CN102412173A - 切割、研磨硅片表面清洗设备 - Google Patents
切割、研磨硅片表面清洗设备 Download PDFInfo
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- CN102412173A CN102412173A CN2011103396721A CN201110339672A CN102412173A CN 102412173 A CN102412173 A CN 102412173A CN 2011103396721 A CN2011103396721 A CN 2011103396721A CN 201110339672 A CN201110339672 A CN 201110339672A CN 102412173 A CN102412173 A CN 102412173A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 87
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 87
- 239000010703 silicon Substances 0.000 title claims abstract description 87
- 238000004140 cleaning Methods 0.000 title claims abstract description 66
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 43
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 21
- 239000002253 acid Substances 0.000 claims abstract description 19
- 239000008367 deionised water Substances 0.000 claims description 25
- 229910021641 deionized water Inorganic materials 0.000 claims description 23
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 16
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- 229910052757 nitrogen Inorganic materials 0.000 claims description 8
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- 238000006386 neutralization reaction Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 abstract 8
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 239000012530 fluid Substances 0.000 description 23
- 239000000243 solution Substances 0.000 description 11
- 238000010792 warming Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000011109 contamination Methods 0.000 description 4
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- 239000004065 semiconductor Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012459 cleaning agent Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 235000008216 herbs Nutrition 0.000 description 2
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- 244000227633 Ocotea pretiosa Species 0.000 description 1
- 235000004263 Ocotea pretiosa Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
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- 238000011010 flushing procedure Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
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- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
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- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
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- 239000000377 silicon dioxide Substances 0.000 description 1
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- 238000002604 ultrasonography Methods 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
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Claims (8)
Priority Applications (1)
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CN 201110339672 CN102412173B (zh) | 2011-11-01 | 2011-11-01 | 切割、研磨硅片表面清洗设备 |
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CN 201110339672 CN102412173B (zh) | 2011-11-01 | 2011-11-01 | 切割、研磨硅片表面清洗设备 |
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CN102412173A true CN102412173A (zh) | 2012-04-11 |
CN102412173B CN102412173B (zh) | 2013-10-16 |
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CN 201110339672 Expired - Fee Related CN102412173B (zh) | 2011-11-01 | 2011-11-01 | 切割、研磨硅片表面清洗设备 |
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103302052A (zh) * | 2013-05-13 | 2013-09-18 | 杭州电子科技大学 | 一种钎焊板式换热器板片去离子高纯水清洗装置与方法 |
CN103736690A (zh) * | 2013-12-31 | 2014-04-23 | 上海集成电路研发中心有限公司 | 硅片清洗方法 |
CN103769383A (zh) * | 2012-10-23 | 2014-05-07 | 宿迁宇龙光电科技有限公司 | 一种硅原料的清洗方法 |
CN103785640A (zh) * | 2012-10-31 | 2014-05-14 | 浙江昱辉阳光能源有限公司 | 一种准单晶硅的清洗方法 |
CN103866396A (zh) * | 2014-03-23 | 2014-06-18 | 山西中电科新能源技术有限公司 | 多晶硅锭边尾料表面预处理装置及其处理方法 |
CN104259133A (zh) * | 2014-07-31 | 2015-01-07 | 江苏吉星新材料有限公司 | 蓝宝石晶片退火前的清洗工艺 |
CN106513375A (zh) * | 2015-09-09 | 2017-03-22 | 日月光半导体制造股份有限公司 | 清洗装置、清洗待清洗工件的方法以及清洗ic衬底传送滚轮的清洗液及方法 |
