CN209399143U - Light-focusing type semiconductor lighting wick structure and lamps and lanterns - Google Patents
Light-focusing type semiconductor lighting wick structure and lamps and lanterns Download PDFInfo
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- CN209399143U CN209399143U CN201920200242.3U CN201920200242U CN209399143U CN 209399143 U CN209399143 U CN 209399143U CN 201920200242 U CN201920200242 U CN 201920200242U CN 209399143 U CN209399143 U CN 209399143U
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Abstract
The utility model relates to a kind of light-focusing type semiconductor lighting wick structure and lamps and lanterns, light-focusing type semiconductor lighting wick structure by luminescence component, go out light part, radiating piece and shading piece be integrated into a mould group, which is fitted to each other, realize mould group miniaturization.The heat of luminescence component is distributed by radiating piece, it is ensured that the Miniaturization Design of luminescence component.Shading piece shelters from luminescence component, avoids generating and dazzle the eyes, and the light that luminescence component issues enters cavity and projected by going out light part, reduces light-emitting surface, so that light utilization efficiency is improved, light light type is good out, facilitates more reasonable light distribution.Meanwhile the wall thickness of light part tends to reduce along the direction far from radiating piece out, forms the structure of similar convex lens, the light of luminescence component can be realized the effect of light-ray condensing by going out the injection of light part.During the manufacturing of lamps and lanterns, the degree of modularity of lamps and lanterns manufacture is improved by light-focusing type semiconductor lighting wick structure, and then improves the efficiency of lamps and lanterns production assembly.
Description
Technical field
The utility model relates to lighting technical fields, more particularly to a kind of light-focusing type semiconductor lighting wick structure and lamp
Tool.
Background technique
Lighting apparatus is all widely used in each field, and the current lighting apparatus degree of modularity is not high, portion
Part is more, and excessive component connection causes the heat dissipation effect of light source poor, causes larger difficulty to light type light distribution.And due to illumination
The part dimension of equipment is larger, causes lighting apparatus to be difficult to reach micromation degree, and then influence the suitability of lighting apparatus.
Utility model content
Based on this, it is necessary in view of the above-mentioned problems, providing a kind of heat dissipation performance for effectively improving lighting apparatus and suitability
Light-focusing type semiconductor lighting wick structure and lamps and lanterns.
A kind of light-focusing type semiconductor lighting wick structure, comprising:
Radiating piece；
Luminescence component, the luminescence component are set on the radiating piece；
Light part out, the light part out has cavity, and one end of the light part out is the open end being connected to the cavity,
The open end is located on the luminescence component, and the wall thickness of the light part out tends to subtract along the direction far from the radiating piece
It is small；And
Shading piece offers fixation hole on the shading piece, and the shading piece is connect with the radiating piece, it is described go out light part
It is pierced by the shading piece by the fixation hole, the luminescence component, light part, radiating piece and shading piece are integrated into a mould out
Group.
Above-mentioned light-focusing type semiconductor lighting wick structure, by by luminescence component, go out light part, radiating piece and shading piece integrate
For an individual mould group, structure is simple, which is fitted to each other, and realizes the miniaturization of mould group, the heat of luminescence component
It is effectively distributed by radiating piece, good heat dissipation performance can ensure that the Miniaturization Design of luminescence component.Luminescence component issues
Light enter cavity and projected by going out light part, reduce light-emitting surface, so that light utilization efficiency is improved, improve optical density, out light light
Type is good, and then facilitates more reasonable light distribution.Simultaneously as the wall thickness of light part tends to reduce along the direction far from radiating piece out, shape
At the structure of similar convex lens, the light of luminescence component can be realized the effect of light-ray condensing by going out the injection of light part, be formed poly-
Optical lighting lamp cored structure.Above-mentioned light-focusing type semiconductor lighting wick structure improves the suitability of mould group application end, allows application
More extensively, during the manufacturing of lamps and lanterns, the degree of modularity of lamps and lanterns manufacture is improved, and then can be improved lamps and lanterns production
The efficiency of assembly.
The luminescence component welding or eutectic are on the radiating piece in one of the embodiments,.
The light part out is in the form of a column in one of the embodiments, and the size of the cavity is along the separate radiating piece
Direction tends to reduce.
Catoptric arrangement is provided on inner wall of the cavity far from the radiating piece in one of the embodiments,.
