CN102285553B - Steep continuous adhesive bonding method and equipment - Google Patents
Steep continuous adhesive bonding method and equipment Download PDFInfo
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- CN102285553B CN102285553B CN201110115160.7A CN201110115160A CN102285553B CN 102285553 B CN102285553 B CN 102285553B CN 201110115160 A CN201110115160 A CN 201110115160A CN 102285553 B CN102285553 B CN 102285553B
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Abstract
The present invention discloses the continuous adhesive bonding method of a kind of bubble and equipment, and its method comprises: be transported to feeding position, by continuous for the main bubble transport step being transported to bond locations by continuous for son bubble; By continuous for the son of the described feeding position bubble heating steps delivered to heating arrangement and heat given side; Move to described bond locations be pressed on adhesion step on described main bubble silk floss by continuous for the son bubble after heating.Said method and equipment above-mentioned steps achieve the automation of the continuous bonding of the tender main bubble of son bubble, improve adhesion efficiency.
Description
Technical field
The present invention relates to the continuous manufacture field of bubble, especially relate to the continuous adhesive bonding method of a kind of bubble and equipment.
Background technology
The plurality of advantages such as bubble silk floss has water proof protection against the tide, shockproof, crashworthiness power strong, environmental protection, usually used as packaging and packing material, especially as the cushioning frame of electronic product, along with the difference of electronic product profile, the shape of cushioning frame also will become corresponding shape by cutting with bond processing.Usual bonding process manually completes, and work efficiency can not meet current need of production, therefore, is badly in need of further improving.
Summary of the invention
Technical matters to be solved by this invention is to provide one and can improves adhesion efficiency and steep continuous adhesive bonding method and equipment.
The object of the invention is to be achieved through the following technical solutions:
The continuous adhesive bonding method of a kind of bubble, comprising: be transported to feeding position, by continuous for the main bubble transport step being transported to bond locations by continuous for son bubble; By continuous for the son of the described feeding position bubble heating steps delivered to heating arrangement and heat given side; Move to described bond locations be pressed on adhesion step on described main bubble silk floss by continuous for the son bubble after heating.
Also provide a kind of bubble continuous binding appts, comprising: be transported to feeding position, by continuous for the main bubble conveyor line being transported to bond locations by continuous for son bubble; The given side of antithetical phrase bubble silk floss carries out the heating arrangement heated; And the multistation mobile device be arranged near described conveyor line and heating arrangement, this multistation mobile device for being transferred to described bond locations being pressed on described main bubble silk floss by continuous for described son bubble to mention from described feeding position after described heating devices heat.
The continuous adhesive bonding method of above-mentioned bubble and equipment are transported to feeding position by adopting conveyor line that son is steeped silk floss, main bubble silk floss are transported to bond locations, adopt the continuous given side of heating arrangement antithetical phrase bubble to heat; Adopt multistation mobile device that continuous for son bubble to move from feeding position is delivered to bond locations and be pressed on main bubble silk floss after heating devices heat, achieve the automation of the continuous bonding of the tender main bubble of son bubble, improve adhesion efficiency.
Accompanying drawing explanation
Fig. 1 is a kind of FB(flow block) of the continuous adhesive bonding method of bubble of embodiment;
Fig. 2 is a kind of schematic diagram of the continuous binding appts of bubble of embodiment;
Fig. 3 is the schematic diagram of the continuous binding appts of bubble of another kind of embodiment;
Fig. 4 is the schematic diagram of the continuous binding appts of bubble of another embodiment.
In Fig. 2 to Fig. 4: conveyor line 100, secondary conveyor line 110, main pipeline 120, pedestal 210, crane 220, sucker 231, stationary positioned pore 131, vacuum cavity 132, unblock pore 141, positive pressure cavity 142, propelling movement platform 143, bay-lift 310, heating head 320.
Detailed description of the invention
Describe the present invention below in conjunction with the drawings and specific embodiments.
See Fig. 1, the continuous adhesive bonding method of bubble of present embodiment comprises:
10, feeding position is transported to, by continuous for the main bubble transport step being transported to bond locations by continuous for son bubble;
This transport step comprises again:
11, continuous for the son bubble pair being transported to feeding position is transported step;
12, by continuous for the main bubble main transport step being transported to bond locations.
