CN102378467A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN102378467A CN102378467A CN2010102601527A CN201010260152A CN102378467A CN 102378467 A CN102378467 A CN 102378467A CN 2010102601527 A CN2010102601527 A CN 2010102601527A CN 201010260152 A CN201010260152 A CN 201010260152A CN 102378467 A CN102378467 A CN 102378467A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- fixing hole
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a printed circuit board. The printed circuit board is fixed to a chassis of electronic equipment. The printed circuit board comprises a plurality of fixing holes, wherein the fixing holes are electrically connected with a grounding layer of the printed circuit board; a wave-absorbing element is arranged on the outer ring of each fixing hole on the top surface of the printed circuit board; each wave-absorbing element comprises a conductive layer and a wave-absorbing layer, wherein the conducive layer is connected with a corresponding fixing hole; the wave-absorbing layer is used for absorbing high-frequency noise; the conductive layer of the wave-absorbing element is electrically connected with the grounding layer of the printed circuit board through the corresponding fixing hole; and the high-frequency noise in the grounding layer of the printed circuit board is transmitted to the conductive layer of the wave-absorbing element through the fixing hole and is absorbed by the wave-absorbing layer of the wave-absorbing element. In the printed circuit board, the high-frequency noise in the grounding layer is absorbed by the wave-absorbing element, so that high-frequency noise is effectively prevented from being radiated out in an electromagnetic wave mode by the chassis of the electronic equipment, and an electromagnetic radiation prevention function of the electronic equipment is enhanced.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB).
Background technology
Printed circuit board (PCB) is fixed on the casing of electronic equipment with the mode of lock screw usually.Said printed circuit board (PCB) is provided with the fixing holes that some and ground plane are electrical connected, and said printed circuit board surface is equipped with the Xi Quan that links to each other with said fixing hole in the outer rim of each fixing hole.When screw was gone on the casing corresponding screw hole through said fixing hole screw lock, said printed circuit board (PCB) contacted with casing and electrical ground connection by said Xi Quan and said screw, thereby reaches the purpose that prevents electromagnetic radiation.But for the high-frequency noise that is produced by the layout flaw of printed circuit board (PCB), in a single day the anti-antenna that is equivalent to of casing, this high-frequency noise flow into casing, will be radiate with form of electromagnetic wave by casing.
Summary of the invention
In view of foregoing, be necessary to provide a kind of printed circuit board (PCB) that can absorb the high-frequency noise that self produces.
A kind of printed circuit board (PCB); Be fixed on the casing of an electronic equipment; Said printed circuit board (PCB) comprises the plurality of fixed hole; The ground plane of said fixing hole and said printed circuit board (PCB) is electrical connected; Be equipped with one in said printed circuit board top surface in the outer rim of each fixing hole and inhale the ripple element, each is inhaled ripple element and comprises that the conductive layer and that links to each other with corresponding fixing hole is used for the suction ripple layer of absorbing high-frequency noise, and the conductive layer of said suction ripple element is electrical connected through the ground plane of corresponding fixing hole and said printed circuit board (PCB); High-frequency noise in the said ground plane of printed circuit board transfers to the conductive layer of said suction ripple element via said fixing hole, and is sponged by the suction ripple layer of said suction ripple element.
Compare prior art; Printed circuit board (PCB) of the present invention sponges the high-frequency noise in the said ground plane of printed circuit board through the suction ripple element of being located at end face; Thereby prevented that effectively said high-frequency noise from being radiate with form of electromagnetic wave by the casing of said electronic equipment, strengthened the function that said electronic equipment prevents electromagnetic radiation.
Description of drawings
Combine preferred embodiments that the present invention is described in further detail with reference to the accompanying drawings:
Fig. 1 is the sketch map of printed circuit board (PCB) preferred embodiments of the present invention.
Fig. 2 is fixed in the sketch map on the casing of electronic equipment for printed circuit board (PCB) of the present invention.
Fig. 3 is the partial exploded view of Fig. 2.