Optically focused knot is equipped with back on the end face of described open end one end on the light part out in one of the embodiments,
Structure.
The open end outer wall of the light part out is equipped with boss in one of the embodiments, and the shading piece is pressed on
On the boss；
Or
It is provided with external screw thread on the outer wall of the open end of light part out, interior spiral shell is provided on the inner wall of the fixation hole
Line, the light part out are connect by the external screw thread with the screw-internal thread fit with the shading piece.
The luminescence component includes substrate and multiple LED light in one of the embodiments, and the substrate is erected on described
On radiating piece, and one end of the substrate is connect with the radiating piece, and the other end of the substrate passes through the fixation hole to remote
Direction from the shading piece extends, and the LED light is fixed on the one side of the substrate or on two sides；
Or
The luminescence component includes substrate and multiple LED light, and the substrate is flat to be set on the radiating piece, and the substrate
One side connect with the radiating piece, the another side of the substrate is equipped with the LED light, and the LED light is located at described
In fixation hole.
The substrate is ceramic substrate in one of the embodiments, and the radiating piece is ceramic heat-dissipating part；The heat dissipation
Part is equipped with the fixing groove for installing the substrate.
Extended cavity is offered on the radiating piece in one of the embodiments, the extended cavity is used to accommodate extension
Radiator structure.
A kind of lamps and lanterns, comprising:
Light-focusing type semiconductor lighting wick structure as described above；And
Lampshade, the lampshade have accommodating chamber, and the lampshade is connect with the shading piece, and the light part out is located at the appearance
It receives intracavitary.
Above-mentioned lamps and lanterns, by by luminescence component, go out light part, radiating piece and shading piece be integrated into an individual light-focusing type partly
Conductor illuminates the mould group of wick structure, and structure is simple, which is fitted to each other, and realizes the miniaturization of mould group, luminescence component
Heat effectively distributed by radiating piece, good heat dissipation performance can ensure that the Miniaturization Design of luminescence component.Shine group
The light that part issues enters cavity and is projected by going out light part, reduces light-emitting surface, so that light utilization efficiency is improved, optical density is mentioned
Height, light light type is good out, and then facilitates more reasonable light distribution.Simultaneously as the wall thickness of light part becomes along the direction far from radiating piece out
In reduction, the structure of similar convex lens is formed, the light of luminescence component can be realized the effect of light-ray condensing by going out the injection of light part
Fruit forms light-focusing type and illuminates wick structure.Above-mentioned light-focusing type semiconductor lighting wick structure improves the adaptation of mould group application end
Property, it makes application more extensive, during the manufacturing of lamps and lanterns, improves the degree of modularity of lamps and lanterns manufacture, and then can mention
The efficiency of high lamps and lanterns production assembly.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the light-focusing type semiconductor lighting wick structure in an embodiment；
Fig. 2 is the decomposition diagram of light-focusing type semiconductor lighting wick structure shown in FIG. 1；
Fig. 3 is the cross-sectional view for going out light part in an embodiment；
Fig. 4 is the cross-sectional view for going out light part in another embodiment；
Fig. 5 is the cross-sectional view of radiating piece in Fig. 2；
Fig. 6 is the decomposition diagram of light-focusing type semiconductor lighting wick structure interior in another embodiment；
Fig. 7 is the structural schematic diagram of the shading piece in an embodiment；
Fig. 8 is the decomposition diagram of the connector in an embodiment.
Description of symbols:
10, light-focusing type semiconductor lighting wick structure, 100, radiating piece, the 110, second connecting hole, 120, extended cavity, 130,
Radiating fin, 140, threading hole, 150, accommodating cavity, 160, fixing groove, 170, convex block, 200, luminescence component, 210, substrate, 220,
LED light, 300, shading piece, 310, fixation hole, the 320, first connecting hole, 330, mounting groove, 340, card slot, 400, go out light part,
410, cavity, 420, open end, 430, boss, 440, catoptric arrangement, 450, concentration structure, 500, connector, 510, mounting hole,
520, hook, 530, first connecting portion, the 531, first half slot, 532, chuck, the 533, first dowel, the 540, second connection
Portion, the 541, second half slot, 542, hook body, the 543, second dowel.
