CN102315591A - Vertical fiber coupling module with multiple semiconductor lasers - Google Patents
Vertical fiber coupling module with multiple semiconductor lasers Download PDFInfo
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- CN102315591A CN102315591A CN2010102138662A CN201010213866A CN102315591A CN 102315591 A CN102315591 A CN 102315591A CN 2010102138662 A CN2010102138662 A CN 2010102138662A CN 201010213866 A CN201010213866 A CN 201010213866A CN 102315591 A CN102315591 A CN 102315591A
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Abstract
The invention provides a vertical fiber coupling module with multiple semiconductor lasers. The vertical fiber coupling module comprises a package case and a plurality of fixed devices arranged at the top of the package case, wherein the fixed devices are provided with lens-fiber assemblies; the package case is internally provided with the semiconductor lasers coaxial with the lens-fiber assemblies, heat sinks for fixing the semiconductor lasers and a baseplate for fixing the heat sinks and electrically connected with the semiconductor lasers; the axes of the lens-fiber assemblies and the semiconductor lasers are vertical to a plane in which the baseplate is located; laser emitted by the semiconductor lasers enters upwards to the lens-fiber assemblies in the way of being vertical to the baseplate; and the laser emitting end of each semiconductor laser is provided with an optical lens for fast axis collimation. Compared with the prior art, the vertical fiber coupling module has the advantages of small volume, simple structure, good stability and convenience in adjustment and maintenance.
Description
Technical field
The present invention relates to the fiber coupling technique of semiconductor laser, relate in particular to a kind of vertical fiber coupling module of a plurality of semiconductor lasers.
Background technology
Need to adopt semiconductor laser (LD) array as light source usually in the occasion of high power laser light output in existing laser display or other.The Output optical power of single semiconductor laser is lower, often can not satisfy the requirement of laser display for high power laser sources, output polishing shape that often will a plurality of independently semiconductor lasers in the practical application, merges to together and exports.For the laser that LD is produced imports optical fiber; Need earlier single LD to be encapsulated in certain specific package module; So that the light signal of its generation reliablely and stablely is coupled to optical fiber; Again a plurality of packaged LD modules are arranged on the substrate with array way, to reach unified power supply and the signals of telecommunication such as direct current biasing, modulation signal to be introduced the purpose of LD.
Fig. 9 is a kind of array floor map of common package module; Comprise base plate 905 and a plurality of common butterfly package module fixed thereon; Shell 904 both sides of butterfly package module offer holddown groove 903; Also be provided with optical fiber coupling assembly 906 on the shell 904, connect acusector pin 902, the A point is drawn and be clustered in to optical fiber 406 from optical fiber coupling component 906, and circuit trace 901 is drawn from connecing acusector pin 902.This arranging has following shortcoming:
1, circuit trace 901 is accomplished in a plane with optical fiber 406, twines easily each other, influences operations such as installation, maintenance.
2, inconsistent to each optical fiber coupling assembly 906 employed fiber lengths from boundling point A, making needs to prepare the optical fiber of different length in the practical operation, for the preparation of optical fiber is made troubles.And the optical fiber replaceability is not strong.
3, the density of arranging of package module is little, because the needs of cabling, package module is arranged in 905 last times of base plate, and the arrangement of must staggering between the module can't reach the maximum quantity of arranging.
For solving the problem that above-mentioned LD package module exists; Those skilled in the art have made some improvement; Like number of patent application is that 200820080688.9 Chinese utility model patent name is called: a kind of semiconductor laser package module and array thereof; This utility model provides a kind of semiconductor laser package module, and is as shown in Figure 8, comprises shell 803, locking slot 801, optical fiber coupling component 802, semiconductor laser 202 and stitch 103; The both sides of shell 803 are provided with locking slot 801; Also be fixed with optical fiber coupling component 802 and stitch 103 on the shell 803; 202 of semiconductor lasers are installed in shell inside; Wherein optical fiber coupling component 802 and semiconductor laser 202 coaxial placements, and the axle of optical fiber coupling component 802 is vertical with the plane at locking slot 801 places.After the module of this utility model is arranged in array, have following advantage:
1, put the same length of each optical fiber coupling component from the optical fiber boundling, the replacement of being convenient to optical fiber is safeguarded.