The main element symbol description
Printed circuit board (PCB) 100
Fixing hole 120
Inhale ripple element 160
Inhale ripple layer 166
Casing 220
Screw hole 222
Screw 300
Embodiment
Please common reference Fig. 1 and Fig. 2, printed circuit board (PCB) 100 of the present invention can be fixed on the casing 220 of an electronic equipment 200.The preferred embodiments of said printed circuit board (PCB) 100 comprises plurality of fixed hole 120 and the suction ripple element of establishing in the outer rim ring of each fixing hole 120 at said printed circuit board (PCB) 100 end faces 160.Each is inhaled ripple element 160 and comprises that the conductive layers 162 and that link to each other with corresponding fixing hole 120 are used for the suction ripple layer 166 of absorbing high-frequency noise.Each fixing hole 120 all is electrical connected with the ground plane of said printed circuit board (PCB) 100 (figure does not show), and each conductive layer 162 of inhaling ripple element 160 is electrical connected through the ground plane of corresponding fixing hole 120 with said printed circuit board (PCB) 100.Be equipped with Yi Xiquan (figure does not show) in said printed circuit board (PCB) 100 bottom surfaces in the outer rim of each fixing hole 120, said Xi Quan links to each other with corresponding fixing hole 120, and is electrical connected through the ground plane of corresponding fixing hole 120 with said printed circuit board (PCB) 100.In this execution mode, said electronic equipment 200 can be server, computer, refrigerator etc.Said high-frequency noise is meant the noise of frequency greater than 1GHz.Each is inhaled ripple element 160 and all is circular, and the outer shroud radius is 10mm, and interior ring radius is 5mm.In other embodiments, the shape of each tin circle 230 and big I adjust accordingly according to actual conditions.
Each is inhaled the conductive layer 162 of ripple element 160 and is made up of electric conducting material, and the suction ripple layer of each suction ripple element 160 166 is made up of electromagnetic wave absorption material, and said electromagnetic wave absorption material comprises macromolecule medium and electromagnetic consumable property material.The proportion that said macromolecule medium and said electromagnetic consumable property material account for said electromagnetic wave absorption material total weight respectively is: 5%～15% and 85%～95%.In this execution mode, said electric conducting material can be tin, copper etc., and said electromagnetic wave absorption material insulate, and said macromolecule medium is a haloflex, and said electromagnetic consumable property material is an iron aluminium silicon mixture.In other is implemented; Said macromolecule medium and said electromagnetic consumable property material account for the proportion of said electromagnetic wave absorption material total weight respectively, all can adjust accordingly according to actual conditions with the constituent of said macromolecule medium and said electromagnetic consumable property material.
Please continue with reference to figure 3, be provided with some screw holes 222 corresponding to said fixing hole 120 places on the casing 220 of said electronic equipment 200.During assembling, penetrate each fixing hole 120 and screw lock with screw 300 from the end face of said printed circuit board (PCB) 100 and go in the corresponding screw hole 222, so that said printed circuit board (PCB) 100 is fixed on the said casing 220.At this moment, corresponding screw hole 222 contacts on each Xi Quan of said printed circuit board (PCB) 100 bottom surfaces and the said casing 220.
During work, the frequency in said printed circuit board (PCB) 100 ground planes is less than the noise of 1GHz, flows into said casing 220 via the Xi Quan and the said screw hole 222 of said fixing hole 120, said bottom surface, and masked by said casing 220.The frequency that is produced by the layout flaw on the said printed circuit board (PCB) 100 is greater than the high-frequency noise of 1GHz; Then flow into the conductive layer 162 of said suction ripple element 160 via said fixing hole 120; Sponged by the suction ripple layer 166 of said suction ripple element 160 again, thereby prevented that effectively high-frequency noise from being radiate with form of electromagnetic wave by casing.
Printed circuit board (PCB) 100 of the present invention sponges the high-frequency noise in said printed circuit board (PCB) 100 ground planes through the suction ripple element 160 of being located at end face; Thereby prevented that effectively said high-frequency noise from being radiate with form of electromagnetic wave by the casing of said electronic equipment 200 220, strengthened the function that said electronic equipment 200 prevents electromagnetic radiation.
Claims (6)
1. printed circuit board (PCB); Be fixed on the casing of an electronic equipment; Said printed circuit board (PCB) comprises the plurality of fixed hole; The ground plane of said fixing hole and said printed circuit board (PCB) is electrical connected; It is characterized in that: be equipped with one in said printed circuit board top surface in the outer rim of each fixing hole and inhale the ripple element, each is inhaled ripple element and comprises that the conductive layer and that links to each other with corresponding fixing hole is used for the suction ripple layer of absorbing high-frequency noise, and the conductive layer of said suction ripple element is electrical connected through the ground plane of corresponding fixing hole and said printed circuit board (PCB); High-frequency noise in the said ground plane of printed circuit board transfers to the conductive layer of said suction ripple element via said fixing hole, and is sponged by the suction ripple layer of said suction ripple element.