Specific embodiment
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, with reference to the accompanying drawing to this
The specific embodiment of utility model is described in detail.Many details are explained in the following description in order to abundant
Understand the utility model.But the utility model can be implemented with being much different from other way described herein, this field
Technical staff can do similar improvement without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific implementation opened.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Each technical characteristic of embodiment described above
It can be combined arbitrarily, for simplicity of description, not to all possible combination of each technical characteristic in above-described embodiment
It is all described, as long as being all considered to be the model of this specification record however, there is no contradiction in the combination of these technical features
It encloses.
Fig. 1 and Fig. 2 is please referred to, the light-focusing type semiconductor lighting wick structure 10 in an embodiment can effectively improve lamp
Have the degree of modularity of manufacture, improves the production assembly efficiency of lamps and lanterns.Specifically, light-focusing type semiconductor lighting wick structure 10 wraps
Include radiating piece 100, luminescence component 200, shading piece 300 and light part 400 out.
Luminescence component 200 is set on radiating piece 100, and light part 400 has cavity 410 out, and one end of light part 400 is out
The open end 420 being connected with cavity 410, open end 420 are located on luminescence component 200, offer fixation on shading piece 300
Hole 310, shading piece 300 are connect with radiating piece 100, and light part 400 is pierced by shading piece 300 by fixation hole 310 out, radiating piece 100,
Luminescence component 200, shading piece 300 and light part 400 is integrated into a mould group out.
Above-mentioned light-focusing type semiconductor lighting wick structure 10, by by radiating piece 100, luminescence component 200, shading piece 300
And light part 400 is integrated into an individual mould group out, structure is simple, which is fitted to each other, and realizes the miniaturization of mould group.
The heat of luminescence component 200 is effectively distributed by radiating piece 100, and good heat dissipation performance can ensure that luminescence component 200
Miniaturization Design, while shading piece 300 shelters from luminescence component 200, avoids generating and dazzle the eyes, the light that luminescence component 200 issues
It is projected into cavity 410 by going out light part 400, reduces light-emitting surface, so that light utilization efficiency is improved, optical density is improved,
Light light type is good out, and then facilitates more reasonable light distribution.Above-mentioned light-focusing type semiconductor lighting wick structure 10 improves mould group application
The suitability at end makes application more extensive, during the manufacturing of lamps and lanterns, improves the degree of modularity of lamps and lanterns manufacture, into
And it can be improved the efficiency of lamps and lanterns production assembly.
Specifically, the wall thickness of light part 400 tends to reduce along the direction far from radiating piece 100 out, makes the side for obtaining light part 400
Wall is capable of forming the structure of similar convex lens.The light of luminescence component 200 is poly- by going out after the injection of light part 400 to can be realized light
The effect of collection, and then it is effectively formed light-focusing type illumination wick structure 10.
Also referring to Fig. 3, in an embodiment, light part 400 is column structure out, and the size of cavity 410 is along far from heat dissipation
The direction of part 100 tends to reduce.The point light source of luminescence component 200 or area source can be become column by above-mentioned light part 400 out
The luminous three-dimensional LED light of body efficiently solves the light emitting anger of 200 light source of luminescence component to reach 360 ° of complete cycle light-out effects
The problem of degree limitation.Specifically, the size of cavity 410 is gradually reduced along the direction far from radiating piece 100, is formed uniform wall thickness and is become
That changes goes out light part 400.
Further, the inner wall of cavity 410 is equipped with diffusion structure.By the way that diffusion structure is arranged, light is enabled to more
Add and uniformly projected by going out light part 400, has reached and preferably go out light light type.Wherein, diffusion structure can be for coated in cavity
Diffusion layer on inner wall, or other can play the other structures of diffusion.
In the present embodiment, catoptric arrangement 440 is provided on inner wall of the cavity 410 far from radiating piece 100.It is tied by reflection
The light that structure 440 can be avoided the sending of luminescence component 200 is distributed by going out the inner wall of the one end of light part 400 far from radiating piece 100
It goes out, causes light uneven.Meanwhile light part 400 can effectively be will be transmitted to out far from radiating piece by catoptric arrangement 440
The light of 100 one end is further reflected into cavity 410, increases spotlight effect.
