CN102332231B - Technology for hybrid integration of multi-chip thick film printed circuit board (PCB) and light-emitting diode (LED) flat plate display - Google Patents
Technology for hybrid integration of multi-chip thick film printed circuit board (PCB) and light-emitting diode (LED) flat plate display Download PDFInfo
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- CN102332231B CN102332231B CN 201110327669 CN201110327669A CN102332231B CN 102332231 B CN102332231 B CN 102332231B CN 201110327669 CN201110327669 CN 201110327669 CN 201110327669 A CN201110327669 A CN 201110327669A CN 102332231 B CN102332231 B CN 102332231B
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Abstract
The invention discloses a technology for hybrid integration of a multi-chip thick film printed circuit board (PCB) and a light-emitting diode (LED) flat plate display, which comprises the following steps of: 1) processing an LED display screen, namely a, forming a film, and b, pasting and bonding; 2) processing a decoding drive PCB core group; 3) assembling; 4) processing a packaged shell cover; and 5) packaging. Through the technical scheme, the technology for the hybrid integration of the multi-chip thick film PCB and the LED flat plate display has the characteristics that: 1) a hybrid integrated circuit (HIC) process and a PCB process adopted in the scheme are domestic mature technologies, and a product has the characteristics of high performance stability and long-term reliability; 2) a PCB substrate has lower material cost and higher mechanical shock resistance than a low temperature co-fired ceramic (LTCC) substrate; 3) the design is flexible, modification and reworking are convenient to perform, the processing difficulty of the process is obviously reduced, and yield is greatly improved; and 4) an LED flat plate display device has small volume, and the technology is suitable for integrating a large planar array LED flat plate display with more than 256*96 pixels.
Description
Technical field
The present invention relates to a kind of multi-chip thick film PCB mixing integrated LED flat display technology.
Background technology
The LED flat-panel monitor is comprised of LED display and Coding and driving control circuit two parts.Existing LED flat-panel monitor integrated technology mainly contains two kinds:
1) HIC mixing integrated technology: mix integrated method by thick film LED display and Coding and driving control circuit are integrated in 96% Al
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On the ceramic substrate.Display adopts the ceramic cap encapsulation, the ceramic cap end face have inlay transparent glass window as the LED display optical channel; Direct insertion outer lead is assembled as physics and the electricity passage of flat-panel monitor in the ceramic substrate both sides.This integrated technology was successfully applied for utility model patent in 2002, and name is called " small electronic display ", the patent No.: ZL02212784.4.
There is following shortcoming in this technology: LED display and Coding and driving control circuit are integrated in same Al
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On (96 porcelain) ceramic substrate, like this, the flat-panel monitor area is bigger than normal, is only applicable to the LED display pixel less than 96 * 96=9216() flat-panel monitor integrated.
2) 3D-MCM-C(3-D multi-chip assembly-thick film) mix integrated technology: with LED display and Coding and driving control circuit separately design, separate machined, LED display adopts conventional serigraphy, directly describes, bonding die, bonding technology are realized.Decoder driver circuit adopts the LTCC(low-temp ceramics to burn altogether) the cavity technology, be about to the Coding and driving bare chip and be embedded in the LTCC cavity inside, again the technique such as, Bonding interconnect bonding by insulating with LED display with Coding and driving LTCC core group up and down lamination be installed in and form the 3D-MCM structure, add a cover the injection moulding framework and inlay cap that PMMA transparent glass window forms as the LED display optical channel, assembling J30-21ZK type connector is as the external electric channel of LED flat-panel monitor.In this integrated technology, " with ltcc substrate and the Al of cavity
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The three-dimensional assembling of ceramic substrate packaging technology " successfully apply for 2007 years patent of invention, the patent No.: ZL200710083513.3.
There is following shortcoming in this technology: the LTCC cavity is processed and the packaging technology difficulty is high, yield rate is low, the LTCC material cost is high, cavity substrate shock strength is poor etc.
Summary of the invention
In order to address the above problem, the object of the invention is to provide a kind of multi-chip thick film PCB mixing integrated LED flat display technology.
