CN102398386B - Highly heat-conducting electric insulation composite material - Google Patents
Highly heat-conducting electric insulation composite material Download PDFInfo
- Publication number
- CN102398386B CN102398386B CN201110255193.1A CN201110255193A CN102398386B CN 102398386 B CN102398386 B CN 102398386B CN 201110255193 A CN201110255193 A CN 201110255193A CN 102398386 B CN102398386 B CN 102398386B
- Authority
- CN
- China
- Prior art keywords
- high heat
- layer
- electric insulation
- composite material
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a highly heat-conducting electric insulation composite material. The highly heat-conducting electric insulation composite material comprises insulation surface layers and heat-conducting core layers and is prepared by alternately distributing and superposing the insulation layers and the heat-conducting core layers to form a sandwich structure, and performing composite molding, wherein an inner surface layer and an outer surface layer of the sandwich structure are the insulation layers; the number of the heat-conducting core layers is one less than that of the insulation layers in the sandwich structure; each insulation layer is made of an electric insulation high polymer material; and each heat-conducting core layer consists of hollow grids, namely heat-conducting grids which are made of a material with high heat conductivity and have a grid structure. The highly heat-conducting electric insulation composite material has the advantages of high heat conductivity, mechanical property and electric insulativity, and the like, and can be applied to the manufacturing of products such as light-emitting diode (LED) radiators, electric appliance radiators and the like.
Description
Technical field
The present invention relates to a kind of high performance high heat-conduction electric insulation composite material.
Background technology
Macromolecular material electrical insulation capability is excellent, but thermal conductivity factor is very low, be generally 0.2W/m.K, that one of percentage of metal material is to one thousandth, for some should have high heat conduction, simultaneously have again insulating properties to require application scenario at present more conventional method be the inorganic filler (aluminium nitride, aluminium oxide etc.) that interpolation has high thermal conductivity coefficient and high impedance in polymer-based material, the patents such as CN02825187.3, CN 200880011625.0 and CN201010194959.5 are all adopt in this way.
But adopt the material prepared in this way, a large amount of interpolations due to heat filling make the mechanical property of composite receive serious infringement, the raising of heat conductivility is simultaneously also remarkable, general very difficult higher than 2W/m.K.
The situation utilizing radiator area flash heat transfer is needed for LED radiator, heat radiation of electrical apparatus device etc., if the thermal conductivity factor of material is little, then its heat transfer is in the longitudinal direction just very difficult, heat all concentrates in very little region and cannot spread, cause the effective area of radiator not make full use of, have impact on radiating efficiency.
Summary of the invention
In order to solve the problem of macromolecular material heat conductivility difference in prior art, the invention provides a kind of high heat-conduction electric insulation composite material, the technical solution used in the present invention is:
A kind of high heat-conduction electric insulation composite material, described high heat-conduction electric insulation composite material comprises insulation top layer and thermal conducting core layer, described high heat-conduction electric insulation composite material is alternately distributed the stacked sandwich structure that formed by a layer insulating, one deck thermal conducting core layer and obtains described high heat-conduction electric insulation composite material through composite molding, endosexine, the extexine of described sandwich structure are insulating barrier, the one deck fewer than insulating barrier of the thermal conducting core layer described in described sandwich structure; Described insulating barrier is made up of electrical-insulation polymeric material, and described thermal conducting core layer is the latticed of hollow out, is the heat conduction grid with network be made up of high heat conductive material.
Described electrical-insulation polymeric material is the macromolecular material having the thermoplastic macromolecule material of good electrical insulating properties, thermoset macromolecule material or add heat-conductive insulation filling modification.
Described high heat conductive material is the metal material of high heat conduction, material with carbon element or inorganic material, is preferably metal material.
Further, described metal material is one or more the combination in silver, copper, copper alloy, aluminium, aluminium alloy, zinc, kirsite, titanium, titanium alloy or iron and steel;
Described material with carbon element is one or both the mixing in carbon fiber or graphite;
Described inorganic material is one or more the combination in aluminium nitride, boron nitride, aluminium oxide, magnesia, beryllium oxide, silicon nitride, carborundum.
Described thermal conducting core layer is the latticed of hollow out, and described hollow out latticed is the shape of any center hollow out, such as square, circular, rhombus or any irregularly shaped.
Described heat conduction grid makes the structure with crisscross gridding with high heat conductive material through braiding, punching press or welding method.