CN107170665A (zh) * | 2017-05-23 | 2017-09-15 | 上海华力微电子有限公司 | 一种在氧化硅湿法刻蚀中降低硅损伤的方法 |
CN107225112A (zh) * | 2017-06-15 | 2017-10-03 | 江苏吉星新材料有限公司 | 一种高效自动化蓝宝石衬底片碱酸清洗一体机 |
CN108060415A (zh) * | 2018-01-23 | 2018-05-22 | 重庆博昶电子科技有限公司 | 一种可烘干工件的发黑处理装置及其处理方法 |
CN113578858A (zh) * | 2021-08-02 | 2021-11-02 | 西安奕斯伟硅片技术有限公司 | 清洗装置和清洗方法 |
CN114850127A (zh) * | 2022-05-30 | 2022-08-05 | 福建晶安光电有限公司 | 一种滤波器基片的清洗工艺 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5837662A (en) * | 1997-12-12 | 1998-11-17 | Memc Electronic Materials, Inc. | Post-lapping cleaning process for silicon wafers |
JPH1140531A (ja) * | 1997-07-15 | 1999-02-12 | Tokyo Electron Ltd | 洗浄システム,洗浄装置及び洗浄方法 |
WO2001059179A1 (en) * | 2000-02-10 | 2001-08-16 | The Government Of The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration (Nasa) | Surface treatment |
CN101062503A (zh) * | 2006-04-24 | 2007-10-31 | 联华电子股份有限公司 | 化学机械研磨后的晶片清洗方法 |
CN101661869A (zh) * | 2008-08-25 | 2010-03-03 | 北京有色金属研究总院 | 一种砷化镓晶片抛光后的清洗方法及甩干机 |
JP2011003759A (ja) * | 2009-06-19 | 2011-01-06 | Nikon Corp | 部材の洗浄方法、露光方法、デバイス製造方法、および洗浄液 |
CN102108517A (zh) * | 2009-12-29 | 2011-06-29 | 中原工学院 | 一种金属烧结网的清洗工艺及其装置 |
CN102412172A (zh) * | 2011-11-01 | 2012-04-11 | 浙江光益硅业科技有限公司 | 切割、研磨硅片表面清洗方法 |
CN202585356U (zh) * | 2011-11-01 | 2012-12-05 | 浙江光益硅业科技有限公司 | 切割、研磨硅片表面清洗设备 |
-
2011
- 2011-11-01 CN CN 201110339672 patent/CN102412173B/zh not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1140531A (ja) * | 1997-07-15 | 1999-02-12 | Tokyo Electron Ltd | 洗浄システム,洗浄装置及び洗浄方法 |
US5837662A (en) * | 1997-12-12 | 1998-11-17 | Memc Electronic Materials, Inc. | Post-lapping cleaning process for silicon wafers |
WO2001059179A1 (en) * | 2000-02-10 | 2001-08-16 | The Government Of The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration (Nasa) | Surface treatment |
CN101062503A (zh) * | 2006-04-24 | 2007-10-31 | 联华电子股份有限公司 | 化学机械研磨后的晶片清洗方法 |
CN101661869A (zh) * | 2008-08-25 | 2010-03-03 | 北京有色金属研究总院 | 一种砷化镓晶片抛光后的清洗方法及甩干机 |
JP2011003759A (ja) * | 2009-06-19 | 2011-01-06 | Nikon Corp | 部材の洗浄方法、露光方法、デバイス製造方法、および洗浄液 |
CN102108517A (zh) * | 2009-12-29 | 2011-06-29 | 中原工学院 | 一种金属烧结网的清洗工艺及其装置 |
CN102412172A (zh) * | 2011-11-01 | 2012-04-11 | 浙江光益硅业科技有限公司 | 切割、研磨硅片表面清洗方法 |
CN202585356U (zh) * | 2011-11-01 | 2012-12-05 | 浙江光益硅业科技有限公司 | 切割、研磨硅片表面清洗设备 |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103769383A (zh) * | 2012-10-23 | 2014-05-07 | 宿迁宇龙光电科技有限公司 | 一种硅原料的清洗方法 |
CN103769383B (zh) * | 2012-10-23 | 2016-05-04 | 宿迁宇龙光电科技有限公司 | 一种硅原料的清洗方法 |
CN103785640B (zh) * | 2012-10-31 | 2016-07-06 | 浙江昱辉阳光能源有限公司 | 一种准单晶硅的清洗方法 |
CN103785640A (zh) * | 2012-10-31 | 2014-05-14 | 浙江昱辉阳光能源有限公司 | 一种准单晶硅的清洗方法 |
CN103302052A (zh) * | 2013-05-13 | 2013-09-18 | 杭州电子科技大学 | 一种钎焊板式换热器板片去离子高纯水清洗装置与方法 |
CN103302052B (zh) * | 2013-05-13 | 2015-05-27 | 杭州杭氧股份有限公司 | 一种钎焊板式换热器板片去离子高纯水清洗装置与方法 |
CN103736690A (zh) * | 2013-12-31 | 2014-04-23 | 上海集成电路研发中心有限公司 | 硅片清洗方法 |
CN103736690B (zh) * | 2013-12-31 | 2018-12-18 | 上海集成电路研发中心有限公司 | 硅片清洗方法 |
CN103866396A (zh) * | 2014-03-23 | 2014-06-18 | 山西中电科新能源技术有限公司 | 多晶硅锭边尾料表面预处理装置及其处理方法 |
CN104259133A (zh) * | 2014-07-31 | 2015-01-07 | 江苏吉星新材料有限公司 | 蓝宝石晶片退火前的清洗工艺 |
CN106513375A (zh) * | 2015-09-09 | 2017-03-22 | 日月光半导体制造股份有限公司 | 清洗装置、清洗待清洗工件的方法以及清洗ic衬底传送滚轮的清洗液及方法 |
CN107170665A (zh) * | 2017-05-23 | 2017-09-15 | 上海华力微电子有限公司 | 一种在氧化硅湿法刻蚀中降低硅损伤的方法 |
CN107170665B (zh) * | 2017-05-23 | 2020-06-16 | 上海华力微电子有限公司 | 一种在氧化硅湿法刻蚀中降低硅损伤的方法 |
CN107225112A (zh) * | 2017-06-15 | 2017-10-03 | 江苏吉星新材料有限公司 | 一种高效自动化蓝宝石衬底片碱酸清洗一体机 |
CN108060415A (zh) * | 2018-01-23 | 2018-05-22 | 重庆博昶电子科技有限公司 | 一种可烘干工件的发黑处理装置及其处理方法 |
CN108060415B (zh) * | 2018-01-23 | 2023-09-22 | 山东九佳紧固件股份有限公司 | 一种可烘干工件的发黑处理装置及其处理方法 |
CN113578858A (zh) * | 2021-08-02 | 2021-11-02 | 西安奕斯伟硅片技术有限公司 | 清洗装置和清洗方法 |
CN114850127A (zh) * | 2022-05-30 | 2022-08-05 | 福建晶安光电有限公司 | 一种滤波器基片的清洗工艺 |
CN114850127B (zh) * | 2022-05-30 | 2024-03-15 | 福建晶安光电有限公司 | 一种滤波器基片的清洗工艺 |
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