201210767 六、發明說明： 【發明所屬之技術，貝域3 發明領域 本發明係有關於一種切削被加工物之切削輪。201210767 VI. Description of the Invention: [Technical Field of the Invention, Bay Field 3 Field of the Invention The present invention relates to a cutting wheel for cutting a workpiece.
L· ZI 發明背景 目前有各種用以實現半導體元件之輕薄短小化的技 術，例如，在形成於半導體晶圓之元件表面形成複數個10 〜ΙΟΟμηι左右高度之稱為凸塊的金屬突起物，使該等凸塊 相對於形成在配線基板之電極而直接接合，如上所述之稱 為覆晶接合的安裝技術已被實用化。 形成於半導體晶圓之元件表面的凸塊係藉由電鍍或打 線凸塊(stud bump)等方法所形成。因此，各個凸塊之高度 不一致，若不進行加工，則難以將保持原樣的複數凸塊完 全均一地接合於配線基板的電極。 又為了貫現尚达、度配線，有一種在凸塊與配線基板 之間夾著異向性導電膜(ACF)而接合的積體電路安裝技 術在使用遠安裝技術時，由於若凸塊之高度不足，則會 導致接合不良，故需要一定程度以上的凸塊高度。 ,因此’期待能將形成於半導體晶圓表面之複數凸塊切 肖!成所品的呵度。使用切削輪切取凸塊來作為將凸塊切削 成所需高度的方法，係例如曰本專利公開公報特開 2000-173954號公報所提出者。 刀肖J輪具備有輪基台 '及包含配設於輪基台之切削刀 Ο 3 201210767 刃的刀具單元，使切削輪旋轉，並且在將切削刀刃抵接於 被加工物之狀態下使切削輪與被加工物相對地移動，藉此 進行切削。 先行技術文獻 專利文獻 專利文獻1 :日本專利公開公報特開2〇〇〇_丨73954號公 報 t ^^明内 發明揭示 發明欲解決之課題 但是，在習知之切削輪中，由於係構成為一個刀具單 元可裝卸地安裝於輪基台，故隨著切肖彳輪_會產生振 動’會有因為該振動而使所切削之被加工物的加工品質惡 化的問題。 本發明係有黎於上述問題點而發明者，目的在於提供 -種可抑制所切削之被加卫物的加工品質惡化的切削輪。 用以欲解決課題之手段 艮本心明，可提供—種切削輪，係切削被加工物之 切削輪’其特徵在於具備有：輪基台；刀具單元，係具有 =裝脫地女裝於③輪基台之切削刀柄、與可裝脫地配設於 ==-柄之_心者；及取平衡賴，係配設於以該 輪基台之旋轉中心為基準相對於該刀具單元為點對稱位置 之该輪基台，且與該刀具單元具有同重量者。 發明效果 201210767 本發明之切削輪，由於在以輪基台之旋轉中心為基準 相對於刀具單元之安裝位置為點對稱位置之輪基台，配設 有與刀具單元同樣重量的取平衡用錘，故可減低伴隨著切 削輪旋轉而產生的振動，而抑制被加工物之加工品質惡化。 圖式簡單說明 第1圖係適合以本發明之切削輪進行切削的半導體晶 圓的立體圖。 第2圖係安裝有本發明之切削輪之刀具切削裝置的立 體圖。 第3圖係本發明實施形態之切削輪的立體圖。 第4圖係刀具單元的分解立體圖。 第5(A)圖係顯示刀具單元往輪基台之安裝構造的側面 圖，第5(B)圖係其一部分的截面正面圖。 第6(A)圖係顯示取平衡用錘往輪基台之安裝構造的側 面圖，第6(B)圖係其一部分的裁面正面圖。 第7圖係顯示以切削輪進行之晶圓切削加工工程的示 意圖。 第8(A)圖係切削前之半導體晶圓的放大截面圖，第8(B) 圖係切削後之半導體晶圓的放大截面圖。 t實方包方式3 用以實施發明之最佳形態 以下，參照圖示詳細說明本發明之實施形態。參照第1 圖，顯示有適合以本發明之切削輪進行切削的半導體晶圓 W的立體圖。在半導體晶圓W表面，垂直地形成有第1切割 201210767 '' '、第2切割道S2，在藉由第1切割道§ 1與第2切割道§2 所區剎出之各區域，分別形成有元件（晶片）〇。 ☆如第1圖之放大圖所示，在各元件口的4邊，形成有複數 犬釔狀的凸塊5。該等凸塊5如第8(A)圖之放大截面圖所 不，埋設於止封材7内。止封材7使用環氧樹脂或苯環丁烯 (BCB) 〇 接著參照第2圖，說明安裝有本發明實施形態之切削輪 的刀具切削裝置2。4是刀具切削裝置2的基座（外罩），在基 *的後方直立設有管柱6。在管柱6固定有延伸於上下方向 的對導軌(僅圖示出一根)8。 沿著該等一對導軌8可移動於上下方向地安裝有刀具 切削平元10。刀具切削單元1〇之外罩2〇安裝於可沿著一對 導轨8移動於上下方向之移動基台12。 刀具切削單元10包含有：外罩20、可旋轉地收容於外 罩2〇中之心軸22(參照第7圖）、固定於心軸22前端之架座 24及可裝卸地安裝於架座24之切削輪25。在切削輪25， 可裝卸地安裝有刀具單元26。 刀具切削單元1〇具備有刀具切削單元搬送機構18，該 刀具切削單元搬送機構18係由將刀具切削單元10沿著—對 引導導執8移動於上下方向的滾珠螺桿14及脈衝碼達μ所 構成者。當脈衝碼達16脈衝驅動，則滾珠螺桿14會旋轉， 而移動基台12移動於上下方向。 在基座4的中間部分配設有具有夾盤台3〇之夾盤台機 構28’夾盤台機構28藉由未圖示之夾盤台移動機構移動於γ 201210767 軸方向。33係蛇腹，可遮蓋夾盤台機構28。 在基座4的前側部分，配設有第1晶圓匣32、第2晶圓匣 34、晶圓搬送用機器手36、具有複數定位銷4〇之定位機構 38、晶圓搬入機構(裝載臂）42、晶圓搬出機構(卸載臂）44 及旋轉器洗淨單元46。 又’在基座4的概略中央部，設有洗淨夾盤台3〇之洗淨 水喷射喷嘴48。該洗淨水噴射噴嘴48在夾盤台3〇位於裝置 正面側之晶圓搬入、搬出區域的狀態時，向夾盤台3〇噴射 洗淨水。 參照第3圖，該圖顯示本發明實施形態之切削輪25的立 體圖。切削輪25係由以下構造所構成：環狀的輪基台5〇、 可裝卸地安裝於輪基台5〇的刀具單元26、及以輪基台5〇之 旋轉中心為基準可裝卸地安裝於相對刀具單元2 6為點對稱 位置之輪基台50且與刀具單元26為同樣重量的取平衡用錘 (平衡物)6 6。切削輪2 5係旋轉於箭號R方向而切削形成在晶 圓W表面的凸塊5。 刀具單元26如第4圖之分解立體圖所示，係由略呈長方 體形狀的刀柄（刀具刀柄）52、及可裝卸地安裝於刀柄52之刀 具54所構成。刀具54呈板狀，在長方向之一端部的表面側， 固定接著有以鑽石等形成為預定形狀的切削刀刃56。在刀 具54形成有螺桿58可插入的圓孔59。 在刀柄52之一側面，形成有與刀具54之厚度為同等深 度的凹處60。在凹處60形成有螺孔61。將刀具54插入刀柄 52之凹處60内’透過刀具54之圓孔59將螺桿58螺合於螺孔 201210767 61 ’藉此，刀具Μ可固定於刀柄52。 如第5圖所示，在輪基台50形成有長方體形狀的安裝孔 Μ、及開口於安裝孔62的螺孔63。將刀具單元％之刀柄^ 插入形成在輪基㈣之安裝孔62中，將螺糾螺合鎖緊於 螺孔63,藉此，刀具單元26可固定於輪基台％。 