the heat pipe that is communicated with sheet-metal layers and heat radiation wing tail end, and an end of heat pipe is welded in the faying face of said sheet-metal layers and said heat radiation wing, and heat pipe is perpendicular to the heat radiation wing, and the heat pipe other end vertically is arranged in the wing tail end that dispels the heat.
The object of the invention can also be realized through following technical scheme:
A kind of preparation method of compound circuit plate, it is characterized in that may further comprise the steps: S1. provides metallic plate; S2., pcb board is provided; S3. gluing; S4. pressing; S5. polish; S6. paste light source erecting bed diaphragm; S7., the circuit of pcb board is set; Wherein, the metallic plate that the S1 step is provided is to have the light source erecting bed, and the light source erecting bed is provided with through cut or die casting mode; The pcb board that S2 provided has hollow hole, hollow hole and said light source erecting bed coupling, and hollow hole is through cut or impact style setting; The alleged gluing of S3 is the faying face gluing at metallic plate and pcb board; The alleged pressing of S4 is to be one with metallic plate and pcb board pressing; Polishing that S5 is alleged is that light source erecting bed and pcb board surface are polished in the lump; The alleged light source erecting bed pasting protective film of S6 is to go on foot on the surface that polishes at S5, the pasting protective film in light source erecting bed zone.
Compound circuit plate of the present invention has double-decker, promptly is positioned at the pcb board layer and the sheet-metal layers that is positioned at bottom on top layer; The pcb board layer is provided with circuit; The pcb board layer has the hole of some hollow outs, and sheet-metal layers has the light source erecting bed of several projections accordingly, and said light source erecting bed is arranged in said hole and extends to the surface of pcb board layer.Compared with prior art, need insulating barrier and circuit be set on the surface of metallic plate, it is low to prepare simple cost.On the other hand; Compound circuit plate of the present invention; Thermally conductive pathways separates with circuit; Light source is arranged at the light source erecting bed can directly to metallic plate heat conduction, realize really that heat (path) electricity (path) separates without circuit board (referring to the aluminium base in pcb board or the background technology), good heat dissipation effect.The present invention provides the preparation method of this compound circuit plate simultaneously.
Description of drawings
Fig. 1 is the sketch map of first embodiment of the invention.
Fig. 2 is the front schematic view of first embodiment of the invention.
Fig. 3 is the replacement scheme sketch map of first embodiment of the invention.
Fig. 4 is the sketch map of second embodiment of the invention.
Fig. 5 is an A-A cross-sectional schematic among Fig. 4.
Fig. 6 is the flow chart of third embodiment of the invention.
Embodiment
To combine accompanying drawing that the present invention is made further detailed description below.
Referring to figs. 1 to Fig. 3, first embodiment of the invention is a kind of compound circuit plate, is exclusively used in the led light source module, and this compound circuit plate has double-decker, promptly is positioned at the pcb board layer 101 and the sheet-metal layers 102 that is positioned at bottom on top layer; Pcb board layer 101 is provided with circuit; Pcb board layer 101 has the hole 104 of some hollow outs, and sheet-metal layers 102 has the light source erecting bed 103 of several projections accordingly, and said light source erecting bed 103 is arranged in said hole 104 and extends to the surface of pcb board layer 101.
Compound circuit plate of the present invention, said hole 104 is a circular port, or the linear slotted hole, or long arc-shaped holes, or square opening, the shape in the shape of said light source erecting bed 103 and hole 104 is complementary; Should be appreciated that on the same block of compound circuit plate, the shape in hole 104 possibly be a kind of, also can be the combination of several kinds of shapes; Be provided with tack coat between said pcb board layer 101 and the said sheet-metal layers 102; A kind of replacement scheme as present embodiment; When pcb board layer 101 not by said hole 104 cut apart more scattered the time; Also can connect between pcb board layer 101 and the said sheet-metal layers 102 through securing member; For the ease of polishing light source erecting bed 103 after the assembling, securing member is installed from sheet-metal layers 102 1 sides, does not expose pcb board layer 101 and is benefit; Said light source erecting bed 103 is arranged in said hole 104 with interference fit, should be appreciated that interference fit just increases a kind of mode of adhesion, also can not adopt interference fit in the present embodiment, and adopts gap or interference fits; Fig. 2 and Fig. 3 are multi-form light source erecting beds 103 and hollow hole 104.