The structure of the polymer-based composite thermal conducting core layer of high heat-conduction electric insulation is the structure with crisscross gridding, to make the macromolecular material on upper and lower two top layers mutually be bonded together in the space by thermal conductive network lattice structure when composite molding, improve the mechanical property of composites.
Sandwich structure of the present invention can be insulating barrier for endosexine, extexine, and centre is the individual layer sandwich structure of one deck thermal conducting core layer, and as shown in Figure 1, in Fig. 1,1 is insulating barrier, and 2 is thermal conducting core layer; Also multilayer sandwiched structure can be formed, described multilayer sandwiched structure is made up of m layer insulating and (m-1) layer thermal conducting core layer, described insulating barrier and thermal conducting core layer are alternately stacked one by one, endosexine, the extexine of described sandwich structure are insulating barrier, m is the positive integer of more than 3, and accompanying drawing 2 is multilayer sandwiched structural representation during m=3, in Fig. 2,1 is insulating barrier, and 2 is thermal conducting core layer.
Sandwich knot of the present invention also can looping structure, and inner ring top layer, the outer shroud top layer of described loop configuration are insulating barrier, is the thermal conducting core layer of one deck annular in the middle of described inner ring top layer, outer shroud top layer.Further, sandwich structure of the present invention can form multi-layer annular structure, by n layer insulating and (n-1) layer thermal conducting core layer looping structure, inner ring top layer, the outer shroud top layer of described loop configuration are insulating barrier, be the concentric ring that insulating barrier and thermal conducting core layer replace stacked composition one by one in the middle of described inner ring top layer, outer shroud top layer, n is the positive integer of more than 3.
The method of composite molding of the present invention is compression molding, extrusion molding, cast molding or injection moulding.Further, laminated into type or cast molding can be adopted when being thermosets for plane based article or top layer macromolecular material, can adopt extrusion molding for tubulose or plane based article, the goods for shape matching complexity can adopt injection moulding or compression-moulding methods preparation.
Know-why of the present invention adopts the material of high thermal conductivity coefficient to prepare network structure heat-conducting layer, heat is made to be diffused into rapidly in whole composite by high heat conduction network, more uniform Temperature Distribution is formed in whole composite, outwards conducted by the macromolecular material on top layer again, solve the shortcoming that the poor material heat of thermal conductivity cannot utilize area to dispel the heat in time.
High heat-conduction electric insulation composite material provided by the invention has the advantages such as high-termal conductivity, excellent in mechanical performance and high electrical insulating properties, can be applicable to product such as preparation LED radiator and heat radiation of electrical apparatus device etc.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of individual layer composites sandwich structures.
Fig. 2 is the schematic diagram of double layer sandwich structural composite material.
Fig. 3 is for having heat conduction network ring-type composites sandwich structures LED radiator illustraton of model
Fig. 4 is the relation curve of homogeneous material cylinder radiator bottom thermal transfer surface temperature and material thermal conductivity
Detailed description of the invention
With specific embodiment, the present invention will be further described below, but protection scope of the present invention is not limited thereto.
Adopt according to summary of the invention and prepare with the individual layer sandwich structure that the grid material of high heat transfer coefficient is thermal conducting core layer, take macromolecular material as insulation top layer the hollow cylinder LED radiator model that a diameter is 30mm, height is 2mm for 50mm, wall thickness, centered by thermal conducting core layer mesh-density, distance is 3x 3mm, cylindrical bottom is the polymeric dielectric layer of 2mm and the metal level compound of 1mm, heat is evenly delivered to the polymeric dielectric layer of 2mm by the metal back layer of 1mm, then is delivered to the surface of cylindrical heat-radiating device; The heat power of setting metal back layer is 2 watts.Can the heat conducting situation of analytical model by ANSYS software steady-state thermal analysis module, and obtain the maximum temperature T of metal back layer
max, T
maxthe key index in design LED radiator, T
maxtoo highly luminous efficiency and the service life of LED, general T will be affected
maxcontrol at 60-70 DEG C.
The T that the homogeneous material that we also can simulate the different thermal conductivity factors of same size equally obtains as radiator
max, obtain homogeneous material cylinder radiator bottom temp T
maxwith the relation curve of material thermal conductivity, see Fig. 4.
