CN102398886A - Packaged structure with micro-electromechanical device and manufacture method thereof - Google Patents
Packaged structure with micro-electromechanical device and manufacture method thereof Download PDFInfo
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- CN102398886A CN102398886A CN2010102870966A CN201010287096A CN102398886A CN 102398886 A CN102398886 A CN 102398886A CN 2010102870966 A CN2010102870966 A CN 2010102870966A CN 201010287096 A CN201010287096 A CN 201010287096A CN 102398886 A CN102398886 A CN 102398886A
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Abstract
The invention relates to a packaged structure with a micro-electromechanical device and a manufacture method thereof, wherein the packaged structure with the micro-electromechanical device comprises a packaged base plate, a first dielectric layer, a third circuit layer, a second dielectric layer, a cover body, connecting materials and a substrate, two surfaces of the packaged base plate are respectively provided with a first circuit layer and a second circuit layer, a chip is embedded and buried in the packaged base plate, the first dielectric layer is arranged on the packaged base plate and the chip, the third circuit layer is arranged on the first dielectric layer, the second dielectric layer is arranged on the first dielectric layer and the third circuit layer, a concave part is arranged on the surface of the second dielectric layer, the cover body is arranged on the inner edge of the concave part and the top surface of the second dielectric layer, a cover body part on the top surface of the second dielectric layer forms a cover body side frame, the connecting materials are arranged on the cover body side frame, the micro-electromechanical device is arranged on the surface of the substrate, in addition, the substrate is engaged on the packaged base plate in a mode that the micro-electromechanical device corresponds to the concave part. The packaged structure has the advantages that the dimension is smaller, the cost is lower, and the electric performance is better.
Description
Technical field
The present invention relates to a kind of encapsulating structure and method for making thereof, particularly relate to a kind of encapsulating structure and method for making thereof of tool microcomputer electric component.
Background technology
MEMS (Micro Electro Mechanical System; Be called for short MEMS) be a kind of small device that has electronics and mechanical function concurrently; On making, then reach, can microcomputer electric component be arranged on the surface of chip, and carry out packaging protection with protective cover or primer through various Micrometer-Nanometer Processing Technologies; Thereby make inner microcomputer electric component not receive the destruction of external environment, and obtain a micro electromechanical encapsulating structure.
See also Fig. 1, be the cutaway view of the encapsulating structure of existing tool microcomputer electric component.As shown in the figure, the encapsulating structure of existing tool microcomputer electric component comprises for example being the lead frame 10 of four limit flat non-connection pins (Quad Flat No Lead is called for short QFN) pattern; Chip 11 is located on this lead frame 10; Microcomputer electric component 12 is located on this chip 11; Lid 13 is located on this chip 11 and this chip 11 of capping; Aluminium lamination 14 is located at the end face of this lid 13; Bonding wire 15 electrically connects this chip 11 and lead frame 10 and electrically connects this aluminium lamination 14 and lead frame 10; And encapsulating material 16, coat this lead frame 10, chip 11, lid 13, aluminium lamination 14 and bonding wire 15.
But above-mentioned existing microcomputer electric component 12 need be arranged at one to have on the lead frame 10 of suitable thickness, and need add lid 13 in addition with protection microcomputer electric component 12, and this lid 13 also has a suitable thickness, causes the integral thickness of encapsulating structure excessive.
In addition; The encapsulating structure of existing tool microcomputer electric component is to electrically connect microcomputer electric component and lead frame through beating the gold thread mode; Thereby cause the slow and sensitivity decline of telecommunication transmission between the two; And as the telecommunication transmission path manufacturing cost of the encapsulating structure of tool microcomputer electric component is significantly improved with gold thread; Finally still need again to coat whole microcomputer electric component and gold thread, and this encapsulating material also can increase the overall package thickness of structure with encapsulating material, so have microcomputer electric component encapsulating structure and do not meet the trend of end product towards more compact volume and lower production cost.
Therefore, how to avoid above-mentioned variety of problems of the prior art, and produce can significantly dwindle overall volume, significantly reduce cost of manufacture, and significantly improve the encapsulating structure of tool microcomputer electric component of telecommunication efficiency of transmission, become the problem that present anxious desire solves in fact.
Summary of the invention
Because the defective of above-mentioned prior art, main purpose of the present invention provides a kind of encapsulating structure and method for making thereof with reduced size and electrically preferable microcomputer electric component.
