CN219514330U - Copper foil lamination tool for circuit board - Google Patents
Copper foil lamination tool for circuit board Download PDFInfo
- Publication number
- CN219514330U CN219514330U CN202320150650.9U CN202320150650U CN219514330U CN 219514330 U CN219514330 U CN 219514330U CN 202320150650 U CN202320150650 U CN 202320150650U CN 219514330 U CN219514330 U CN 219514330U
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- CN
- China
- Prior art keywords
- plate
- suction
- copper foil
- pressing plate
- plates
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 239000011889 copper foil Substances 0.000 title claims abstract description 54
- 238000003475 lamination Methods 0.000 title abstract description 3
- 238000003825 pressing Methods 0.000 claims abstract description 60
- 238000010030 laminating Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model provides a copper foil lamination tool for a circuit board, which is characterized by comprising the following components: a pressing plate and four suction plates. The pressing plate is of a rectangular plate-shaped structure; four suction plates are respectively movably connected to the periphery of the pressing plate, the suction plates are of a strip-shaped structure and are parallel to the side face of the pressing plate, the bottom face of each suction plate is provided with a vacuum suction hole, the bottom face of each suction plate is parallel to the bottom face of the pressing plate, when the suction plates move upwards relative to the pressing plate, the suction plates simultaneously move to the outer side of the pressing plate, and when the suction plates move upwards to the highest point, the bottom faces of the suction plates and the bottom faces of the pressing plate are in the same plane. Can effectively prevent the copper foil from wrinkling.
Description
Technical Field
The utility model belongs to the field of equipment for producing circuit boards, and particularly relates to a copper foil laminating tool for a circuit board.
Background
The base materials for manufacturing the circuit board are mainly two kinds, namely a copper-clad plate with copper-clad layers on two sides, and a copper foil is adhered to the surface of the insulating substrate. In the process of pasting copper foil, the circuit board formed by adopting the copper foil pasting mode generally needs to transfer the copper foil onto the insulating substrate by utilizing a vacuum chuck, then the copper foil and the insulating substrate are pressed by utilizing a pressing plate, and the copper foil and the insulating substrate are tightly pasted by heating while pressing. The phenomenon of copper foil wrinkling often occurs in the existing copper foil pasting process, so that materials are scrapped, and two main reasons exist for the phenomenon, wherein one reason is that the existing sucker usually adopts a plurality of independently arranged sucking discs with disc structures to adsorb the copper foil, and the copper foil is wrinkled during the adsorption; another reason is that the copper foil is not stretched while being laminated, resulting in wrinkles being formed in the copper foil.
Disclosure of Invention
In order to solve the defects in the prior art, the utility model provides the copper foil laminating tool for the circuit board, which can effectively prevent the copper foil from being wrinkled.
In order to achieve the object of the utility model, the following scheme is adopted:
the utility model provides a circuit board copper foil pressfitting frock which characterized in that includes: a pressing plate and four suction plates.
The pressing plate is of a rectangular plate-shaped structure;
four suction plates are respectively movably connected to the periphery of the pressing plate, the suction plates are of a strip-shaped structure and are parallel to the side face of the pressing plate, the bottom face of each suction plate is provided with a vacuum suction hole, the bottom face of each suction plate is parallel to the bottom face of the pressing plate, when the suction plates move upwards relative to the pressing plate, the suction plates simultaneously move to the outer side of the pressing plate, and when the suction plates move upwards to the highest point, the bottom faces of the suction plates and the bottom faces of the pressing plate are in the same plane.
Further, the suction plate and the pressing plate are connected in an isomorphic parallel four-bar structure.
Further, two groups of parallel four-bar structures are arranged between each suction plate and the side face of the pressing plate, each parallel four-bar structure comprises two connecting plates with the same length, two ends of each connecting plate are respectively connected to the side wall of the pressing plate and the side wall of the suction plate in a rotating mode, and the two connecting plates are parallel to each other.
Further, the top surfaces around the pressing plate are all provided with outwards extending baffles, the bottom surfaces of the baffles are connected with the tops of the suction plates through springs, when the springs are in a natural state, the bottom surfaces of the suction plates are lower than the bottom surfaces of the pressing plate, and at the moment, the connecting plates are connected with one ends of the suction plates in an inclined downward mode.