Referring to Fig. 4, in another embodiment, the end face on light part 400 back on 420 one end of open end is equipped with poly- out
Photo structure 450.The light that luminescence component 200 issues is further able to distribute by going out light part 400 far from one end of radiating piece 100
It goes out, and passes through concentration structure 450, so that effectively poly- by going out the light that light part 400 is issued far from one end of radiating piece 100
Collection, further reaches spotlight effect.
Referring to Fig. 2, in an embodiment, it is provided with boss 430 on the outer wall of the open end 420 of light part 400 out, is hidden
Light part 300 is pressed on boss 430.By the way that boss 430 is arranged in the open end 420 of light part 400 out, shading piece 300 is installed on
It may make on radiating piece 100 and the pressure of boss 430 be set on radiating piece 100, make the installation for obtaining light part 400 Yu radiating piece 100
More stable, light part 400 and the connection of radiating piece 100 are more convenient out.
Specifically, boss 430 is shaped in out on the outer wall of 400 open end 420 of light part.By the one of boss 430 at
Type is further simplified out the processing technology of light part 400 on the outer wall of light part 400 out, reduces out the cost of light part 400.
Further, light part 400 can be plastic parts out.Certainly, light part 400 can also be glass workpiece out, as long as can
Luminescence component 200 is covered, so that luminescence component 200 shines by going out light part 400.
In another embodiment, be provided with external screw thread on the outer wall of the open end 420 of light part 400 out, fixation hole 310 it is interior
Internal screw thread is provided on wall, light part 400 is connect by external screw thread with screw-internal thread fit with shading piece 300 out.Light part 400 passes through out
It is threadedly connected in the fixation hole 310 of shading piece 300, shading piece 300 is installed on radiating piece 100, can will be gone out light part 400 and be pacified
Loaded on radiating piece 100, the dismounting of light part 400 Yu shading piece 300 is facilitated out.
Certainly, in other embodiments, light part 400 can also be directly cemented in the fixation hole 310 of shading piece 300 out,
Or be directly connected on radiating piece 100, as long as enabling to luminescence component 200 to be located in cavity 410, by going out light part 400
It shines.
In one embodiment, the first connecting hole 320 is offered on shading piece 300, radiating piece 100 offer the second connecting hole
110, the connection corresponding with the first connecting hole 320 of the second connecting hole 110.By attachment screw be arranged in the first connecting hole 320 with
In second connecting hole 110, so that shading piece 300 is fixed on radiating piece 100.Facilitate shading piece 300 by above-mentioned connection type
Relative to the dismounting on radiating piece 100.
Certainly, in other embodiments, shading piece 300 can also be directly cemented on radiating piece 100, or pass through its other party
Formula is fixed on radiating piece 100, as long as enabling to show that light part 400 is installed on radiating piece 100 by shading piece 300.
In the present embodiment, shading piece 300 is plastic parts.Radiating piece is installed on by shading piece 300 due to going out light part 400
On 100, shading piece 300 uses plastic parts, and it is really up to the mark to avoid shading piece 300, and light part 400 or hair are broken out during installation
Optical assembly 200.
Certainly, in other embodiments, shading piece 300 can also be metalwork, as long as light part 400 is enabled to out to pass through
Shading piece 300 is installed on radiating piece 100.
Please refer to fig. 5, optionally, extended cavity 120 is offered on radiating piece 100, extended cavity 120 is for accommodating extension
Radiator structure.It, can be by the heat of luminescence component 200 by radiating piece 100 since luminescence component 200 is main heater element
It distributes.Due to current material limitation or cost the considerations of, the heat dissipation performance of radiating piece 100 will receive certain limit
System facilitates by the way that extended cavity 120 is arranged and accommodates the better radiator structure of heat dissipation performance, further increase the heat dissipation of radiating piece 100
Performance.
Specifically, extended cavity 120 is opened in radiating piece 100 towards on the surface of shading piece 300, and shading piece 300 can cover
Lid extended cavity 120.Since shading piece 300 can cover extended cavity 120, when the radiator structure of extension is set to extended cavity
When in 120, extended cavity 120 is covered by shading piece 300, so that the radiator structure of extension is effectively fixed in extended cavity 120, is kept away
Exempt from the radiator structure for increasing the fixed extension of other shading pieces 300.
Further, the extended cavity 120 of radiating piece 100 is multiple, the setting of multiple intervals of extended cavity 120.And then it can be same
100 structure of radiating piece of the multiple extensions of Shi Rongna.
