CN102384654B - Sintering-purpose burner - Google Patents
Sintering-purpose burner Download PDFInfo
- Publication number
- CN102384654B CN102384654B CN201110229913.7A CN201110229913A CN102384654B CN 102384654 B CN102384654 B CN 102384654B CN 201110229913 A CN201110229913 A CN 201110229913A CN 102384654 B CN102384654 B CN 102384654B
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- quality
- base material
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- middle close
- burner
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Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/14—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silica
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/56—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides
- C04B35/565—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbides or oxycarbides based on silicon carbide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
- C04B2235/9623—Ceramic setters properties
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Furnace Charging Or Discharging (AREA)
- Ceramic Products (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
The invention provides a sintering-purpose burner, which not only achieves heat resistance and mechanical strength, but also has the characteristics of being not reacted with ceramic electronic components which are being sintered, thereby realizing excellent energy efficiency and furnace efficiency. The burner has a base material and a surface coating layer on the upper layer of the base material, wherein the base material contains 70-99 wt% of SiC and 1-30 wt% of Si.
Description
Technical field
The present invention relates to be particularly suitable for the small-sized electronic parts such as ceramic capacitor burn till burn till with holding burner (セ Star タ mono-).
Background technology
For holding for burner of using in the heat treatment at small-sized electronic parts such as ceramic capacitors, except requiring to there is heat resistance, mechanical strength, also require to have the characteristic of not reacting with the ceramic electronic components burning till.All the time, as the burner of holding with such characteristic, disclose and on the surface of the silica-based base material of aluminium oxide, formed the intermediate layer that formed by aluminium oxide and then the technology (patent documentation 1) as coating layer at its surface-coated zirconia.
In recent years, further miniaturization and along with electronic units such as ceramic capacitors, viewpoint from energy efficiency, the efficiency of furnace, demand makes this burn till the technology of holding burner minimal thickness of middle use, yet, the existing burner of holding at substrate surface with coating layer has the thickness of slab about 5mm conventionally, has energy efficiency, poor this problem of the efficiency of furnace.
Prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2007-15882 communique
Summary of the invention
The problem that invention will solve
The object of the invention is to solve foregoing problems, provide except thering is heat resistance, mechanical strength, also there is the characteristic of not reacting with the ceramic electronic components burning till, and and then energy efficiency, efficiency of furnace excellence hold burner.
The means of dealing with problems
The small-sized electronic part of the present invention completing in order to solve above-mentioned problem burns till with holding burner and is characterised in that, there is base material and the surface-coated layer that is located thereon layer, the Si of the SiC that this base material contains 70～99 quality %, 1～30 quality % (technical scheme 1).
Invention described in technical scheme 2 is characterised in that, at the small-sized electronic part described in technical scheme 1, burns till with holding in burner, and the total content of SiC and Si of take is 100 quality %, and this base material further contains Al, Fe and Ca as micro constitutent,
The content of this Al is 0.01～0.2 quality %, and the content of Fe is 0.01～0.2 quality %, and the content of Ca is 0.01～0.2 quality %.
Invention described in technical scheme 3 is characterised in that, small-sized electronic part in technical scheme 1～2 described in any one burns till with holding in burner, the surface roughness based on arithmetic average of this base material is Ra=0.1～30 μ m, elastic modelling quantity is 200～400GPa, 4 bending strengths are 100～400MPa, thermal conductivity under room temperature is 150～240W/mk, and the porosity is below 1%.
Invention described in technical scheme 4 is characterised in that, at the small-sized electronic part described in technical scheme 1 or 2, burn till with holding in burner, the middle close binder with bonding this surface-coated layer and base material, the injection coating layer of this middle close binder for forming by spraying process, this middle close binder contains take the aggregate particle that mullite is principal component, as chemical composition, the Al that contains 70～85 quality %
2o
3, 15～30 quality % SiO
2, with this Al
2o
3and SiO
2total content be 100 quality %, further contain MgO, Fe
2o
3, Na
2o, B
2o
3as micro constitutent, the content of MgO is 0.5～3 quality %, Fe
2o
3content be 0.01～0.1 quality %, Na
2the content of O is 0.05～0.5 quality %, B
2o
3content be 0.001～0.01 quality %.
Invention described in technical scheme 5 is characterised in that, at the small-sized electronic part described in technical scheme 4, burns till with holding in burner, and the average grain diameter of this aggregate particle is 5～50 μ m.
Invention described in technical scheme 6 is characterised in that, at the small-sized electronic part described in technical scheme 5, burns till with holding in burner, and the porosity of this middle close binder is 20～60%.
