CN102378548A

CN102378548A - Radiating device

Info

Publication number: CN102378548A
Application number: CN2010102574267A
Authority: CN
Inventors: 官志彬
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2010-08-19
Filing date: 2010-08-19
Publication date: 2012-03-14

Abstract

The invention discloses a radiating device, which is used for the radiating of a heating element and comprises a radiator and a buffering element, wherein the radiator comprises a bottom part and a plurality of radiating fins, the buffering element is made of an elastic radiating material and comprises a first side board contacted with the heating element and a second side board contacted with the bottom part, and a buffering part is arranged between the first side board and the second side board. Compared with the prior art, the radiating device disclosed by the invention can carry out the buffering by utilizing the buffering element when being shocked by external force, and thus the heating element is prevented from being damaged.

Description

Heat abstractor

Technical field

The present invention relates to a kind of heat abstractor.

Background technology

Existing radiator is direct closely contact heating element normally, such as chip, and external impacts radiator and cause heater element impaired easily.

Summary of the invention

In view of above content, be necessary the heat abstractor that provides a kind of external force resistance to impact.

A kind of heat abstractor; Be used for a heater element is dispelled the heat; This heat abstractor comprises a radiator and a buffer element, and this radiator comprises a bottom and some radiating fins, and buffer element is processed for the elastic heat dissipating material; Buffer element comprises first side plate that contacts with heater element and second side plate that contacts with the bottom of radiator, wherein is provided with buffer part between first side plate and second side plate.

Compare prior art, can utilize buffer element to cushion when heat abstractor of the present invention receives external impacts, avoid heater element impaired.

Description of drawings

Combine embodiment that the present invention is done further description with reference to the accompanying drawings.

Fig. 1 is the three-dimensional combination figure of the preferred embodiments of heat abstractor of the present invention.

Fig. 2 is the three-dimensional exploded view of the preferred embodiments of heat abstractor of the present invention.

Fig. 3 is the end view of Fig. 1.

Fig. 4 is the three-dimensional combination of side view of another preferred embodiments of heat abstractor of the present invention.

The main element symbol description

Heater element 100

Radiator 20

Bottom 21

Radiating fin 23

Buffer element 30

First side plate 31

Fixed part 311

Second side plate 33

Buffer part 35

Embodiment

See also Fig. 1 and Fig. 2, heat abstractor of the present invention is used for heater element 100 is dispelled the heat.Heater element 100 can be electronic components such as chip.This heat abstractor comprises a radiator 20 and a buffer element 30.

Radiator 20 comprises

bottom

21 and 21 some radiating fins 23 of extending to form vertically upward from the bottom.

Buffer element 30 is that a heat conductivility better elastic material is processed, such as metal materials such as copper, silver.It is Z-shaped that buffer element 30 roughly is, and obviously, as required, buffer element 30 also can be processed M shape etc.Buffer element 30 comprises one first side plate 31, second side plate 33 and a buffer part 35 first side plate 31 and second side plate 33 between parallel with first side plate 31.First side plate 31 and second side plate 33 lay respectively at the outside of buffer element 30.The diagonal position of first side plate 31 is respectively equipped with fixed part 311, is used for that buffer element 30 is fixed in the integrated circuit board (figure does not show) that heater element 100 is installed and goes up and first side plate 31 is closely contacted with heater element 100.

Please consult Fig. 3 in the lump, second side plate 33 of buffer element 30 is used for being connected with the bottom 21 of radiator 20.During practical implementation, weld together after can being fitted in the bottom 21 of the upper surface of second side plate 33 and radiator 20, perhaps adopt modes such as screws or riveted that the upper surface of second side plate 33 is connected with the bottom 21 of radiator 20.

Other is connected second side plate 33 with the bottom 21 of radiator 20 mode; As shown in Figure 4; Offer a fluting 211 in the bottom 21 of radiator 20, the fluting 211 that second side plate 33 is penetrated radiator 20 is interior so that second side plate 33 is connected with the bottom 21 of radiator 20.Certainly, the size of utilizing this mode need adjust second side plate 33 is complementary itself and fluting 211.

In other execution mode, can buffer element 30 is one-body molded with the bottom 21 of radiator 20.

When heat abstractor of the present invention received external impacts, buffer element 30 can play cushioning effect, to avoid heater element 100 impaired.

Claims

1. heat abstractor; Be used for a heater element is dispelled the heat; This heat abstractor comprises a radiator and a buffer element, and this radiator comprises a bottom and some radiating fins, and buffer element is processed for the elastic heat dissipating material; Buffer element comprises first side plate that contacts with heater element and second side plate that contacts with the bottom of radiator, wherein is provided with buffer part between first side plate and second side plate.

2. heat abstractor as claimed in claim 1 is characterized in that: said buffer element is that metal materials such as copper, silver are processed.

3. heat abstractor as claimed in claim 1 is characterized in that: said buffer element roughly is M shape.

4. heat abstractor as claimed in claim 1 is characterized in that: said buffer element roughly is Z-shaped.

5. heat abstractor as claimed in claim 1 is characterized in that: said second side plate adopts the mode of welding to be connected with the bottom of radiator.

6. heat abstractor as claimed in claim 1 is characterized in that: said second side plate adopts riveted joint or the fixing mode of screw to be connected with the bottom of radiator.

7. heat abstractor as claimed in claim 1 is characterized in that: the bottom of said radiator offers fluting, and second side plate penetrates in the fluting of radiator and is connected with the bottom of radiator.

8. heat abstractor as claimed in claim 1 is characterized in that: second side plate of the bottom of said radiator and said buffer element is one-body molded.

9. heat abstractor as claimed in claim 1 is characterized in that: the diagonal position of said first side plate is respectively equipped with fixed part, is used for fixing buffer element.