Another object of the present invention provides a kind of encapsulating structure and method for making thereof of microcomputer electric component, can reduce cost of manufacture and simplify processing step.
For achieving the above object, the present invention provides a kind of encapsulating structure of tool microcomputer electric component, comprising: have the base plate for packaging of relative first surface and second surface, and this base plate for packaging has: first line layer is formed on the first surface; Second line layer is formed on the second surface; And conductive through hole, run through this base plate for packaging and electrically connect this first line layer and second line layer; Chip is embedded in this base plate for packaging, and has a plurality of electronic padses that expose to this base plate for packaging first surface on this chip; First dielectric layer is located on this first surface and the chip, and exposes outside this first line layer and electronic pads; The tertiary circuit layer is located on this first dielectric layer and is electrically connected this first line layer and electronic pads; Second dielectric layer is located on this first dielectric layer and the tertiary circuit layer, the perforation that this second dielectric layer surface has recess and runs through this first and second dielectric layer; Lid, be located at this recess inner edge, with the second dielectric layer top surface of recess periphery, wherein, the cap portion on this second dielectric layer top surface constitutes the lid frame; First electric connection pad is located on this second dielectric layer; Second conductive blind hole is located in this perforation and is electrically connected this first line layer and first electric connection pad; Then material is located on this first electric connection pad and this lid frame; And base material, have the microcomputer electric component and second electric connection pad be located on the substrate surface, and this base material is engaged on this base plate for packaging to mode that should recess with this microcomputer electric component.
The present invention also provides a kind of method for making of encapsulating structure of tool microcomputer electric component; Comprise: preparation one has the base plate for packaging of relative first surface and second surface; The first surface of this base plate for packaging and second surface are formed with first line layer and second line layer respectively; And the conductive through hole through running through this base plate for packaging electrically connects this first line layer and second line layer, is embedded with chip in this base plate for packaging, has a plurality of electronic padses that expose to this base plate for packaging first surface on this chip; On this first surface and chip, form first dielectric layer in regular turn and electrically connect this electronic pads and the tertiary circuit layer of first line layer; On this first dielectric layer and tertiary circuit layer, form second dielectric layer; Remove this second dielectric layer of part to form the perforation that recess and formation run through this first and second dielectric layer; At this recess inner edge, form lid with the second dielectric layer top surface of recess periphery; Wherein, Cap portion on this second dielectric layer top surface constitutes the lid frame; And on this second dielectric layer, form first electric connection pad, and in this perforation, form second conductive blind hole that electrically connects this first line layer and first electric connection pad; On this first electric connection pad and this lid frame, form then material; Provide a surface to be provided with the base material of the microcomputer electric component and second electric connection pad; And mode that should recess is engaged this base material and base plate for packaging with this microcomputer electric component.
By on can know, the encapsulating structure of tool microcomputer electric component of the present invention be directly with chip embedding bury in base plate for packaging, therefore can reduce overall package thickness of structure and volume.Moreover the present invention is through being embedded into circuit to electrically connect chip, microcomputer electric component and base plate for packaging, and the existing routing mode of its telecommunication efficiency of transmission is high, and its cost of manufacture is low than the routing mode; Lid of the present invention again can form with first electric connection pad and second conductive blind hole simultaneously, so can simplify processing step.In addition, than existing four limit flat non-connection pin pattern lead frames, the formed array soldered ball of the present invention can provide the electric connection point of more and comparatively dense, and then enlarges its range of application.
Description of drawings
Fig. 1 is the cutaway view of the encapsulating structure of prior art tool microcomputer electric component;
Fig. 2 A to Fig. 2 E is the encapsulating structure of tool microcomputer electric component of the present invention and the cutaway view of method for making thereof, and wherein, Fig. 2 C ' is for showing the method for making sketch map that forms first welding resisting layer.
The main element symbol description:
10 lead frames
11,22 chips
12,41 microcomputer electric components
13,28 lids
14 aluminium laminations
15 bonding wires
16 encapsulating materials
2 encapsulating structures
20 base plate for packaging
The 20a first surface
The 20b second surface
200 conductive through holes
21a first line layer
21b second line layer
221 electronic padses
23 first dielectric layers
24 tertiary circuit layers
241 first conductive blind holes
25 second dielectric layers
250 recesses
26 layer reinforced structures
261 the 4th dielectric layers
262 the 4th line layers
263 the 3rd conductive blind holes
264 solder ball pads
27 second welding resisting layers
270 welding resisting layer perforates
281 lid frames
29 first electric connection pads
290 perforation
291 second conductive blind holes
30 follow material
31 soldered balls
32 first welding resisting layers
40 base materials
401 second electric connection pads
402 metal frames
The specific embodiment
Below through particular specific embodiment embodiment of the present invention is described, those skilled in the art can understand other advantages of the present invention and effect easily by the content that this specification disclosed.