Invention described in technical scheme 7 is characterised in that, at the small-sized electronic part described in technical scheme 1 or 2, burns till with holding in burner, and this surface-coated layer is to be selected from through calcium oxide (CaO) or yttria (Y by stacked
2o
3) stabilized zirconia, the BaZrO of stabilisation
3and CaZrO
3in the zirconia compound of at least one formation form, there is the thickness of 50～500 μ m.
Invention described in technical scheme 8 is characterised in that, it uses the manufacture method of holding burner for the small-sized electronic part described in technical scheme 4 burns till, the slurry of the mixed material that silica material forms is added in use in the aggregate raw material of middle close binder, by spraying process after the stacked middle close binder in the surface of base material, at this silica material, by heating to become, at vitreous temperature, carry out burn-back, by middle close binder and substrate bonding, and then, by spraying plating or spraying process at the stacked surface-coated layer in the surface of this middle close binder.
Invention effect
Small-sized electronic part of the present invention burn till with hold burner be there is base material and be located thereon layer surface-coated layer sandwich construction hold burner, this base material has following formation: contain respectively the SiC of 70～99 quality %, the Si of 1～30 quality %.The Si-SiC sintered body of the Si of the SiC that contains 70～99 quality %, 1～30 quality % is compared heat resistance, excellent corrosion resistance with the sintered body of alumina silica matter, and possesses high strength and the such physical property of high heat conductance.In the present invention, by adopt high-intensity Si-SiC sintered body as base material seek to hold burner minimal thickness, seek the raising of the efficiency of furnace, simultaneously by adopting the Si-SiC sintered body of high heat conductance to seek the raising of energy efficiency.Upper strata by the base material such forms the surface-coated layer with the characteristic of not reacting with the ceramic electronic components burning till, thereby except thering is heat resistance, mechanical strength, also there is the characteristic of not reacting with the ceramic electronic components burning till, and and then the burner of holding of the 3-tier architecture that is base material with existing use alumina silica compares, can realize the burner of holding of energy efficiency, efficiency of furnace excellence.
Accompanying drawing explanation
Fig. 1 is the observation image (SEM image) of the composition picture of middle close binder.
The specific embodiment
The present invention be there is base material and be located thereon layer surface-coated layer hold burner, the Si of the SiC that this base material contains 70～99 quality %, 1～30 quality %.Base material, surface-coated layer and the gluing of surfaces coating layer between base material and surface-coated layer and the middle close binder of base material are described respectively below.
(base material)
As base material raw material, use: the SiC powder of the C powder that contains 1～12 quality %, 88～99 quality %, and then join in addition the raw material of meter (take SiC and Si total content be 100 quality %) the organic bonding agent that contains 0.1～15 quality % and the moisture of appropriate amount.Mixing this shaping is with raw material and be configured as formed body.Then, this formed body is placed under metallic silicon atmosphere to not active gases atmosphere or the vacuum of decompression, makes impregnation metallic silicon in formed body, manufacture Si-SiC based sintered material.
This base material join that meter (using SiC and Si total content be 100 quality %) further contains the Al of 0.01～0.2 quality % beyond preferably, the Ca of the Fe of 0.01～0.2 quality %, 0.01～0.2 quality % as micro constitutent, the surface roughness that is preferably based on arithmetic average is Ra=0.1～30 μ m, elastic modelling quantity is 200～400GPa, intensity is 100～400MPa, thermal conductivity under room temperature is 150～240W/mk, and the porosity is below 1%.The parts by use with such chemical composition and physical property, can seek lightweight, evenly heating, high strength and the long lifetime of base material.
When the above-mentioned metallic silicon of impregnation, the porosity of the Si-SiC based sintered material that obtains of take carries out impregnation as the mode below 1%.Now, the addition of metal Si is due to relation of impregnation efficiency etc., the theoretical amount required with the porosity of realizing 1% compare need to be made as excessive.That is,, in order to realize 1% the porosity, need to excessively add above metal Si to compare 1.05 times with this theoretical amount.The metal Si now adding for the part of the reaction in Si+C → SiC, the part of landfill pore and these three kinds of modes of remaining Si part be consumed.When being less than 1.05 times, can producing the Si impregnation the porosity bad and sintered body that makes to obtain and increase, make oxidative resistance to reduce, therefore not preferred.In addition, although owing to giving excessive metal Si, unnecessary Si can leach into the surface of sintered body, and it can be removed by sanding machine, lathe processing, machining etc.The result of impregnation metal Si is in this wise, as the Si-SiC based sintered material obtaining, the SiC of the Si that principal phase contains 1～30 quality % and 70～99 quality %.
