CN102314812A - LED (Light-Emitting Diode) display screen - Google Patents

LED (Light-Emitting Diode) display screen Download PDF

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Publication number
CN102314812A
CN102314812A CN201110249137A CN201110249137A CN102314812A CN 102314812 A CN102314812 A CN 102314812A CN 201110249137 A CN201110249137 A CN 201110249137A CN 201110249137 A CN201110249137 A CN 201110249137A CN 102314812 A CN102314812 A CN 102314812A
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led
module
circuit board
led display
light
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CN201110249137A
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Chinese (zh)
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CN102314812B (en
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徐望飞
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创维光电科技(深圳)有限公司
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Abstract

The invention relates to an LED (Light-Emitting Diode) display screen, which comprises a plurality of light-source modules, wherein the light-source modules are spliced together, each light-source module comprises an LED module, the LED module comprises a circuit board and a plurality of LEDs which are installed on the circuit board, each light-source module also comprises a protecting seat for installing the LED module, the protecting seat comprises a soleplate and a lateral wall which extends in the same direction with the circumferential edge of the soleplate, the LED module is installed on the soleplate, a glue-pouring space is formed between the circuit board of the LED module and the lateral wall of the protecting seat, casting glue is filled in the glue-pouring space to form a casting-glue layer, and the LEDs of the LED module are embedded in the casting-glue layer. The LED modules of the LED display screen are installed on the protecting seats, and the casting glue is filled in the glue-pouring spaces between the circuit boards and the lateral walls of the protecting seats, so that the protection level of each light-source module reaches more than IP65.

Description

LED显示屏 LED display

技术领域 FIELD

[0001] 本发明涉及一种LED照明装置,特别涉及一种LED显示屏。 [0001] The present invention relates to an LED lighting apparatus, and particularly relates to an LED display. 背景技术 Background technique

[0002] LED(发光二极管)以发光效率高、使用寿命长、安全可靠和环保节能的特点受到广泛的重视。 [0002] LED (Light Emitting Diode) with high luminous efficiency, long life, reliable and energy-saving and environmental protection features wide attention. LED显示屏作为信息传播的一种重要手段,已经成为城市信息现代化建设的标志,随着社会经济的不断进步以及LED显示技术的不断完善,人们对LED显示屏的认识将会越来越深入,其应用领域将会越来越广。 LED display as an important means of information dissemination, has become a symbol of modernization of city information, along with the social and economic advances in LED display technology continues to improve, people's understanding of the LED display will be more in-depth, their applications will be more extensive.

[0003] 目前LED显示屏行业都是通过多个模组拼接方式来完成组装,每一模组的正面均进行灌胶后,然后多个模组拼接于一箱体上,该模组的反面会裸露于外部。 [0003] LED display industry is currently done by splicing a plurality of modules assembled, the front of each module are performed after gluing and stitching the plurality of modules on a housing, opposite surface of the module It will be exposed to the outside. 当环境湿度过高时,或者温差变化较大时,模组的PCB板的反面上容易凝成水珠,对LED灯脚进行氧化,对产品正常运行受到影响,这种LED显示屏的防护等级最高能达到IPM的防护等级,不能满足户外恶劣的环境使用。 When the humidity is too high, or the temperature changes easily condenses into water on the reverse side is large, PCB board of the module, the LED lamp pins oxidized product affected the normal operation, such protection level LED display IPM can achieve the highest degree of protection, and can not meet harsh outdoor environments.

发明内容 SUMMARY

[0004] 有鉴于此,有必要提供一种高防护等级的LED显示屏。 [0004] In view of this, it is necessary to provide a high degree of protection of the LED display.

[0005] 本发明的LED显示屏是这样实现的:一种LED显示屏,其包括拼接在一起的若干光源模组,每一光源模组包括一发光二极管模组,所述发光二极管模组包括一电路板及安装于所述电路板上的若干LED,每一光源模组还包括供所述发光二极管模组安装的保护座,所述保护座包括一底板及由所述底板的周缘同向延伸的侧壁,所述发光二极管模组安装于所述底板上,所述发光二极管模组的电路板与所述保护座的侧壁形成一灌胶空间,所述灌胶空间内填充灌封胶以形成一灌封胶层,所述发光二极管模组的LED嵌于灌封胶层内。 [0005] LED display of the present invention is implemented as follows: an LED display, which includes a plurality of light source module are spliced ​​together, each light source module includes an LED module, the LED module comprises a circuit board and a plurality of LED mounted on the circuit board, each light source module further comprises a protective housing for the light emitting diode module is mounted, the protective housing comprises a bottom plate and in the same direction by a circumferential edge of the bottom plate extending sidewall, the LED module mounted on the base plate, the LED module circuit board and the sidewall of the protector block is formed of a potting space, filling the inner space filled with potting gel potting plastic to form a subbing layer, a light emitting diode LED module is embedded in the potting adhesive layer.