Further, both ends of the suction plate are provided with pipe joints connected with the vacuum suction pipe.
The utility model has the beneficial effects that: the copper foil is adsorbed by an adsorption structure of an annular frame formed by four adsorption plates so as to keep the flatness of the adsorbed copper foil and prevent local wrinkles of the copper foil; the copper foil is stretched by the suction plates around, so that the copper foil is always in a stretched state in the process of pressing the copper foil by the pressing plate, and the copper foil after pressing is prevented from being wrinkled.
Drawings
The drawings described herein are for illustration of selected embodiments only and not all possible implementations, and are not intended to limit the scope of the utility model.
Fig. 1 shows a schematic view of the bottom structure of the present utility model.
Fig. 2 shows a schematic view of the use state of the present utility model.
The marks in the figure: the device comprises a pressing plate-1, a baffle plate-11, a spring-12, a suction plate-2, a pipe joint-21, a connecting plate-31, a workbench-4 and an insulating substrate-5.
Description of the embodiments
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the following detailed description of the embodiments of the present utility model will be given with reference to the accompanying drawings, but the described embodiments of the present utility model are some, but not all embodiments of the present utility model.
As shown in fig. 1 and 2, a copper foil laminating tool for a circuit board includes: a pressing plate 1 and four suction plates 2.
The pressing plate 1 is of a rectangular plate-shaped structure, the top of the pressing plate is used for being connected with a transfer device to realize the integral movement of the tool, and the transfer device can be constructed by adopting a cylinder which is horizontally and vertically arranged;
the four suction plates 2 are respectively and movably connected to the periphery of the pressing plate 1, the suction plates 2 are of strip-shaped structures and are parallel to the side surfaces of the pressing plate 1, the bottom surface of each suction plate 2 is provided with a vacuum suction hole, copper foil is sucked by negative pressure, the suction structures of an annular frame are formed by the four suction plates 2 so as to keep the flatness of the sucked copper foil, local wrinkling of the copper foil is prevented, the bottom surfaces of the suction plates 2 are parallel to the bottom surface of the pressing plate 1, when the suction plates 2 move upwards relative to the pressing plate 1, the suction plates 2 move outwards of the pressing plate 1 at the same time, when the suction plates 2 move upwards to the highest point, the bottom surfaces of the suction plates 2 and the bottom surface of the pressing plate 1 are in the same plane, the copper foil can be stretched around by the aid of the four-side suction plates 2, the copper foil is gradually pressed close to the bottom surface of the pressing plate 1, the copper foil is always in a stretched state in the process of pressing the copper foil, and wrinkling after pressing is prevented; conversely, when the suction plate 2 moves downward with respect to the platen 1, the suction plate 2 moves toward the middle of the platen 1 at the same time, and the bottom surface of the suction plate 2 is lower than the bottom surface of the platen 1.
Preferably, the suction plate 2 and the pressing plate 1 are connected in an isomorphic parallel four-bar structure, so as to ensure that the bottom surface of the suction plate 2 is always parallel to the bottom surface of the pressing plate 1 in the process of moving up and down relative to the pressing plate 1.
More specifically, as shown in fig. 1 and 2, two sets of parallel four-bar structures are arranged between each suction plate 2 and the side surface of the pressing plate 1, each parallel four-bar structure comprises two connecting plates 31 with the same length, two ends of each connecting plate 31 are respectively connected to the side wall of the pressing plate 1 and the side wall of the suction plate 2 in a rotating manner, the two connecting plates 31 are parallel to each other, and the parallel four-bar structures are formed by jointly constructing the two connecting plates 31, the side wall of the pressing plate 1 and the side wall of the suction plate 2.