As the manufacturing process of base material, can be any one in stamping, castable, extrusion molding, from the viewpoint of production, preferably stamping.As pressuring method preferred oil press, hydraulic press pressure is now generally 10～200MPa.
(middle close binder)
In the present invention, alleged middle close binder refers to and is formed at the surperficial gluing of surfaces coating layer of base material and the layer of base material.
In the present invention, the slurry of the mixed material that the silica material of ormal weight forms has been added in use in the aggregate raw material of middle close binder, superficial layer poststack by spraying process at base material, at silica material, by heating to become at vitreous temperature, carry out burn-back, by middle close binder and substrate bonding.
This middle close binder contains take the aggregate particle that mullite is principal component, as the chemical composition of middle close binder, and the Al that contains 70～85 quality %
2o
3, 15～30 quality % SiO
2, below beyond join meter, the Fe of the MgO that contains 0.5～3 quality %, 0.01～0.1 quality %
2o
3, 0.05～0.5 quality % Na
2the B of O, 0.001～0.01 quality %
2o
3.
The formation of the middle close binder after burn-back is processed is: the sintered body that is the aggregate particle of 5～50 μ m by average grain diameter forms, and as the chemical composition of middle close binder, contains respectively the Al of 70～85 quality %
2o
3, 15～30 quality % SiO
2, below beyond join meter, the Fe of the MgO that contains 0.5～3 quality %, 0.01～0.1 quality %
2o
3, 0.05～0.5 quality % Na
2the B of O, 0.001～0.01 quality %
2o
3.This middle close binder consists of aggregate particle He Li circle.Grain circle refers to the region of the contact portion that forms aggregate.Can think, what in this region, exist derives from SiO
2the nature of glass play the effect that makes the combination of aggregate particle, and then when having coexisted MgO with aforementioned ratio, this vitreous aggregate particle is further strengthened in conjunction with function, and is also reinforced with the adaptation of base material.Particularly, can think, by deriving from SiO
2the nature of glass, the Mg composition that diffuses to top layer from base material reacts with mullite aggregate, makes the part on aggregate surface become fusing point lower than the cordierite of mullite, thereby particle is strengthened in conjunction with function with the adaptation of base material.
Base material of the present invention is that compact substance below 1% forms by the porosity as previously mentioned, and this substrate surface has concavo-convex few structure.When such substrate surface forms middle close binder, easily peel off, but according to formation of the present invention, the faying face of middle close binder and base material also has the SiO that derives from that adhesion strengthened
2the formed integrated structure of the nature of glass, therefore can avoid the problem that the middle close binder on the base material consisting of compact substance is peeled off that is formed at.
In addition, during by the stacked middle close binder of metallikon, due to the melting when the spraying plating of aggregate particle, therefore as shown in the SEM image of Fig. 1, form the indefinite film in the intergranular border of each aggregate, but in the present invention by adopting spraying process, form the clearer and more definite film in the intergranular border of each aggregate.Particularly, this middle close binder has 20～60% the porosity.By this, form, by being adjusted into the best with the thermal expansion difference that by the porosity is the base material of the Si-SiC matter that forms of the compact substance below 1%, can avoid the problem that the caused middle close binders such as thermal expansion difference, adaptation are peeled off.
According to the present invention, by adjusting in this wise middle close binder raw material and adopting spraying process, can effectively avoid the problem that middle close binder is peeled off.
(surface-coated layer)
In the present invention, alleged surface-coated layer refers to the layer surperficial, that form and by sintered body be the contact-making surface of electronic part material that is formed at middle close binder.If form surface-coated layer, can prevent that base material, the contained reactive materials in top layer from contacting with electronic part material.Of the present invention, hold in burner, in surface-coated layer, preferably contain as with by the zirconia of the low material of the reactivity of sintered body.
Surface-coated layer be necessary for by the low material of the reactivity of sintered body, but its material can be according to the kind of electronic unit and difference.For example,, in the situation that the ceramic capacitor consisting of barium titanate is preferably selected the zirconia compound reactive low with it.As zirconia compound, can consider described reactivity, from by through calcium oxide (CaO) or yttria (Y
2o
3) stabilized zirconia, the BaZrO of stabilisation
3and CaZrO
3in the zirconia compound of at least one formation in suitably select optimal zirconia.In addition, also can use and contain the sprayed as surface-coated layer of aluminium oxide and zirconic eutectic thing according to the kind of electronic unit.
Surface-coated layer in the present invention can be take above-claimed cpd and is layered in the surface of base material or the surface on top layer as material and by the existing method of spraying plating or spraying of utilizing.In the present invention, as long as the thickness of surface-coated layer can be guaranteed above-mentioned effect, be not particularly limited.
