JP3663445B2 - Electronic component firing jig - Google Patents
Electronic component firing jig Download PDFInfo
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- JP3663445B2 JP3663445B2 JP2000316266A JP2000316266A JP3663445B2 JP 3663445 B2 JP3663445 B2 JP 3663445B2 JP 2000316266 A JP2000316266 A JP 2000316266A JP 2000316266 A JP2000316266 A JP 2000316266A JP 3663445 B2 JP3663445 B2 JP 3663445B2
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- alumina
- zirconia
- electronic component
- coarse aggregate
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/5025—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials with ceramic materials
- C04B41/5042—Zirconium oxides or zirconates; Hafnium oxides or hafnates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Furnace Charging Or Discharging (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、誘電体、積層コンデンサ、セラミックコンデンサ、圧電素子、サーミスタ等の電子部品を焼成する際に用いられるセッター、棚板、匣鉢等の電子部品焼成用治具に関する。
【0002】
【従来の技術及び発明が解決しようとする課題】
電子部品焼成用治具は、作業性及び燃料費削減のために、軽量化が進みつつある。特に連続炉で電子部品を焼成する場合には、冶具の熱容量が小さく、昇温、降温が熱的に容易なセッターやシート状の基材が望まれる。この場合、基材の厚さは3〜4mm以下である。
【0003】
また、電子部品焼成用治具は、耐熱性や機械的強度の他に、焼成するセラミック電子部品と反応しないことが要求される。誘電体等の電子部品ワークが焼成用治具と接触し反応すると、融着したり、ワークの組成変動によって特性低下が生ずる等の課題がある。
【0004】
通常は、これらの電子部品焼成用治具の基材として、熱間強度が高く、熱スポーリング性の良好なアルミナ・ムライト系基材が汎用されている。このアルミナ・ムライト系基材は、電子部品ワークとの反応が起こり易く、この反応を防止するために、基材表面にジルコニアを被覆する方法が採用されている。
【0005】
ジルコニアは基材との反応性は低いが、上記基材との熱膨張係数の差が大きいため基材に反りが発生し、繰り返し熱サイクルが生ずる使用環境下ではジルコニア表面層に亀裂が生じたり、剥離するといった問題がある。
【0006】
また、ジルコニアは約1200℃で単斜晶から正方晶への相転移が起こる。その結果、繰り返し熱サイクルによる相転移に伴う熱膨張係数の変化により、ジルコニアの表面層が脱離しやすいという問題がある。また、未安定化ジルコニアを表面層として使用する場合には、相転移に伴う粉化が生ずるという問題もある。
【0007】
このような問題を解決するために、基材とジルコニア表面層との間に種々の中間層を設けることが提案されている(特開平3−137078号公報、特許第2859911号等)。
【0008】
例えば特開平3−137078号公報では、アルミナからなる中間層を設けている。しかし、この電子部品焼成用治具では、アルミナの焼結性が悪く、ジルコニア表面層と基材との中間層として充分な密着性を持たず、さらに上記した基材の反りを満足できるレベルで防止できない。
【0009】
従って、本発明の目的は、基材とジルコニア表面層との熱膨張差を緩和することによって表面亀裂や基材の反りを著しく低減した電子部品焼成用治具を提供することにある。
【0010】
【課題を解決するための手段】
本発明者らは、検討の結果、基材とジルコニア表面層との間に、粗粒骨材と微粒ボンド相とからなる中間層を用いることによって、上記目的が達成し得ることを知見した。
【0011】
本発明は、上記知見に基づきなされたもので、基材とジルコニア表面層との間に、粗粒骨材と微粒ボンド相とからなる中間層を有し、該中間層が、粗粒骨材50〜90重量%と微粒ボンド相50〜10重量%とからなること特徴とする電子部品焼成用治具を提供するものである。
【0012】
【発明の実施の形態】
以下、本発明の電子部品焼成用治具の実施の形態について説明する。
【0013】
図1は、本発明の電子部品焼成用治具の概略断面図であり、また、図2は中間層の模式断面図である。図1〜2において、1は電子部品焼成用冶具、2は基材、3は中間層、4はジルコニア被覆層、31は粗粒骨材、32は微粒ボンド相、33は空隙をそれぞれ示す。
【0014】
図1の電子部品焼成用治具1において、基材2は、従来より使用されているものと同様でよく、例えばアルミナ系材料、アルミナ・ムライト系材料、アルミナ・マグネシア系スピネル材料、アルミナ・ムライト・コージェライト系材料、又はこれらの組合せによる材料が使用される。
【0015】
ジルコニア4表面層は、未安定化ジルコニア、部分安定化ジルコニア及び安定化ジルコニア等が使用できるが、ジルコニア表面層は電子部品と直接接触するため、電子部品に悪影響を与えるものであってはならず、従ってイットリア、カルシア及びマグネシア等により部分安定化又は安定化させたジルコニア又はそれらの混合物を使用することが望ましい。ジルコニアは室温では単斜晶系であり、温度上昇と共に、単斜晶系→(約1200℃)→正方晶系→(2370℃)→立方晶系の相転移が起こるが、ジルコニアにイットリアやマグネシア等の部分溶融結合材(安定化剤)を固溶させることにおより、高温相である正方晶や立方晶を室温下で安定化できる。
