CN102395250A - Vacuum pumping device and method for circuit board - Google Patents
Vacuum pumping device and method for circuit board Download PDFInfo
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- CN102395250A CN102395250A CN2011103399522A CN201110339952A CN102395250A CN 102395250 A CN102395250 A CN 102395250A CN 2011103399522 A CN2011103399522 A CN 2011103399522A CN 201110339952 A CN201110339952 A CN 201110339952A CN 102395250 A CN102395250 A CN 102395250A
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- guide bar
- air guide
- circuit board
- groove
- support
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Abstract
The embodiment of the invention discloses a vacuum pumping device and a method for a circuit board. The device comprises a bracket (201), a glass frame (204), a sealing rubber ring (205), and gas guide strips (206), wherein grooves (207) are formed on the surfaces of the gas guide strips (206); difference value between the sum of the thickness of a circuit board (202) placed between the bracket (201) and the glass frame (204) and that of a bottom plate (203), and the thickness of the gas guide strips (206) is larger than or equal to zero, and is within a preset value; the gas guide strips (206) are located in a cavity between the bracket (201) and the glass frame (204); the sealing rubber ring (205) is used for sealing the cavity between the bracket (201) and the glass frame (204); and an air exhaust outlet (209) formed on the vacuum pumping device is communicated with the grooves (207) formed on the gas guide strips (206). The invention can improve the vacuum pumping effect and the product yield of the PCB.
Description
Technical field
The present invention relates to circuit board manufacturing technology field, the apparatus and method that particularly a kind of circuit board vacuumizes.
Background technology
Base plate for packaging be a kind of printed substrate that is exclusively used in Chip Packaging (Printed Circuit Board, PCB).Substrate can be chip effects such as electrical connection, protection, support, heat radiation, assembling is provided, and to realize many pinizations, dwindles the encapsulating products volume, improves the purpose of electrical property and thermal diffusivity, VHD or multi-chip moduleization.Base plate for packaging is a kind of of circuit board, and the embodiment of the invention will describe as example, and circuit board can also be: printed circuit board, flexible PCB etc.; Therefore base plate for packaging is not the exhaustive of embodiment of the invention range of application, base plate for packaging should not be construed as qualification for example to embodiment of the invention range of application.
The fine-line manufacture craft flow process of base plate for packaging shown in Figure 1A to Fig. 1 E, comprising successively: blanking, paste dry film, exposure, etching, take off film.
Figure 1A, the blanking step is covered Copper Foil 102 on central layer 101;
Figure 1B pastes the dry film step, on Copper Foil 102, pastes dry film 103;
Fig. 1 C, step of exposure is made circuit through exposure at dry film 103;
Fig. 1 D, etching step through acid etching, etches away the Copper Foil 102 that does not cover dry film 103 and produces circuit;
Fig. 1 E takes off the film step at last and removes the dry film 103. on the Copper Foil 102
In above technological process, the exposure flow process mainly use silver film do egative film with figure transfer to plate, this is one of fine-line making core process.The shutter of general base plate for packaging graph exposure machine is " sandwich " structure, and the shutter size is generally fixed, plate that can the production fixed dimension." sandwich " as shown in Figure 2 structure; Shutter is mainly support (holder) 201, substrate 202A and instrument bezel 203 and is " sandwich " structure; Egative film 203 is between instrument bezel 204 and substrate 202A; (Ultraviolet Rays UV) passes instrument bezel 204 and makes public with egative film 203 ultraviolet light shown in the arrow on Fig. 2 right side.In this step, need bleed through the bleeding point that is arranged on the shutter, make the inner vacuum state that forms of shutter, make between substrate 202A and egative film 203, egative film 203 and the instrument bezel 204 to be close together.Therefore shutter also has O-ring seal 205.
Yet; If shutter is during greater than the plate size, after air was drawn out of, the air pressure of shutter internal cavity can step-down; The pressure that the atmospheric pressure that causes the instrument bezel outer surface to receive receives much larger than the instrument bezel inner surface; Thereby instrument bezel can be out of shape, and causes vacuumizing bad, in step of exposure, also can badly cause ultraviolet light to produce refraction aliasing (void of promptly exposing to the sun) occurring because of vacuumizing in addition; Cause after etching step is carried out, occurring edges of boards thus and owe corrosion and short circuit phenomenon, thereby PCB product yields is low.
