CN102371371A - Turning Tool - Google Patents
Turning Tool Download PDFInfo
- Publication number
- CN102371371A CN102371371A CN2011102196018A CN201110219601A CN102371371A CN 102371371 A CN102371371 A CN 102371371A CN 2011102196018 A CN2011102196018 A CN 2011102196018A CN 201110219601 A CN201110219601 A CN 201110219601A CN 102371371 A CN102371371 A CN 102371371A
- Authority
- CN
- China
- Prior art keywords
- lathe tool
- wheel
- turning
- pedestal
- handle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 28
- 230000006866 deterioration Effects 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 5
- 230000003321 amplification Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000003199 nucleic acid amplification method Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Abstract
The invention provides a turning tool which can inhibit quality deterioration of a processed piece which is cut out. The turning tool is used for cutting pieces. It is characterized in that the turning tool includes a turning module provided with a turning handle and a cutting knife. The turning handle can be installed on a wheel base in a dismountable manner. The cutting knife can be arranged on the turning handle in a dismountable manner. The turning tool also includes a balancing counter weight arranged in a position of the wheel base. A rotation center is taken as the reference. The position is point symmetrical to the turning module. And the balancing counter weight has the same weight with the turning module.
Description
Technical field
The present invention relates to cut the lathe tool wheel of machined object.
Background technology
There is the multiple technology that is used to realize compactization of semiconductor devices.As an example; The following encapsulation technology that is called as upside-down mounting welding (Flip Chip Bonding) is by practicability: form the metal protuberance thing that is known as projection (Bump) that a plurality of height are approximately 10～100 μ m at the device surface that is formed at semiconductor wafer, these projections are also directly engaged with the electrode contraposition that is formed at circuit board.
The method that ball (stud bump) and so on was electroplated, planted in projection utilization in that the device surface of semiconductor wafer forms forms.Thus, the height of each projection is also inhomogeneous, if keep the words of this state to be difficult to a plurality of projections are all equally joined to the electrode of circuit board.
In addition, in order to realize high-density wiring, exist and between projection and circuit board, clip anisotropic conductive film (Anisotropic Conductive Film, the integrated circuit encapsulation technology that ACF) engages.Adopting under the situation of this encapsulation technology, if the height of projection is not enough, then can cause engaging bad, so above bump height that need reach a certain height.
Therefore, expectation will be cut to the height of expection at a plurality of projections of the surface of semiconductor wafer formation.As the method that projection is cut to the height of expection, for example in TOHKEMY 2000-173954 communique, proposed to use the method for lathe tool wheel cutting projection.
Lathe tool wheel possesses the wheel pedestal and is equipped on the wheel pedestal and comprises the lathe tool unit of cutting edge, makes the rotation of lathe tool wheel on one side, is connected at cutting edge on one side under the state of machined object lathe tool wheel and machined object are slided, and execution is cut thus.
Patent documentation 1: TOHKEMY 2000-173954 communique
Yet; In lathe tool wheel in the past; Owing to be that a lathe tool unit is installed on the such structure of wheel pedestal with the mode that can load and unload, therefore have following problems: produce vibration along with the rotation of lathe tool wheel, the processing quality of the machined object that is cut out worsens because of this vibration.
Summary of the invention
The present invention accomplishes in view of such problem just, and its purpose is to provide a kind of lathe tool wheel of deterioration of processing quality of the machined object that can suppress to be cut out.
According to the present invention, a kind of lathe tool wheel is provided, it is used to cut machined object, it is characterized in that, and this lathe tool wheel possesses: the wheel pedestal; The lathe tool unit, it has lathe tool handle and cutting edge, and said lathe tool handle is installed on the said pedestal of taking turns with the mode that can load and unload, and said cutting edge is equipped on said lathe tool handle with the mode that can load and unload; And balance uses counterweight, and it is equipped on, and said what take turns pedestal is the point-symmetric position of benchmark and said lathe tool unit with this pivot of taking turns pedestal, and this balance has identical weight with counterweight and said lathe tool unit.