【0016】
本発明では、上記した基材2とジルコニア表面層4との間に設けられた中間層3は、図2に示されるように、粗粒骨材31と微粒ボンド相32とからなり、また空隙33が存在する。この中間層の厚みは特に限定されないが、好ましくは50〜200μmである。
【0017】
中間層における粗粒骨材31と微粒ボンド相32の含有割合は、粗粒骨材50〜90重量%、微粒ボンド相50〜10重量%である。粗粒骨材50重量%未満又は微粒ボンド相50重量%超では、熱膨張の緩和が不充分である。また、粗粒骨材90重量%超又は微粒ボンド相10重量%未満では、強度が低下する。
【0018】
粗粒骨材31は、アルミナ、アルミナ・スピネル複合酸化物又はそれらの混合物からなるものが好ましい。また、粗粒骨材の平均粒径は30〜500μmであることが望ましい。
【0019】
微粒ボンド相32は、アルミナを80重量%以上含み、残部がジルコニア、アルミナ・マグネシアスピネル複合酸化物、アルカリ土類金属酸化物、希土類酸化物、チタン酸アルミニウムから選ばれる1種以上からなるものが好ましい。残部となるジルコニア等の酸化物は、主としてアルミナの焼成性を高め、ジルコニア表面層のぼろつきを抑制し、また基材との密着性を向上させるために含有される。これらの酸化物の含有量は1〜20重量%が好ましく、含有量が1重量%未満では焼成性が向上せず、また20重量%を超えるとアルミナの特性が変化して、亀裂の発生及び基材の反りを低減できない。また、微細ボンド相の平均粒径が10μm以下であることが望ましい。
【0020】
このように、粗粒骨材と31と微粒ボンド相32を組み合わせることによって、中間層3は適度な空隙(気孔)33を有し、基材2とジルコニア表面層4との熱膨張差が緩和される。また、微粒ボンド相32により粗粒骨材31が強固に結合され、かつ空隙33を有する構造となるため、厚さの薄いセッターやシート等の基材上2に上記中間層3を形成することにより、基材2の反りを著しく低減できる。
【0021】
次に、本発明の電子部品焼成用治具の製造方法について説明する。
先ず、所定割合の粗粒骨材及び微粒ボンド相に有機バインダ及び水を加え、撹拌、混合してスラリーを得る。
【0022】
このスラリーを、アルミナ・ムライト等からなる基材表面に、スプレー塗布、浸漬コーティング等の公知の被覆方法により所定の厚みとなるように被覆し、次いで乾燥して中間層を形成する。
【0023】
続いて、この中間層の上に、ジルコニアのスラリーを、上記と同様にスプレー塗布、浸漬コーティング等の公知の被覆方法により所定の厚みとなるように被覆し、ジルコニア表面層を形成する。次いで、1300〜1600℃で焼成し、電子部品焼成用治具を製造する。
【0024】
【実施例】
以下、実施例に基づいて本発明を具体的に説明する。
【0025】
〔実施例1〕
微粒ボンド相が、アルミナ100重量%からなり、平均粒径5μmのものを用いた。また、粗粒骨材としてアルミナからなり、平均粒径50μmのものを用いた。
【0026】
この微粒ボンド相と粗粒骨材とを20重量%:80重量%の割合で配合し、ボールミキサー中で均一に混合し、水とバインダーであるポリビニルアルコールを加えたスラリーとした。
【0027】
シリカ含有量が10重量%のアルミナ−ムライト基材表面に、上記スラリーをスプレーコートし、約100℃で乾燥した。得られた中間層の厚さは約100μmであった。次いで、この中間層の表面にイットリア(Y2 O3 )で安定化したジルコニアスラリーをスプレーコートし約100℃で乾燥した。得られたジルコニア表面層の厚さは約100μmであった。この積層体を1500℃で2時間保持し、電子部品焼成用治具を得た。
【0028】
〔実施例2〜7及び比較例1〜2〕
粗粒骨材と微粒ボンド相とを表1に示される種類及び割合で用いた以外は、実施例1と同様にして電子部品焼成用治具を得た。但し、比較例1は、粗粒骨材を用いなかった。
【0029】
このようにして得られた電子部品焼成用治具の表面亀裂の発生と基材の反りの有無を下記により評価した。
【0030】
すなわち、電子部品焼成用治具を電気炉で500℃から1350℃まで3時間かけて急熱し、次いで1350℃から500℃まで3時間かけて急冷することを50回繰り返し、表面亀裂の発生と基材の反りの有無を評価した。亀裂は目視できるものを亀裂とし、反りは厚さ3mmで約100×200mmの大きさの基材に対して、1mm以上の変形があったものを反りとした。結果を表1に示す。
【0031】
【表1】
【0032】
表1に示されるように、実施例1〜7は、表面亀裂や反りが生じないのに対し、比較例1〜2では、表面亀裂も反りも生じた。
【0033】
【発明の効果】
本発明の電子部品焼成用冶具によって、基材とジルコニア表面層との熱膨張差が緩和され、表面亀裂や基材の反りを著しく低減できる。
【図面の簡単な説明】
【図1】図1は、本発明の電子部品焼成用治具の概略断面図である。
【図2】図2は、図1の中間層の模式断面図である。
【符号の説明】
1:電子部品焼成用冶具
2:基材
3:中間層
4:ジルコニア表面層
31:粗粒骨材
32:微粒ボンド相
33:空隙[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a jig for firing electronic parts such as setters, shelf boards, and mortars used when firing electronic parts such as dielectrics, multilayer capacitors, ceramic capacitors, piezoelectric elements, and thermistors.