Certainly, in other embodiments, extended cavity 120 can not also be opened up on radiating piece 100, only by radiating piece
100 itself radiate to luminescence component 200.
In one embodiment, multiple spaced radiating fins 130 are formed on the outer wall of radiating piece 100.It is dissipated by being arranged
Hot wing 130 can further increase the heat dissipation performance of radiating piece 100, and then further transfer out the heat of luminescence component 200
It goes.Specifically, radiating fin 130 can be arranged along the circumferencial direction interval of radiating piece 100, it is of course also possible to along radiating piece 100
The setting of axis direction interval.
In one embodiment, radiating piece 100 offers threading hole 140, threading hole 140 on the end face far from luminescence component 200
Radiating piece 100 is through to towards the end face of shading piece 300.The company of luminescence component 200 Yu power supply can be facilitated by threading hole 140
It connects.Specifically, threading hole 140 is two, is opened in the opposite facing two sides of luminescence component 200 respectively, further facilitates luminous
The conducting wire of component 200 passes through threading hole 140 and connects power supply.Certainly, in other embodiments, threading hole 140 can also be one
Or it is multiple, as long as the conducting wire of luminescence component 200 can be facilitated to pass through threading hole 140.
In one embodiment, radiating piece 100 offers accommodating cavity 150, accommodating cavity 150 on the surface far from luminescence component 200
For accommodating the devices such as power supply.Wherein, threading hole 140 is connected with accommodating cavity 150, and luminescence component 200 is facilitated to be connected to power supply
On equal devices.
In one embodiment, fixing groove 160 is offered on radiating piece 100, luminescence component 200 is embedded in fixing groove 160.It is logical
Crossing setting fixing groove 160 can facilitate luminescence component 200 to be embedded on radiating piece 100, and then luminescence component 200 is facilitated to be connected to
On radiating piece 100.Specifically, fixing groove 160 is opened in radiating piece 100 towards the side of shading piece 300.When shading piece 300 is pacified
When loaded on radiating piece 100, fixing groove 160 is enabled to correspond to fixation hole 310, so that luminescence component 200 can have
Effect is located in light part 400.
In one embodiment, the welding of luminescence component 200 or eutectic are on radiating piece 100.Specifically, luminescence component 200 welds
Or eutectic is in fixing groove 160.By welding luminescence component 200 or eutectic is in radiating piece 100, luminescence component can be reduced
Thermal resistance between 200 and radiating piece 100, it is ensured that 200 heat of luminescence component is oriented to the unimpeded of radiating piece 100.
In one embodiment, 200 tin cream of luminescence component is welded on radiating piece 100.Certainly, in other embodiments, shine group
Part 200 can also be set to by other means on radiating piece 100, as long as the heat of luminescence component 200 is enabled effectively to pass
It is delivered on radiating piece 100.
Specifically, luminescence component 200 includes substrate 210 and multiple LED light 220, and multiple LED light 220 are fixed on substrate
210.Further, substrate 210 is ceramic substrate, and radiating piece 100 is ceramic heat-dissipating part, and ceramic substrate and ceramic heat-dissipating part connect
It connects.The heat dissipation effect of LED light 220 can be further improved by the connection of ceramic substrate and ceramic heat-dissipating part.
Further, LED light 220 is directly formed on ceramic substrate 210 by circuit manufacture procedure, to meet smaller shine
The production of the luminescence component 200 of face or approximate point light source.Luminous intensity can effectively be increased, improve light utilization efficiency, reduction is matched
Light difficulty.Ceramic substrate 210 has good heat dissipation effect simultaneously, and then can effectively be transferred to the heat of LED light 220 scattered
On warmware 100.
In traditional technique, SMT (Surface Mount Technology, surface mounting technology) technique forms luminous
Then luminescence component is connect by way of bonding or mechanical fasteners with radiating piece by component.Lead to the machine of heat dissipation Joint failure
Rate is big, and therefore, the light source power of single luminous point is limited, and then the quantity that will lead to single luminous point light source increases, shape ruler
Very little big, processing cost increases or luminous intensity is not high, and light utilization efficiency is low.And light-focusing type semiconductor lighting wick structure 10 is logical
It crosses and welds luminescence component 200 or eutectic is in radiating piece 100 can effectively reduce thermal resistance, while LED light 220 is directly passed through into electricity
Road processing procedure is formed on ceramic substrate 210, further decreases the size of luminescence component 200, and then can effectively reduce light-focusing type
The overall dimensions of semiconductor lighting wick structure 10, to meet the application of lamps and lanterns under more scenes.