With reference to figure 4, Fig. 5, second embodiment of the invention also is a kind of compound circuit plate, is exclusively used in the led light source module, and this compound circuit plate has double-decker, promptly is positioned at the pcb board layer 201 and the sheet-metal layers 202 that is positioned at bottom on top layer; Pcb board layer 201 is provided with circuit; Pcb board layer 201 has the hole 204 of some hollow outs, and sheet-metal layers 202 has the light source erecting bed 203 of several projections accordingly, and said light source erecting bed 203 is arranged in said hole 204 and extends to the surface of pcb board layer 201; Compound circuit plate of the present invention, said hole 204 is a circular port, or the linear slotted hole, or long arc-shaped holes, or square opening, the shape in the shape of said light source erecting bed 203 and hole 204 is mated each other; Should be appreciated that on the same block of compound circuit plate, the shape in hole 204 can be a kind of, also can be the combination of several kinds of shapes; Be provided with tack coat between said pcb board layer 201 and the said sheet-metal layers 202; A kind of replacement scheme as present embodiment; When pcb board emerge in an endless stream 201 not by said hole 204 cut apart more scattered the time; Also can connect between pcb board layer 201 and the said sheet-metal layers 202 through securing member; For the ease of polishing light source erecting bed 203 after the assembling, securing member is installed from sheet-metal layers 202 1 sides, does not expose pcb board layer 201 and is benefit; Said light source erecting bed 203 is arranged in said hole 204 with interference fit, should be appreciated that interference fit just increases a kind of mode of adhesion, also can not adopt interference fit in the present embodiment, and adopts gap or interference fits; One side of this compound circuit sheetmetal flaggy also is provided with heat abstractor; Said heat abstractor comprises that one is vertically installed in the heat radiation wing 205 of sheet-metal layers; Said heat abstractor also comprises the heat pipe 206 that is communicated with sheet-metal layers 202 and heat radiation wing 205 tail ends; One end of heat pipe 206 is welded in the faying face of said sheet-metal layers 202 and said heat radiation wing 205; And heat pipe 206 is perpendicular to heat radiation wing 205, and the heat pipe other end vertically is arranged in heat radiation wing 206 tail ends.Take this, the compound circuit plate of present embodiment has two kinds of heat radiation channels, and the one, directly dispel the heat through sheet-metal layers 202 and heat radiation wing 205, another is that radiating effect is better through heat pipe 206 auxiliary heat dissipations.When part light source erecting bed 203 constituted longitudinally strip, heat pipe directly was welded in the relative position of sheet-metal layers 202 reverse side and light source erecting bed 203, and radiating effect is better.
With reference to figure 6, third embodiment of the invention is a kind of preparation method of compound circuit plate, and it is characterized in that may further comprise the steps: S1. provides metallic plate; S2., pcb board is provided; S3. gluing; S4. pressing; S5. polish; S6. paste light source erecting bed diaphragm; S7., the circuit of pcb board is set; Wherein, the metallic plate that the S1 step is provided is to have the light source erecting bed, and the light source erecting bed is provided with through cut or die casting mode; The pcb board that S2 provided has hollow hole, hollow hole and said light source erecting bed coupling, and hollow hole is through cut or impact style setting; The alleged gluing of S3 is the faying face gluing at metallic plate and pcb board; The alleged pressing of S4 is to be one with metallic plate and pcb board pressing; Polishing that S5 is alleged is that light source erecting bed and pcb board surface are polished in the lump; The alleged light source erecting bed pasting protective film of S6 is to go on foot on the surface that polishes at S5, and the pasting protective film in light source erecting bed zone is so that be provided with the surperficial cleaning of accumulating link protection light source erecting bed of circuit and compound circuit plate.
Claims (10)
1. compound circuit plate that is exclusively used in the led light source module, it is characterized in that: this compound circuit plate has double-decker, promptly is positioned at the pcb board layer and the sheet-metal layers that is positioned at bottom on top layer; The pcb board layer is provided with circuit; The pcb board layer has the hole of some hollow outs, and sheet-metal layers has the light source erecting bed of several projections accordingly, and said light source erecting bed is arranged in said hole and extends to the surface of pcb board layer.
2. compound circuit plate according to claim 1 is characterized in that: said hole is a circular port, or the linear slotted hole, or long arc-shaped holes, or square opening, and the shape of said light source erecting bed and the shape in hole are complementary.
3. compound circuit plate according to claim 1 is characterized in that: be provided with tack coat between said pcb board layer and the said sheet-metal layers; Or connect through securing member between said pcb board layer and the said sheet-metal layers.
4. according to claim 1 or 3 described compound circuit plates, it is characterized in that: said light source erecting bed is arranged in said hole with interference fit, and the height of said light source erecting bed equals the thickness of said pcb board.
5. according to any described compound circuit plate of claim 1-3, it is characterized in that: a side of this compound circuit sheetmetal flaggy also is provided with heat abstractor.
6. compound circuit plate according to claim 5 is characterized in that: said heat abstractor comprises that one is vertically installed in the heat radiation wing of sheet-metal layers.
7. compound circuit plate according to claim 6; It is characterized in that: said heat abstractor also comprises the heat pipe that is communicated with sheet-metal layers and heat radiation wing tail end; One end of heat pipe is welded in the faying face of said sheet-metal layers and said heat radiation wing; And heat pipe is perpendicular to the heat radiation wing, and the heat pipe other end vertically is arranged in heat radiation wing tail end.