Summary of the invention
The apparatus and method that the embodiment of the invention provides a kind of circuit board to vacuumize improve the effect that vacuumizes, and promote PCB product yields.
The device that the embodiment of the invention provides a kind of circuit board to vacuumize comprises:
Support (201), instrument bezel (204), O-ring seal (205), air guide bar (206);
The plane of air guide bar (206) is provided with groove (207), and the difference of thickness of thickness sum and air guide bar (206) that is positioned over circuit board (202) and egative film (203) between support (201) and the instrument bezel (204) is more than or equal to 0, and difference is in predetermined value;
Air guide bar (206) is positioned at the cavity between support (201) and the instrument bezel (204), and O-ring seal (205) seals the cavity between said support (201) and the instrument bezel (204);
The bleeding point that is provided with on the device that said circuit board vacuumizes (209) is communicated with the groove 207 of air guide bar (206).
The method that the embodiment of the invention also provides a kind of circuit board to vacuumize comprises:
Circuit board (202) and egative film (203) are positioned in the device that any described circuit board of claim 1 to 6 vacuumizes, and placement location is: between support (201) and the instrument bezel (204);
Air guide bar (206) is placed between support (201) and the instrument bezel (204);
The vacuum pumping opening (209) that is provided with on the device that vacuumizes through said circuit board is extracted the interior air of cavity between support (201) and the instrument bezel (204) out.
Can find out from above technical scheme; The embodiment of the invention has the following advantages: owing to air guide bar 206 is arranged as supporting, after air was drawn out of, instrument bezel 204 can be pressed on the air guide bar 206; Instrument bezel 204 just can not be out of shape like this; Use this scheme, even shutter is very big, but also production small size plate.Break through in the making of circuit board fine-line; The graph exposure machine can only be produced the rigid requirement of unique size plate, is not changing under the device hardware, through increasing the air guide bar 206 of band groove; Elimination vacuumizes bad, thereby solves the empty problem of exposing to the sun that optical disc production small size plate occurs of making public.Therefore improve the effect that vacuumizes, and promoted PCB product yields.
Description of drawings
In order to be illustrated more clearly in the technical scheme in the embodiment of the invention; The accompanying drawing of required use is briefly introduced in will describing embodiment below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skill in the art; Under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
Figure 1A is a prior art base plate for packaging baiting structure sketch map;
Figure 1B pastes the dry film structural representation for the prior art base plate for packaging;
Fig. 1 C is a prior art base plate for packaging exposure structure sketch map;
Fig. 1 D is a prior art base plate for packaging etch structures sketch map;
Fig. 1 E takes off the membrane structure sketch map for the prior art base plate for packaging;
Fig. 2 is a prior art shutter structural representation;
The apparatus structure sketch map that Fig. 3 vacuumizes for embodiment of the invention circuit board;
Fig. 4 is an embodiment of the invention air guide bar schematic cross-section;
Fig. 5 is an embodiment of the invention I shape air guide bar structural representation;
Fig. 6 is the L shaped air guide bar of an embodiment of the invention structural representation;
Fig. 7 is an embodiment of the invention method flow sketch map;
Fig. 8 A is an embodiment of the invention supporting structure sketch map;
Fig. 8 B is an embodiment of the invention circuit board put area sketch map;
Fig. 8 C is an embodiment of the invention air guide bar scheme of installation.