[0002]
[Prior art and problems to be solved by the invention]
Electronic component firing jigs are being reduced in weight in order to reduce workability and fuel costs. Particularly when electronic parts are fired in a continuous furnace, a setter or a sheet-like base material is desired which has a small heat capacity of the jig and can be easily heated and lowered. In this case, the thickness of the base material is 3 to 4 mm or less.
[0003]
In addition to heat resistance and mechanical strength, the electronic component firing jig is required not to react with the ceramic electronic component to be fired. When an electronic component work such as a dielectric contacts and reacts with a firing jig, there are problems such as fusion or deterioration of characteristics due to variation in the composition of the work.
[0004]
Usually, an alumina / mullite base material having high hot strength and good thermal spalling properties is widely used as a base material for these electronic component firing jigs. This alumina / mullite base material is likely to react with the electronic component work, and a method of coating the surface of the base material with zirconia is employed to prevent this reaction.
[0005]
Zirconia has low reactivity with the base material, but the difference in thermal expansion coefficient with the above base material is large, so the base material warps and the zirconia surface layer cracks under the usage environment where repeated thermal cycling occurs. There is a problem of peeling.
[0006]
Zirconia undergoes a phase transition from monoclinic to tetragonal at about 1200 ° C. As a result, there is a problem that the surface layer of zirconia tends to be detached due to a change in the thermal expansion coefficient accompanying the phase transition due to repeated thermal cycling. Moreover, when using unstabilized zirconia as a surface layer, there also exists a problem that the powdering accompanying a phase transition arises.
[0007]
In order to solve such a problem, it has been proposed to provide various intermediate layers between the base material and the zirconia surface layer (Japanese Patent Laid-Open No. 3-137708, Japanese Patent No. 2859911, etc.).
[0008]
For example, in Japanese Patent Application Laid-Open No. 3-137708, an intermediate layer made of alumina is provided. However, in this jig for firing electronic parts, the sinterability of alumina is poor, it does not have sufficient adhesion as an intermediate layer between the zirconia surface layer and the base material, and at the level that can satisfy the warp of the base material described above. It cannot be prevented.
[0009]
Accordingly, an object of the present invention is to provide an electronic component firing jig in which surface cracks and warpage of a substrate are remarkably reduced by reducing a difference in thermal expansion between the substrate and a zirconia surface layer.
[0010]
[Means for Solving the Problems]
As a result of the study, the present inventors have found that the above object can be achieved by using an intermediate layer composed of coarse aggregate and fine bond phase between the base material and the zirconia surface layer.
[0011]
The present invention has been made based on the above findings, between the substrate and the zirconia surface layer, have a middle layer consisting of coarse aggregate and fine bond phase, the intermediate layer, coarse aggregate there is provided an electronic component firing jig to Rukoto features from 50 to 90% by weight and fine bond phase 50 to 10% by weight.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the jig for firing electronic parts of the present invention will be described.
[0013]
FIG. 1 is a schematic cross-sectional view of an electronic component firing jig according to the present invention, and FIG. 2 is a schematic cross-sectional view of an intermediate layer. 1 and 2, 1 is a jig for firing electronic parts, 2 is a base material, 3 is an intermediate layer, 4 is a zirconia coating layer, 31 is a coarse aggregate, 32 is a fine bond phase, and 33 is a void.