Referring to Fig. 2, in one embodiment, substrate 210 is flat to be set on radiating piece 210, and the one side of substrate 210 and is dissipated
Warmware 210 connects, and the another side of substrate 210 is equipped with LED light 220, and LED light 220 is located in fixation hole 310.Further,
Ceramic substrate 210 is flat to be set in fixing groove 160, so that shading piece 300 can effectively block LED light 220, avoids dazzle
It generates, while effectively efficiency of the enhancing ceramic substrate 210 to the conduction heat of radiating piece 100.It can be to LED by fixation hole 310
Lamp 220 plays certain shaded effect, reduces the unfavorable factor of dazzle, avoids human eye direct-view to LED light 220, plays eyeshield
Effect.
Further, the size of fixing groove 160 and the size on 210 surface of ceramic substrate match, ceramic basic to facilitate
Can effectively it be arranged in fixing groove 160.
Referring to Fig. 6, the light-focusing type semiconductor lighting wick structure 10 in another embodiment, substrate 210 is erected on heat dissipation
On part 100, and one end of substrate 210 is connect with radiating piece 100, and the other end of substrate 210 passes through fixation hole 310 to far from shading
The direction of part 300 extends, and LED light 220 is fixed on the one side of substrate 210 or on two sides, so that LED light 220
In in the cavity 410 of light part 400 out, it is more advantageous to form 360 ° of complete cycle light-out effects, effectively improves the utilization rate of light.
Specifically, substrate 210 is ceramic substrate, and radiating piece 100 is ceramic heat-dissipating part.Fixation is offered on radiating piece 100
The size of slot 160, the cross section of the size and ceramic substrate of fixing groove 160 matches, to facilitate ceramic substrate that can be inserted in
In fixing groove 160.
In one embodiment, radiating piece 100 towards convex block 170 is formed on the surface of luminescence component 200, open by fixing groove 160
On convex block 170.The depth of fixing groove 160 can be effectively increased by the way that convex block 170 is arranged, so that ceramic substrate 210
It is more stably placed in fixing groove 160, while effectively increasing the contact area of ceramic substrate 210 Yu radiating piece 100, improve
Radiating efficiency.
Radiating piece 100 in another embodiment, convex block can also be formed in radiating piece 100 back on luminescence component 200
On surface.Fixing groove 160 is opened on the surface of radiating piece 100, is further opened on convex block, to increase fixing groove 160
Depth.
Certainly, in other embodiments, luminescence component 200 can also be set on radiating piece 100 with other postures, can only
Enough so that luminescence component 200 is located in light part 400.
Above-mentioned light-focusing type semiconductor lighting wick structure 10 can be applied in lamps and lanterns, the lamps and lanterns in an embodiment, including
Light-focusing type semiconductor lighting wick structure 10 and lampshade.Lampshade has accommodating chamber, and lampshade is connect with shading piece 300, out light part 400
In accommodating chamber.Lamps and lanterns are formed and then lampshade is set outside light part 400 out, wherein lampshade can be according to usage scenario
It is different and be arranged.
The mounting assembly of original lamps and lanterns is effectively optimized for two portions by above-mentioned light-focusing type semiconductor lighting wick structure 10
Part, i.e. light-focusing type semiconductor lighting wick structure 10 and lampshade effectively improve the mould of lamps and lanterns so that the simple for structure of lamps and lanterns is illustrated
Block degree, the manufacture so that lamps and lanterns are easily accomplished scale production.The production assembly efficiency and yields of lamps and lanterns are improved simultaneously.Together
When, 10 perfect heat-dissipating of light-focusing type semiconductor lighting wick structure, suitability is strong, size is small, so that light-focusing type semiconductor lighting
Wick structure 10 it is more adaptable, and then increase effectively the design space of lamps and lanterns.
In one embodiment, towards mounting groove 330 is offered on the surface of luminescence component 200, lampshade can be consolidated shading piece 300
Due in mounting groove 330, and then form lamps and lanterns.Specifically, lampshade can be directly adhered in mounting groove 330.Alternatively, mounting groove
It is provided with internal screw thread on 330 inner wall, external screw thread is provided on the outer wall of lampshade, lampshade is threadably secured in shading piece 300
On.