Embodiment
In order to make the object of the invention, technical scheme and advantage clearer, will combine accompanying drawing that the present invention is done to describe in detail further below, obviously, described embodiment only is a part of embodiment of the present invention, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making all other embodiment that obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
The device that the embodiment of the invention provides a kind of circuit board to vacuumize, as shown in Figure 3, wherein the arrow shown in Fig. 3 right side is the ultraviolet light incident direction, is not the part of device; Please consult air guide bar 206 sectional views shown in Figure 4 in the lump, comprising:
The plane of air guide bar 206 is provided with groove 207, and the difference of thickness of thickness sum and air guide bar 206 that is positioned over circuit board 202 and egative film 203 between support 201 and the instrument bezel 204 is more than or equal to 0, and difference is in predetermined value;
The bleeding point 209 that is provided with on the device that the foregoing circuit plate vacuumizes is communicated with the groove 207 of air guide bar 206.
When being illustrated in 0.1 centimetre, the experimental data of above-mentioned predetermined value can reach the technique effect that the embodiment of the invention requires.The position of the device that above-mentioned bleeding point 209 vacuumizes at circuit board can be also can be at instrument bezel 204 at support 201, can also will not limit this embodiment of the invention at sealing ring 205.
If the device that the foregoing circuit plate vacuumizes is applied to the scene that substrate vacuumizes, foregoing circuit plate 202 is substrate 202A so.Need to prove that circuit board 202 can also be printed circuit board, flexible PCB etc.; The scheme of the embodiment of the invention is applied to the scene that other circuit boards beyond the base plate for packaging vacuumize, and also can reach the effect of the embodiment of the invention.It is understandable that base plate for packaging is not the exhaustive of embodiment of the invention range of application, should not be construed as the qualification to the embodiment of the invention.
Embodiment of the invention scheme is owing to have air guide bar 206 as supporting, and after air was drawn out of, instrument bezel 204 can be pressed on the air guide bar 206, and instrument bezel 204 just can not be out of shape like this, uses this scheme, even shutter is very big, but also production small size plate.Break through in the making of circuit board fine-line; The graph exposure machine can only be produced the rigid requirement of unique size plate, is not changing under the device hardware, through increasing the air guide bar 206 of band groove; Elimination vacuumizes bad, thereby solves the empty problem of exposing to the sun that optical disc production small size plate occurs of making public.Therefore improve the effect that vacuumizes, and promoted PCB product yields.
Preferably, air guide bar 206 as shown in Figure 4, the plane of above-mentioned air guide bar 206 is provided with groove 207 and is specially: be provided with groove 207 on two relative planes of air guide bar 206.Even need to prove the air guide bar is that a plane is provided with groove 207 and also is fine, groove 207 air-out more smoothly is set all on the two sides preferably.
Preferably, like Fig. 5, the groove 207 of above-mentioned air guide bar 206 is oblique, and oblique direction is pointed to vacuum pumping opening 209.More specifically, the groove 207 of above-mentioned air guide bar 206 is oblique 45 with the limit of air guide bar 206.Above-mentioned 45 is a preferred angle, can also be other angle in the actual fabrication process, and is just passable as long as the oblique direction of groove 207 is pointed to vacuum pumping opening 209.Can reduce the circuitous of air like this, with air-out more smoothly.
More preferably, above-mentioned air guide bar 206 is an I shape or L shaped; Aim at sideline 208 rectangular distributions on I shape and L shaped air guide bar 206 and the support 201.Wherein shown in Figure 5 is the air guide bar of I shape, and shown in Figure 6 is L shaped air guide bar.
The method that the embodiment of the invention also provides a kind of circuit board to vacuumize, as shown in Figure 7, comprising:
701: in the device that any one circuit board that circuit board 202 and egative film 203 are positioned over the embodiment of the invention and provide vacuumizes, placement location is: between support 201 and the instrument bezel 204;
702: air guide bar 206 is placed between support 201 and the instrument bezel 204;
Preferably, be provided with groove 207 on two of above-mentioned air guide bar 206 relative planes.
If the groove of air guide bar 206 207 is oblique 45 with the limit of air guide bar 206; Then also comprise: the direction of the groove 207 of air guide bar 206 is pointed to vacuum pumping opening 209.
If above-mentioned air guide bar 206 is an I shape or L shaped; Then also comprise: the position of adjustment I shape and L shaped air guide bar 206 makes and aims at sideline 208 rectangular distributions on I shape and L shaped air guide bar 206 and the support 201.