2, optical fiber coupling component in the semiconductor laser package module and stitch make that circuit trace and the optical fiber cabling in the array accomplished in Different Plane not in same plane, can not twine each other, and then influence are installed, safeguarded.
3, the semiconductor laser package module density of in array, arranging is compared higherly with conventional art, and with the more package module of can arranging under the homalographic, promptly the array gross power is bigger.
But this utility model is only placed a semiconductor laser in a package module, the arranging density of semiconductor laser still has the space of raising.In the LD package module TEC (semiconductor cooler) need be set separately in addition, with the series connection of the TEC in each LD package module in the array, the module manufacturing cost is higher and resistance to overturning is wayward again.
Summary of the invention
Be the wiring complicacy that the solution prior art exists, debug difficulties, the manufacturing cost problem of higher, it is a kind of simple in structure that the present invention provides, adjustment and easy to maintenance, the semiconductor laser module that the density of arranging is big.
The vertical fiber coupling module of a plurality of semiconductor lasers; Comprise package casing and a plurality of fixtures that are opened in the package casing top; Described fixture is provided with lens-optical fiber component; Be provided with the semiconductor laser coaxial in the package casing with lens-optical fiber component, be used for fixing semiconductor laser heat sink, be used for fixing substrate heat sink and that be electrically connected semiconductor laser and (electrically connect as prior art between substrate and the semiconductor laser; Like the conducting that is connected through lead and solder joint; Not shown in the figures), the axle of described lens-optical fiber component, semiconductor laser is vertical with plane, substrate place, and said semiconductor laser emitted laser upwards incides lens-optical fiber component perpendicular to substrate.Also be provided with the lens (fast axis collimation lens is a prior art, adopts the sphere GRIN Lens among the present invention, and volume is less, and is not shown in the figures) that are used to carry out fast axis collimation at semiconductor laser emission laser one end.
Described semiconductor laser is the semiconductor laser array of single semiconductor laser chip or semiconductor laser bar bar or a plurality of semiconductor laser chip composition.
Described fixture is stationary pipes or installing hole.
Fixed form between described stationary pipes and the lens-optical fiber component is welding or splicing or socket, and the fixed form between described installing hole and the lens-optical fiber component is welding or splicing.
Also be provided with semiconductor cooler between described substrate and the package casing.
Connected mode between described semiconductor cooler and substrate, the package casing is for welding or being spirally connected.
Said lens-optical fiber component is made up of lens subassembly, lens adaptation, spacing ring, optical fiber, optical fiber contact pins and sleeve.
Said lens subassembly is one of them of GRIN Lens, cylindrical lens, bitoric lens, C lens and compound lens.
The present invention has the following advantages:
1, adopts vertical coupling arrangement architecture, a plurality of semiconductor lasers are encapsulated in the shell, arrange closelyr between the semiconductor laser, reduced the wasted space between the LD; And plane, semiconductor laser emitted laser bundle and substrate place is vertical, and lens---optical fiber component is arranged on the package casing top, and optical fiber and circuit non-interference have been simplified the optical fiber bundle structure, compares formerly to be decreased to a thirtieth with the power model volume.
2, of the present invention being electrically connected adopts circuit board to replace the electric wire connection, and the solder joint that only needs both positive and negative polarity with the LD diode be connected to the peripheral circuit plate gets final product, and improved stability and the maintenance of module, the ease for operation of replacing greatly.
3, adopt semiconductor cooler (TEC) integral heat sink, compare the LD independence TEC series connection of original system, it is whole module heat dissipating that new module adopts a monoblock TEC, when having guaranteed radiating effect, has improved the stability of module, has reduced cost.
4, compare original system and adopt globe lens to focus on, exterior mechanical adjustment coupling, new module adopts the less sphere GRIN Lens of volume, utilizes the concentric fit accuracy guarantee GRIN Lens of sleeve and the aligning of optical fiber; Simple in structure, easy to adjust, and can guarantee the efficient and the stability of laser coupled, and can realize the plug of optical fiber splice, improved the ease for use of system; Be applicable to large-scale modularization production.