8. compound circuit plate according to claim 1 is characterized in that: said pcb board is a multi-layer sheet.
9. compound circuit plate according to claim 1 is characterized in that: said hole is a circular port, or the linear slotted hole, or long arc-shaped holes, or square opening, and the shape of said light source erecting bed and the shape in hole are complementary; Be provided with tack coat between said pcb board layer and the said sheet-metal layers; Or connect through securing member between said pcb board layer and the said sheet-metal layers; Said light source erecting bed is arranged in said hole with interference fit; One side of this compound circuit sheetmetal flaggy also is provided with heat abstractor; Said heat abstractor comprises that one is vertically installed in the heat radiation wing of sheet-metal layers; Said heat abstractor also comprises the heat pipe that is communicated with sheet-metal layers and heat radiation wing tail end, and an end of heat pipe is welded in the faying face of said sheet-metal layers and said heat radiation wing, and heat pipe is perpendicular to the heat radiation wing, and the heat pipe other end vertically is arranged in the wing tail end that dispels the heat.
10. the preparation method of a compound circuit plate is characterized in that may further comprise the steps:
S1., metallic plate is provided;
S2., pcb board is provided;
S3. gluing;
S4. pressing;
S5. polish;
S6. paste light source erecting bed diaphragm;
S7., the circuit of pcb board is set;
Wherein, the metallic plate that the S1 step is provided is to have the light source erecting bed, and the light source erecting bed is provided with through cut or die casting mode; The pcb board that S2 provided has hollow hole, hollow hole and said light source erecting bed coupling, and hollow hole is through cut or impact style setting; The alleged gluing of S3 is the faying face gluing at metallic plate and pcb board; The alleged pressing of S4 is to be one with metallic plate and pcb board pressing; Polishing that S5 is alleged is that light source erecting bed and pcb board surface are polished in the lump; The alleged light source erecting bed pasting protective film of S6 is to go on foot on the surface that polishes at S5, the pasting protective film in light source erecting bed zone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102586273A CN102427656A (en) | 2011-09-04 | 2011-09-04 | Composite circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102586273A CN102427656A (en) | 2011-09-04 | 2011-09-04 | Composite circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102427656A true CN102427656A (en) | 2012-04-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102586273A Pending CN102427656A (en) | 2011-09-04 | 2011-09-04 | Composite circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN102427656A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021178722A1 (en) * | 2020-03-04 | 2021-09-10 | Transport Phenomena Technologies, Llc | Compliant thermal management devices, systems, and methods of fabrication thereof |
Citations (6)
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|---|---|---|---|---|
| CN101042226A (en) * | 2007-04-20 | 2007-09-26 | 诸建平 | High power LED lighting lamp model set |
| CN101592322A (en) * | 2009-06-05 | 2009-12-02 | 史杰 | The LED method for packing of high-power LED lighting fixture |
| CN101814574A (en) * | 2010-04-16 | 2010-08-25 | 惠州市华阳多媒体电子有限公司 | Light emitting diode base plate heat radiation structure and manufacture method thereof |
| CN101907232A (en) * | 2009-06-05 | 2010-12-08 | 台达电子工业股份有限公司 | Light fitting and illuminating apparatus thereof |
| CN101975343A (en) * | 2010-10-07 | 2011-02-16 | 东莞市万丰纳米材料有限公司 | Light source module and preparation method thereof |
| CN102121581A (en) * | 2010-12-03 | 2011-07-13 | 东莞勤上光电股份有限公司 | Method for preparing LED (light emitting diode) light source module |
-
2011
- 2011-09-04 CN CN2011102586273A patent/CN102427656A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101042226A (en) * | 2007-04-20 | 2007-09-26 | 诸建平 | High power LED lighting lamp model set |
| CN101592322A (en) * | 2009-06-05 | 2009-12-02 | 史杰 | The LED method for packing of high-power LED lighting fixture |
| CN101907232A (en) * | 2009-06-05 | 2010-12-08 | 台达电子工业股份有限公司 | Light fitting and illuminating apparatus thereof |
| CN101814574A (en) * | 2010-04-16 | 2010-08-25 | 惠州市华阳多媒体电子有限公司 | Light emitting diode base plate heat radiation structure and manufacture method thereof |
| CN101975343A (en) * | 2010-10-07 | 2011-02-16 | 东莞市万丰纳米材料有限公司 | Light source module and preparation method thereof |
| CN102121581A (en) * | 2010-12-03 | 2011-07-13 | 东莞勤上光电股份有限公司 | Method for preparing LED (light emitting diode) light source module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021178722A1 (en) * | 2020-03-04 | 2021-09-10 | Transport Phenomena Technologies, Llc | Compliant thermal management devices, systems, and methods of fabrication thereof |
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Application publication date: 20120425 |