Preferably, as shown in fig. 2, the top surface around the pressing plate 1 is provided with the baffle plate 11 extending outwards, the bottom surface of the baffle plate 11 is connected with the top of the suction plate 2 through the spring 12, when the spring is in a natural state, the bottom surface of the suction plate 2 is lower than the bottom surface of the pressing plate 1, at the moment, the connecting plate 31 is connected with one end of the suction plate 2 in an inclined downward manner, as shown in fig. 2, when the copper foil is pressed towards the insulating substrate 5 on the workbench 4 by the fixture, the suction plate 2 is contacted with the workbench firstly, the supporting force of the workbench 4 to the suction plate 2 can enable the suction plate 2 to move upwards relative to the pressing plate 1, at the moment, the spring 12 is compressed, one end of the connecting plate 31 connected with the suction plate 2 swings upwards, and the connecting plate 31 gradually tends to be in a horizontal state, and the end connected with the suction plate 2 is gradually far away from the side wall of the pressing plate 1, so that the connecting plate 31 can drive the suction plate 2 gradually moves outwards of the pressing plate 1, thereby tightening the copper foil, and the bottom surface of the suction plate 2 is close to the bottom surface of the copper foil towards the workbench 1 until the copper foil is completely pressed on the bottom surface of the workbench 1, the copper foil is pressed on the bottom surface of the copper foil, the copper foil on the workbench 5, the copper foil is completely, the copper foil is pressed on the insulating substrate 5, the copper foil is not tightened in the insulating substrate 5, and the insulating substrate is cured, and the copper foil is in the insulating state, and the insulating substrate is in the insulating state, and the copper foil is in the insulating state and the copper foil is in the state. After the pressing is completed, the pressing tool is separated from the workbench, and the suction plate 2 moves downwards relative to the pressing plate 1 under the action of the elastic force of the spring 12, so that the bottom surface of the suction plate 2 is lower than the bottom surface of the pressing plate 1 again.
Preferably, as shown in fig. 2, both ends of the suction plate 2 are provided with pipe joints 21 connected with vacuum suction pipes, so that the negative pressure in the suction plate 2 is more balanced and the adsorption stability of the noble copper foil is improved.
The foregoing description of the preferred embodiments of the utility model is merely exemplary and is not intended to be exhaustive or limiting of the utility model. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model.
Claims (5)
1. The utility model provides a circuit board copper foil pressfitting frock which characterized in that includes:
a pressing plate (1) with a rectangular plate-shaped structure;
four suction plates (2), swing joint is around clamp plate (1) respectively, suction plate (2) are rectangular shape structure, and are on a parallel with the side of clamp plate (1), suction plate (2) bottom surface has vacuum suction hole, the bottom surface of suction plate (2) is on a parallel with the bottom surface of clamp plate (1), when suction plate (2) upwards move for clamp plate (1), suction plate (2) remove to the outside of clamp plate (1) simultaneously, when suction plate (2) upwards move to the highest point, the bottom surface of suction plate (2) is in the coplanar with the bottom surface of clamp plate (1).
2. The copper foil laminating tool for the circuit board according to claim 1, wherein the suction plate (2) is connected with the pressing plate (1) in an isomorphic parallel four-bar structure.
3. The copper foil laminating tool of claim 2, wherein two groups of parallel four-bar structures are arranged between each suction plate (2) and the side face of the pressing plate (1), each parallel four-bar structure comprises two connecting plates (31) with the same length, two ends of each connecting plate (31) are respectively connected to the side wall of the pressing plate (1) and the side wall of the suction plate (2) in a rotating mode, and the two connecting plates (31) are parallel to each other.
4. The copper foil laminating tool of claim 2, wherein the top surfaces around the pressing plate (1) are respectively provided with an outwards extending baffle plate (11), the bottom surfaces of the baffle plates (11) are connected with the tops of the suction plates (2) through springs (12), when the springs are in a natural state, the bottom surfaces of the suction plates (2) are lower than the bottom surfaces of the pressing plate (1), and at the moment, the connecting plates (31) are connected to one ends of the suction plates (2) in an inclined downward mode.
5. The copper foil laminating tool for the circuit board according to claim 1, wherein the two ends of the suction plate (2) are provided with pipe joints (21) connected with a vacuum suction pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320150650.9U CN219514330U (en) | 2023-02-08 | 2023-02-08 | Copper foil lamination tool for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320150650.9U CN219514330U (en) | 2023-02-08 | 2023-02-08 | Copper foil lamination tool for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219514330U true CN219514330U (en) | 2023-08-11 |
Family
ID=87525237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320150650.9U Active CN219514330U (en) | 2023-02-08 | 2023-02-08 | Copper foil lamination tool for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219514330U (en) |
-
2023
- 2023-02-08 CN CN202320150650.9U patent/CN219514330U/en active Active
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