Description of drawings
Fig. 1 is the stereogram of the embodiment of the invention 1;
Fig. 2 is the side sectional view of the embodiment of the invention 1;
Fig. 3 is the substrate sketch map that the embodiment of the invention 1 is provided with semiconductor laser;
Fig. 4 is the lens-optical fiber component operation principle sketch map of the embodiment of the invention 1;
Fig. 5 is the side sectional view of the embodiment of the invention 2;
Fig. 6 is the vertical view of the embodiment of the invention 2;
Fig. 7 is the substrate sketch map that the embodiment of the invention 3 is provided with semiconductor laser;
Fig. 8 is that number of patent application is 200820080688.9 sketch map;
Fig. 9 is the array floor map of common package module.
Each parts sequence number is following among the figure:
101---package casing; 102---lens-optical fiber component; 103---stitch; 104---stationary pipes; 201---substrate; 202---semiconductor laser; 203---semiconductor cooler; 204---heat sink; 301---solder joint; 302---the stitch solder joint; 401---the lens adaptation; 402---spacing ring; 403---sleeve; 404---optical fiber contact pins; 405---the contact pin tail; 406---optical fiber; 407---GRIN Lens; 408---laser beam; 501---installing hole; 502---fixture; 801---locking slot; 802---optical fiber coupling component; 803---shell; 901---circuit trace; 902---connect the acusector pin; 903---holddown groove; 904---shell; 905---base plate; 906---the optical fiber coupling assembly.
Embodiment
Above-mentioned accompanying drawing of following foundation and specific embodiment describe semiconductor laser module of the present invention in detail.
Embodiment 1:
Referring to shown in Figure 1, the vertical fiber coupling module of a plurality of semiconductor lasers comprises package casing 101 and nine stationary pipes 104 that are opened in package casing 101 tops.Like Fig. 2, shown in Figure 3; In each stationary pipes 104, be provided with a lens-optical fiber component 102; Be provided with nine semiconductor lasers 202 coaxial in the package casing 101 with lens-optical fiber component 102, be used for fixing semiconductor laser 202 heat sink 204, be used for fixing heat sink 204 and be electrically connected the substrate 201 of semiconductor laser 202, semiconductor laser 202 is fixed on the substrate 201 through heat sink 204.The axle of described lens-optical fiber component 102, semiconductor laser 202 is vertical with plane, substrate 201 place; Described semiconductor laser 202 emitted laser upwards incide lens-optical fiber component 102 perpendicular to substrate 201, also are provided with fast axis collimation lens at semiconductor laser 202 emission laser one end.(fast axis collimation lens is prior art, and is not shown in the figures).Described semiconductor laser 202 is single semiconductor laser chip, also can be the semiconductor laser array that semiconductor laser bar bar or a plurality of semiconductor laser chip are formed.On package casing 101, also be provided with the stitch 103 that is used to connect outer lead.
Fixed form between described stationary pipes 104 and the lens-optical fiber component 102 is welding, also can be and glueds joint or socket.
As shown in Figure 2, also be provided with semiconductor cooler 203 between described substrate 201 and the package casing 101, the connected mode between described semiconductor cooler 203 and substrate 201, the package casing 101 is welding.
As shown in Figure 3, substrate 201 is provided with the solder joint 301 and stitch solder joint 302 that is used for conducting semiconductor laser 202.
As shown in Figure 4; Described lens-optical fiber component 102 is made up of lens subassembly, lens adaptation 401, spacing ring 402, optical fiber 406, optical fiber contact pins 404 and sleeve 403; Described lens subassembly is a GRIN Lens 407, also can select one of them of cylindrical lens, bitoric lens, C lens and compound lens for use.GRIN Lens 407 is arranged in the lens adaptation 401; To guarantee that its external diameter is identical with optical fiber contact pins 404 external diameters; One end of optical fiber 406 is contained in the optical fiber contact pins 404; Optical fiber contact pins 404 inserts and holds out against the spacing ring 402 that is arranged in the sleeve 403 from sleeve 403 1 ends, and the position of optical fiber contact pins 404 is by spacing ring 402,405 decisions of contact pin tail.The internal diameter of spacing ring 402 is less than the external diameter of optical fiber contact pins 404, and optical fiber contact pins 404 is inserted in spacing ring 402 places the most deeply in sleeve 403.GRIN Lens 407 scioptics adaptation 401 are fixed on the other end of sleeve 403.The concentric fit accuracy guarantee of sleeve 403 aiming at of GRIN Lens 407 and optical fiber 406, be coupled into optical fiber 406 from semiconductor laser 202 emitted laser bundles 408 through GRIN Lens 407, coupling efficiency can reach 90%.The also available cylindrical lens of GRIN Lens 406, bitoric lens, C lens or compound lens substitute.