It should be noted that main transport step can to transport step synchronous with pair, also can be later than and secondaryly transport step, as long as to catch up with before adhesion step or simultaneously.Two transfer rates can be set to difference like this, be convenient to adjust more reasonably compounding operation, simplify control process.
Accurate in order to ensure to transport the continuous position of bubble, described transport step comprises the continuous step positioned of the tender main bubble of described son bubble.
As preferably, the continuous step positioned of the tender main bubble of described antithetical phrase bubble is steeped tender main bubble silk floss by antithetical phrase and is imposed negative pressure realization.For the product that bubble this type of material continuous is lighter, negative pressure location is the simplest, and the flexibility of system is maximum.
20, by continuous for the son of the described feeding position bubble heating steps delivered to heating arrangement and heat given side;
In order to reduce from the energy consumption during feeding of feeding position, in described heating steps, continuous for the son of the feeding position bubble process delivering to heating arrangement is comprised the continuous step removing location of described son bubble.
As preferably, described antithetical phrase bubble is continuous removes the step of location by realizing the continuous malleation that imposes of described son bubble.
30, move to described bond locations be pressed on adhesion step on described main bubble silk floss by continuous for the son bubble after heating.
In heating steps and adhesion step antithetical phrase bubble continuous carry out shifting realized by negative-pressure adsorption fixing.
The continuous adhesive bonding method of above-mentioned bubble is transported to feeding position, by continuous for the main bubble transport step being transported to bond locations according to son to be steeped silk floss; By continuous for the son of the described feeding position bubble heating steps delivered to heating arrangement and heat given side; Move to described bond locations be pressed on adhesion step on described main bubble silk floss by continuous for the son bubble after heating, achieve the automation of the continuous bonding of the tender main bubble of son bubble, improve adhesion efficiency.
The continuous binding appts of bubble of present embodiment comprises: conveyor line 100 (see Fig. 3), heating arrangement and the multistation mobile device be arranged near conveyor line 100 and heating arrangement.
Conveyor line 100 is transported to feeding position for son being steeped silk floss, and main bubble silk floss is transported to bond locations; The given side that heating arrangement is used for antithetical phrase bubble continuous heats; Multistation mobile device for delivering to bond locations be pressed on main bubble silk floss by continuous for son bubble to move from feeding position after heating devices heat.
Present embodiment is transported to feeding position by adopting conveyor line 100 that son is steeped silk floss, main bubble silk floss is transported to bond locations, adopts the continuous given side of heating arrangement antithetical phrase bubble to heat; Adopt multistation mobile device that continuous for son bubble to move from feeding position is delivered to bond locations and be pressed on main bubble silk floss after heating devices heat, achieve the automation of the continuous bonding of the tender main bubble of son bubble.
In order to ensure conveyor line 100 to steep continuous accurate positioning, also comprise the location structure be arranged on conveyor line 100.See Fig. 2, as preferably, location structure comprises: be arranged on the location pore 131 on conveyor line 100 table top, and the vacuum cavity 132 through with this location pore 131.For the product that bubble this type of material continuous is lighter, negative pressure location is the simplest, and the flexibility of system is maximum.Certain location structure can also be arranged on the mechanical snap on conveyor line 100 table top, and its control can adopt relay.
Conveyor line 100 can be one, and the tender continuous both sides being placed on this conveyor line 100 of main bubble of son bubble, see Fig. 3; Conveyor line 100 can be set to two, and one is by continuous for the son bubble secondary conveyor line 110 being transported to feeding position, and another is by continuous for the main bubble main pipeline 120 being transported to bond locations, sees Fig. 2.The benefit setting up two separately is: the transfer rate of two conveyor lines can be different, are convenient to adjust more reasonably compounding operation, simplify control process.On this basis, completing stroke needed for one group of technique to reduce multistation mobile device, heating arrangement being arranged between major and minor conveyor line (120,110).Contrast from Fig. 2 and Fig. 3, heating arrangement is arranged between major and minor conveyor line (120,110), and the stroke sum that multistation mobile device completes one-period is significantly less than the stroke sum that heating arrangement is arranged on major and minor conveyor line (120,110) side.