2. printed circuit board (PCB) as claimed in claim 1 is characterized in that: the conductive layer of said suction ripple element is made up of electric conducting material, and the suction ripple layer of said suction ripple element is made up of electromagnetic wave absorption material.
3. printed circuit board (PCB) as claimed in claim 2 is characterized in that: said electromagnetic wave absorption material comprises macromolecule medium and electromagnetic consumable property material.
4. printed circuit board (PCB) as claimed in claim 3; It is characterized in that: the proportion that said macromolecule medium accounts for said electromagnetic wave absorption material total weight is 5%～15%, and the proportion that said electromagnetic consumable property material accounts for said electromagnetic wave absorption material total weight is 85%～95%.
5. printed circuit board (PCB) as claimed in claim 3 is characterized in that: said macromolecule medium is a haloflex, and said electromagnetic consumable property material is an iron aluminium silicon mixture.
6. printed circuit board (PCB) as claimed in claim 1 is characterized in that: said suction ripple element is circular, and the outer shroud radius is 10mm, and interior ring radius is 5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102601527A CN102378467A (en) | 2010-08-23 | 2010-08-23 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102601527A CN102378467A (en) | 2010-08-23 | 2010-08-23 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102378467A true CN102378467A (en) | 2012-03-14 |
Family
ID=45796166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102601527A Pending CN102378467A (en) | 2010-08-23 | 2010-08-23 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102378467A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206503A (en) * | 2016-07-28 | 2016-12-07 | 华为技术有限公司 | A kind of power module and the preparation method of power module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040061566A1 (en) * | 2002-09-27 | 2004-04-01 | Visteon Global Technologies, Inc. | EMI suppression method for powertrain control modules |
| CN201248218Y (en) * | 2008-08-26 | 2009-05-27 | 英业达股份有限公司 | Fixed device |
-
2010
- 2010-08-23 CN CN2010102601527A patent/CN102378467A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040061566A1 (en) * | 2002-09-27 | 2004-04-01 | Visteon Global Technologies, Inc. | EMI suppression method for powertrain control modules |
| CN201248218Y (en) * | 2008-08-26 | 2009-05-27 | 英业达股份有限公司 | Fixed device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206503A (en) * | 2016-07-28 | 2016-12-07 | 华为技术有限公司 | A kind of power module and the preparation method of power module |
| CN106206503B (en) * | 2016-07-28 | 2019-05-21 | 华为技术有限公司 | A kind of preparation method of power module and power module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203951671U (en) | A kind of PCB structure with good electromagnetic compatibility | |
| WO2012058131A3 (en) | Composite film for board level emi shielding | |
| US9160046B2 (en) | Reduced EMI with quarter wavelength transmission line stubs | |
| JP5969816B2 (en) | Structural member and communication device | |
| CN103715493A (en) | Composite module and electronic apparatus including the same | |
| TW201325426A (en) | Printed circuit board | |
| JP2003078279A (en) | Shielding method of printed board and device mounting printed board using that method | |
| CN201374868Y (en) | Circuit board structure | |
| CN110099509A (en) | Circuit board and electronic equipment | |
| US20100309632A1 (en) | Motherboard with mounting holes | |
| CN107846834B (en) | Power module | |
| CN204598570U (en) | A kind of anti-interference screening arrangement | |
| TW201444462A (en) | Fixed structure of printed circuit board and shield case | |
| CN101730377A (en) | Coupling layer and printed circuit board with same | |
| JP4910335B2 (en) | Printed wiring board and semiconductor integrated circuit device | |
| CN102378467A (en) | Printed circuit board | |
| US20130242519A1 (en) | Printed circuit board | |
| US20120184326A1 (en) | Electronic Circuit | |
| TWI451628B (en) | Electronic equipment with antenna | |
| JP2003218541A (en) | Circuit board structured to reduce emi | |
| CN204906857U (en) | Ground connection eyelet welding dish, printed circuit board and equipment | |
| CN209487497U (en) | A kind of chip structure | |
| US20120043113A1 (en) | Printed circuit board | |
| CN201563292U (en) | Grounding structure of circuit board | |
| CN202269094U (en) | Printed circuit board module group and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120314 |