Embodiment 2:
Referring to shown in Figure 5; The vertical fiber coupling module of a plurality of semiconductor lasers; Comprise package casing 101 and nine installing holes 501 that are opened in package casing 101 tops; In each installing hole 502, be provided with a lens-optical fiber component 102; Be provided with nine semiconductor lasers 202 coaxial in the package casing 101 with lens-optical fiber component 102, be used for fixing semiconductor laser 202 heat sink 204, be used for fixing heat sink 204 and be electrically connected the substrate 201 of semiconductor laser 202, semiconductor laser 202 is fixed on the substrate 201 through heat sink 204.The axle of described lens-optical fiber component 102, semiconductor laser 202 is vertical with plane, substrate 201 place; Described semiconductor laser 202 emitted laser upwards incide lens-optical fiber component 102 perpendicular to substrate 201, also are provided with fast axis collimation lens at semiconductor laser 202 emission laser one end.(fast axis collimation lens is prior art, and is not shown in the figures).As shown in Figure 6, described semiconductor laser 202 is a semiconductor laser bar bar, also can be the semiconductor laser array that a plurality of semiconductor laser chips are formed.On package casing 101, also be provided with the stitch 103 that is used to connect outer lead.
The sleeve of described lens-optical fiber component 102 is provided with fixture 502, lens---and optical fiber component 102 is welded in the installing hole 501 through fixture 502, and the fixed form of lens---optical fiber component also can be splicing.
Also be provided with semiconductor cooler 203 between described substrate 201 and the package casing 101, the connected mode between described semiconductor cooler 203 and substrate 201, the package casing 101 is for being spirally connected.
Described lens-optical fiber component 102 is identical with embodiment 1 primary structure.
Embodiment 3:
Identical with embodiment 1 primary structure, difference is 4 semiconductor lasers 202 are set on the described substrate 201, and as shown in Figure 7, substrate is provided with solder joint 301, the stitch solder joint 302 that is used for conducting semiconductor laser 202.
Component size in institute's drawings attached among the present invention and distance are the signal effect, do not have restriction, and concrete application process can be distinguished therewith to some extent.
It should be noted last that above embodiment is only unrestricted in order to technical scheme of the present invention to be described.Although the present invention is specified with reference to embodiment; Those of ordinary skill in the art is to be understood that; Technical scheme of the present invention is made amendment or is equal to replacement, do not break away from the spirit and the scope of technical scheme of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (8)
1. the vertical fiber coupling module of many semiconductor lasers; Comprise package casing (101) and be opened in a plurality of fixtures at package casing (101) top; It is characterized in that: described fixture is provided with lens-optical fiber component (102); Be provided with the semiconductor laser (202) coaxial in the package casing (101) with lens-optical fiber component (102), be used for fixing semiconductor laser (202) heat sink (204), be used for fixing heat sink (204) and be electrically connected the substrate (201) of semiconductor laser (202); The axle of described lens-optical fiber component (102), semiconductor laser (202) is vertical with plane, substrate (201) place, and described semiconductor laser (202) emitted laser upwards incides lens-optical fiber component (102) perpendicular to substrate (201).
2. the vertical fiber coupling module of a plurality of semiconductor lasers according to claim 1 is characterized in that the semiconductor laser array of described semiconductor laser (202) for single semiconductor laser chip or semiconductor laser bar bar or a plurality of semiconductor laser chip composition.
3. the vertical fiber coupling module of a plurality of semiconductor lasers according to claim 1 is characterized in that described fixture is stationary pipes (104) or installing hole (501).
4. the vertical fiber coupling module of a plurality of semiconductor lasers according to claim 3; It is characterized in that the fixed form between described stationary pipes (104) and the lens-optical fiber component (102) is welding or splicing or socket, the fixed form between described installing hole (501) and the lens-optical fiber component (102) is welding or splicing.
5. the vertical fiber coupling module of a plurality of semiconductor lasers according to claim 1 is characterized in that also being provided with semiconductor cooler (203) between described substrate (201) and the package casing (101).