See Fig. 2 to Fig. 4, above-mentioned multistation mobile device specifically comprises: play the pedestal 210 of fixation, being arranged on this pedestal 210 can the crane 220 of vertical lifting, this crane 220 is arranged can parallel motion pick and place part.As preferably, described in pick and place part be the sucker 231 that the aperture of end is greater than its barrel dliameter, this sucker 231 is through with gas tank.Pick and place the form that part can also be claw, the driving of claw can be electronic mode, pneumatic mode and hydraulic driving mode.
See Fig. 2, in order to reduce multistation mobile device from the energy consumption during feeding of feeding position, described secondary conveyor line 110 does not arrange location pore 131 and vacuum cavity 132, at ambient pressure feeding in feeding position.As preferably, secondary conveyor line 110 provides malleation in feeding position to son bubble silk floss, concrete structure is: arrange on the table top of feeding position and unlock pore 141 and the positive pressure cavity 142 through with this unblock pore 141, this position arranges positive pressure cavity 142, if picking and placeing part is sucker 231, reduce the negative pressure needed for sucker 231, if picking and placeing part is claw, then reduce the grip needed for claw.In addition, can also arrange under feeding position and push platform 143 (see Fig. 4), continuous for son bubble being pushed to is picked and placeed in the desirable scope of part.
See Fig. 2 to Fig. 4, for reducing multistation mobile device by continuous for the son bubble time of to mention from feeding position through this operation of heating devices heat, heating arrangement comprises bay-lift 310 and heating head 320, this heating head 320 is arranged on bay-lift 310, mentioning son bubble silk floss when multistation mobile device from feeding position goes to the process of heating arrangement, heating head 320 rises by this bay-lift 310, multistation mobile device by continuous for son bubble deliver to directly over heating arrangement while or afterwards, heating head 320 arrives range and steeps continuous contact with son, and antithetical phrase bubble silk floss heats.
Heating head 320 can be the element of directly heating, such as electric heating element.Also can be the form adopting heat element and heat conducting element to combinationally use.
Concise and to the point description is done below in conjunction with the workflow of Fig. 2 to the continuous binding appts of the bubble of preferred forms, due to secondary conveyor line 110 table top offering the location pore 131 through with vacuum cavity 132, negative pressure is imposed to the son bubble silk floss on secondary conveyor line 110, serve the effect that stator bubble is continuous, son is steeped silk floss and is transported to feeding position by secondary conveyor line 110; After having arrived feeding position, on secondary conveyor line 110, feeding position is malleation, and first station of sucker 231 in feeding position, antithetical phrase is steeped silk floss to execute negative pressure and son is steeped silk floss pick up, and goes to second station; Second station and heating location, continuous for son bubble transhipment is sent the top of heating arrangement by sucker 231, at the same time or afterwards, the bay-lift 310 of heating arrangement rises until range, heating head 320 antithetical phrase bubble silk floss heats, and after heating predetermined time, goes to the 3rd station; 3rd station and bond locations, continuous for son bubble transhipment is sent the top of main pipeline 120 by sucker 231, at the same time or before, main bubble silk floss is transported to bond locations by main pipeline 120, after the 3rd station, multistation mobile device presses down and is pressed on main bubble silk floss by heating surface continuous for son bubble; Then sucker 231 puts down son bubble silk floss, falls back on first station soon and carries out next round action.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, some simple deduction or replace can also be made, all should be considered as belonging to protection scope of the present invention.
Claims (9)
1. steep a continuous adhesive bonding method, it is characterized in that, comprising:
Feeding position is transported to, by continuous for the main bubble transport step being transported to bond locations by continuous for son bubble; Described transport step comprises transports step, respectively by continuous for the main bubble main transport step being transported to bond locations by continuous for the son bubble pair being transported to feeding position;
By continuous for the son of the described feeding position bubble heating steps delivered to heating arrangement and heat given side;
Move to described bond locations be pressed on adhesion step on described main bubble silk floss by continuous for the son bubble after heating.
2. the continuous adhesive bonding method of bubble according to claim 1, is characterized in that, described transport step comprises the continuous step positioned of the tender main bubble of described son bubble.