[0006] 所述LED显示屏的发光二极管模组安装于一保护座上,并通过灌封胶填充于电路板与所述保护座的侧壁之间的灌胶空间内,使得光源模组达到IP65以上的防护等级。 [0006] The light emitting diode LED display module mounted on a seat protection, and filled by potting in the protective circuit board and the inner space between the side walls Glue seat, so that the light source module to achieve more than IP65 degree of protection.

附图说明 BRIEF DESCRIPTION

[0007] 图1为本发明一实施例的LED显示屏的光源模组的立体组装图。 [0007] FIG. 1 is a perspective assembled view of an LED display panel according to an embodiment of the light source module of the present invention.

[0008] 图2为图1的圆圈A处的放大图。 [0008] FIG. 2 is an enlarged view of circle A at 1.

[0009] 图3为图1的另一角度的立体分解图。 [0009] FIG. 3 is another perspective exploded perspective view of FIG. 1 FIG.

[0010] 图4为图3的圆圈B处的放大图。 [0010] FIG. 4 is an enlarged view of circle B at 3.

[0011] 图5为图1的俯视图。 [0011] FIG. 5 is a top view of FIG. 1.

[0012] 图6为图5的沿VI-VI线的剖视放大图。 [0012] FIG. 6 is a view taken along line VI-VI 5 is an enlarged cross-sectional view of FIG.

[0013] 图7为图5的沿VII-VII线的剖视放大图。 [0013] FIG. 7 taken along line VII-VII of FIG. 5 an enlarged sectional view of FIG.

[0014] 图8为图1的另一角度的倒置图。 [0014] FIG. 8 is another aspect of the upside of FIG. 1 FIG.

具体实施方式[0015] 为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。 DETAILED DESCRIPTION [0015] To make the objectives, technical solutions and advantages of the present invention will become more apparent hereinafter in conjunction with the accompanying drawings and embodiments of the present invention will be further described in detail. 应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。 It should be understood that the specific embodiments described herein are only intended to illustrate the present invention and are not intended to limit the present invention.

[0016] 请参阅图1和图2,本发明一实施例的LED(发光二极管)显示屏包括拼接在一起的若干光源模组100。 [0016] Please refer to FIGS. 1 and 2, LED (light emitting diode) to an embodiment of the present invention includes a plurality of display light source module 100 are spliced ​​together. 每一光源模组100呈长条状结构。 Each light source module 100 is strip-shaped structure. 每一光源模组100包括一保护座10及安装于该保护座10上的一发光二极管模组30。 Each light source module 100 includes a protective housing 30 on an LED module 10 attached to the guard 10 and the seat.

[0017] 请同时参阅图3至图7,所述发光二极管模组30包括一电路板31、安装于所述电路板31上的若干LED 32及与所述电路板31电性连接的连接器34。 [0017] Please refer to FIGS. 3 to 7 at the same time, the LED module 30 includes a circuit board 31, a plurality of LED 32 is attached to the connector and the circuit board 31 is electrically connected to the circuit board 31 on 34. 当所述发光二极管模组30安装于所述保护座10上时,所述电路板31与所述保护座10的外围形成一灌胶空间33。 When the LED module 30 is attached to the protective housing 10, the circuit board 31 is formed with a potting space 33 in the periphery of the protector block 10. 所述灌胶空间33内填充灌封胶以形成一灌封胶层36。 The space 33 filled with the potting potting adhesive layer 36 to form a casting. 所述发光二极管模组30的LED 32嵌于灌封胶层36内。 The LED module 30 of the LED 32 embedded in the potting adhesive layer 36. 在本实施例中,所述LED 32的顶面与所述灌封胶层36的顶面平齐。 In the present embodiment, the LED top surface of the potting adhesive layer 32 is flush with the top surface 36. 所述电路板31的底面贴设若干芯片(IC)37。 The bottom surface of the circuit board 31 is provided attached to a plurality of chip (IC) 37. 所述芯片37与所述保护座10的底部之间夹设有若干导热硅胶片38。 The interposed chip 37 and the protective sheet 38 is provided between the plurality of thermal silica seat bottom 10.