6. the vertical fiber coupling module of a plurality of semiconductor lasers according to claim 5 is characterized in that the connected mode between described semiconductor cooler (203) and substrate (201), the package casing (101) is welding or is spirally connected.
7. the vertical fiber coupling module of a plurality of semiconductor lasers according to claim 1 is characterized in that: said lens-optical fiber component (102) is made up of lens subassembly, lens adaptation (401), spacing ring (402), optical fiber (406), optical fiber contact pins (404) and sleeve (403).
8. the vertical fiber coupling module of a plurality of semiconductor lasers according to claim 7 is characterized in that said lens subassembly is one of them of GRIN Lens (407), cylindrical lens, bitoric lens, C lens and compound lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102138662A CN102315591A (en) | 2010-06-30 | 2010-06-30 | Vertical fiber coupling module with multiple semiconductor lasers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102138662A CN102315591A (en) | 2010-06-30 | 2010-06-30 | Vertical fiber coupling module with multiple semiconductor lasers |
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| Publication Number | Publication Date |
|---|---|
| CN102315591A true CN102315591A (en) | 2012-01-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102138662A Pending CN102315591A (en) | 2010-06-30 | 2010-06-30 | Vertical fiber coupling module with multiple semiconductor lasers |
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| CN (1) | CN102315591A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103197385A (en) * | 2013-04-08 | 2013-07-10 | 青岛海信宽带多媒体技术有限公司 | Optical module and light path coupling method thereof |
| CN105169571A (en) * | 2015-09-30 | 2015-12-23 | 西安炬光科技股份有限公司 | Contact-type laser operating head and medical beauty treatment device thereof |
| CN110488427A (en) * | 2018-05-14 | 2019-11-22 | 深圳市联赢激光股份有限公司 | A kind of laser light source coupling device and method |
| CN111264007A (en) * | 2017-10-31 | 2020-06-09 | 三菱电机株式会社 | Laser light source device and method for manufacturing same |
| CN116865085A (en) * | 2023-07-20 | 2023-10-10 | 长春慧眼神光光电科技有限公司 | Simple small NA semiconductor optical fiber laser |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5812571A (en) * | 1996-10-25 | 1998-09-22 | W. L. Gore & Associates, Inc. | High-power vertical cavity surface emitting laser cluster |
| US20100074580A1 (en) * | 2008-09-22 | 2010-03-25 | Jyunichi Aizawa | Light source unit and image displaying apparatus |
-
2010
- 2010-06-30 CN CN2010102138662A patent/CN102315591A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5812571A (en) * | 1996-10-25 | 1998-09-22 | W. L. Gore & Associates, Inc. | High-power vertical cavity surface emitting laser cluster |
| US20100074580A1 (en) * | 2008-09-22 | 2010-03-25 | Jyunichi Aizawa | Light source unit and image displaying apparatus |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103197385A (en) * | 2013-04-08 | 2013-07-10 | 青岛海信宽带多媒体技术有限公司 | Optical module and light path coupling method thereof |
| CN103197385B (en) * | 2013-04-08 | 2015-04-08 | 青岛海信宽带多媒体技术有限公司 | Optical module and light path coupling method thereof |
| CN105169571A (en) * | 2015-09-30 | 2015-12-23 | 西安炬光科技股份有限公司 | Contact-type laser operating head and medical beauty treatment device thereof |
| CN105169571B (en) * | 2015-09-30 | 2017-08-25 | 西安炬光科技股份有限公司 | A kind of contact laser work head and its medical and beauty treatment equipment |
| CN111264007A (en) * | 2017-10-31 | 2020-06-09 | 三菱电机株式会社 | Laser light source device and method for manufacturing same |
| CN111264007B (en) * | 2017-10-31 | 2022-07-12 | 三菱电机株式会社 | Laser light source device and method for manufacturing same |
| CN110488427A (en) * | 2018-05-14 | 2019-11-22 | 深圳市联赢激光股份有限公司 | A kind of laser light source coupling device and method |
| CN116865085A (en) * | 2023-07-20 | 2023-10-10 | 长春慧眼神光光电科技有限公司 | Simple small NA semiconductor optical fiber laser |
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Application publication date: 20120111 |