Contrast two kinds of situations are adopted to obtain T
max, as both T
max, then we can obtain the thermal conductivity factor of composite and homogeneous material equivalence.Can be found by the simulation of different embodiment, adopt the Equivalent Thermal Conductivities of sandwich to be to accomplish very high, be much better than the heat-conducting polymer material adopting the modification of common interpolation heat filling.
Embodiment 1
The grid material of thermal conducting core layer adopts thermal conductivity factor to be the fine copper of 400W/m.K, and the diameter of grid material is 1mm, and centered by mesh-density, distance is 3x3mm.The polymer insulation layer material on two surfaces adopts polybutylene terephthalate (PBT) (PBT), and its thermal conductivity factor is 0.2W/m.K.By injection moulding method prepare diameter be 30mm, highly for 50mm, wall thickness are 2mm, wherein there is the sandwich cylindrical LED radiator of thermal conductive network grid material as inserts, cylindrical bottom is the polymeric dielectric layer of 2mm and the metal level compound of 1mm, heat is evenly delivered to the polymeric dielectric layer of 2mm by the metal back layer of 1mm, then is delivered to the surface of cylindrical heat-radiating device; The heat power of setting metal back layer is 2 watts, utilizes ANSYS software (ANSYS Workbench 11.0) steady-state thermal analysis module simulation to calculate T
max=46.7 DEG C, the Equivalent Thermal Conductivities that can be obtained sandwich by Fig. 4 is 39.2W/m.K.
Embodiment 2
The grid material of thermal conducting core layer adopts thermal conductivity factor to be the fine copper of 400W/m.K, and the diameter of grid material is 0.8mm, and the polymer insulation layer material on two surfaces adopts polybutylene terephthalate (PBT) (PBT), and its thermal conductivity factor is 0.2W/m.K.By the method for embodiment 1 prepare shaping after, utilize ANSYS Workbench11.0 steady-state thermal analysis module simulation to calculate T
max=48.3 DEG C, the Equivalent Thermal Conductivities that can be obtained sandwich by Fig. 4 is 27.4W/m.K.
Embodiment 3
The grid material of thermal conducting core layer adopts thermal conductivity factor to be the fine copper of 400W/m.K, and the diameter of grid material is 0.6mm, and the polymer insulation layer material on two surfaces adopts PBT, and its thermal conductivity factor is 0.2W/m.K.By the method for embodiment 1 prepare shaping after, utilize ANSYS Workbench 11.0 steady-state thermal analysis module simulation to calculate T
max=51.2 DEG C, the Equivalent Thermal Conductivities that can be obtained sandwich by Fig. 4 is 17.3W/m.K.
Embodiment 4
The grid material of thermal conducting core layer adopts thermal conductivity factor to be the aluminium of 200W/m.K, and the diameter of grid material is 1mm, and the polymer insulation layer material on two surfaces adopts PBT, and its thermal conductivity factor is 0.2W/m.K.By the method for embodiment 1 prepare shaping after, utilize ANSYS Workbench 11.0 steady-state thermal analysis module simulation to calculate T
max=49.0 DEG C, the Equivalent Thermal Conductivities that can be obtained sandwich by Fig. 4 is 23.8W/m.K.
Embodiment 5
The grid material of thermal conducting core layer adopts thermal conductivity factor to be the aluminium of 200W/m.K, and the diameter of grid material is 1mm, and the polymer insulation layer material on two surfaces adopts the PBT adding the modification of 50wt% aluminium oxide heat filling, and its thermal conductivity factor is 1W/m.K.By the method for embodiment 1 prepare shaping after, utilize ANSYS Workbench11.0 steady-state thermal analysis module simulation to calculate T
max=48.2 DEG C, the Equivalent Thermal Conductivities that can be obtained sandwich by Fig. 4 is 27.6W/m.K.
Embodiment 6
The grid material of thermal conducting core layer adopts thermal conductivity factor to be the steel of 60W/m.K, and the diameter of grid material is 1mm, and the polymer insulation layer material on two surfaces adopts Merlon (PC), and its thermal conductivity factor is 0.2W/m.K.By the method for embodiment 1 prepare shaping after, utilize ANSYS Workbench 11.0 steady-state thermal analysis module simulation to calculate T
max=57.3 DEG C, the Equivalent Thermal Conductivities that can be obtained sandwich by Fig. 4 is 8.5W/m.K.
