CN110913595B - Wet film pressing optimization structure and wet film pressing method - Google Patents
Wet film pressing optimization structure and wet film pressing method Download PDFInfo
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- CN110913595B CN110913595B CN201911229233.8A CN201911229233A CN110913595B CN 110913595 B CN110913595 B CN 110913595B CN 201911229233 A CN201911229233 A CN 201911229233A CN 110913595 B CN110913595 B CN 110913595B
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- air
- film
- film pressing
- air pipe
- dry film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0186—Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a wet film pressing optimization structure and a wet film pressing method, wherein the wet film pressing optimization structure comprises an air pipe support and an air pipe support connecting block, wherein air pipes are rotatably arranged on two sides of the support connecting block, one end of each air pipe is sealed, and an air inlet interface valve is arranged at the other end of each air pipe; the air pipe is provided with an air blowing hole in the axial direction, the bottom of the air pipe support is a support bottom plate, and the support connecting block is of a cuboid structure transversely arranged. The invention has simple structure, ensures the uniform water film of the board surface and the semi-floating state when the dry film is relaxed by adding the special blowing device and utilizing the flowing gas generated by the blowing device, and meets the requirements of improving the wet film pressing bubbles and improving the film pasting quality.
Description
Technical Field
The invention belongs to a PCB image transfer process, and particularly relates to a wet film pressing optimization structure and a wet film pressing method.
Background
With the advent of HDI (High Density Interconnection) technology, electronic products are continuously developing towards miniaturization, light weight, high speed, multi-functionalization and High reliability, the circuit manufacturing capability has reached an unprecedented height, 40/40um circuits have been widely used in High-end HDI products, 35/35um circuits have also entered the mass production stage, such High fine circuits have extremely strict requirements for the quality of copper surfaces, and the fine copper surface depressions will cause poor circuit quality. In order to improve the quality of fine circuits, companies adopt a wet film pressing process, but in the actual application process of the wet film pressing process, as a dry film falls under the action of gravity before film pressing, the dry film is in contact with a board surface in advance, film pressing bubbles are generated in the film pressing process, and the quality is poor.
Disclosure of Invention
The present invention is to solve the above-mentioned drawbacks of the prior art, and provides a wet film pressing optimization structure and a wet film pressing method with simple structure and low cost, so as to achieve the purposes of ensuring uniform water film on the board surface and semi-floating dry film when the dry film is relaxed, improving wet film pressing bubbles, and improving the film sticking quality.
According to the technical scheme provided by the invention: a wet-type film pressing optimization structure comprises an air pipe support, wherein a support connecting block is arranged at the upper part of the air pipe support, air pipes are rotatably arranged on two sides of the support connecting block, one end of each air pipe is sealed, and an air inlet interface valve is arranged at the other end of each air pipe; the air pipe is provided with an air blowing hole in the axial direction.
As a further improvement of the invention, the bottom of the air pipe support is a support bottom plate.
As a further improvement of the invention, the support connecting block is of a cuboid structure transversely arranged.
As a further improvement of the invention, two sides of the support connecting block are provided with support connecting holes.
As a further improvement of the invention, lantern rings are arranged on two sides of the support connecting block, and an air pipe is rotatably arranged in the lantern rings.
As a further improvement of the invention, the air pipe is provided with the air blowing holes at equal intervals in the axial direction.
As a further improvement of the invention, the aperture of the air blowing hole is less than 0.5mm.
As a further improvement of the invention, the trachea is 700+/-200mm in length and 60+/-20mm in diameter.
A wet lamination method comprising the steps of:
a. the optimized structure is arranged right in front of a water-coating wheel in a film pressing machine, an air inlet interface valve is connected into an air pressure pipe, the direction of an air blowing hole is respectively aligned with an upper film pressing wheel and a lower film pressing wheel, and an upper dry film sucking disc and a lower dry film sucking disc are arranged between the optimized structure and the upper film pressing wheel and between the optimized structure and the lower film pressing wheel;
b. after the circuit board is subjected to a water coating process, the circuit board is conveyed from back to front along a support base plate towards the directions of an upper film pressing wheel and a lower film pressing wheel;
c. after the film sticking strip pre-presses the dry film to the front end of the circuit board, the air inlet interface valve is opened, air is blown to the circuit board through the air blowing holes, and the positions of the board surface where the water film is not formed are blown away into uniform water films, so that the uniformity of the water films on the board surface is ensured;
d. when the film pasting strip is pressed downwards, the upper dry film sucker and the lower dry film sucker stop sucking air, so that the dry films are loosened and are in a semi-floating state, the circuit board and the optimization structure move forwards together, and the dry films fall down under the action of self gravity;
e. the hole of blowing will relax the side dry film and blow gently, makes it be in half cursory state, avoids the dry film to contact the face in advance and causes the press mold bubble, and after circuit board and dry film got into press mold wheel from top to bottom completely, the upper and lower dry film sucking disc can breathe in again, adsorbs the dry film.