Notice; The appended graphic structure that illustrates of this specification, ratio, size etc.; All only in order to cooperate the content that specification disclosed, understanding and reading for those skilled in the art, is not in order to limit the enforceable qualifications of the present invention; Event is the technical essential meaning of tool not; The adjustment of the modification of any structure, the change of proportionate relationship or size is not influencing under effect that the present invention can produce and the purpose that can reach, all should still drop in the scope that disclosed technology contents possibly contain.Simultaneously, that is quoted in this specification reaches terms such as " one " like " upper and lower ", also is merely be convenient to narrate clear; But not in order to limit the enforceable scope of the present invention; The change of its relativeness or adjustment are under no essence change technology contents, when also being regarded as the enforceable category of the present invention.
See also Fig. 2 A to Fig. 2 E, be the encapsulating structure of tool microcomputer electric component of the present invention and the cutaway view of method for making thereof.
At first; Shown in Fig. 2 A; Prepare a base plate for packaging 20; This base plate for packaging 20 has first surface 20a and second surface 20b, and this first surface 20a and second surface 20b are formed with the first line layer 21a and the second line layer 21b respectively, and electrically connects this first line layer 21a and the second line layer 21b through the conductive through hole 200 that runs through this base plate for packaging 20.Be embedded with chip 22 in this base plate for packaging 20 again, wherein, have a plurality of electronic padses 221 that expose to this base plate for packaging 20 first surface 20a on this chip 22, this chip 22 can be application-specific IC (ASIC) chip.Then; On this first surface 20a and chip 22, form first dielectric layer 23; And on this first dielectric layer 23, form tertiary circuit layer 24; Wherein, can in first dielectric layer 23, form first conductive blind hole 241 through the mode of laser beam perforation to electrically connect this electronic pads 221 and the first line layer 21a; Then, on this first dielectric layer 23 and tertiary circuit layer 24, form second dielectric layer 25, the material of this second dielectric layer 25 can be anti-welding material or photosensitive dielectric material.And; Can have layer reinforced structure 26 on base plate for packaging 20 second surfaces that provided; Perhaps; Also can in technical process, on the second surface 20b of this base plate for packaging 20, form layer reinforced structure 26; This layer reinforced structure 26 comprises at least one the 4th dielectric layer 261, be formed at the 4th line layer 262 on the 4th dielectric layer 261, and a plurality ofly be formed in the 4th dielectric layer 261 and electrically connect the 4th line layer 262 and the 3rd conductive blind hole 263 of the second line layer 21b, again formation second welding resisting layer 27 on this layer reinforced structure 26.
Shown in Fig. 2 B; Utilize light lithography (photo-lithography) technology or laser technology to remove this second dielectric layer 25 of part to form recess 250 and to form the perforation 290 that runs through this first dielectric layer 23 and second dielectric layer 25; Then; At these recess 250 inner edges, form lid 28 with second dielectric layer, 25 top surfaces of recess 250 peripheries, wherein, lid 28 parts on these second dielectric layer, 25 top surfaces constitute lid frame 281; And the mode of passing through plating technic or deposition forms first electric connection pad 29 on this second dielectric layer 25; And in this perforation 290, form second conductive blind hole 291 that electrically connects this first line layer 21a and first electric connection pad 29, wherein, the material of this lid 28 can be metal, silicon, glass or pottery.
Shown in Fig. 2 C; On this first electric connection pad 29 and this lid frame 281, form then material 30, then material 30 is solder projection, solder(ing) paste or the glass viscose glue that is arranged at the solder projection on this first electric connection pad 29 and plants ring-type on this lid frame 281.
In addition; Shown in Fig. 2 C '; Before material 30 is followed in formation, also can on this second dielectric layer 25 and first electric connection pad 29, form first welding resisting layer 32, and form the perforate that a plurality of correspondences expose this first electric connection pad 29; And then material 30 is formed in this perforate, and the material of this first welding resisting layer 32 can be anti-welding material or photosensitive dielectric material.