Embodiment 7
The grid material of thermal conducting core layer adopts thermal conductivity factor to be the steel of 60W/m.K, and the diameter of grid material is 0.6mm, and the polymer insulation layer material on two surfaces adopts heat cured unsaturated polyester resin, and its thermal conductivity factor is 0.2W/m.K.Using thermal conductive network grid material as inserts, adopt the preparation of the method for cast molding to have the radiator of composite construction, utilize ANSYS Workbench 11.0 steady-state thermal analysis module simulation to calculate T
max=70.6 DEG C, the Equivalent Thermal Conductivities that can be obtained sandwich by Fig. 4 is 2.8W/m.K.
Embodiment 8
The grid material of thermal conducting core layer adopts thermal conductivity factor to be the aluminium nitride ceramics of 200W/m.K, and the diameter of grid material is 1mm, and the polymer insulation layer material on two surfaces adopts heat cured unsaturated polyester resin, and its thermal conductivity factor is 0.2W/m.K.Using thermal conductive network grid material as inserts, adopt the preparation of the method for cast molding to have the radiator of composite construction, utilize ANSYS Workbench 11.0 steady-state thermal analysis module simulation to calculate T
max=49.0 DEG C, the Equivalent Thermal Conductivities that can be obtained sandwich by Fig. 4 is 23.0W/m.K.
Embodiment 9
The grid material employing thermal conductivity factor of thermal conducting core layer is the grid cloth of the carbon fiber knit of 500W/m.K, and the thickness of grid material is 0.6mm, and the polymer insulation layer material on two surfaces adopts heat cured unsaturated polyester resin, and its thermal conductivity factor is 0.2W/m.K.First the grid cloth of carbon fiber knit being flooded in unsaturated polyester resin aftershaping is cylindric inserts, then prepares composite structure radiator by cast molding method, utilizes ANSYS Workbench 11.0 steady-state thermal analysis module simulation to calculate T
max=50.0 DEG C, the Equivalent Thermal Conductivities that can be obtained sandwich by Fig. 4 is 19.6W/m.K.
Can be found out by the contrast of embodiment 1 with embodiment 6, the thermal conductivity factor of thermal conductive network grid material has considerable influence to composite Equivalent Thermal Conductivities, the thermal conductivity factor of two grid materials is respectively 400W/m.K and 60W/m.K, and the Equivalent Thermal Conductivities of two composites is respectively 39.2W/m.K and 8.5W/m.K.
Can be found out by the contrast of embodiment 1, embodiment 2 and embodiment 3, when other conditions are identical, the Size on Composite Equivalent Thermal Conductivities of thermal conductive network grid material has considerable influence, when heat conduction Mesh Diameter is respectively 1mm, 0.8mm and 0.6mm, the Equivalent Thermal Conductivities of corresponding composite is respectively 39.2W/m.K, 27.4W/m.K and 17.3W/m.K.
Can be found by Fig. 4, when the thermal conductivity factor of radiator material is less (≤10W/m.K), the thermal conductivity factor of material is to radiator bottom temp T
maxconsiderable influence, this be due to radiator bottom heat cannot get rid of, cause T
maxraise; After the thermal conductivity factor of radiator material is greater than 10W/m.K, then the thermal conductivity factor improving material is to reduction T
maximpact very little.
Claims (10)
1. the high heat-conduction electric insulation composite material for the preparation of LED radiator and heat radiation of electrical apparatus device, it is characterized in that described high heat-conduction electric insulation composite material comprises insulation top layer and thermal conducting core layer, described high heat-conduction electric insulation composite material is alternately distributed the stacked sandwich structure that formed by a layer insulating, one deck thermal conducting core layer and obtains described high heat-conduction electric insulation composite material through composite molding, endosexine, the extexine of described sandwich structure are insulating barrier, the one deck fewer than insulating barrier of the thermal conducting core layer described in described sandwich structure; Described insulating barrier is made up of electrical-insulation polymeric material, and described thermal conducting core layer is the latticed of hollow out, is the heat conduction grid with network be made up of high heat conductive material.
2. high heat-conduction electric insulation composite material as claimed in claim 1, is characterized in that described electrical-insulation polymeric material is the macromolecular material having the thermoplastic macromolecule material of good electrical insulating properties, thermoset macromolecule material or add heat-conductive insulation filling modification.