[0018] 所述保护座10由铝合金、锌合金、铁、钢、铜等导热性能良好的材料一体成型。 [0018] 10 made of aluminum alloy, zinc alloy, iron, steel, copper or the like with good heat conductivity material of the protective seat are integrally formed. 在本实施例中,所述保护座10选用铝合金材料压铸成型,在其他实施例中,所述保护座10可以通过数控加工中心加工而成。 In the present embodiment, the protector block 10 selected aluminum alloy die casting, in other embodiments, the protective housing 10 may be processed by CNC machining center. 在本实施例中,所述保护座10包括一底板11、由所述底板11周缘沿垂直于底板11方向同向延伸的四侧壁12、由该底板11延伸的若干导热柱13及由该底板11延伸的若干安装柱16。 In the present embodiment, the protective housing 10 includes a bottom 11, a peripheral edge of the base plate 11 in the vertical direction with the four side walls 12 extending, by extending a plurality of heat conducting column 11 to the bottom plate 11 and the bottom plate 13 of the a plurality of mounting post 16 of the base plate 11 extends. 所述导热柱13及安装柱16的延伸方向与所述侧壁12 的延伸方向相同。 The extending direction of the heat conducting column 13 and mounting post 16 and the extending direction of the side wall 12 of the same. 每一导热柱13开设有一通孔14。 Each heat conducting column 13 defines a through hole 14. 该通孔14贯通所述导热柱13及所述保护座10的底板11。 The through hole 14 through the heat conducting column 13 and the bottom plate 11 of the protector block 10. 所述导热柱13的高度大于所述安装柱16的高度。 The height of the heat conducting column 13 is greater than the height of the column 16 is mounted. 所述导热柱13的顶端与所述保护座10的侧壁12的顶端平齐。 The heat conducting column 13 to the top of the protective housing 10 to the top wall 12 is flush. 所述灌封胶层36的顶面与所述保护座10的侧壁12的顶端平齐。 The potting adhesive layer 36 of the top surface of the top wall 12 of the protector block 10 is flush. 当所述发光二极管模组30安装于所述保护座10上时,所述电路板31 与所述保护座10的侧壁12形成所述灌胶空间33。 When the LED module 30 is attached to the protective housing 10, the circuit board 31 and the base 10 of the protective side wall 12 of space 33 formed in the potting. 所述芯片37与所述保护座10的底板11之间夹设所述导热硅胶片38。 The chip 37 and interposed between the bottom plate 11 of the thermally conductive silicone sheet 10 the protective housing 38.

[0019] 所述保护座10长度方向上的中部开设一穿孔15,以便于所述连接器34穿过该穿孔15与所述电路板31电性连接。 [0019] in the middle of the protective housing 10 defines a longitudinal direction of the perforations 15, to pass through the through hole 15 is electrically connected to the circuit board 31 to the connector 34. 在本实施例中,所述穿孔15为方形孔。 In the present embodiment, the perforations 15 is a square hole. 所述保护座10 的底板11的底面向外延伸有螺纹柱39,用于整个LED显示屏的连接。 The bottom surface of the bottom plate 11 of the protective base 10 extends outwardly threaded post 39 for connecting the LED display.

[0020] 所述发光二极管模组30的电路板31上开设若干安装孔35。 [0020] The LED module 35 defines a plurality of mounting holes 30 in circuit board 31. 所述安装孔35位于所述LED 32之间,且与所述保护座10的导热柱13 —一对应。 The mounting hole 35 is located between the LED 32 and the protective housing 10 of the heat conducting column 13 - one correspondence. 所述安装孔35的孔径略大于所述导热柱13的外径,以便于所述导热柱13能够穿过所述安装孔35。 The mounting hole 35 slightly larger than the pore size of the outer diameter of the heat conducting column 13, a heat conducting column 13 so as to be able to pass through the mounting hole 35.

