CN202888239U - Heat dissipation carrier structure of light-emitting diode (LED) luminous chip - Google Patents
Heat dissipation carrier structure of light-emitting diode (LED) luminous chip Download PDFInfo
- Publication number
- CN202888239U CN202888239U CN 201220586748 CN201220586748U CN202888239U CN 202888239 U CN202888239 U CN 202888239U CN 201220586748 CN201220586748 CN 201220586748 CN 201220586748 U CN201220586748 U CN 201220586748U CN 202888239 U CN202888239 U CN 202888239U
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- Prior art keywords
- heat radiation
- luminescence chip
- radiation carrier
- circuit board
- carrier structure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a heat dissipation carrier structure of a light-emitting diode (LED) luminous chip. The heat dissipation carrier structure comprises a circuit board, at least one electric pin, a metal heat dissipation carrier and transparent glue, wherein at least one luminous chip is configured on the circuit board; the electric pin is connected to the luminous chip of the circuit board and extends towards a backlight side of the luminous chip; the metal heat dissipation carrier is of a concave basin shape, the circuit board and the luminous chip are contained in the metal heat dissipation carrier, and the electric pin penetrates through a bottom plate of the heat dissipation carrier; and the transparent glue is filled in the metal heat dissipation carrier and completely covers the circuit board and the luminous chip. Consequently, the effects of high heat dissipation, water proof and dust proof and a purpose of installing LEDs on outdoor boards, signboards or outer walls of buildings can be realized.
Description
Technical field
The utility model relates to the heat radiation carrier structure of a kind of light-emitting diode (LED) luminescence chip, particularly about the light emitting diode construction of a kind of high heat radiation, waterproof and dustproof.
Background technology
Light-emitting diode (LED) has been quite ripe technology, and what light-emitting diode needed most consideration at present is heat dissipation problem, and the bad meeting of dispelling the heat causes the luminescence chip quick aging, affects luminous usefulness and life-span.
The utility model is for being applied to light-emitting diode the view display screen of advertisement plate, signboard or building exposed wall, therefore design a series of High Power LED, also designed the heat radiation carrier structure of luminescence chip of the present utility model for High Power LED.
The utility model content
The purpose of this utility model is to provide a kind of heat radiation carrier structure of LED luminescence chip, has the effect of high heat radiation, waterproof and dustproof, and the utility model LED can be installed on the exterior wall in outdoor billboard, signboard or building.
For reaching above-mentioned purpose, the utility model provides a kind of heat radiation carrier structure of LED luminescence chip, and it comprises:
One circuit board, at least one luminescence chip of configuration on it;
At least one electric pin is connected to this luminescence chip of this circuit board, and extends to the back side of this luminescence chip; And
One heat radiation carrier is metal material, has an opening and a base plate, is recessed peviform, and accommodating this circuit board and this luminescence chip in it, this base plate are provided with through hole that should electric pin, pass this base plate for this electric pin.
The heat radiation carrier structure of above-mentioned LED luminescence chip, wherein this circuit board is the substrate of metal material.
The heat radiation carrier structure of above-mentioned LED luminescence chip, wherein this circuit board is aluminium base.
The heat radiation carrier structure of above-mentioned LED luminescence chip, wherein this luminescence chip is the luminescence chip of solid color or a plurality of colors.
The heat radiation carrier structure of above-mentioned LED luminescence chip, wherein this electric pin is coated with to make between this electric pin and this base plate near the part outer surface of this heat radiation carrier and is the insulating varnish of state of insulation, insulating cement or installs insulating case.
The heat radiation carrier structure of above-mentioned LED luminescence chip wherein is equipped with the insulating case that makes between this electric pin and this base plate as a hollow form of state of insulation in this through hole, this electric pin passes this insulating case.
The heat radiation carrier structure of above-mentioned LED luminescence chip, rounded, square, the rectangle of profile, polygonal or irregularly shaped that wherein should the heat radiation carrier.
The heat radiation carrier structure of above-mentioned LED luminescence chip, wherein the metal material of this heat radiation carrier is aluminum metal.
The heat radiation carrier structure of above-mentioned LED luminescence chip, electroplating surface one insulating barrier of the carrier that wherein should dispel the heat.
The heat radiation carrier structure of above-mentioned LED luminescence chip, wherein this circuit board is provided with at least one connecting hole, in order to connect this electric pin, also is provided with the conducting wire on this circuit board and is electrically connected this luminescence chip and this electric pin.
The heat radiation carrier structure of above-mentioned LED luminescence chip wherein also comprises printing opacity glue, is filled in this heat radiation carrier, and covers fully on this circuit board and this luminescence chip.