Shown in Fig. 2 D; Provide a surface to be provided with the base material 40 of the microcomputer electric component 41 and second electric connection pad 401; The material of this base material 40 can be siliceous material; This second electric connection pad 401 is followed material 30 to be electrically connected to this first electric connection pad 29 through this; Also include a plurality of metal frames 402 with these base material 40 surfaces of these microcomputer electric component 41 homonymies, and through this follow material 30 with 41 pairs of this microcomputer electric components should recess 250 mode engage this base material 40 and base plate for packaging 20, just through then material 30 corresponding this lid frames 281 and metal frames 402 that connect.The metal frame 402 that is connected with this lid frame 281 is around this microcomputer electric component 41; So that this microcomputer electric component 41 is sealed in encapsulating structure inside, this microcomputer electric component 41 can be gyroscope (gyroscope), accelerometer (accelerometer) or radio-frequency micro electromechanical (RF MEMS) element.
Shown in Fig. 2 E; These layer reinforced structure 26 outermost the 4th line layers 262 also can have a plurality of solder ball pads 264; In this second welding resisting layer 27, form a plurality of correspondences and expose the respectively welding resisting layer perforate 270 of this solder ball pad 264, and respectively forming soldered ball 31 on this solder ball pad 264, last; Cut single technology (singulation), with the encapsulating structure 2 that obtains a plurality of tool microcomputer electric components.
The present invention also provides a kind of encapsulating structure 2 of tool microcomputer electric component, comprising: have the base plate for packaging 20 of relative first surface 20a and second surface 20b, and this base plate for packaging 20 has: the first line layer 21a is formed on the first surface 20a; The second line layer 21b is formed on the second surface 20b; And conductive through hole 200, run through this base plate for packaging 20 and electrically connect this first line layer 21a and the second line layer 21b; Chip 22 is embedded in this base plate for packaging 20, and has a plurality of electronic padses 221 that expose to this base plate for packaging 20 first surface 20a on this chip 22; First dielectric layer 23 is located on this first surface 20a and the chip 22, and exposes outside this first circuit 21a layer and electronic pads 221; Tertiary circuit layer 24 is located on this first dielectric layer 23 and is electrically connected this first line layer 21a and electronic pads 221; Second dielectric layer 25 is located on this first dielectric layer 23 and the tertiary circuit layer 24, and these second dielectric layer, 25 surfaces have recess 250 and run through the perforation 290 of this first dielectric layer 23 and second dielectric layer 25; Lid 28, be located at these recess 250 inner edges, with second dielectric layer, 25 top surfaces of recess 250 peripheries, wherein, lid 28 parts on these second dielectric layer, 25 top surfaces constitute lid frame 281; First electric connection pad 29 is located on this second dielectric layer 25; Second conductive blind hole 291 is located in this perforation 250 and is electrically connected this first line layer 21a and first electric connection pad 29; Then material 30 is located on this first electric connection pad 29 and this lid frame 281; And base material 40, have the base material of the being located at 40 lip-deep microcomputer electric components 41 and second electric connection pad 401, and this base material 40 with 41 pairs of this microcomputer electric components should recess 250 mode be engaged on this base plate for packaging 20.
In the encapsulating structure 2 of above-mentioned tool microcomputer electric component, also include a plurality of metal frames 402 with these base material 40 surfaces of this microcomputer electric component 41 homonymies, and through then material 30 corresponding this lid frames 281 and these metal frame second electric connection pads 402 that connect.In addition; The encapsulating structure 2 of above-mentioned tool microcomputer electric component also can comprise first welding resisting layer 32 (shown in Fig. 2 C '); Be located on this second dielectric layer 25 and first electric connection pad 29; The material of this first welding resisting layer 32 can be anti-welding material or photosensitive dielectric material, and this first welding resisting layer 32 has the perforate that a plurality of correspondences expose this first electric connection pad 29, and then material is formed in this perforate.
Again in aforesaid encapsulating structure; Also can comprise layer reinforced structure 26; Be located on this base plate for packaging 20 second surface 20a; This layer reinforced structure 26 comprises at least one the 4th dielectric layer 261, be formed at the 4th line layer 262 on the 4th dielectric layer 261, and a plurality ofly be formed in the 4th dielectric layer 261 and electrically connect the 4th line layer 262 and the 3rd conductive blind hole 263 of the second line layer 21b, and these layer reinforced structure 26 outermost the 4th line layers 262 also have a plurality of solder ball pads 264.