曰另-方面，取平衡用鐘66具有與刀具單元勒同的重 量’如第3及6圖所示，將取平衡用錘的插人安裝用孔的中， 將螺桿70螺合鎖緊於螺孔69中，藉此，將取平衡用祕固 定於輪基台5G ’且前述安裝用⑽係形成在以輪基台別之 旋轉中心為基準地相對於刀具單元26為點對稱位置之輪基 台50上。 接著，參照第7圖，說明以切削輪25所進行之半導體晶 SIW的切削加工方法。在半導體晶圓w表面，如第8(A)圖之 放大截面圖所示’形成有分別連接於各元電極的複數凸 塊5，該等凸塊5埋設於由環氧樹脂等所形成之止封材7中。 將心轴22以約2〇〇〇rpm進行旋轉，並且驅動切削輪搬送 機構18，使刀具單元26之切削刀刃56於止封材7切入預定深 度，一面使失盤台30以lmm/s的移動速度於箭號γ方向移 動，一面切削止封材7與凸塊5。在該切削加工時，夾盤台 30不旋轉地於Y轴方向進行加工移動。 當吸引保持於夾盤台3 〇之晶圓w的左端通過切削刀刃 56之安裝位置，則晶圓w之切削結束，如第8(b)圖所示，止 封材7表面呈平垣，凸塊5與止封材7一起被切削而其高度被 加工成均一。 201210767 在本實施形態之切削輪25中，由於在以輪基台50之旋 轉中心為基準地相對於刀具單元26為點對稱位置之輪基台 50，配設有與刀具單元26具有同樣重量之取平衡錘66，故 可減輕隨著切削輪25的旋轉而來的振動，可抑制因振動所 引起之被加工物的加工品質惡化。 I：圖式簡單說明3 第1圖係適合以本發明之切削輪進行切削的半導體晶 圓的立體圖。 第2圖係安裝有本發明之切削輪之刀具切削裝置的立 體圖。 第3圖係本發明實施形態之切削輪的立體圖。 第4圖係刀具單元的分解立體圖。 第5(A)圖係顯示刀具單元往輪基台之安裝構造的側面 圖，第5(B)圖係其一部分的截面正面圖。 第6(A)圖係顯示取平衡用錘往輪基台之安裝構造的側 面圖，第6(B)圖係其一部分的截面正面圖。 苐7圖係顯不以切削輪進4于之晶圓切削加工工程的不 意圖。 第8(A)圖係切削前之半導體晶圓的放大截面圖，第8(B) 圖係切削後之半導體晶圓的放大截面圖。 【主要元件符號說明】 2.. .刀具切削裝置 6...管柱 4.. .外罩 7...止封材 5…凸塊 8...導執 201210767 ίο…刀具切削單元 12.. .移動基台 14.. .滚珠螺桿 16.. .脈衝馬達 18.. .切削輪搬送機構 20.. .外罩 22. · ·心轴 24.. .架座 25.. .切削輪 26.. .刀具單元 28.. .夾盤台機構 30.. .夾盤台 32.. .第1晶圓匣 33.. .蛇腹 34.. .第2晶圓匡 36.. .晶圓搬送用機器手 38.. .定位機構 40.. .定位銷 42…晶圓搬入機構(裝載臂) 44.. .晶圓搬出機構(卸載臂) 46.. .旋轉器洗淨單元 48.. •洗淨水喷射喷嘴 50.. .輪基台 52.. .刀柄(刀具刀柄） 54.. .刀具 56.. .切削刀刃 58、64、70.··螺桿 59.. .圓孔 60.. .凹處 61、63、69…螺孔 62.. .安裝孔 66···取平衡用錘(平衡物） 68…安裝用孔 R...方向 51.. .第1切割道 52.. .第2切割道 W...半導體晶圓BACKGROUND OF THE INVENTION There are various techniques for realizing the thinness and thinning of semiconductor devices, for example, forming a plurality of metal protrusions called bumps at a height of about 10 ΙΟΟμηι on the surface of a device formed on a semiconductor wafer. These bumps are directly bonded to the electrodes formed on the wiring substrate, and the mounting technique called flip chip bonding as described above has been put into practical use. The bumps formed on the surface of the element of the semiconductor wafer are formed by plating or wire bumping. Therefore, the height of each of the bumps does not match, and if the processing is not performed, it is difficult to completely and uniformly bond the plurality of bumps as they are to the electrodes of the wiring board. In order to achieve the snagging and the wiring, there is an integrated circuit mounting technique in which an anisotropic conductive film (ACF) is interposed between the bump and the wiring substrate, and when the remote mounting technique is used, If the height is insufficient, the joint is poor, so a certain height of bumps is required. Therefore, it is expected that the plurality of bumps formed on the surface of the semiconductor wafer can be cut into a product. A method of cutting a projection using a cutting wheel as a method of cutting a projection to a desired height is disclosed in Japanese Laid-Open Patent Publication No. 2000-173954. The K-wheel of the Knife Shaw has a wheel base ' and a cutter unit including a cutting blade 2012 3 201210767 blade provided on the wheel base to