In lathe tool wheel of the present invention; Since will the balance identical uses with the lathe tool unit weight counterweight be provided in the wheel pedestal with the pivot of taking turns pedestal point-symmetric position, installation site as benchmark and lathe tool unit; Therefore the vibration of accompanying can be reduced, thereby the deterioration of the processing quality of machined object can be suppressed with the rotation of lathe tool wheel.
Description of drawings
Fig. 1 is suitable for utilizing lathe tool of the present invention to take turns the stereogram of the semiconductor wafer that cuts.
Fig. 2 is the stereogram that is equipped with the lathe tool topping machanism of lathe tool wheel of the present invention.
Fig. 3 is the stereogram of the lathe tool wheel that relates to of embodiment of the present invention.
Fig. 4 is the exploded perspective view of lathe tool unit.
Fig. 5 (A) illustrates the side view of lathe tool unit with respect to the mounting structure of wheel pedestal, and Fig. 5 (B) is the front view that its part is cut open.
Fig. 6 (A) illustrates balance with the side view of counterweight with respect to the mounting structure of wheel pedestal, and Fig. 6 (B) is the front view that its part is cut open.
Fig. 7 illustrates to utilize lathe tool to take turns the sketch map of the cut operation of the wafer that carries out.
Fig. 8 (A) is the amplification view of the semiconductor wafer before the cutting, and Fig. 8 (B) is the amplification view of the semiconductor wafer after the cutting.
Label declaration
W: semiconductor wafer; D: device; 2: the lathe tool topping machanism; 5: projection; 10: the lathe tool cutting unit; 25: the lathe tool wheel; 26: the lathe tool unit; 30: chuck table; 50: the wheel pedestal; 52: handle (lathe tool handle); 54: lathe tool; 56: cutting edge; 66: balance is used counterweight.
The specific embodiment
Below, with reference to accompanying drawing embodiment of the present invention is described at length.With reference to figure 1, it shows and is suitable for adopting lathe tool of the present invention to take turns the stereogram of the semiconductor wafer W of cutting.Be formed with the 1st spacing track S1 and the 2nd spacing track S2 on the surperficial quadrature ground of semiconductor wafer W, be formed with device (chip) D respectively in each zone that marks off by the first spacing track S1 and the second spacing track S2.
Shown in the enlarged drawing of Fig. 1, become to have the projection 5 of a plurality of overshooting shapes at the quadrangle of each device D.Shown in the amplification view of Fig. 8 (A), these projections 5 are embedded in the underfill (ア Application ダ one Off イ Le material) 7.Adopt epoxy resin or benzocyclobutene (BCB) as underfill 7.
Next with reference to Fig. 2, the lathe tool topping machanism 2 that is equipped with the lathe tool wheel that embodiment of the present invention relates to is described.Label 4 is bases (housing) of lathe tool topping machanism 2, erects at the rear of base 4 and is provided with column 6.Be fixed with the pair of guide rails (only illustrating) 8 of extending along the vertical direction at column 6.
Along this pair of guide rails 8 can be equipped with lathe tool cutting unit 10 in the mode that above-below direction moves.The housing 20 of lathe tool cutting unit 10 is installed on mobile foundation 12, and this mobile foundation 12 moves at above-below direction along pair of guide rails 8.
Lathe tool cutting unit 10 comprises: housing 20; Main shaft 22 (with reference to Fig. 7), it rotatably is accommodated in the housing 20; Mount pad 24, it is fixed on the end of main shaft 22; And lathe tool wheel 25, it is assemblied in mount pad 24 with the mode that can load and unload.Lathe tool unit 26 is installed on lathe tool wheel 25 with the mode that can load and unload.
Lathe tool cutting unit 10 possesses lathe tool cutting unit feed mechanism 18, and this lathe tool cutting unit feed mechanism 18 is by lathe tool cutting unit 10 is constituted with impulse motor 16 at the ball-screw 14 that above-below direction moves along pair of guide rails 8.When paired pulses motor 16 carries out pulsed drive, ball-screw 14 rotations, mobile foundation 12 moves along the vertical direction.
Mid portion at base 4 is equipped with the chuck table mechanism 28 with chuck table 30, and chuck table mechanism 28 moves in Y direction by not shown chuck workbench moving arrangement.Label 33 is wrinkle protective covers, and it covers chuck table mechanism 28.