In the encapsulating structure of described tool microcomputer electric component; Also can comprise second welding resisting layer 27, be located on this layer reinforced structure 26 to have a plurality of correspondences in this second welding resisting layer 27 and expose the respectively welding resisting layer perforate 270 of this solder ball pad 264; Also can comprise soldered ball 31 again, be located at respectively on this solder ball pad 264.
In the encapsulating structure of described tool microcomputer electric component; This chip 22 can be application-specific IC (ASIC) chip; The material of this second dielectric layer 25 can be anti-welding material or photosensitive dielectric material; The material of this lid 28 can be metal, silicon, glass or pottery, and this microcomputer electric component 41 can be gyroscope, accelerometer or radio-frequency micro electromechanical element, and the material of this base material 40 can be siliceous material.
In sum, the encapsulating structure of tool microcomputer electric component of the present invention be directly with chip embedding bury in base plate for packaging, therefore can reduce overall package thickness of structure and volume.Moreover the present invention is through being embedded into circuit to electrically connect chip, microcomputer electric component and base plate for packaging, and its telecommunication efficiency of transmission is high than the routing mode, and its cost of manufacture is low than the routing mode.Lid of the present invention again can form with first electric connection pad and second conductive blind hole simultaneously, so can simplify processing step; And than existing QFN pattern lead frame, the formed array soldered ball of the present invention can provide the electric connection point of more and comparatively dense, and then enlarges its range of application.
The foregoing description is in order to illustrative principle of the present invention and effect thereof, but not is used to limit the present invention.Any those skilled in the art all can make amendment to the foregoing description under spirit of the present invention and category.Therefore rights protection scope of the present invention should be foundation with the scope of claims.
Claims (19)
1. the encapsulating structure of a tool microcomputer electric component is characterized in that, comprising:
Base plate for packaging with relative first surface and second surface, and this base plate for packaging has:
First line layer is formed on the first surface;
Second line layer is formed on the second surface;
Conductive through hole runs through this base plate for packaging and electrically connects this first line layer and second line layer;
Chip is embedded in this base plate for packaging, and has a plurality of electronic padses that expose to this base plate for packaging first surface on this chip;
First dielectric layer is located on this first surface and the chip, and exposes outside this first line layer and electronic pads;
The tertiary circuit layer is located on this first dielectric layer and is electrically connected this first line layer and electronic pads;
Second dielectric layer is located on this first dielectric layer and the tertiary circuit layer, the perforation that this second dielectric layer surface has recess and runs through this first and second dielectric layer;
Lid, be located at this recess inner edge, with the second dielectric layer top surface of recess periphery, wherein, the cap portion on this second dielectric layer top surface constitutes the lid frame;
First electric connection pad is located on this second dielectric layer;
Second conductive blind hole is located in this perforation and is electrically connected this first line layer and first electric connection pad;
Then material is located on this first electric connection pad and this lid frame; And
Base material has the microcomputer electric component and second electric connection pad be located on the substrate surface, and this base material is engaged on this base plate for packaging mode that should recess with this microcomputer electric component.
2. the encapsulating structure of tool microcomputer electric component according to claim 1 is characterized in that, also includes metal frame with this substrate surface of this microcomputer electric component homonymy, and through then corresponding this lid frame that connects of material.
3. the encapsulating structure of tool microcomputer electric component according to claim 1; It is characterized in that; Also comprise first welding resisting layer; Be located on this second dielectric layer and first electric connection pad, and this first welding resisting layer has the perforate that a plurality of correspondences expose this first electric connection pad, and then material is formed in this perforate.
4. the encapsulating structure of tool microcomputer electric component according to claim 1; It is characterized in that; Also comprise layer reinforced structure; Be located on this base plate for packaging second surface, this layer reinforced structure comprises at least one the 4th dielectric layer, be formed at the 4th line layer on the 4th dielectric layer, and a plurality ofly be formed in the 4th dielectric layer and electrically connect the 4th line layer and the 3rd conductive blind hole of second line layer, and outermost the 4th line layer of this layer reinforced structure also has a plurality of solder ball pads.