The heat radiation carrier structure of above-mentioned LED luminescence chip wherein also comprises an euphotic cover, is incorporated into the opening part of this heat radiation carrier, to seal this heat radiation carrier.Below in conjunction with the drawings and specific embodiments the utility model is described in detail, but not as to restriction of the present utility model.
Description of drawings
Fig. 1 is the embodiment overall structure figure of the utility model light-emitting diode;
Fig. 2 is the three-dimensional exploded view of Fig. 1;
Fig. 3 is the cross-sectional schematic of Fig. 1;
Fig. 4 is another embodiment stereogram of the present utility model.
Wherein, Reference numeral
10 circuit boards
11 luminescence chips
12 connecting holes
13 electric pins
14 insulating cases
20 heat radiation carriers
21 accommodation spaces
22 base plates
23 through holes
30 printing opacity glue
40 euphotic covers
Embodiment
Below in conjunction with accompanying drawing structural principle of the present utility model and operation principle are done concrete description:
The embodiment overall structure of the utility model light-emitting diode as shown in Figure 1, and Fig. 2 is the three-dimensional exploded view of Fig. 1.See also Fig. 1 and Fig. 2, light-emitting diode of the present utility model includes a circuit board 10, disposes a luminescence chip 11 on the circuit board 10, and luminescence chip 11 can be a plurality of led chips of solid color or the led chip of a plurality of colors.The material of this circuit board 10 can be used the circuit substrate of the better metal material of heat radiation, or metal and nonmetallic synthetic substrate, such as aluminium base, and more include at least one connecting hole 12 on the circuit board 10, can connect at least one electric pin 13 for corresponding, and electric pin 13 is to extend towards the back side of luminescence chip 11.
In the embodiment of the utility model Fig. 1 and Fig. 2, be provided with two electric pins 13, and circuit board 10 is provided with the connecting hole of two corresponding electric pins 13, allowing electric pin 13 can pass connecting hole is welded on the circuit board 10, and also being provided with the conducting wire (not shown) on the circuit board 10 is electrically connected between luminescence chip 11 and the electric pin 13, these two electric pins 13 can be electrically connected to outside circuit substrate or electric power source, for should the luminous electric power of luminescence chip, form electric loop.Yet electric pin 13 of the present utility model can only have one, and utilize the metallic conduction characteristic of heat radiation carrier to form electric loop, perhaps electric pin 13 of the present utility model can have above more than two, is electrically connected respectively luminescence chip 11 of a plurality of different colours etc.
The utility model also is provided with a heat radiation carrier 20, this heat radiation carrier 20 is recessed peviform, has an opening, to be that metal material is integrally formed make heat radiation carrier 20, as the good aluminum metal of dispelling the heat, the profile of heat radiation carrier 20 can be irregularly shaped for the polygonal such as circular, square, rectangle, triangle, hexagon, octangle or trapezoidal or rhombus etc.
The inside of the utility model heat radiation carrier 20 is formed with an accommodation space 21, in order to accommodating circuit board 10 and luminescence chip 11, the light-emitting area of luminescence chip 11 is towards the opening part of recessed basin, heat radiation carrier 20 has a base plate 22 on the opposite of relative opening, base plate 22 is provided with the through hole 23 of corresponding electric pin 13, and the through hole 23 that can allow electric pin 13 pass base plate 22 extends to the back side of luminescence chip 11.
Because heat radiation carrier 20 is metal material, for making electric pin 13 can not contact short circuit with heat radiation carrier 20, so the utility model embodiment is coated with insulating varnish, insulating cement or installs insulating case 14 at the part outer surface of electric pin 13 near heat radiation carrier 20, so that when electric pin 13 passes the through hole 23 of base plate 22, form the state of insulation between electric pin 13 and the base plate 22, certainly the utility model example also can at electroplating surface one layer insulating of heat radiation carrier 20, reach the purpose of insulation.
See also Fig. 3, Fig. 3 is the cross-sectional schematic of Fig. 1, the utility model embodiment also can be mounted to insulating case 14 on the electric pin 13 first, again electric pin is inserted, or with at the through hole 23 interior insulating cases 14 that hollow form is installed first, again electric pin 13 is passed insulating case 14, insulating case 14 can also make the sealing state of the base plate 22 formation waterproof of heat radiation carrier 20 except making insulation between electric pin 13 and the heat radiation carrier 20.When circuit board 10 and luminescence chip 11 be fit into the accommodation space 21 of heat radiation carrier 20 interior after, recycling printing opacity glue 30 is filled in the accommodation space 21 of heat radiation carrier 20, after printing opacity glue is dry, this the heat radiation carrier 20 opening sealing state, and circuit board 10 and the luminescence chip 11 of heat radiation carrier 20 inside can be hedged off from the outer world, and form waterproof and dustproof and the good High Power LED that dispels the heat.