The front part of base 4 be equipped with first wafer case 32, second wafer case 34, wafer transfer with manipulator 36, detent mechanism 38, wafer with a plurality of alignment pins 40 move into mechanism's (charging arm) 42, wafer is taken out of mechanism's (unloading arm) 44 and rotation cleaning unit 46.
In addition, the substantial middle portion at base 4 is provided with the cleaning fluid injection nozzle 48 that is used to clean chuck table 30.This cleaning fluid injection nozzle 48 chuck table 30 be located in device nearby the wafer of side move into take out of the zone state under towards chuck table 30 jet cleaning liquid.
With reference to figure 3, it shows the stereogram of the lathe tool wheel 25 that embodiment of the present invention relates to.Lathe tool wheel 25 is made up of following parts: the wheel pedestal 50 of ring-type; Lathe tool unit 26, it is installed on wheel pedestal 50 with the mode that can load and unload; And balance is with counterweight (counterweight) 66, and it is benchmark and 26 point-symmetric positions, lathe tool unit with the pivot with wheel pedestal 50 that the mode that can load and unload is installed on wheel pedestal 50, and this balance has identical weight with counterweight 66 and lathe tool unit 26.Lathe tool wheel 25 rotates the projection 5 that forms on the surface of wafer W with cutting to the direction of arrow R.
Shown in the exploded perspective view of Fig. 4, lathe tool unit 26 constitutes by the handle of rectangular shape (lathe tool handle) 52 roughly with the lathe tool 54 that the mode that can load and unload is installed on handle 52.Lathe tool 54 is tabular, and is fixed with cutting edge 56 in the face side of an end of length direction, and this cutting edge 56 forms predetermined shape by diamond etc.On lathe tool 54, be formed with the circular hole 59 that supplies screw 58 to insert.
A side at handle 52 is formed with groove 60, and this groove 60 has the degree of depth identical with the thickness of lathe tool 54.Be formed with screwed hole 61 at groove 60.Lathe tool 54 is inserted in the groove 60 of handle 52, and the circular hole 59 that passes lathe tool 54 screws togather screw 58 and screwed hole 61, thus, lathe tool 54 is fixed in handle 52.
As shown in Figure 5, taking turns the screwed hole 63 that pedestal 50 is formed with the installing hole 62 of rectangular shape and is opened in installing hole 62.The handle 52 of lathe tool unit 26 is inserted in the installing hole 62 that is formed at wheel pedestal 50, and screw 64 and screwed hole 63 are screwed togather and tighten, thus, lathe tool unit 26 is fixed in wheel pedestal 50.
On the other hand; Balance has the weight identical with lathe tool unit 26 with counterweight 66, like Fig. 3 and shown in Figure 6, balance is inserted in the erection opening 68 with counterweight 66; The pivot with wheel pedestal 50 that this erection opening 68 is formed at wheel pedestal 50 is benchmark and 26 point-symmetric positions, lathe tool unit; And screw 70 is screwed togather and is anchored in the screwed hole 69, and thus, balance is fixed in wheel pedestal 50 with counterweight 66.
Next, with reference to Fig. 7 the cutting working method based on the semiconductor wafer W of lathe tool wheel 25 is described.Shown in the amplification view of Fig. 8 (A), be formed with a plurality of projections 5 that are connected with the electrode of each device D respectively on the surface of semiconductor wafer W, these projections 5 are embedded in the underfill 7 that is formed by epoxy resin etc.
Make the rotating speed rotation of main shaft 22 on one side with about 2000rpm; Thereby driving cars break bar feed mechanism 18 makes the cutting edge 56 of lathe tool unit 26 cut underfill 7 with desired depth on one side; Chuck table 30 is moved to arrow Y direction with the feed speed of 1mm/s, and in cutting underfill 7, cut projection 5.When this cut, chuck table 30 is processed feeding and is not rotated in Y direction.
When the left end of the wafer W that attracts to remain in chuck table 30 through behind the installation site of cutting edge 56; The cutting of wafer W finishes, and shown in Fig. 8 (B), the surface of underfill 7 becomes smooth; Projection 5 is cut with underfill 7, and its height is by processing equably.
