CN102313256A - Ceramic layer plated base for light emitting diode (LED) light source multi-cup module - Google Patents
Ceramic layer plated base for light emitting diode (LED) light source multi-cup module Download PDFInfo
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- CN102313256A CN102313256A CN201110266634A CN201110266634A CN102313256A CN 102313256 A CN102313256 A CN 102313256A CN 201110266634 A CN201110266634 A CN 201110266634A CN 201110266634 A CN201110266634 A CN 201110266634A CN 102313256 A CN102313256 A CN 102313256A
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- ceramic layer
- base
- led
- light source
- reflector
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention provides a ceramic layer plated base for a light emitting diode (LED) light source multi-cup module, which comprises a base plate and a plurality of reflective cups which are arranged on the base plate, wherein a ceramic layer is plated on an illumination face for installing an LED on each reflective cup; and the whiteness of the ceramic layers is more than or equal to 70, the better whiteness is more than or equal to 85, and the best whiteness is more than or equal to 88. The base plate and the reflective cups are molded into one body or the reflective cups are stuck and fixed on the base plate and small grooves, which extend into side walls of the reflective cups and are used for installing circuit boards, are arranged on the base plate. Through the ceramic layer plated base for the LED light source multi-cup module, the manufacture work procedures of a traditional LED metal base can be reduced, i.e. the manufacture process is simplified so that the manufacture cost can be greatly saved and the ceramic layer plated base is favorable to mass industrial production; simultaneously the base can be manufactured directly in a prefabrication manner and because the high whiteness ceramic layers are plated on the reflective cups of the base, the light extraction efficiency of LED chips is greatly improved, the consumption can be greatly reduced when light energy is converted into heat energy, and the heat dissipating performance is greatly improved; and an LED lamp which adopts the ceramic layer plated base has better safety performance, is not conductive, is firm and has a longer service life.
Description
Technical field
The present invention relates to a kind of lighting apparatus, relate in particular to a kind of LED lamp.
Background technology
LED is a kind of low voltage light sources, because its power saving, life-span are long, has been widely used in various lighting devices at present; If traditional LED bulb lamp all adopts metal material as the LED base plate for packaging, because the whiteness of metal substrate own is lower, therefore the not treated encapsulation base plate of directly making the LED lamp; Its reflector efficiency is not high; Particularly in great power LED was used, because its caloric value is bigger, life of product was lower; Therefore the light-emitting area on the existing metal substrate all can be handled earlier, as improving its whiteness as the reflector layer of reflector layer or pressing one deck white at its surface brush one deck white paint, but this way; At first its technology is complicated; Production cost is higher, simultaneously, because after having increased one deck reflector layer; Traditional its heat dispersion of led light source module encapsulation construction reduces greatly, can't solve the heat dissipation problem of high-power LED light source module more.
Summary of the invention
The technical problem that the present invention will solve is to provide a kind of and can either saves production cost, can keep many glasss of modules usefulness of the led light source plating ceramic layer base of heat dispersion preferably again.
The technical scheme that the present invention adopts is: many glasss of modules of a kind of led light source are with plating ceramic layer base; Said base comprises substrate and is arranged on the some reflectors on the substrate; It is characterized in that: the light-emitting area that is used to install LED on the said reflector is coated with a ceramic layer, the whiteness of said ceramic layer >=70.
Said substrate and reflector are to adopt one-body molded processing, or reflector is bonded and fixed on the substrate.
The whiteness of said ceramic layer is more preferred from >=and 85.
Whiteness the best of said ceramic layer is >=88.
The sidewall of said reflector also is provided with opening, also is concaved with a circuit board slot on the said base, and this circuit board slot extends to respectively in the opening of reflector sidewall, and circuit board slot below also is provided with a through hole.
The bottom of said circuit board slot is lower than the bottom of reflector.
Said base and reflector are circle.
Said reflector is 6, and said circuit board slot is " king " font.
Compared with prior art, the present invention has following advantage: since said substrate and reflector be employing metal material is one-body molded processes, or after being bonded and fixed at reflector on the substrate; Plating high whiteness ceramic layer again handles; The reflector layer production process that can reduce traditional LED to adopt metab and need to increase had both been simplified production technology, can save production cost greatly; Help large batch of suitability for industrialized production, can adopt prefabricated mode Direct Production base simultaneously; The inventor finds through long-term a large amount of experiment in addition, the whiteness of its base reflective surface is increased to >=70, can promote well and get optical efficiency, and heat dispersion is excellent; Its whiteness is >=88 best results if lifting is better for >=85 effects if promote; Because after being coated with high whiteness ceramic layer on the reflector of base; The getting optical efficiency and will promote greatly of led chip; Therefore can significantly reduce luminous energy and be converted into heat energy loss, so its heat dispersion also will improve greatly, good with its its security performance of LED lamp of processing; Non-conductive, also improve greatly non-friable service life.
Description of drawings
Combine embodiment that the present invention is further described with reference to the accompanying drawings.
Fig. 1 is the overall structure sketch mapes of many glasss of modules of led light source of the present invention with plating ceramic layer base.
Fig. 2 is the B-B generalized section of Fig. 1.