In order to reach above purpose, the technical solution used in the present invention is: a kind of multi-chip thick film PCB mixing integrated LED flat display technology may further comprise the steps:
1) processing of LED display
A. film forming: the row that adopts silk-screen printing technique processing LED display to conductive strips and row to the transition pad, silk-screen printing technique is by the screen mesh on the mask plate, deposit to equably thick film ink on the insulating substrate, formation has the pattern of certain thickness and shape, and insulating substrate adopts 96% Al
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O
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Pottery, web plate order number are 300 orders～400 orders, and mask thickness is 25 μ m～40 μ m; Adopt direct writing process to depict for the datum line of locating bonding die with dielectric paste, the nib model is 4-3 or 3-2, fires under 850 ℃ ± 10 ℃ after describing; Adopt direct writing process to depict barrier film between the adjacent two row conductive strips with dielectric paste, direct writing process is by directly describing the nib on the specialized equipment, describe equably thick film ink on the insulating substrate, formation has the pattern of certain thickness and shape, the nib model that adopts is 4-3 or 3-2, baking under 150 ℃ ± 10 ℃ after describing;
B. bonding die is connected with bonding and is realized in every row that by bonding die technique the lower N utmost point of LED pipe connects; Realize P utmost point electricity connection on the LED pipe in every row by gold wire bonding;
2) processing of Coding and driving PCB core group
Code translator is welded mutually with connector and PCB substrate;
3) assembling
By technique for sticking LED display and Coding and driving PCB core group stacked on top of one another are fixed together, realize that by spun gold ball bonding technology LED display is connected with Coding and driving PCB core group electricity again, form LED flat-panel monitor core group;
4) processing of encapsulation cap
The encapsulation cap adopts the injection moulding framework to inlay the PMMA transparent glass;
5) encapsulation
Light-emitting diode display adopts the embedding mode to encapsulate, and will encapsulate cap and the bonding curing of LED flat-panel monitor core group with silica gel first, reinforces with glue all around at pcb board and encapsulation cap seam crossing again.
Another technical scheme provided by the invention is: a kind of multi-chip thick film PCB mixing integrated LED flat display technology may further comprise the steps:
1) processing of LED display
A. film forming: the row that adopts direct writing process processing LED display to conductive strips and row to the transition pad, insulating substrate adopts 96% Al
2
O
3
Pottery, directly describing conductive strips nib model is 6-4; Adopt direct writing process to depict for the datum line of locating bonding die with dielectric paste, the nib model is 4-3 or 3-2, fires under 850 ℃ ± 10 ℃ after describing; Adopt direct writing process to depict barrier film between the adjacent two row conductive strips with dielectric paste, the nib model is 4-3 or 3-2, after describing 150 ℃ ± 10 ℃ lower bakings;
B. bonding die is connected with bonding and is realized in every row that by bonding die technique the lower N utmost point of LED pipe connects; Realize P utmost point electricity connection on the LED pipe in every row by gold wire bonding;
2) processing of Coding and driving PCB core group
Code translator is welded mutually with connector and PCB substrate;
3) assembling
By technique for sticking LED display and Coding and driving PCB core group stacked on top of one another are fixed together, realize that by spun gold ball bonding technology LED display is connected with Coding and driving PCB core group electricity again, form LED flat-panel monitor core group;
4) processing of encapsulation cap
The encapsulation cap adopts the injection moulding framework to inlay the PMMA transparent glass;
5) encapsulation
Light-emitting diode display adopts the embedding mode to encapsulate, and will encapsulate cap and the bonding curing of LED flat-panel monitor core group with silica gel first, reinforces with glue all around at pcb board and encapsulation cap seam crossing again.
Further, in the film forming step of step 1, the row of processing LED display to conductive strips and row to the transition pad time conductor paste that adopts be DUPONT-5771Au; The dielectric paste that adopts when describing to locate the datum line of bonding die and the barrier film between the adjacent two row conductive strips is DUPONT-5704.
Further, in the bonding die and bonding step of step 1), the bonding agent model that bonding die adopts is the H20E conducting resinl; The cloth gluing method is Semi-automatic dispenser point cloth or serigraphy.
Preferably, in step 1), the gold wire bonding method is the full-automatic continuous bonding of spun gold ball key or the continuous bonding of manual semi-automatic spun gold ball; The spun gold string diameter that adopts is φ 18 μ m～φ 25 μ m, and spun gold gold content is 99.99%.
Further, in step 2) in, the thickness of PCB substrate is 1.5mm ± 0.15mm.
Further, in step 2) in, the transition pad that being used on the PCB substrate is connected with LED display is gold-plated, plated thickness 〉=0.1 μ m.