Another embodiment of the present utility model, as shown in Figure 4, the utility model also is provided with an euphotic cover 40, can be incorporated into the opening part of this heat radiation carrier 20, and the carrier that should dispel the heat sealing forms waterproof and dustproof and the good High Power LED that dispels the heat.
Certainly; the utility model also can have other various embodiments; in the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the utility model.
Claims (12)
1. the heat radiation carrier structure of a LED luminescence chip is characterized in that, comprising:
One circuit board, at least one luminescence chip of configuration on it;
At least one electric pin is connected to this luminescence chip of this circuit board, and extends to the back side of this luminescence chip; And
One heat radiation carrier is metal material, has an opening and a base plate, is recessed peviform, and accommodating this circuit board and this luminescence chip in it, this base plate are provided with through hole that should electric pin, pass this base plate for this electric pin.
2. the heat radiation carrier structure of LED luminescence chip according to claim 1 is characterized in that, this circuit board is the substrate of metal material.
3. the heat radiation carrier structure of LED luminescence chip according to claim 2 is characterized in that, this circuit board is aluminium base.
4. the heat radiation carrier structure of LED luminescence chip according to claim 1 is characterized in that, this luminescence chip is the luminescence chip of solid color or a plurality of colors.
5. the heat radiation carrier structure of LED luminescence chip according to claim 1, it is characterized in that the part outer surface of close this heat radiation carrier of this electric pin is coated with and makes between this electric pin and this base plate is the insulating varnish of state of insulation, insulating cement or installing insulating case.
6. the heat radiation carrier structure of LED luminescence chip according to claim 1 is characterized in that, the insulating case that makes between this electric pin and this base plate as a hollow form of state of insulation is installed in this through hole, and this electric pin passes this insulating case.
7. the heat radiation carrier structure of LED luminescence chip according to claim 1 is characterized in that, rounded, square, the rectangle of profile, the polygonal or irregularly shaped of this heat radiation carrier.
8. the heat radiation carrier structure of LED luminescence chip according to claim 1 is characterized in that, the metal material of this heat radiation carrier is aluminum metal.
9. the heat radiation carrier structure of LED luminescence chip according to claim 1 is characterized in that, electroplating surface one insulating barrier of this heat radiation carrier.
10. the heat radiation carrier structure of LED luminescence chip according to claim 1 is characterized in that, this circuit board is provided with at least one connecting hole, in order to connect this electric pin, also is provided with the conducting wire on this circuit board and is electrically connected this luminescence chip and this electric pin.
11. the heat radiation carrier structure of LED luminescence chip according to claim 1 is characterized in that, also comprises printing opacity glue, is filled in this heat radiation carrier, and covers fully on this circuit board and this luminescence chip.
12. the heat radiation carrier structure of LED luminescence chip according to claim 1 is characterized in that, also comprises an euphotic cover, is incorporated into the opening part of this heat radiation carrier, to seal this heat radiation carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220586748 CN202888239U (en) | 2012-11-08 | 2012-11-08 | Heat dissipation carrier structure of light-emitting diode (LED) luminous chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220586748 CN202888239U (en) | 2012-11-08 | 2012-11-08 | Heat dissipation carrier structure of light-emitting diode (LED) luminous chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202888239U true CN202888239U (en) | 2013-04-17 |
Family
ID=48079634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220586748 Expired - Fee Related CN202888239U (en) | 2012-11-08 | 2012-11-08 | Heat dissipation carrier structure of light-emitting diode (LED) luminous chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202888239U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104602445A (en) * | 2015-02-06 | 2015-05-06 | 长沙信元电子科技有限公司 | Straight-plug terminal applicable to aluminum-base circuit board |
| WO2019095543A1 (en) * | 2017-11-20 | 2019-05-23 | 湖南粤港模科实业有限公司 | Package structure for led light source |
-
2012
- 2012-11-08 CN CN 201220586748 patent/CN202888239U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104602445A (en) * | 2015-02-06 | 2015-05-06 | 长沙信元电子科技有限公司 | Straight-plug terminal applicable to aluminum-base circuit board |
| CN104602445B (en) * | 2015-02-06 | 2018-08-24 | 江门市中友电子有限公司 | A kind of direct insertion terminal suitable for aluminum base circuit board |
| WO2019095543A1 (en) * | 2017-11-20 | 2019-05-23 | 湖南粤港模科实业有限公司 | Package structure for led light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130417 Termination date: 20151108 |
|
| EXPY | Termination of patent right or utility model |