Embodiment
Below, use embodiment to be described in detail the burner of holding of the present invention.But the present invention is not limited by these embodiment.In addition, in following examples, the shape of holding burner is made as tabular.
(evaluation of middle close binder: embodiment 1～5, comparative example 1～5)
In embodiment 1～5 and comparative example 1～5, when changing the composition and construction method of middle close binder, making consists of the 3-tier architecture of base material, middle close binder and surface-coated layer respectively holds burner, then carries out heat run, carries out the evaluation relevant to peeling off of middle close binder.
Holding in burner of embodiment 1～5, comparative example 1～5, with regard to base material, as base material raw material, by the SiC powder of the C powder that contains 5 quality %, 95 quality %, and then the raw material of joining in addition the meter total content of C powder and SiC powder (take be 100 quality %) the organic bonding agent that contains 2 quality % and the moisture of 30 % by weight is mixing, prepares mud.By jet dryer, this mud granulation is made to shapings raw material, utilize hydraulic press to carry out with the pressure of 100MPa stamping, the formed body of acquisition 150 * 150 * 2mm.Then, this formed body is placed under metallic silicon atmosphere to the not active gases atmosphere of decompression, makes impregnation metallic silicon in formed body, manufacture Si-SiC based sintered material.It is removed to surperficial excess metal silicon by sanding machine, make base material.Confirm that in the Si-SiC based sintered material of made, SiC is that 70～99 quality %, Si are 1～30 quality %, the porosity is below 1%.
The chemical composition of middle close binder and construction method are made as respectively as shown in table 1.And then, will with by sintered body (for example, ceramic capacitor) the low material of reactivity is that zirconia is layered in by metallikon or spraying process behind the surface of middle close binder, and the product obtaining for constructing by spraying process carries out burn-back and forms surface-coated layer at 1350 ℃.For the product of constructing and obtaining by metallikon, after completing, spraying plating do not carry out burn-back, directly enter following evaluation.
For the resistance to fissility evaluation of middle close binder, the burner of holding of making is processed into 120mm * 20mm, after its coated on one side dielectric substance barium titanate solution, with barium titanate solution coat, towards upper mode, loaded in width and be set on the fixture of 100mm, under the condition of 1300 ℃, 5 hours, by small-sized electric furnace, repeatedly burn till, with middle close binder or surface-coated layer, from base material, start to peel off and to it, peel off area and reach 10% number of times that passes through stove constantly and evaluate.
Table 1
As shown in table 1, as the chemical composition of this middle close binder, the Al that contains 70～85 quality %
2o
3, 15～30 quality % SiO
2, below beyond join meter, the Fe of the MgO that contains 0.5～3 quality %, 0.01～0.1 quality %
2o
3, 0.05～0.5 quality % Na
2the B of O, 0.001～0.01 quality %
2o
3, by adopting spraying process, can effectively avoid the problem (embodiment 1～5) that middle close binder is peeled off.On the other hand, though there is aforementioned chemical composition but adopt (comparative example 5) in the situation of metallikon even and adopted spraying process but do not had in the situation of aforementioned chemical composition (comparative example 1,3), in the logical stove below 5 times, peel off.
In table, the chemical composition in intermediate layer represents with % by weight, and principal component represented with interior joining, and beyond micro constitutent, joined to represent.
Claims (7)
1. small-sized electronic part burns till with holding a burner, it is characterized in that, has base material and the surface-coated layer that is located thereon layer, the Si of the SiC that this base material contains 70～99 quality %, 1～30 quality %,
The surface roughness based on arithmetic average of this base material is Ra=0.1～30 μ m, and elastic modelling quantity is 200～400GPa, and 4 bending strengths are 100～400MPa, and the thermal conductivity under room temperature is 150～240W/mk, and the porosity is below 1%.
2. small-sized electronic part according to claim 1 burns till with holding burner, it is characterized in that, the total content of SiC and Si of take is 100 quality %, and this base material further contains Al, Fe and Ca as micro constitutent,
The content of this Al is 0.01～0.2 quality %, and the content of Fe is 0.01～0.2 quality %, and the content of Ca is 0.01～0.2 quality %.
3. small-sized electronic part according to claim 1 and 2 burns till with holding burner, it is characterized in that, has the middle close binder of bonding this surface-coated layer and base material,
This middle close binder is by spraying process, to be layered in the surperficial injection coating layer of base material,
This middle close binder contains take the aggregate particle that mullite is principal component, as chemical composition, and the Al that contains 70～85 quality %
2o
3, 15～30 quality % SiO
2,
With this Al
2o
3and SiO
2total content be 100 quality %, further contain MgO, Fe
2o
3, Na
2o, B
2o
3as micro constitutent,
The content of MgO is 0.5～3 quality %, Fe
2o
3content be 0.01～0.1 quality %, Na
2the content of O is 0.05～0.5 quality %, B
2o
3content be 0.001～0.01 quality %.