Further, in step 3), spun gold ball bonding method is full-automatic spun gold ball key bonding or manual semi-automatic spun gold ball bonding; The spun gold string diameter that adopts is φ 18 μ m～φ 25 μ m, and spun gold gold content is 99.99%.
Further, in step 4), the thickness of glass is 1.5mm ± 0.05mm, transmittance 〉=92%; Framework and glass are bonding with bonding agent, and the bonding agent model is WD2104.
Preferably, in the step 5), adopt 704 model silica gel will encapsulate cap and LED flat-panel monitor core group is bonding, around pcb board and encapsulation cap seam crossing, reinforce with WD2104 glue again.
By adopting above technical scheme, multi-chip thick film PCB mixing integrated LED flat display technology of the present invention has following characteristics:
1) HIC technique and the PCB technique of this programme employing all are domestic maturation process, and the characteristics of its product are: stable performance is good, and long-term reliability is high;
2) the cost of material is low, anti-mechanical impact strength is high than ltcc substrate for the PCB substrate;
3) flexible design is revised, is done over again conveniently, and the processes difficulty significantly reduces, and yield rate improves greatly;
4) LED flat-panel display device volume is little, and the large face matrix LED flat-panel monitor that is fit to 256 * 96 above pixels is integrated.
Description of drawings
Accompanying drawing 1 is the construction packages figure of LED flat-panel monitor of the present invention;
Accompanying drawing 2 is LED flat-panel monitor core group structural representation of the present invention;
Accompanying drawing 3 is encapsulation cap structural representation of the present invention.
Wherein:
10, LED display; 20, PCB substrate; 21, code translator; 22, connector; 23, epoxy film; 24, spun gold; 30, framework; 31, glass; 32, silica gel; 33, WD2104 glue.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
Embodiment one
A kind of multi-chip thick film PCB mixing integrated LED flat display technology may further comprise the steps:
1) processing of LED display 10
A. film forming: the row that adopts silk-screen printing technique processing LED display 10 to conductive strips and row to the transition pad, silk-screen printing technique is screen mesh on the mask plate that passes through, deposit to equably thick film ink on the insulating substrate, formation has the pattern of certain thickness and shape, and insulating substrate adopts 96% Al
2
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3
Pottery, web plate order number are 300 orders～400 orders, and mask thickness is 25 μ m～40 μ m, and conductor paste is the thick film conductor paste of DUPONT-5771Au or suitable performance;
Direct writing process is by directly describing the nib on the specialized equipment, describe equably thick film ink on the insulating substrate, formation has the pattern of certain thickness and shape, adopt direct writing process to depict for the datum line of locating bonding die with dielectric paste, the nib model is 4-3 or 3-2, the dielectric paste that adopts is the thick film conductor paste of DUPONT-5704 or suitable performance, fires under 850 ℃ ± 10 ℃ after describing; Adopt direct writing process to depict barrier film between the adjacent two row conductive strips with dielectric paste, the nib model is 4-3 or 3-2, the dielectric paste that adopts is the thick film conductor paste of DUPONT-5704 or suitable performance, toasts film forming after describing under 150 ℃ ± 10 ℃;
B. bonding die is connected with bonding and is realized in every row that by bonding die technique the lower N utmost point of LED pipe connects, and the bonding agent model that adopts is H20E or suitable performance conductive epoxy glue, and the cloth gluing method is Semi-automatic dispenser point cloth or serigraphy; Realize P utmost point electricity connection on the LED pipe in every row by gold wire bonding, the gold wire bonding method is the full-automatic continuous bonding of spun gold ball key or the continuous bonding of manual semi-automatic spun gold ball, and the spun gold string diameter that adopts is φ 18 μ m～φ 25 μ m, and spun gold gold content is 99.99%;
2) processing of Coding and driving PCB core group
3) assembling
By technique for sticking LED display 10 and Coding and driving PCB core group stacked on top of one another are fixed together, adhesives adopts 5020-1-.005 epoxy film 23 or suitable performance adhesives, bonding epoxy film 23 is cut into strip, epoxy film 23 is of a size of (30 ± 1) * (7 ± 1) mm, every circuit uses 2 epoxy film bars 23, and the distance that two adjacent epoxy films are 23 is 4mm ± 1mm; Realize that by spun gold ball bonding technology LED display 10 is connected with Coding and driving PCB core group electricity again, formation LED flat-panel monitor core group, schematic diagram as shown in Figure 2, spun gold ball bonding method is full-automatic spun gold ball key bonding or the semi-automatic spun gold ball bonding of craft; Spun gold 24 string diameters that adopt are φ 18 μ m～φ 25 μ m, and the gold content of spun gold 24 is 99.99%;
4) processing of encapsulation cap
The encapsulation cap adopts injection moulding framework 30 to inlay PMMA transparent glass 31, framework 30 materials adopt the black injected plastics material of polyphenylene sulfide or suitable performance, the thickness of glass 31 is 1.5mm ± 0.05mm, and transmittance 〉=92%, framework 30 adopt with glass 31 that WD2104 is gluing to be connect; The structural drawing of encapsulation cap as shown in Figure 3;
5) encapsulation
Light-emitting diode display adopts the embedding mode to encapsulate, and will encapsulate cap and the bonding curing of LED flat-panel monitor core group with silica gel first, and silica gel adopts black 704 silica gel in the present embodiment, reinforces with WD2104 glue 33 all around at PCB substrate 20 and encapsulation cap seam crossing again.Its construction packages figure as shown in Figure 1.