[0021] 在所述光源模组100的安装过程中,首先在所述保护座10的底板11上贴设一导热硅胶片38(如图6所示)。 [0021] During installation of the light source module 100, the first protective substrate 10 in the housing 11 is provided a thermally conductive silicone sheet pasted 38 (shown in FIG. 6). 然后,所述发光二极管模组30的电路板31的安装孔35与所述保护座10的导热柱13对应,电路板31穿过导热柱13安装于保护座10内,并通过若干锁固件50螺锁于所述保护座10上的所述安装柱16上来完成发光二极管模组30的固定。 Then, the light emitting diode module attachment hole 31 of the circuit board 35 of the protector block 13 corresponding to the heat conducting column 10, circuit board 31 through the heat conducting column 13 installed inside the protective housing 10, and by a plurality of fasteners 50 screwed to the mounting of the protective posts 10 on seat 16 fixed onto the LED module 30 is completed. 此时,所述导热硅胶片38夹于所述电路板31的芯片37和所述底板11之间,以将所述电路板31上的热量传递至底板11上。 In this case, the thermally conductive silicone sheet 38 to the circuit board 31 sandwiched in between the die 37 and the bottom plate 11 to heat on the circuit board 31 is transmitted to the base plate 11. 然后,所述灌胶空间33内填充灌封胶。 Then, filling the inner space 33 is filled plastic encapsulants. 所述灌封胶填满于灌胶空间33内。 The potting fill the space 33 within the potting. 此时,所述灌封胶层36的顶面、所述保护座10的侧壁12的顶端、所述导热柱13的顶端及所述LED 32的顶面均平齐。 At this time, the top surface of the potting adhesive layer 36, the protective top sidewall 12 of base 10, the heat conducting column 13 to the top of the LED 32 and the top surface are flush. 请同时参阅图8,所述连接器34固定于所述保护座10的穿孔15内,使连接器34的一端与所述电路板31电性连接,连接器34的另一端凸伸出所述保护座10的底板11,以便与其他外部电子元件连接,达到提供电源及通信的目的。 See Figure 8. At the same time, the connector 34 is fixed to the protective perforations 15 10, one end 34 of the connector 31 is electrically connected to the circuit board, the male connector 34 and the other end extending out of said bottom plate 11 of the protector block 10, for connection to other external electronic components, to achieve the object of providing power and communications. 所述连接器34与所述穿孔15之间设有防水圈。 The connector 34 and the waterproof ring is provided between the perforations 15.

[0022] 在本实施例中,所述锁固件50为螺丝。 [0022] In the present embodiment, the fasteners 50 are screws. 所述灌封胶为有机硅胶、环氧树脂胶、聚氨酯胶或AB胶。 The organic silicone potting, epoxy glue, polyurethane glue or glue AB.

[0023] 本发明的LED显示屏的光源模组100在所述发光二极管模组30完成安装后,灌封胶封盖住所述电路板31、所述锁固件50、所述电路板31与所述保护座10的侧壁12的缝隙, 使可能受到尘土、外物,潮气及水影响的地方均封盖住,使得光源模组100达到IP65以上的防护等级。 [0023] LED display of the present invention, the light source module 100 in the LED module 30 after installation is completed, potting closed over the circuit board 31, the fasteners 50, 31 of the circuit board and where the protective slot side wall 12 of the seat 10, so may be subject to dust, foreign material, moisture and are closed over the influence of water, such that the light source module 100 more than IP65 protection.

[0024] 另外,所述保护座10的通孔14的作用有三,其一,增加保护座10与周围空气的接触面积,使得所述发光二极管模组30产生的热量得以有效散发,提高了散热效率;其二,起到透风及减少风阻的作用,增强光源模组100的抗风能力;其三,起到透光的作用,利于LED 显示屏背后的采光。 [0024] Further, the protective effect of the through hole 14 of the seat 10 there are three, one, 10 increase the contact area with the surrounding air protection seat 30 such that the heat generated by the LED module is effectively circulated, to improve thermal efficiency; Second, play the role of ventilation and reduce wind resistance, to enhance the wind resistance of the light source module 100; Third, play the role of a light-transmitting, to lighting the LED display behind.

[0025] 以上仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。 [0025] The above embodiment is only preferred embodiments of the present invention but are not intended to limit the present invention, any modifications within the spirit and principle of the present invention, equivalent substitutions and improvements should be included in the present invention. within the scope of protection.

Claims (10)