rotate the cutting wheel and cut the cutting edge against the workpiece. The wheel moves relative to the workpiece to perform cutting. The prior art document discloses a problem to be solved by the invention. However, in the conventional cutting wheel, since the system is configured as a single one, it is disclosed in Japanese Patent Laid-Open Publication No. Hei. Since the cutter unit is detachably attached to the wheel base, there is a problem that the machining quality of the workpiece to be processed is deteriorated due to the vibration due to the vibration of the cutter wheel. The present invention has been made by the inventors of the above problems, and an object of the invention is to provide a cutting wheel capable of suppressing deterioration in processing quality of a workpiece to be cut. The method for solving the problem is to provide a cutting wheel, which is a cutting wheel for cutting a workpiece, which is characterized in that it has a wheel base; a cutter unit, which has a dressing-up The cutting shank of the 3-wheel abutment and the detachable ground are disposed at the center of the ==-handle; and the balance is applied to the tool unit based on the rotation center of the base of the wheel The wheel base is a point symmetrical position and has the same weight as the tool unit. Advantageous Effects of Invention 201210767 The cutting wheel of the present invention has a wheel base that is point-symmetrical with respect to a mounting position of the tool unit with respect to a rotation center of the wheel base, and a balance hammer having the same weight as the tool unit is disposed. Therefore, the vibration generated by the rotation of the cutting wheel can be reduced, and the deterioration of the processing quality of the workpiece can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a semiconductor wafer suitable for cutting by the cutting wheel of the present invention. Fig. 2 is a perspective view of a cutter cutting device to which the cutting wheel of the present invention is mounted. Fig. 3 is a perspective view of a cutting wheel according to an embodiment of the present invention. Figure 4 is an exploded perspective view of the cutter unit. Fig. 5(A) is a side view showing a mounting structure of the cutter unit to the wheel base, and Fig. 5(B) is a cross-sectional front view showing a part thereof. Fig. 6(A) is a side view showing the mounting structure of the balance hammer for the wheel base, and Fig. 6(B) is a front view of a part of the same. Fig. 7 is a view showing a wafer cutting process by a cutting wheel. Fig. 8(A) is an enlarged cross-sectional view of the semiconductor wafer before cutting, and Fig. 8(B) is an enlarged cross-sectional view of the semiconductor wafer after cutting. BEST EMBODIMENT OF THE INVENTION The embodiment of the present invention will be described in detail below with reference to the drawings. Referring to Fig. 1, there is shown a perspective view of a