Embodiment two
A kind of multi-chip thick film PCB mixing integrated LED flat display technology may further comprise the steps:
1) processing of LED display 10
A. film forming: the row that adopts direct writing process processing LED display 10 to conductive strips and row to the transition pad, direct writing process is by directly describing the nib on the specialized equipment, describe equably thick film ink on the insulating substrate, formation has the pattern of certain thickness and shape, and insulating substrate adopts 96% Al
2
O
3
Pottery, directly describing conductive strips nib model is 6-4; Adopt direct writing process to depict for the datum line of locating bonding die with dielectric paste, the nib model is 4-3 or 3-2, and the dielectric paste of employing is the thick film conductor paste of DUPONT-5704 or suitable performance, fires under 850 ℃ ± 10 ℃ after describing; Adopt direct writing process to depict barrier film between the adjacent two row conductive strips with dielectric paste, the nib model is 4-3 or 3-2, the dielectric paste that adopts is the thick film conductor paste of DUPONT-5704 or suitable performance, toasts film forming after describing under 150 ℃ ± 10 ℃;
B. bonding die is connected with bonding and is realized in every row that by bonding die technique the lower N utmost point of LED pipe connects, and the bonding agent model that adopts is H20E or suitable performance conductive epoxy glue, and the cloth gluing method is Semi-automatic dispenser point cloth or serigraphy; Realize P utmost point electricity connection on the LED pipe in every row by gold wire bonding, the gold wire bonding method is the full-automatic continuous bonding of spun gold ball key or the continuous bonding of manual semi-automatic spun gold ball, and the spun gold string diameter that adopts is φ 18 μ m～φ 25 μ m, and spun gold gold content is 99.99%;
2) processing of Coding and driving PCB core group
3) assembling
By technique for sticking LED display 10 and Coding and driving PCB core group stacked on top of one another are fixed together, adhesives adopts 5020-1-.005 epoxy film 23 or suitable performance adhesives, bonding epoxy film 23 is cut into strip, epoxy film 23 is of a size of (30 ± 1) * (7 ± 1) mm, every circuit uses 2 epoxy film bars 23, and the distance that two adjacent epoxy films are 23 is 4mm ± 1mm; Realize that by spun gold ball bonding technology LED display 10 is connected with Coding and driving PCB core group electricity again, formation LED flat-panel monitor core group, schematic diagram as shown in Figure 2, spun gold ball bonding method is full-automatic spun gold ball key bonding or the semi-automatic spun gold ball bonding of craft; Spun gold 24 string diameters that adopt are φ 18 μ m～φ 25 μ m, and the gold content of spun gold 24 is 99.99%;
4) processing of encapsulation cap
The encapsulation cap adopts injection moulding framework 30 to inlay PMMA transparent glass 31, framework 30 materials adopt the black injected plastics material of polyphenylene sulfide or suitable performance, the thickness of glass 31 is 1.5mm ± 0.05mm, and transmittance 〉=92%, framework 30 adopt with glass 31 that WD2104 is gluing to be connect; The structural drawing of encapsulation cap as shown in Figure 3;
5) encapsulation
Light-emitting diode display adopts the embedding mode to encapsulate, and will encapsulate cap and the bonding curing of LED flat-panel monitor core group with silica gel first, and silica gel adopts black 704 silica gel in the present embodiment, reinforces with WD2104 glue 33 all around at PCB substrate 20 and encapsulation cap seam crossing again.Its construction packages figure as shown in Figure 1.