703: the air in the cavity that the vacuum pumping opening 209 that is provided with on the device that vacuumizes through the foregoing circuit plate is extracted out between supports 201 and the instrument bezel 204.
In the above-described embodiments; If above-mentioned air guide bar 206 is an I shape or L shaped; Concrete installation process is shown in Fig. 8 A to Fig. 8 C, and wherein the support 201 among Fig. 8 A is provided with and aims at sideline 208, shown in the dotted line; When this aligning sideline 208 was used for circuit board 202 placements, a sideline of circuit board 202 was aimed at it.Shown in Fig. 8 B, hatched example areas is that circuit board 202 is placed on the zone on the support 201.On the support shown in Fig. 8 A 201, also be provided with vacuum pumping opening 209, when carrying out exhaust, air extracted out in cavity from this vacuum pumping opening 209.
Shown in Fig. 8 C, aim at sideline 208 rectangular distributions on I shape and L shaped air guide bar 206 and the support 201, circuit board 202 can be placed in the zone of above-mentioned rectangle with egative film 203 like this.
I shape air guide bar 206 shown in Fig. 8 C is installed in the upper left side and the upper right side of rectangular area, and L shaped air guide bar 206 is installed in the following and lower right corner, a left side of rectangular area.
Because air guide bar 206 is arranged as supporting, after air was drawn out of, instrument bezel 204 can be pressed on the air guide bar 206, instrument bezel 204 just can not be out of shape like this, uses this method, even shutter is very big, but also production small size plate.Break through in the making of circuit board fine-line; The graph exposure machine can only be produced the rigid requirement of unique size plate, is not changing under the device hardware, through increasing the air guide bar 206 of band groove; Elimination vacuumizes bad, thereby solves the empty problem of exposing to the sun that optical disc production small size plate occurs of making public.
Need to prove; For aforesaid method embodiment, for simple description, so it all is expressed as a series of combination of actions; But those skilled in the art should know; The present invention does not receive the restriction of described sequence of movement, because according to the present invention, some step can adopt other orders or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in the specification all belongs to preferred embodiment, and related action and module might not be that the present invention is necessary.
More than method that the circuit board that the embodiment of the invention provided is vacuumized carried out detailed introduction; Used concrete example among this paper principle of the present invention and execution mode are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that on embodiment and range of application, all can change, to sum up, this description should not be construed as limitation of the present invention.
Claims (10)
1. the device that circuit board vacuumizes is characterized in that, comprising:
Support (201), instrument bezel (204), O-ring seal (205), air guide bar (206);
The plane of air guide bar (206) is provided with groove (207), and the difference of thickness of thickness sum and air guide bar (206) that is positioned over circuit board (202) and egative film (203) between support (201) and the instrument bezel (204) is more than or equal to 0, and difference is in predetermined value;
Air guide bar (206) is positioned at the cavity between support (201) and the instrument bezel (204), and O-ring seal (205) seals the cavity between said support (201) and the instrument bezel (204);
The bleeding point that is provided with on the device that said circuit board vacuumizes (209) is communicated with the groove (207) of air guide bar (206).
2. according to the said device of claim 1, it is characterized in that the plane of air guide bar (206) is provided with groove (207) and is specially:
The air guide bar is provided with groove (207) on (206) two relative planes.
3. according to the said device of claim 1, it is characterized in that said bleeding point (209) is communicated with the groove (207) of air guide bar (206) and is specially:
The groove (207) of air guide bar (206) is oblique, and oblique direction is pointed to vacuum pumping opening (209).
4. according to the said device of claim 3, it is characterized in that the groove (207) of said air guide bar (206) is oblique 45 with the limit of air guide bar (206).
5. according to the said device of claim 1, it is characterized in that said predetermined value is 0.1 centimetre.
6. according to any said device of claim 1 to 5, it is characterized in that said air guide bar (206) is an I shape or L shaped; Aim at the rectangular distribution in sideline (208) on I shape and L shaped air guide bar (206) and the support (201).