Referring to Figure 7 together with Fig. 8, in another embodiment, lamps and lanterns further include connector 500, are also opened on shading piece 300
Equipped with mounting groove 330, lampshade is installed in mounting groove 330 by connector 500.It is further facilitated by the way that connector 500 is arranged
Lampshade is fixed on shading piece 300.
Specifically, one end of lampshade is fixing end, is formed with mounting plate on the outer wall of fixing end, is formed on connector 500
There is mounting hole 510, fixing end is arranged in mounting hole 510, and mounting plate can be pressed and is set in mounting groove 330 by connector 500.Pass through
The mounting plate of lampshade, lampshade can be effectively fixed on shading piece 300 by connector 500, so that the company of lampshade and shading piece 300
It connects more convenient.
Further, the size of mounting hole 510 and the size of fixing end match, so that lampshade can more steadily be set
It is placed in mounting hole 510, avoids lampshade relative to 300 activity of shading piece.
Optionally, card slot 340 is offered on the inner wall of mounting groove 330, the side of connector 500 towards shading piece 300 is set
It is equipped with hook 520, hook 520 can be arranged in card slot 340.When the hook 520 of connector 500 is arranged in card slot 340,
The mounting plate pressure of lampshade is set in mounting groove 330 simultaneously, further facilitates the installation of lampshade Yu shading piece 300.
Optionally, connector 500 includes first connecting portion 530 and second connecting portion 540, first connecting portion 530 and second
Interconnecting piece 540 is semicircle shape structure.The first half slot 531 is offered in first connecting portion 530, is opened up in second connecting portion 540
There is the second half slot 541, first connecting portion 530 is oppositely arranged with second connecting portion 540, so that the first half slot 531 and second
Half slot 541 surrounds mounting hole 510 jointly.The fixation of lampshade can be facilitated by first connecting portion 530 and second connecting portion 540
End is arranged in mounting hole 510.
Specifically, it is formed with chuck 532 in first connecting portion 530, is formed in second connecting portion 540 and hooks body 542, hooks body
542, which can correspond to hook, is set in chuck 532, so that first connecting portion 530 opposite can be connect with second connecting portion 540.Into one
Step ground, the opposite both ends of first connecting portion 530 have been respectively formed on chuck 532, and the opposite both ends of second connecting portion 540 are respectively formed on
There is hook body 542 corresponding with chuck 532, hooks corresponding hook of body 542 and be set in chuck 532, so that first connecting portion 530 and second
Interconnecting piece 540 more steadily connects.
In one embodiment, first connecting portion 530 is towards being also formed with the first dowel 533 on the surface of shading piece 300.It is logical
The structural strength of first connecting portion 530 can not only be reinforced by crossing the first dowel 533, by can be effectively by the mounting plate of lampshade
Pressure is set in mounting groove 330.
In one embodiment, second connecting portion 540 is towards being also formed with the second dowel 543 on the surface of shading piece 300.It is logical
The structural strength of second connecting portion 540 can not only be reinforced by crossing the second dowel 543, by can be effectively by the mounting plate of lampshade
Further pressure is set in mounting groove 330.
The surface of first connecting portion 530 and second connecting portion 540 towards shading piece 300 has been respectively formed on hook 520, hook
520 is corresponding with the card slot 340 on shading piece 300.So that first connecting portion 530 and second connecting portion 540 can be with shadings
Part 300 effectively connects.
In one embodiment, the quantity of hook 520 is multiple, multiple intervals of hook 520 setting, the quantity and card of card slot 340
The quantity of hook 520 is corresponding, and each hook 520, which can correspond to, to be arranged in a card slot 340, and then can effectively improve connector
500 stability installed on shading piece 300.
In the present embodiment, spaced hook 520 there are three being formed in first connecting portion 530, second connecting portion 540
There are three spaced hooks 520 for upper formation, so that first connecting portion 530 can steadily be set with second connecting portion 540
It is placed in mounting groove 330.Certainly, in other embodiments, the quantity of the hook 520 in first connecting portion 530 can also be two
A, other numbers such as four, as long as first connecting portion 530 is enabled to steadily to be set on shading piece 300.Second
The quantity of hook 520 on interconnecting piece 540 can also be two, four lamp other numbers, as long as enabling to the second connection
Portion 540 is steadily set on shading piece 300.