1. 一种LED显示屏,其包括拼接在一起的若干光源模组,每一光源模组包括一发光二极管模组,所述发光二极管模组包括一电路板及安装于所述电路板上的若干LED,其特征在于:每一光源模组还包括供所述发光二极管模组安装的保护座,所述保护座包括一底板及由所述底板的周缘同向延伸的侧壁,所述发光二极管模组安装于所述底板上,所述发光二极管模组的电路板与所述保护座的侧壁形成一灌胶空间,所述灌胶空间内填充灌封胶以形成一灌封胶层,所述发光二极管模组的LED嵌于灌封胶层内。 An LED display, which includes a plurality of light source modules are spliced ​​together, each light source module includes an LED module, the LED module comprises a circuit board and mounted on the circuit board a plurality of LED, the characterized in that: each light source module further comprises a protective housing for mounting the light emitting diode module, the protective housing comprises a bottom plate and the bottom plate by the peripheral edge of the side wall extending in the same direction, the light emitting LED module mounted on said base plate, said LED module circuit board and the sidewall of the protector block is formed of a potting space, filling the inner space is filled plastic encapsulants to form a subbing layer potting the light emitting diode LED module embedded in the potting adhesive layer.
2 如权利要求1所述的LED显示屏,其特征在于:所述灌封胶层的顶面与所述光源模组的保护座的侧壁的顶端平齐。 2 LED display as recited in claim 1, wherein: the top of the sidewall rubber layer of the potting protector block top surface is flush with the light source module.
3.如权利要求1所述的LED显示屏,其特征在于:所述灌封胶层的顶面与所述发光二极管模组的LED的顶面平齐。 3. The LED display according to claim 1, wherein: the potting adhesive layer top face of the top surface of the LED and the LED module are flush.
4.如权利要求1至3任意一项所述的LED显示屏,其特征在于:所述保护座还包括由所述底板延伸的若干导热柱,所述导热柱穿过所述发光二极管模组的电路板并伸入灌封胶层内。 1 to 4. The 3 LED display according to any one of the preceding claims, characterized in that: said housing further comprises a plurality of heat conductive protective post extending from said base plate, said heat conducting column through the LED module board and extending into the potting adhesive layer.
5.如权利要求4所述的LED显示屏,其特征在于:所述保护座的导热柱开设通孔,所述通孔贯通所述导热柱及所述保护座的底板。 5. The LED display of claim 4, wherein: said heat conducting column protector block defines a through hole, the through hole penetrating the protective housing of the heat conducting column, and a bottom plate.
6.如权利要求4所述的LED显示屏,其特征在于:所述保护座的导热柱的顶端与所述灌封胶层的顶面平齐。 6. The LED display of claim 4, wherein: the top of the thermal protection seat post and a top surface of the potting adhesive layer is flush.
7.如权利要求4所述的LED显示屏,其特征在于:所述保护座由导热材料一体成型。 The LED display of claim 4, wherein: said protector block is integrally molded from a thermally conductive material.
8.如权利要求7所述的LED显示屏,其特征在于:所述保护座由铝合金材料一体成型。 8. The LED display according to claim 7, wherein: said protector block is integrally formed of an aluminum alloy material.
9.如权利要求4所述的LED显示屏,其特征在于:所述光源模组还包括一连接器,所述保护座的底板开设一穿孔,所述连接器镶嵌于所述穿孔内,所述连接器的一端与所述发光二极管模组的电路板电性连接,所述连接器的另一端凸伸出所述底板。 9. The LED display of claim 4, wherein: the light source module further comprises a connector, the protection plate defines a through hole seat, the connector is embedded in the perforations, the a circuit board electrically one end of the LED module is connected to said connector, the other end projecting unit projecting the floor.
10.如权利要求4所述的LED显示屏,其特征在于:所述发光二极管模组的电路板上设置芯片,所述芯片与所述保护座的底板之间夹设一导热硅胶片。 10. The LED display of claim 4, wherein: said light emitting diode chip module disposed on a circuit board, a thermally conductive silicone sheet is interposed between the chip and the base plate of the protector block.
CN 201110249137 2011-08-26 2011-08-26 LED (Light-Emitting Diode) display screen CN102314812B (en)

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CN102930785A (en) * 2012-09-26 2013-02-13 惠州雷曼光电科技有限公司 LED (Light-Emitting Diode) display module
CN103280164A (en) * 2013-05-30 2013-09-04 创维光电科技(深圳)有限公司 Led display module and led display
US10248372B2 (en) 2013-12-31 2019-04-02 Ultravision Technologies, Llc Modular display panels

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CN102044535A (en) * 2009-10-26 2011-05-04 佛山市国星光电股份有限公司 Surface mounted device (SMD) light emitting diode (LED) device and display module thereof for outdoor display screen
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Publication number Priority date Publication date Assignee Title
CN102930785A (en) * 2012-09-26 2013-02-13 惠州雷曼光电科技有限公司 LED (Light-Emitting Diode) display module
CN103280164A (en) * 2013-05-30 2013-09-04 创维光电科技(深圳)有限公司 Led display module and led display
CN103280164B (en) * 2013-05-30 2016-02-17 创维光电科技(深圳)有限公司 Led display module and led display
US10248372B2 (en) 2013-12-31 2019-04-02 Ultravision Technologies, Llc Modular display panels

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