[0014]
In the electronic
[0015]
As the zirconia 4 surface layer, unstabilized zirconia, partially stabilized zirconia, stabilized zirconia, and the like can be used. However, since the zirconia surface layer is in direct contact with the electronic component, it should not adversely affect the electronic component. Therefore, it is desirable to use zirconia or a mixture thereof partially stabilized or stabilized by yttria, calcia, magnesia or the like. Zirconia is monoclinic at room temperature. As the temperature rises, the phase transition of monoclinic → (about 1200 ° C) → tetragonal → (2370 ° C) → cubic occurs, but zirconia has yttria and magnesia. By dissolving a partially melted binder (stabilizer) such as tetragonal crystal or cubic crystal which is a high temperature phase, it can be stabilized at room temperature.
[0016]
In the present invention, the intermediate layer 3 provided between the base material 2 and the zirconia surface layer 4 is composed of a
[0017]
The content ratio of the
[0018]
The
[0019]
The fine-
[0020]
Thus, by combining the
[0021]
Next, the manufacturing method of the electronic component baking jig of the present invention will be described.
First, an organic binder and water are added to a predetermined ratio of coarse aggregate and fine bond phase, and stirred and mixed to obtain a slurry.
[0022]
The slurry is coated on the surface of a substrate made of alumina, mullite or the like by a known coating method such as spray coating or dip coating, and then dried to form an intermediate layer.
[0023]
Subsequently, a zirconia slurry is coated on the intermediate layer so as to have a predetermined thickness by a known coating method such as spray coating or dip coating in the same manner as described above to form a zirconia surface layer. Next, firing is performed at 1300 to 1600 ° C. to manufacture an electronic component firing jig.
[0024]
【Example】
Hereinafter, the present invention will be specifically described based on examples.
[0025]
[Example 1]
A fine bond phase composed of 100% by weight of alumina and having an average particle size of 5 μm was used. Further, coarse aggregates made of alumina and having an average particle size of 50 μm were used.
[0026]
The fine bond phase and the coarse aggregate were blended at a ratio of 20% by weight to 80% by weight, mixed uniformly in a ball mixer, and made into a slurry in which water and polyvinyl alcohol as a binder were added.
[0027]
The slurry was spray-coated on the surface of an alumina-mullite substrate having a silica content of 10% by weight and dried at about 100 ° C. The thickness of the obtained intermediate layer was about 100 μm. Next, zirconia slurry stabilized with yttria (Y 2 O 3 ) was spray-coated on the surface of this intermediate layer and dried at about 100 ° C. The thickness of the obtained zirconia surface layer was about 100 μm. This laminate was held at 1500 ° C. for 2 hours to obtain an electronic component firing jig.
[0028]
[Examples 2-7 and Comparative Examples 1-2]
An electronic component firing jig was obtained in the same manner as in Example 1 except that coarse aggregate and fine bond phase were used in the types and proportions shown in Table 1. However, Comparative Example 1 did not use coarse aggregate.
[0029]
The occurrence of surface cracks in the electronic component firing jig thus obtained and the presence or absence of warpage of the substrate were evaluated as follows.
[0030]
That is, the electronic component firing jig was rapidly heated in an electric furnace from 500 ° C. to 1350 ° C. over 3 hours, and then rapidly cooled from 1350 ° C. to 500 ° C. over 3 hours. The presence or absence of warping of the material was evaluated. The crack was defined as a visible crack, and the warp was defined as a warp having a thickness of 3 mm and a deformation of 1 mm or more with respect to a substrate having a size of about 100 × 200 mm. The results are shown in Table 1.
[0031]
[Table 1]
[0032]
As shown in Table 1, in Examples 1 to 7, surface cracks and warpage did not occur, whereas in Comparative Examples 1 and 2, surface cracks and warpage occurred.
[0033]
【The invention's effect】
With the electronic component firing jig of the present invention, the difference in thermal expansion between the base material and the zirconia surface layer is alleviated, and surface cracks and warpage of the base material can be significantly reduced.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view of an electronic component firing jig according to the present invention.
FIG. 2 is a schematic cross-sectional view of the intermediate layer of FIG.
[Explanation of symbols]
1: Electronic component firing jig 2: Base material 3: Intermediate layer 4: Zirconia surface layer 31: Coarse aggregate 32: Fine bond phase 33: Void
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2000316266A JP3663445B2 (en) | 2000-10-17 | 2000-10-17 | Electronic component firing jig |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2000316266A JP3663445B2 (en) | 2000-10-17 | 2000-10-17 | Electronic component firing jig |
Publications (2)
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JP2002128571A JP2002128571A (en) | 2002-05-09 |
JP3663445B2 true JP3663445B2 (en) | 2005-06-22 |
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JP2000316266A Expired - Lifetime JP3663445B2 (en) | 2000-10-17 | 2000-10-17 | Electronic component firing jig |
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