In one embodiment, lamps and lanterns further include lamp holder, and lamp holder is set to radiating piece 100 back on one end of lampshade.Shine group
Part 200 can be electrically connected on lamp holder by radiating piece 100.It can be powered by lamp holder for luminescence component 200.Certainly,
In other embodiments, lamp holder can also omit, and luminescence component 200 can be directly connected to power supply.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of light-focusing type semiconductor lighting wick structure characterized by comprising
Radiating piece；
Luminescence component, the luminescence component are set on the radiating piece；
Light part out, the light part out has cavity, and one end of the light part out is the open end being connected to the cavity, described
Open end is located on the luminescence component, and the wall thickness of the light part out tends to reduce along the direction far from the radiating piece；And
Shading piece offers fixation hole on the shading piece, and the shading piece is connect with the radiating piece, it is described go out light part pass through
The fixation hole is pierced by the shading piece, and the luminescence component, light part, radiating piece and shading piece are integrated into a mould group out.
2. light-focusing type semiconductor lighting wick structure according to claim 1, which is characterized in that the luminescence component welding
Or eutectic is on the radiating piece.
3. light-focusing type semiconductor lighting wick structure according to claim 1, which is characterized in that the light part out is in column
The size of shape, the cavity tends to reduce along the direction far from the radiating piece.
4. light-focusing type semiconductor lighting wick structure according to claim 1-3, which is characterized in that the cavity
Catoptric arrangement is provided on inner wall far from the radiating piece.
5. light-focusing type semiconductor lighting wick structure according to claim 1-3, which is characterized in that the light out
End face on part back on described open end one end is equipped with concentration structure.
6. light-focusing type semiconductor lighting wick structure according to claim 1-3, which is characterized in that the light out
The open end outer wall of part is equipped with boss, and the shading piece is pressed on the boss；Or
It is provided with external screw thread on the outer wall of the open end of light part out, internal screw thread, institute are provided on the inner wall of the fixation hole
It states out light part and is connect by the external screw thread with the screw-internal thread fit with the shading piece.
7. light-focusing type semiconductor lighting wick structure according to claim 1-3, which is characterized in that described to shine
Component includes substrate and multiple LED light, and the substrate is erected on the radiating piece, and one end of the substrate and the heat dissipation
Part connection, the other end of the substrate pass through the fixation hole and extend to the direction far from the shading piece, and the LED light is fixed
On the one side of the substrate or on two sides；Or
The luminescence component includes substrate and multiple LED light, and the substrate is flat to be set on the radiating piece, and the one of the substrate
Side is connect with the radiating piece, and the another side of the substrate is equipped with the LED light, and the LED light is located at the fixation
In hole.
8. light-focusing type semiconductor lighting wick structure according to claim 7, which is characterized in that the substrate is ceramic base
Plate, the radiating piece are ceramic heat-dissipating part；The radiating piece is equipped with the fixing groove for installing the substrate.
9. light-focusing type semiconductor lighting wick structure according to claim 1-3, which is characterized in that the heat dissipation
Extended cavity is offered on part, the extended cavity is used to accommodate the radiator structure of extension.
10. a kind of lamps and lanterns characterized by comprising
Such as the described in any item light-focusing type semiconductor lighting wick structures of claim 1-9；And
Lampshade, the lampshade have accommodating chamber, and the lampshade is connect with the shading piece, and the light part out is located at the accommodating chamber
It is interior.
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| CN201920200242.3U CN209399143U (en) | 2019-02-15 | 2019-02-15 | Light-focusing type semiconductor lighting wick structure and lamps and lanterns |
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| CN201920200242.3U CN209399143U (en) | 2019-02-15 | 2019-02-15 | Light-focusing type semiconductor lighting wick structure and lamps and lanterns |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109630911A (en) * | 2019-02-15 | 2019-04-16 | 刘锋 | Light-focusing type semiconductor lighting wick structure and lamps and lanterns |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109630911A (en) * | 2019-02-15 | 2019-04-16 | 刘锋 | Light-focusing type semiconductor lighting wick structure and lamps and lanterns |
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