In the lathe tool wheel 25 of this embodiment; The pivot with wheel pedestal 50 at wheel pedestal 50 is benchmark and 26 point-symmetric positions, lathe tool unit; Be equipped with have identical weight with lathe tool unit 26 balance with counterweight 66; Thus, reduced the vibration of accompanying with the rotation of lathe tool wheel 25, thus the deterioration of the processing quality of the machined object that can suppress to cause by vibration.
Claims (1)
1. a lathe tool is taken turns, and it is used to cut machined object, it is characterized in that,
This lathe tool wheel possesses:
The wheel pedestal;
The lathe tool unit, it has lathe tool handle and cutting edge, and said lathe tool handle is installed on the said pedestal of taking turns with the mode that can load and unload, and said cutting edge is equipped on said lathe tool handle with the mode that can load and unload; And
Balance is used counterweight, and it is equipped on, and said what take turns pedestal is the point-symmetric position of benchmark and said lathe tool unit with this pivot of taking turns pedestal, and this balance has identical weight with counterweight and said lathe tool unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-175338 | 2010-08-04 | ||
| JP2010175338A JP2012035343A (en) | 2010-08-04 | 2010-08-04 | Cutting tool wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102371371A true CN102371371A (en) | 2012-03-14 |
Family
ID=45790916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102196018A Pending CN102371371A (en) | 2010-08-04 | 2011-08-02 | Turning Tool |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2012035343A (en) |
| KR (1) | KR20120022590A (en) |
| CN (1) | CN102371371A (en) |
| TW (1) | TW201210767A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5925050B2 (en) * | 2012-05-22 | 2016-05-25 | 株式会社ディスコ | Tool for cutting tools |
| JP6069122B2 (en) * | 2013-07-22 | 2017-02-01 | 株式会社ディスコ | Cutting equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63131312U (en) * | 1987-02-18 | 1988-08-26 | ||
| CN1102366A (en) * | 1993-07-06 | 1995-05-10 | 奥克斯特·贝克有限公司 | Apparatus for working with removing material |
| JP2004174691A (en) * | 2002-11-29 | 2004-06-24 | Sanyo Kogyo:Kk | Cutter for mirror finishing resin material end surface and mirror finishing device of resin material end surface furnished with this cutter |
| JP2006116627A (en) * | 2004-10-20 | 2006-05-11 | Sanyo Kogyo:Kk | Cutter for mirror-finishing resin material |
| CN101018634A (en) * | 2004-09-14 | 2007-08-15 | 彗星集团控股有限公司 | Tool head for machine-tools with unbalance damping |
| JP2008258321A (en) * | 2007-04-03 | 2008-10-23 | Disco Abrasive Syst Ltd | Cutting method and cutting device |
-
2010
- 2010-08-04 JP JP2010175338A patent/JP2012035343A/en active Pending
-
2011
- 2011-07-19 TW TW100125470A patent/TW201210767A/en unknown
- 2011-07-29 KR KR1020110075863A patent/KR20120022590A/en not_active Application Discontinuation
- 2011-08-02 CN CN2011102196018A patent/CN102371371A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63131312U (en) * | 1987-02-18 | 1988-08-26 | ||
| CN1102366A (en) * | 1993-07-06 | 1995-05-10 | 奥克斯特·贝克有限公司 | Apparatus for working with removing material |
| JP2004174691A (en) * | 2002-11-29 | 2004-06-24 | Sanyo Kogyo:Kk | Cutter for mirror finishing resin material end surface and mirror finishing device of resin material end surface furnished with this cutter |
| CN101018634A (en) * | 2004-09-14 | 2007-08-15 | 彗星集团控股有限公司 | Tool head for machine-tools with unbalance damping |
| JP2006116627A (en) * | 2004-10-20 | 2006-05-11 | Sanyo Kogyo:Kk | Cutter for mirror-finishing resin material |
| JP2008258321A (en) * | 2007-04-03 | 2008-10-23 | Disco Abrasive Syst Ltd | Cutting method and cutting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012035343A (en) | 2012-02-23 |
| TW201210767A (en) | 2012-03-16 |
| KR20120022590A (en) | 2012-03-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120314 |