Above embodiment only is explanation technical conceive of the present invention and characteristics; its purpose is to allow the people that is familiar with technique understand content of the present invention and is implemented; can not limit protection scope of the present invention with this; all equivalences that Spirit Essence is done according to the present invention change or modify, and all should be encompassed in protection scope of the present invention.
Claims (10)
1. thick film PCB mixing integrated LED flat-panel monitor manufacturing process may further comprise the steps:
1) processing of LED display
A. film forming: the row that adopts silk-screen printing technique processing LED display to conductive strips and row to the transition pad, silk-screen printing technique is by the screen mesh on the mask plate, deposit to equably thick film ink on the insulating substrate, formation has the pattern of certain thickness and shape, and insulating substrate adopts 96% Al
2O
3Pottery, web plate order number are 300 orders～400 orders, and mask thickness is 25 μ m～40 μ m; Adopt direct writing process to depict for the datum line of locating bonding die with dielectric paste, direct writing process is by directly describing the nib on the specialized equipment, describe equably thick film ink on the insulating substrate, formation has the pattern of certain thickness and shape, the nib model that adopts is 4-3 or 3-2, fires under 850 ℃ ± 10 ℃ after describing; Adopt direct writing process to depict barrier film between the adjacent two row conductive strips with dielectric paste, the nib model is 4-3 or 3-2, after describing 150 ℃ ± 10 ℃ lower bakings;
B. bonding die is connected with bonding and is realized in every row that by bonding die technique the lower N utmost point of LED pipe connects; Realize P utmost point electricity connection on the LED pipe in every row by gold wire bonding;
2) processing of Coding and driving PCB core group
Code translator is welded mutually with connector and PCB substrate;
3) assembling
By technique for sticking described LED display and Coding and driving PCB core group stacked on top of one another are fixed together, realize that by spun gold ball bonding technology described LED display is connected with Coding and driving PCB core group electricity again, form LED flat-panel monitor core group;
4) processing of encapsulation cap
The encapsulation cap adopts the injection moulding framework to inlay the PMMA transparent glass;
5) encapsulation
Described light-emitting diode display adopts the embedding mode to encapsulate, first with silica gel with described encapsulation cap and the bonding curing of LED flat-panel monitor core group, reinforce with glue all around at pcb board and encapsulation cap seam crossing again.
2. thick film PCB mixing integrated LED flat-panel monitor manufacturing process may further comprise the steps:
1) processing of LED display
A. film forming: the row that adopts direct writing process processing LED display to conductive strips and row to the transition pad, insulating substrate adopts 96% Al
2O
3Pottery, the nib model of directly describing conductive strips is 6-4; Adopt direct writing process to depict for the datum line of locating bonding die with dielectric paste, the nib model is 4-3 or 3-2, fires under 850 ℃ ± 10 ℃ after describing; Adopt direct writing process to depict barrier film between the adjacent two row conductive strips with dielectric paste, the nib model is 4-3 or 3-2, after describing 150 ℃ ± 10 ℃ lower bakings;
B. bonding die is connected with bonding and is realized in every row that by bonding die technique the lower N utmost point of LED pipe connects; Realize P utmost point electricity connection on the LED pipe in every row by gold wire bonding;
2) processing of Coding and driving PCB core group
Code translator is welded mutually with connector and PCB substrate;
3) assembling
By technique for sticking described LED display and Coding and driving PCB core group stacked on top of one another are fixed together, realize that by spun gold ball bonding technology described LED display is connected with Coding and driving PCB core group electricity again, form LED flat-panel monitor core group;
4) processing of encapsulation cap
The encapsulation cap adopts the injection moulding framework to inlay the PMMA transparent glass;
5) encapsulation
Described light-emitting diode display adopts the embedding mode to encapsulate, first with silica gel with described encapsulation cap and the bonding curing of LED flat-panel monitor core group, reinforce with glue all around at pcb board and encapsulation cap seam crossing again.
3. thick film PCB mixing integrated LED flat-panel monitor manufacturing process according to claim 1 and 2, it is characterized in that: in the film forming step of step 1), the row of processing LED display to conductive strips and row to the transition pad time conductor paste that adopts be DUPONT-5771Au; The dielectric paste that adopts when describing to locate the datum line of bonding die and the barrier film between the adjacent two row conductive strips is DUPONT-5704.