Compared with the prior art, the invention has the following advantages:
1. the invention has simple structure, easy realization and lower cost.
2. According to the invention, by adding the special air blowing device and utilizing the flowing gas generated by the air blowing device, the uniform water film on the board surface and the semi-floating state of the dry film when the dry film is relaxed are ensured, and the requirements of improving wet film pressing bubbles and improving the film pasting quality are met.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic diagram of the position structure of the lantern ring, the air pipe, the air blowing hole and the air inlet interface valve.
Fig. 3 is a schematic structural view of the trachea support of the invention.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings.
In the figures 1-3, the support comprises a lantern ring 1, an air pipe 2, an air blowing hole 3, an air inlet interface valve 4, an air pipe support 6, a support bottom plate 6-1, a support connecting block 6-2, a support connecting hole 6-3 and the like.
As shown in figure 1, the invention relates to a wet-type film pressing optimization structure which comprises a gas pipe support 6, as shown in figure 3, the bottom of the gas pipe support 6 is a support bottom plate 6-1, the upper part of the gas pipe support 6 is a support connecting block 6-2, the support connecting block 6-2 is a cuboid structure transversely arranged, support connecting holes 6-3 are formed in two sides of the support connecting block 6-2, bolts penetrate through the support connecting holes 6-3 to connect the gas pipe support 6 in a film pressing machine, as shown in figure 2, lantern rings 1 are arranged on two sides of the support connecting block 6-2, a gas pipe 2 is arranged in the lantern ring 1 to facilitate adjustment of a blowing angle, the gas pipe 2 is transversely arranged, one end of the gas pipe 2 is sealed, an air inlet interface valve 4 is arranged at the other end of the gas pipe 2, and the gas blowing holes 3 are formed in the gas pipe 2 at equal intervals in the axial direction of the gas pipe 2. The aperture of the air blowing hole 3 is less than 0.5mm.
The trachea 2 is 700+/-200mm in length and 60+/-20mm in diameter.
A wet lamination method comprises the following steps:
a. the optimized structure is arranged right in front of a water coating wheel in a film pressing machine, an air inlet valve 4 is connected into an air pressure pipe, the direction of an air blowing hole 3 is respectively aligned to an upper film pressing wheel and a lower film pressing wheel, and an upper dry film sucking disc and a lower dry film sucking disc are arranged between the optimized structure and the upper film pressing wheel and between the optimized structure and the lower film pressing wheel;
b. after the circuit board is subjected to the water coating process, the circuit board is conveyed from back to front along the support base plate 6-1 in the direction of the upper film pressing wheel and the lower film pressing wheel;
c. after the film sticking strip pre-presses the dry film to the front end of the circuit board, the air inlet interface valve 4 is opened, air is blown to the circuit board through the air blowing holes 3, the positions of the board surface where the water film is not formed are blown away into uniform water films, and the uniformity of the water films on the board surface is ensured;
after the film sticking strip pre-presses the dry film to the front end of the circuit board, the air inlet interface valve 4 is opened, air is blown to the circuit board through the air blowing holes 3, the positions of the board surface where the water film is not formed are blown away into uniform water films, and the uniformity of the water films on the board surface is ensured;
d. when the film pasting strip is pressed downwards, the upper dry film sucker and the lower dry film sucker stop sucking air, so that the dry films are loosened and are in a semi-floating state, the circuit board and the optimization structure move forwards together, and the dry films fall down under the action of self gravity;
e. the hole of blowing 3 blows the side dry film of lax gently, makes it be in half floating state, avoids the dry film to contact the face in advance and causes the pressure membrane bubble, after circuit board and dry film got into press mold wheel from top to bottom completely, upper and lower dry film sucking disc can breathe in again, adsorbs the dry film.