3. high heat-conduction electric insulation composite material as claimed in claim 1, is characterized in that described high heat conductive material is the metal material of high heat conduction, material with carbon element or inorganic material;
Described metal material is one or more the combination in silver, copper, copper alloy, aluminium, aluminium alloy, zinc, kirsite, titanium, titanium alloy or iron and steel;
Described material with carbon element is one or both the mixing in carbon fiber or graphite;
Described inorganic material is one or more the combination in aluminium nitride, boron nitride, aluminium oxide, magnesia, beryllium oxide, silicon nitride, carborundum.
4. high heat-conduction electric insulation composite material as claimed in claim 1, is characterized in that described thermal conducting core layer is the latticed of hollow out, and described hollow out latticed is the shape of any center hollow out.
5. high heat-conduction electric insulation composite material as claimed in claim 1, is characterized in that described heat conduction grid makes the structure with crisscross gridding with high heat conductive material through braiding, punching press or welding method.
6. high heat-conduction electric insulation composite material as claimed in claim 1, is characterized in that described sandwich structure is endosexine, extexine is insulating barrier, and centre is the individual layer sandwich structure of one deck thermal conducting core layer.
7. high heat-conduction electric insulation composite material as claimed in claim 1, it is characterized in that described sandwich structure circularizes structure, inner ring top layer, the outer shroud top layer of described loop configuration are insulating barrier, are the thermal conducting core layer of one deck annular in the middle of described inner ring top layer, outer shroud top layer.
8. high heat-conduction electric insulation composite material as claimed in claim 1, it is characterized in that described sandwich structure is made up of m layer insulating and (m-1) layer thermal conducting core layer, described insulating barrier and thermal conducting core layer are alternately stacked one by one, endosexine, the extexine of described sandwich structure are insulating barrier, and m is the positive integer of more than 3.
9. high heat-conduction electric insulation composite material as claimed in claim 1, it is characterized in that described sandwich structure is by n layer insulating and (n-1) layer thermal conducting core layer looping structure, inner ring top layer, the outer shroud top layer of described loop configuration are insulating barrier, be the concentric ring that insulating barrier and thermal conducting core layer replace stacked composition one by one in the middle of described inner ring top layer, outer shroud top layer, n is the positive integer of more than 3.
10. high heat-conduction electric insulation composite material as claimed in claim 1, is characterized in that the method for described composite molding is compression molding, extrusion molding, cast molding or injection moulding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110255193.1A CN102398386B (en) | 2011-08-31 | 2011-08-31 | Highly heat-conducting electric insulation composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110255193.1A CN102398386B (en) | 2011-08-31 | 2011-08-31 | Highly heat-conducting electric insulation composite material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102398386A CN102398386A (en) | 2012-04-04 |
| CN102398386B true CN102398386B (en) | 2015-01-28 |
Family
ID=45881231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110255193.1A Active CN102398386B (en) | 2011-08-31 | 2011-08-31 | Highly heat-conducting electric insulation composite material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102398386B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102649328B (en) * | 2012-05-14 | 2015-07-15 | 陈建伟 | Metal wire mesh reinforced heat-conducting plastic with high strength, high corrosion resistance and high heat conductivity |
| CN102816442A (en) * | 2012-07-31 | 2012-12-12 | 华南理工大学 | Composite material with high heat conductivity |
| CN104152751B (en) * | 2014-07-07 | 2016-08-24 | 安徽吉思特智能装备有限公司 | A kind of LED aluminum-base composite heat sink material containing modified potassium titanate crystal whisker |
| CN104087792B (en) * | 2014-07-08 | 2016-06-08 | 安徽艳阳电气集团有限公司 | A kind of LED insulation heatproof aluminum-base composite heat sink material |
| CN104164631B (en) * | 2014-07-22 | 2016-08-24 | 安徽冠宇光电科技有限公司 | A kind of LED aluminum-base composite heat sink material containing modified alumina silicate fibre |
| CN104376936B (en) * | 2014-11-22 | 2016-08-17 | 吉林市能兴电力设备有限公司 | Lightning protection pillar insulator |
| CN106048327A (en) * | 2016-08-11 | 2016-10-26 | 安徽波浪岛游乐设备有限公司 | LED substrate composite heat radiation material and production method thereof |