4. thick film PCB mixing integrated LED flat-panel monitor manufacturing process according to claim 1 and 2, it is characterized in that: in the bonding die and bonding step of step 1), the bonding agent model that bonding die adopts is the H20E conducting resinl; The cloth gluing method is Semi-automatic dispenser point cloth or serigraphy.
5. thick film PCB mixing integrated LED flat-panel monitor manufacturing process according to claim 1 and 2, it is characterized in that: in step 1), the gold wire bonding method is the full-automatic continuous bonding of spun gold ball key or the continuous bonding of manual semi-automatic spun gold ball; The spun gold string diameter that adopts is φ 18 μ m～φ 25 μ m, and spun gold gold content is 99.99%.
6. thick film PCB mixing integrated LED flat-panel monitor manufacturing process according to claim 1 and 2 is characterized in that: in step 2) in, the thickness of PCB substrate is 1.5mm ± 0.15mm.
7. thick film PCB mixing integrated LED flat-panel monitor manufacturing process according to claim 1 and 2, it is characterized in that: in step 2) in, the transition pad that being used on the PCB substrate is connected with LED display is gold-plated, plated thickness 〉=0.1 μ m.
8. thick film PCB mixing integrated LED flat-panel monitor manufacturing process according to claim 1 and 2 is characterized in that: in step 3), spun gold ball bonding method is full-automatic spun gold ball key bonding or manual semi-automatic spun gold ball bonding; The spun gold string diameter that adopts is φ 18 μ m～φ 25 μ m, and spun gold gold content is 99.99%.
9. thick film PCB mixing integrated LED flat-panel monitor manufacturing process according to claim 1 and 2, it is characterized in that: in step 4), the thickness of glass is 1.5mm ± 0.05mm, transmittance 〉=92%; Described framework and glass are bonding with bonding agent, and the bonding agent model is WD2104.
10. thick film PCB mixing integrated LED flat-panel monitor manufacturing process according to claim 1 and 2, it is characterized in that: in the step 5), adopt 704 model silica gel that described encapsulation cap and LED flat-panel monitor core group is bonding, reinforce with WD2104 glue all around at pcb board and encapsulation cap seam crossing again.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201110327669 CN102332231B (en) | 2011-10-26 | 2011-10-26 | Technology for hybrid integration of multi-chip thick film printed circuit board (PCB) and light-emitting diode (LED) flat plate display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN 201110327669 CN102332231B (en) | 2011-10-26 | 2011-10-26 | Technology for hybrid integration of multi-chip thick film printed circuit board (PCB) and light-emitting diode (LED) flat plate display |
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| CN102332231B true CN102332231B (en) | 2013-02-06 |
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| CN102855825B (en) * | 2012-09-20 | 2014-04-02 | 中国兵器工业集团第二一四研究所苏州研发中心 | Linear array and digital combined light-emitting diode (LED) display process |
| CN105437449B (en) * | 2014-08-21 | 2018-08-24 | 阿里巴巴集团控股有限公司 | A kind of liquid-state silicon gel injection moulding process and the electronic equipment with display screen |
| CN104384068B (en) * | 2014-11-03 | 2016-08-31 | 温岭市秀恩五金工具有限公司 | A kind of LED glue dispensing and packaging equipment of band position sensor and alarm |
| CN106159070B (en) * | 2016-08-26 | 2019-01-15 | 曾广祥 | A kind of highly dense display screen unit panel and preparation method thereof |
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| JP2003131232A (en) * | 2001-10-30 | 2003-05-08 | Kyocera Corp | Liquid crystal display device |
| CN1645546A (en) * | 2004-01-19 | 2005-07-27 | 上海三星真空电子器件有限公司 | Three-dimensional thick-membrane vacuum fluorescent displaying device and production thereof |
| CN100416624C (en) * | 2004-01-20 | 2008-09-03 | 友达光电股份有限公司 | Bonding structure for bonding electrode and circuit board electrode and flat display device |
| CN1655308A (en) * | 2004-12-30 | 2005-08-17 | 彩虹集团电子股份有限公司 | Method for making panel display screen |
| JP2007286527A (en) * | 2006-04-20 | 2007-11-01 | Fujitsu Hitachi Plasma Display Ltd | Display device with display panel and method of disassembling same |
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