Claims (8)
1. A wet lamination method comprises the following steps:
a. an optimized structure is installed right in front of a water-coating wheel in a film pressing machine, the optimized structure comprises an air pipe support (6), a support connecting block (6-2) is arranged at the upper part of the air pipe support (6), air pipes (2) are rotatably installed on two sides of the support connecting block (6-2), one end of each air pipe (2) is sealed, and an air inlet interface valve (4) is installed at the other end of each air pipe; the air pipe (2) is provided with an air blowing hole (3) in the axial direction, an air inlet interface valve (4) is connected into an air pressure pipe, the direction of the air blowing hole (3) is respectively aligned to the upper film pressing wheel and the lower film pressing wheel, and an upper dry film sucking disc and a lower dry film sucking disc are arranged between the optimized structure and the upper film pressing wheel and the lower film pressing wheel;
b. after the circuit board is subjected to a water coating process, the circuit board is conveyed from back to front along a support base plate (6-1) towards the directions of an upper film pressing wheel and a lower film pressing wheel;
c. after the film sticking strip pre-presses the dry film to the front end of the circuit board, the air inlet interface valve (4) is opened, air is blown to the circuit board through the air blowing holes (3), and the positions of the board surface where the water film is not formed are blown away into uniform water films, so that the uniform water films of the board surface are ensured;
d. when the film pasting strip is pressed downwards, the upper dry film sucker and the lower dry film sucker stop sucking air, so that the dry films are loosened and are in a semi-floating state, the circuit board and the optimization structure move forwards together, and the dry films fall down under the action of self gravity;
e. the air blowing holes (3) blow up the dry film on the loose side lightly to enable the dry film to be in a semi-floating state, so that the dry film is prevented from contacting the board surface in advance to cause film pressing bubbles, and after the circuit board and the dry film completely enter the upper film pressing wheel and the lower film pressing wheel, the upper dry film sucking disc and the lower dry film sucking disc can suck air again to adsorb the dry film.
2. A wet lamination process according to claim 1, wherein: the bottom of the air pipe support (6) is a support bottom plate (6-1).
3. A wet lamination process according to claim 1, wherein: the support connecting block (6-2) is of a cuboid structure transversely arranged.
4. A wet lamination process according to claim 1, wherein: and support connecting holes (6-3) are formed in two sides of the support connecting block (6-2).
5. A wet lamination process according to claim 1, wherein: lantern rings (1) are installed on two sides of the support connecting block (6-2), and an air pipe (2) is rotatably installed in the lantern rings (1).
6. A wet lamination process according to claim 1, wherein: the air pipe (2) is provided with the air blowing holes (3) at equal intervals in the axial direction.
7. A wet lamination process according to claim 1, wherein: the aperture of the air blowing hole (3) is less than 0.5mm.
8. A wet lamination process according to claim 1, wherein: the length of the air pipe (2) is 700+/-200mm, and the diameter of the air pipe is 60+/-20mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911229233.8A CN110913595B (en) | 2019-12-04 | 2019-12-04 | Wet film pressing optimization structure and wet film pressing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911229233.8A CN110913595B (en) | 2019-12-04 | 2019-12-04 | Wet film pressing optimization structure and wet film pressing method |
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| Publication Number | Publication Date |
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| CN110913595A CN110913595A (en) | 2020-03-24 |
| CN110913595B true CN110913595B (en) | 2022-12-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911229233.8A Active CN110913595B (en) | 2019-12-04 | 2019-12-04 | Wet film pressing optimization structure and wet film pressing method |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113816144A (en) * | 2021-08-23 | 2021-12-21 | 甘肃旭盛显示科技有限公司 | Glass substrate fetching device and glass substrate production line |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105712108A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Transfer device, film laminator and wet film lamination method |
| CN206383451U (en) * | 2017-01-19 | 2017-08-08 | 东莞市进通电子有限公司 | It is a kind of to prevent the blowning installation of land area pressing mold |
| CN207978178U (en) * | 2018-01-12 | 2018-10-16 | 欣强电子（清远）有限公司 | It is a kind of efficiently to tear protective film machine automatically |
-
2019
- 2019-12-04 CN CN201911229233.8A patent/CN110913595B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105712108A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Transfer device, film laminator and wet film lamination method |
| CN206383451U (en) * | 2017-01-19 | 2017-08-08 | 东莞市进通电子有限公司 | It is a kind of to prevent the blowning installation of land area pressing mold |
| CN207978178U (en) * | 2018-01-12 | 2018-10-16 | 欣强电子（清远）有限公司 | It is a kind of efficiently to tear protective film machine automatically |
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| CN110913595A (en) | 2020-03-24 |
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Address after: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32 Applicant after: Gaode (Jiangsu) Electronic Technology Co.,Ltd. Address before: Jiangsu province Wuxi Chunhui road 214101 Xishan City Economic Development Zone No. 32 Applicant before: GULTECH (JIANGSU) ELECTRONIC TECHNOLOGIES CO.,LTD. |
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