7. the method that circuit board vacuumizes is characterized in that, comprising:
Circuit board (202) and egative film (203) are positioned in the device that any described circuit board of claim 1 to 6 vacuumizes, and placement location is: between support (201) and the instrument bezel (204);
Air guide bar (206) is placed between support (201) and the instrument bezel (204);
The vacuum pumping opening (209) that is provided with on the device that vacuumizes through said circuit board is extracted the interior air of cavity between support (201) and the instrument bezel (204) out.
8. according to the said method of claim 7, it is characterized in that, be provided with groove (207) on two relative planes of said air guide bar (206).
9. according to the said method of claim 7, it is characterized in that, if the limit of the groove (207) of air guide bar (206) and air guide bar (206) is oblique 45; Also comprise:
The direction of the groove (207) of air guide bar (206) is pointed to vacuum pumping opening (209).
10. according to any said method of claim 7 to 9, it is characterized in that, if said air guide bar (206) is an I shape or L shaped; Also comprise:
The position of adjustment I shape and L shaped air guide bar (206) makes and aims at the rectangular distribution in sideline (208) on I shape and L shaped air guide bar (206) and the support (201).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110339952 CN102395250B (en) | 2011-11-01 | 2011-11-01 | Vacuum pumping device and method for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110339952 CN102395250B (en) | 2011-11-01 | 2011-11-01 | Vacuum pumping device and method for circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN102395250A true CN102395250A (en) | 2012-03-28 |
| CN102395250B CN102395250B (en) | 2013-08-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201110339952 Active CN102395250B (en) | 2011-11-01 | 2011-11-01 | Vacuum pumping device and method for circuit board |
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| CN (1) | CN102395250B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102478593A (en) * | 2010-11-30 | 2012-05-30 | 励威电子股份有限公司 | Probe card structure |
| CN103048890A (en) * | 2012-12-20 | 2013-04-17 | 景旺电子科技(龙川)有限公司 | PIN alignment system and method for outer manual exposure machine |
| CN104677566A (en) * | 2013-11-28 | 2015-06-03 | 天津华赛尔传热设备有限公司 | Fixed vacuuming platform for plate pair leakage detection for plate type heat exchanger |
| CN110411613A (en) * | 2019-09-04 | 2019-11-05 | 川北真空科技(北京)有限公司 | Air guide washer and its manufacturing method |
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| EP0618505A1 (en) * | 1993-03-31 | 1994-10-05 | Automa-Tech | Device for exposing to light a double sided circuit board plate through printing plates |
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| CN201937973U (en) * | 2011-03-09 | 2011-08-17 | 厦门高威尔电子科技有限公司 | Improved air pumping system of flexible printed circuit board exposure machine |
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| US5337151A (en) * | 1992-07-28 | 1994-08-09 | Optical Radiation Corporation | Double-sided circuit board exposure machine and method with optical registration and material variation compensation |
| EP0618505A1 (en) * | 1993-03-31 | 1994-10-05 | Automa-Tech | Device for exposing to light a double sided circuit board plate through printing plates |
| CN1170149A (en) * | 1996-05-15 | 1998-01-14 | 奥托玛-泰克公司 | Light exposure installation of double-sided printed circuit plate through artworks |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102478593A (en) * | 2010-11-30 | 2012-05-30 | 励威电子股份有限公司 | Probe card structure |
| CN102478593B (en) * | 2010-11-30 | 2014-04-16 | 励威电子股份有限公司 | Probe card structure |
| CN103048890A (en) * | 2012-12-20 | 2013-04-17 | 景旺电子科技(龙川)有限公司 | PIN alignment system and method for outer manual exposure machine |
| CN104677566A (en) * | 2013-11-28 | 2015-06-03 | 天津华赛尔传热设备有限公司 | Fixed vacuuming platform for plate pair leakage detection for plate type heat exchanger |
| CN110411613A (en) * | 2019-09-04 | 2019-11-05 | 川北真空科技(北京)有限公司 | Air guide washer and its manufacturing method |
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| Publication number | Publication date |
|---|---|
| CN102395250B (en) | 2013-08-21 |
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Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |