CN102394225A - 晶圆弯曲度测算方法 - Google Patents
晶圆弯曲度测算方法 Download PDFInfo
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- CN102394225A CN102394225A CN2011102963325A CN201110296332A CN102394225A CN 102394225 A CN102394225 A CN 102394225A CN 2011102963325 A CN2011102963325 A CN 2011102963325A CN 201110296332 A CN201110296332 A CN 201110296332A CN 102394225 A CN102394225 A CN 102394225A
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CN201110296332.5A CN102394225B (zh) | 2011-09-30 | 2011-09-30 | 晶圆弯曲度测算方法 |
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CN201110296332.5A CN102394225B (zh) | 2011-09-30 | 2011-09-30 | 晶圆弯曲度测算方法 |
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CN102394225A true CN102394225A (zh) | 2012-03-28 |
CN102394225B CN102394225B (zh) | 2016-06-22 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106255923A (zh) * | 2014-05-01 | 2016-12-21 | 信越半导体株式会社 | 晶圆的弯曲的评价方法与使用此评价方法的晶圆的选别方法 |
CN108666229A (zh) * | 2018-05-16 | 2018-10-16 | 德淮半导体有限公司 | 晶圆弯曲度的确定方法以及扫描设备 |
CN109560002A (zh) * | 2018-11-30 | 2019-04-02 | 上海华力微电子有限公司 | 晶圆翘曲程度的监控方法 |
CN111735392A (zh) * | 2020-06-28 | 2020-10-02 | 合肥维信诺科技有限公司 | 一种柔性显示面板及其展平度测试方法 |
WO2023108530A1 (en) * | 2021-12-16 | 2023-06-22 | Yangtze Memory Technologies Co., Ltd. | Prediction of wafer flatness |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6220080B1 (en) * | 2000-05-12 | 2001-04-24 | Sigma Tech, Inc. | Extended range and ultra precision non contact dimensional gauge for ultra thin wafers and work pieces |
JP2002243431A (ja) * | 2001-02-09 | 2002-08-28 | Hitachi Electronics Eng Co Ltd | ウエハのそり測定方法 |
CN1510732A (zh) * | 2002-12-20 | 2004-07-07 | 株式会社东芝 | 晶片平坦度评价方法、实行该评价方法的装置及其应用 |
JP2008186944A (ja) * | 2007-01-29 | 2008-08-14 | Shin Etsu Handotai Co Ltd | 気相成長用サセプタ及び気相成長装置並びに気相成長用サセプタの設計方法及び気相成長方法 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6220080B1 (en) * | 2000-05-12 | 2001-04-24 | Sigma Tech, Inc. | Extended range and ultra precision non contact dimensional gauge for ultra thin wafers and work pieces |
JP2002243431A (ja) * | 2001-02-09 | 2002-08-28 | Hitachi Electronics Eng Co Ltd | ウエハのそり測定方法 |
CN1510732A (zh) * | 2002-12-20 | 2004-07-07 | 株式会社东芝 | 晶片平坦度评价方法、实行该评价方法的装置及其应用 |
JP2008186944A (ja) * | 2007-01-29 | 2008-08-14 | Shin Etsu Handotai Co Ltd | 気相成長用サセプタ及び気相成長装置並びに気相成長用サセプタの設計方法及び気相成長方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106255923A (zh) * | 2014-05-01 | 2016-12-21 | 信越半导体株式会社 | 晶圆的弯曲的评价方法与使用此评价方法的晶圆的选别方法 |
CN106255923B (zh) * | 2014-05-01 | 2018-04-20 | 信越半导体株式会社 | 晶圆的弯曲的评价方法与使用此评价方法的晶圆的选别方法 |
US10345102B2 (en) | 2014-05-01 | 2019-07-09 | Shin-Etsu Handotai Co., Ltd. | Method for evaluating warpage of wafer and method for sorting wafer |
CN108666229A (zh) * | 2018-05-16 | 2018-10-16 | 德淮半导体有限公司 | 晶圆弯曲度的确定方法以及扫描设备 |
CN109560002A (zh) * | 2018-11-30 | 2019-04-02 | 上海华力微电子有限公司 | 晶圆翘曲程度的监控方法 |
CN111735392A (zh) * | 2020-06-28 | 2020-10-02 | 合肥维信诺科技有限公司 | 一种柔性显示面板及其展平度测试方法 |
WO2023108530A1 (en) * | 2021-12-16 | 2023-06-22 | Yangtze Memory Technologies Co., Ltd. | Prediction of wafer flatness |
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CN102394225B (zh) | 2016-06-22 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140507 |
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Effective date of registration: 20140507 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
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