5. the encapsulating structure of tool microcomputer electric component according to claim 4 is characterized in that, also comprises second welding resisting layer, is located on this layer reinforced structure, has a plurality of correspondences in this second welding resisting layer and exposes the respectively welding resisting layer perforate of this solder ball pad.
6. the encapsulating structure of tool microcomputer electric component according to claim 5 is characterized in that, also comprises soldered ball, is located at respectively on this solder ball pad.
7. the encapsulating structure of tool microcomputer electric component according to claim 1 is characterized in that, the material of this second dielectric layer is anti-welding material or photosensitive dielectric material.
8. the encapsulating structure of tool microcomputer electric component according to claim 3 is characterized in that, the material of this first welding resisting layer is anti-welding material or photosensitive dielectric material.
9. the encapsulating structure of tool microcomputer electric component according to claim 1 is characterized in that, the material of this base material is a siliceous material.
10. the method for making of the encapsulating structure of a tool microcomputer electric component is characterized in that, comprising:
Preparation one has the base plate for packaging of relative first surface and second surface; The first surface of this base plate for packaging and second surface are formed with first line layer and second line layer respectively; And the conductive through hole through running through this base plate for packaging electrically connects this first line layer and second line layer; Be embedded with chip in this base plate for packaging, have a plurality of electronic padses that expose to this base plate for packaging first surface on this chip;
On this first surface and chip, form first dielectric layer in regular turn and electrically connect this electronic pads and the tertiary circuit layer of first line layer;
On this first dielectric layer and tertiary circuit layer, form second dielectric layer;
Remove this second dielectric layer of part to form the perforation that recess and formation run through this first and second dielectric layer;
At this recess inner edge, form lid with the second dielectric layer top surface of recess periphery; Wherein, Cap portion on this second dielectric layer top surface constitutes the lid frame; And on this second dielectric layer, form first electric connection pad, and in this perforation, form second conductive blind hole that electrically connects this first line layer and first electric connection pad;
On this first electric connection pad and this lid frame, form then material;
Provide a surface to be provided with the base material of the microcomputer electric component and second electric connection pad; And
With this microcomputer electric component mode that should recess is engaged this base material and base plate for packaging.
11. the method for making of the encapsulating structure of tool microcomputer electric component according to claim 10 is characterized in that, also includes a plurality of metal frames with this substrate surface of this microcomputer electric component homonymy, and through then corresponding this lid frame that connects of material.
12. the method for making of the encapsulating structure of tool microcomputer electric component according to claim 10; It is characterized in that; Also be included in to form and follow before the material; On this second dielectric layer and first electric connection pad, form first welding resisting layer, and form the perforate that a plurality of correspondences expose this first electric connection pad, and then material is formed in this perforate.
13. the method for making of the encapsulating structure of tool microcomputer electric component according to claim 10; It is characterized in that; Also be included on this base plate for packaging second surface and form layer reinforced structure; This layer reinforced structure comprises at least one the 4th dielectric layer, be formed at the 4th line layer on the 4th dielectric layer, and a plurality ofly be formed in the 4th dielectric layer and electrically connect the 4th line layer and the 3rd conductive blind hole of second line layer, and outermost the 4th line layer of this layer reinforced structure also has a plurality of solder ball pads.
14. the method for making of the encapsulating structure of tool microcomputer electric component according to claim 13 is characterized in that, also be included in to form second welding resisting layer on this layer reinforced structure, and a plurality of correspondences of formation exposes the respectively welding resisting layer perforate of this solder ball pad in this second welding resisting layer.
15. the method for making of the encapsulating structure of tool microcomputer electric component according to claim 14 is characterized in that, also is included in respectively and forms soldered ball on this solder ball pad.
16. the method for making of the encapsulating structure of tool microcomputer electric component according to claim 15 is characterized in that, also comprises cutting single technology, to obtain the encapsulating structure of a plurality of tool microcomputer electric components.
17. the method for making of the encapsulating structure of tool microcomputer electric component according to claim 10 is characterized in that, the material of this second dielectric layer is anti-welding material or photosensitive dielectric material.
18. the method for making of the encapsulating structure of tool microcomputer electric component according to claim 12 is characterized in that, the material of this first welding resisting layer is anti-welding material or photosensitive dielectric material.
19. the method for making of the encapsulating structure of tool microcomputer electric component according to claim 10 is characterized in that, the material of this base material is a siliceous material.
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