The specific embodiment
Come the present invention is carried out detailed explanation below in conjunction with specific embodiment.
Many glasss of modules of a kind of led light source are with plating ceramic layer base; Said base comprises substrate 1 and is arranged on 6 reflectors 2 on the substrate; Also be provided with opening 21 on the sidewall 22 of said reflector 2, also be concaved with a circuit board slot 3 on the said base, said circuit board slot 3 is " king " font; This circuit board slot 3 extends to respectively in the opening 21 of reflector 2 sidewalls; Circuit board slot 3 belows also are provided with a through hole 31, and the light-emitting area that is used to install led chip on the said reflector 2 is coated with a ceramic layer 23, the whiteness of said ceramic layer 23 >=70; Be more preferred from >=85; The best is >=88.
Said substrate 1 and reflector 2 are to adopt that metal material is one-body molded to be processed, or reflector 2 is bonded and fixed on the substrate 1.The bottom of said circuit board slot 3 is lower than the bottom of reflector 2, is convenient to after wiring board is installed equally with the reflector bottom, and base described in the present embodiment and reflector are circle.
Therefore traditional general whiteness of LED metab needs light-emitting area above that to increase the reflector layer production process in actual production all less than 70, but do like this heat dispersion of LED base is reduced greatly, and increase production process, has also increased production cost.The present invention is employed in the way that the light-emitting area of reflector is plated the ceramic layer of a high whiteness; Can burn out the concrete shape that has reflector, opening, circuit board slot and through hole that needs according to the prefabricated base that processes the size of needs of production needs, both can satisfy the requirement of whiteness >=70; Can improve heat dispersion again; Both can simplify production technology, can also save a large amount of production costs, help large batch of suitability for industrialized production; Simultaneously can adopt prefabricated mode Direct Production base, production efficiency will improve greatly.
In the foregoing description, the shape of said base also is not limited to circle, can do shapes such as squarely or strip, still can reach aforesaid goal of the invention.
Claims (8)
1. many glasss of modules of a led light source are with plating ceramic layer base, and said base comprises substrate and is arranged on the some reflectors on the substrate, it is characterized in that: the light-emitting area that is used to install LED on the said reflector is coated with a ceramic layer, the whiteness of said ceramic layer >=70.
2. many glasss of modules of led light source according to claim 1 is characterized in that with plating ceramic layer base: said substrate and reflector are to adopt one-body molded processing, or reflector is bonded and fixed on the substrate.
3. many glasss of modules of led light source according to claim 1 is characterized in that with plating ceramic layer base: the whiteness of said ceramic layer is more preferred from >=and 85.
4. many glasss of modules of led light source according to claim 1 is characterized in that with plating ceramic layer base: the whiteness of said ceramic layer is best for >=88.
5. many glasss of modules of led light source according to claim 1 are with plating ceramic layer base; It is characterized in that: the sidewall of said reflector also is provided with opening; Also be concaved with a circuit board slot on the said base; This circuit board slot extends to respectively in the opening of reflector sidewall, and circuit board slot below also is provided with a through hole.
6. many glasss of modules of led light source according to claim 5 are with plating ceramic layer base, and it is characterized in that: the bottom of said circuit board slot is lower than the bottom of reflector.
7. many glasss of modules of led light source according to claim 1 are with plating ceramic layer base, and it is characterized in that: said base and reflector are circle.
8. many glasss of modules of led light source according to claim 5 are with plating ceramic layer base, and it is characterized in that: said reflector is 6, and said circuit board slot is " king " font.
Priority Applications (1)
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CN201110266634A CN102313256A (en) | 2011-09-09 | 2011-09-09 | Ceramic layer plated base for light emitting diode (LED) light source multi-cup module |
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CN201110266634A CN102313256A (en) | 2011-09-09 | 2011-09-09 | Ceramic layer plated base for light emitting diode (LED) light source multi-cup module |
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CN201110266634A Pending CN102313256A (en) | 2011-09-09 | 2011-09-09 | Ceramic layer plated base for light emitting diode (LED) light source multi-cup module |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101027781A (en) * | 2004-08-03 | 2007-08-29 | 德山株式会社 | Package for storing light emitting element and method for producing package for storing light emitting element |
CN101598305A (en) * | 2009-07-07 | 2009-12-09 | 李�浩 | A kind of LED cooling base encapsulating structure |
CN102072422A (en) * | 2010-09-30 | 2011-05-25 | 福建省万邦光电科技有限公司 | Packaging structure of high-power LED (light emitting diode) light source module |
-
2011
- 2011-09-09 CN CN201110266634A patent/CN102313256A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101027781A (en) * | 2004-08-03 | 2007-08-29 | 德山株式会社 | Package for storing light emitting element and method for producing package for storing light emitting element |
CN101598305A (en) * | 2009-07-07 | 2009-12-09 | 李�浩 | A kind of LED cooling base encapsulating structure |
CN102072422A (en) * | 2010-09-30 | 2011-05-25 | 福建省万邦光电科技有限公司 | Packaging structure of high-power LED (light emitting diode) light source module |
Non-Patent Citations (1)
Title |
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吴建锋等: "高反射激光泵浦腔材料的研制", 《佛山陶瓷》 * |
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Application publication date: 20120111 |