semiconductor wafer W suitable for cutting by the cutting wheel of the present invention. On the surface of the semiconductor wafer W, the first cut 201210767 '' ' and the second cut line S2 are vertically formed, and each of the regions secured by the first scribe line § 1 and the second scribe line § 2 is respectively An element (wafer) is formed. ☆ As shown in the enlarged view of Fig. 1, a plurality of dog-shaped bumps 5 are formed on four sides of each element port. The bumps 5 are embedded in the sealing material 7 as shown in the enlarged cross-sectional view of Fig. 8(A). The sealing material 7 is made of epoxy resin or benzocyclobutene (BCB). Next, referring to Fig. 2, the cutting tool 2 to which the cutting wheel according to the embodiment of the present invention is attached will be described. 4 is the base of the cutting device 2 (cover) ), the column 6 is erected at the rear of the base*. To the column 6, a pair of guide rails (only one shown) 8 extending in the up and down direction are fixed. A cutter cutting element 10 is attached to the pair of guide rails 8 so as to be movable in the vertical direction. The cutter cutting unit 1 is attached to the moving base 12 which is movable in the vertical direction along the pair of guide rails 8. The tool cutting unit 10 includes a cover 20, a spindle 22 rotatably housed in the cover 2 (see FIG. 7), a holder 24 fixed to the front end of the spindle 22, and detachably mounted to the holder 24. Cutting wheel 25. The cutter unit 26 is detachably attached to the cutting wheel 25. The tool cutting unit 1A includes a tool cutting unit conveying mechanism 18 that moves the tool cutting unit 10 along the pair of guiding guides 8 in the vertical direction of the ball screw 14 and the pulse code μ. Constitute. When the pulse code is driven by 16 pulses, the ball screw 14 is rotated, and the moving base 12 is moved in the up and down direction. A chuck mechanism 28' having a chuck table 3' is disposed in the middle portion of the susceptor 4. The chuck mechanism 28 is moved in the γ 201210767 axial direction by a chuck moving mechanism (not shown). The 33 series bells cover the chuck mechanism 28. In the front side portion of the susceptor 4, a first wafer cassette 32, a second wafer cassette 34, a wafer transfer robot 36, a positioning mechanism 38 having a plurality of positioning pins 4, and a wafer loading mechanism (loading) are disposed. The arm 42 and the wafer unloading mechanism (unloading arm) 44 and the rotator cleaning unit 46. Further, in the center portion of the base 4, a washing water spray nozzle 48 for cleaning the chuck table 3 is provided. The washing water spray nozzle 48 sprays the washing water to the chuck table 3 when the chuck table 3 is placed in the loading and unloading area of the wafer on the front side of the apparatus. Referring to Fig. 3, there is shown a perspective view of a cutting wheel 25 according to an embodiment of the present