| CN106863923A (en) * | 2017-03-01 | 2017-06-20 | 联想(北京)有限公司 | Plate construction with grid laminboard layer and the product casing including the plate construction |
| CN111572114A (en) * | 2020-05-13 | 2020-08-25 | 湖南东映碳材料科技有限公司 | Carbon net composite membrane and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5540969A (en) * | 1992-12-28 | 1996-07-30 | Asea Brown Boveri Ltd. | Insulating tape and method of producing it |
| CN101545587A (en) * | 2009-06-08 | 2009-09-30 | 刘素霞 | A preparation method of high-performance heat-radiating semiconductor planar light source |
| CN201413692Y (en) * | 2009-06-01 | 2010-02-24 | 苏州巨峰金属线缆有限公司 | Self-adhesive high-thermal-conductivity double glass fiber copper-clad aluminum flat wire |
| CN102055266A (en) * | 2010-12-29 | 2011-05-11 | 哈尔滨电机厂有限责任公司 | High thermal conductivity insulation structure of stator bar of excess epoxy mould pressing insulation system |
| CN202344914U (en) * | 2011-08-31 | 2012-07-25 | 浙江工业大学 | High-heat-conductivity electric insulating composite material |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7655868B2 (en) * | 2008-01-08 | 2010-02-02 | General Electric Company | Stator bar components with high thermal conductivity |
-
2011
- 2011-08-31 CN CN201110255193.1A patent/CN102398386B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5540969A (en) * | 1992-12-28 | 1996-07-30 | Asea Brown Boveri Ltd. | Insulating tape and method of producing it |
| CN201413692Y (en) * | 2009-06-01 | 2010-02-24 | 苏州巨峰金属线缆有限公司 | Self-adhesive high-thermal-conductivity double glass fiber copper-clad aluminum flat wire |
| CN101545587A (en) * | 2009-06-08 | 2009-09-30 | 刘素霞 | A preparation method of high-performance heat-radiating semiconductor planar light source |
| CN102055266A (en) * | 2010-12-29 | 2011-05-11 | 哈尔滨电机厂有限责任公司 | High thermal conductivity insulation structure of stator bar of excess epoxy mould pressing insulation system |
| CN202344914U (en) * | 2011-08-31 | 2012-07-25 | 浙江工业大学 | High-heat-conductivity electric insulating composite material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102398386A (en) | 2012-04-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102398386B (en) | Highly heat-conducting electric insulation composite material | |
| CN105140194A (en) | Heat-superconducting radiator and manufacturing method thereof | |
| CN1551339A (en) | Thermal management device or heat sink manufactured from conductive loaded resin-based materials | |
| CN103247399A (en) | Surface tack thermistor element | |
| CN202344914U (en) | High-heat-conductivity electric insulating composite material | |
| CN102711367B (en) | A kind of heat conduction aluminum substrate and preparation method thereof | |
| CN105163485A (en) | Heat conducting substrate for heating device and heating device and manufacturing method thereof | |
| CN201197197Y (en) | PTC gridding surface-shape heater | |
| CN102548353A (en) | Stack-up type membrane heat dissipation structure and realization method thereof | |
| CN202439289U (en) | Graphite composite membrane | |
| CN201708146U (en) | Radiator and semiconductor module with the same | |
| CN201785338U (en) | Composite heat-dissipating graphite material | |
| CN202074871U (en) | Self-adjustment high heat dissipation film composite material | |
| CN103722804B (en) | A kind of Quaternary liquid metal heat interface material with two melting point character | |
| CN102538547A (en) | Self-adjusting high heat dissipation film composite material and manufacturing method thereof | |
| CN105679424A (en) | High-voltage power cable | |
| CN103087415B (en) | Thermally conductive and insulating composite material and preparation method thereof | |
| CN206124035U (en) | Hot plate for vulcanizer | |
| CN204392757U (en) | Electrographite thin slice and graphite substrate | |
| CN209930824U (en) | Wave plate is inhaled in heat dissipation | |
| CN212086511U (en) | Electroluminescence thin film | |
| CN202523767U (en) | Big power LED heat radiation device | |
| CN203703900U (en) | Upright-type heat-dissipation structure with plastic heat-dissipation lamp body for LED lamp | |
| CN208305978U (en) | A kind of high-cooling property aluminum-based copper-clad plate structure | |
| CN203596271U (en) | Current transformer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191225 Address after: 314415 within huangwan town government, Jiaxing City, Zhejiang Province Patentee after: Haining huangwan town Asset Management Co.,Ltd. Address before: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee before: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Effective date of registration: 20191225 Address after: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee after: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Address before: 310014 Hangzhou city in the lower reaches of the city of Zhejiang Wang Road, No. 18 Patentee before: Zhejiang University of Technology |