4. small-sized electronic part according to claim 3 burns till with holding burner, it is characterized in that, the average grain diameter of this aggregate particle is 5～50 μ m.
5. small-sized electronic part according to claim 4 burns till with holding burner, it is characterized in that, the porosity of this middle close binder is 20～60%.
6. small-sized electronic part according to claim 1 and 2 burns till with holding burner, it is characterized in that, this surface-coated layer is to be that CaO or yttria are Y by stacked being selected from through calcium oxide
2o
3the stabilized zirconia of stabilisation, BaZrO
3and CaZrO
3in the zirconia compound of at least one formation form, there is the thickness of 50～500 μ m.
7. small-sized electronic part burns till by a manufacture method of holding burner, it is characterized in that, it uses the manufacture method of holding burner for small-sized electronic part claimed in claim 3 burns till,
The slurry of the mixed material that silica material forms is added in use in the aggregate raw material of middle close binder, by spraying process after the stacked middle close binder in the surface of base material, at this silica material, by heating to become, at vitreous temperature, carry out burn-back, by middle close binder and substrate bonding
And then, by spraying plating or spraying process at the stacked surface-coated layer in the surface of this middle close binder.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-180013 | 2010-08-11 | ||
| JP2010180013 | 2010-08-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102384654A CN102384654A (en) | 2012-03-21 |
| CN102384654B true CN102384654B (en) | 2014-08-27 |
Family
ID=45824304
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110229913.7A Active CN102384654B (en) | 2010-08-11 | 2011-08-09 | Sintering-purpose burner |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5465216B2 (en) |
| KR (1) | KR101819748B1 (en) |
| CN (1) | CN102384654B (en) |
| MY (1) | MY152945A (en) |
| TW (1) | TWI511942B (en) |
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| JP6811196B2 (en) * | 2018-01-10 | 2021-01-13 | 日本碍子株式会社 | Baking setter |
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| WO2021015059A1 (en) * | 2019-07-25 | 2021-01-28 | Ａｇｃ株式会社 | Laminated member |
| KR20220037437A (en) | 2019-07-25 | 2022-03-24 | 에이지씨 가부시키가이샤 | Laminated member |
| CN114430733B (en) * | 2019-10-02 | 2023-05-09 | 日本碍子株式会社 | Refractory material |
| CN115697929A (en) * | 2020-06-10 | 2023-02-03 | Ａｇｃ株式会社 | Glass |
| JP7151001B2 (en) * | 2020-08-28 | 2022-10-11 | 日本碍子株式会社 | ceramic material |
| CN112028650A (en) * | 2020-09-03 | 2020-12-04 | 深圳市飞粤新材料科技有限公司 | Sagger for lithium ion battery anode material |
| CN112553565B (en) * | 2020-11-13 | 2023-04-21 | 厦门金鹭特种合金有限公司 | Interlayer for sintering hard alloy pressed product |
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- 2011-07-08 JP JP2011151601A patent/JP5465216B2/en active Active
- 2011-07-15 TW TW100125081A patent/TWI511942B/en active
- 2011-08-01 KR KR1020110076663A patent/KR101819748B1/en active IP Right Grant
- 2011-08-05 MY MYPI2011003676 patent/MY152945A/en unknown
- 2011-08-09 CN CN201110229913.7A patent/CN102384654B/en active Active
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| CN86100202A (en) * | 1985-01-18 | 1986-08-27 | 日本碍子株式会社 | High strength feldspathic porcelain and manufacture method thereof |
| CN1081760A (en) * | 1992-06-08 | 1994-02-09 | 日本碍子株式会社 | The lattice plate of spalling resistance, anti-burst and oxidative resistance |
| JP2758313B2 (en) * | 1992-06-08 | 1998-05-28 | 日本碍子株式会社 | Sporing-resistant shelf |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP5465216B2 (en) | 2014-04-09 |
| MY152945A (en) | 2014-12-12 |
| CN102384654A (en) | 2012-03-21 |
| JP2012056831A (en) | 2012-03-22 |
| KR101819748B1 (en) | 2018-01-17 |
| TWI511942B (en) | 2015-12-11 |
| KR20120025396A (en) | 2012-03-15 |
| TW201213275A (en) | 2012-04-01 |
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