invention. The cutting wheel 25 is composed of an annular wheel base 5〇, a cutter unit 26 detachably attached to the wheel base 5〇, and a detachable mounting based on the rotation center of the wheel base 5〇. A balance hammer (balance) 6 6 having the same weight as the cutter unit 26 at the wheel base 50 at a point symmetrical position with respect to the cutter unit 26 is used. The cutting wheel 25 is rotated in the direction of the arrow R to cut the bump 5 formed on the surface of the wafer W. As shown in the exploded perspective view of Fig. 4, the cutter unit 26 is composed of a tool holder (tool holder) 52 having a substantially rectangular parallelepiped shape and a cutter 54 detachably attached to the holder 52. The cutter 54 has a plate shape, and a cutting edge 56 formed in a predetermined shape by diamond or the like is fixed to the surface side of one end portion in the longitudinal direction. A circular hole 59 into which the screw 58 can be inserted is formed in the cutter 54. On one side of the shank 52, a recess 60 having the same depth as the thickness of the cutter 54 is formed. A screw hole 61 is formed in the recess 60. The cutter 54 is inserted into the recess 60 of the shank 52. The screw 58 is screwed into the screw hole through the circular hole 59 of the cutter 54. 201210767 61 ' Thereby, the cutter Μ can be fixed to the shank 52. As shown in Fig. 5, a mounting hole having a rectangular parallelepiped shape and a screw hole 63 opening in the mounting hole 62 are formed in the wheel base 50. The cutter unit % of the tool holder is inserted into the mounting hole 62 formed in the wheel base (4), and the screw is screwed to the screw hole 63, whereby the cutter unit 26 can be fixed to the wheel base unit%. On the other hand, the balance clock 66 has the same weight as the cutter unit. As shown in Figures 3 and 6, the balance hammer is inserted into the mounting hole, and the screw 70 is screwed to the screw. In the screw hole 69, the balance is fixed to the wheel base 5G', and the mounting (10) is formed in a wheel that is point-symmetrical with respect to the cutter unit 26 based on the rotation center of the wheel base. On the abutment 50. Next, a cutting method of the semiconductor crystal SIW by the cutting wheel 25 will be described with reference to Fig. 7. On the surface of the semiconductor wafer w, as shown in an enlarged cross-sectional view of FIG. 8(A), a plurality of bumps 5 respectively connected to the respective element electrodes are formed, and the bumps 5 are buried in an epoxy resin or the like. In the sealing material 7. The mandrel 22 is rotated at about 2 rpm, and the cutting wheel transfer mechanism 18 is driven to cut the cutting edge 56 of the cutter unit 26 into the predetermined depth of the sealing material 7, while the loss table 30 is at 1 mm/s. The moving speed is moved in the direction of the arrow γ, and the sealing material 7 and the bump 5 are cut on one side. At the time of this cutting process, the chuck table 30 is moved in the Y-axis direction without rotation. When the left end of the wafer w held by the chuck table 3 is attracted to the mounting position of the cutting edge 56, the cutting of the wafer w is completed. As shown in Fig. 8(b), the surface of the sealing material 7 is flat, and the bump is formed. 5 is cut together with the sealing material 7 and its height is processed to be uniform. In the cutting wheel 25 of the present embodiment, the wheel base 50 that is point-symmetrical with respect to the cutter unit 26 with respect to the rotation center of the wheel base 50 is provided with the same weight as the cutter unit 26. Since the counterweight 66 is taken, the vibration due to the rotation of the cutting wheel 25 can be reduced, and the deterioration of the processing quality of the workpiece due to the vibration can be suppressed. I: BRIEF DESCRIPTION OF THE DRAWINGS 3 Fig. 1 is a perspective view of a semiconductor wafer suitable for cutting by the cutting wheel of the present invention. Fig. 2 is a perspective view of a cutter cutting device to which the cutting wheel of the present invention is mounted. Fig. 3 is a perspective view of a cutting wheel according to an embodiment of the present invention. Figure 4 is an exploded perspective view of the cutter unit. Fig. 5(A) is a side view showing a mounting structure of the cutter unit to the wheel base, and Fig. 5(B) is a cross-sectional front view showing a part thereof. Fig. 6(A) is a side view showing a mounting structure for a balance hammer to the wheel base, and Fig. 6(B) is a front sectional view showing a part thereof. The 苐7 image shows no intention of cutting the wafer into the wafer. Fig. 8(A) is an enlarged cross-sectional view of the semiconductor wafer before cutting, and Fig. 8(B) is an enlarged cross-sectional view of the semiconductor wafer after cutting. [Description of main component symbols] 2.. Tool cutting device 6...Pipe 4:. Cover 7...Finishing material 5...Bump 8...Console 201210767 ίο...Tool cutting unit 12.. . Mobile Abutment 14 .. Ball Screw 16 .. Pulse Motor 18.. Cutting Wheel Transfer Mechanism 20 .. . Cover 22. · Mandrel 24 .. . Rack 25 .. . Cutting Wheel 26 .. Tool unit 28... chuck table mechanism 30.. chuck table 32.. .1st wafer cassette 33.. . snake belly 34.. . 2nd wafer cassette 36.. wafer transfer machine Hand 38.. Positioning mechanism 40.. Positioning pin 42... Wafer loading mechanism (loading arm) 44.. Wafer carrying out mechanism (unloading arm) 46.. Rotator cleaning unit 48.. • Washing Water jet nozzle 50.. Wheel base 52.. Tool holder (tool holder) 54.. Tool 56.. Cutting edge 58, 64, 70.. Screw 55.. Round hole 60.. Concave 61, 63, 69... Screw hole 62.. Mounting hole 66··· Take balance hammer (balance) 68... Mounting hole R... Direction 51.. . 1st cutting path 52.. .2nd cutting channel W...semiconductor wafer
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