3. the continuous adhesive bonding method of bubble according to claim 2, is characterized in that, steeps the continuous negative pressure that imposes of tender main bubble realize the continuous step positioned of the tender main bubble of described son bubble by antithetical phrase.
4. the continuous adhesive bonding method of bubble according to claim 2, is characterized in that, in described heating steps comprises continuous for the son of the feeding position bubble process delivering to heating arrangement to the continuous step removing location of described son bubble.
5. the continuous adhesive bonding method of bubble according to claim 4, is characterized in that, the step described son bubble silk floss being removed to location realizes by imposing malleation to described son bubble silk floss.
6. the continuous adhesive bonding method of bubble according to claim 1, is characterized in that, in described heating steps and adhesion step antithetical phrase bubble continuous carry out shifting realized by negative-pressure adsorption fixing.
7. steep a continuous binding appts, it is characterized in that, comprising:
Son bubble silk floss is transported to the secondary conveyor line of feeding position, by continuous for the main bubble main pipeline being transported to bond locations;
The given side of antithetical phrase bubble silk floss carries out the heating arrangement heated;
And the multistation mobile device be arranged near described main pipeline and heating arrangement, this multistation mobile device is pressed on described main bubble silk floss for described son bubble silk floss is moved to described bond locations after heating devices heat described in the described feeding position warp let-off.
8. the continuous binding appts of bubble according to claim 7, is characterized in that, described multistation mobile device comprises: pedestal, arranging on the base can the crane of vertical lifting, and this crane is arranged can the sucker of parallel motion.
9. the continuous binding appts of the bubble according to claim 7 or 8, is characterized in that, also comprise the location structure be arranged on described secondary conveyor line; Described location structure comprises: be arranged on the location pore on described secondary conveyor line table top, and the vacuum cavity through with this location pore.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110115160.7A CN102285553B (en) | 2011-05-05 | 2011-05-05 | Steep continuous adhesive bonding method and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110115160.7A CN102285553B (en) | 2011-05-05 | 2011-05-05 | Steep continuous adhesive bonding method and equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102285553A CN102285553A (en) | 2011-12-21 |
| CN102285553B true CN102285553B (en) | 2016-01-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110115160.7A Expired - Fee Related CN102285553B (en) | 2011-05-05 | 2011-05-05 | Steep continuous adhesive bonding method and equipment |
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| CN (1) | CN102285553B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114043729B (en) * | 2021-11-11 | 2022-10-25 | 新壹洲高新材料科技(江苏)有限公司 | Reciprocating type foam hot-pasting machine |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2151851Y (en) * | 1992-11-20 | 1994-01-05 | 林明苍 | Foam sponge body jointing machine |
| EP0970792A2 (en) * | 1998-07-10 | 2000-01-12 | DEVI S.p.A. | Process and apparatus for molding a plastic foam material coupled with a film, in particular to realise motor vehicle upholstery elements |
| CN2511476Y (en) * | 2001-11-15 | 2002-09-18 | 欣玛兴业有限公司 | Automatic binding and forming device for foamed plastics |
| CN1970291A (en) * | 2005-11-25 | 2007-05-30 | 丰和工业株式会社 | Production method and device of sheet lamination |
| CN101179101A (en) * | 2006-11-07 | 2008-05-14 | 株式会社Npc | Laminating apparatus |
| CN201245586Y (en) * | 2008-08-25 | 2009-05-27 | 文峰 | Novel bonding laminating apparatus |
| CN201317149Y (en) * | 2008-12-17 | 2009-09-30 | 李锦泉 | Two-patch lining device |
| CN202053641U (en) * | 2011-05-05 | 2011-11-30 | 邢皓宇 | Foam bonding device |
-
2011
- 2011-05-05 CN CN201110115160.7A patent/CN102285553B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2151851Y (en) * | 1992-11-20 | 1994-01-05 | 林明苍 | Foam sponge body jointing machine |
| EP0970792A2 (en) * | 1998-07-10 | 2000-01-12 | DEVI S.p.A. | Process and apparatus for molding a plastic foam material coupled with a film, in particular to realise motor vehicle upholstery elements |
| CN2511476Y (en) * | 2001-11-15 | 2002-09-18 | 欣玛兴业有限公司 | Automatic binding and forming device for foamed plastics |
| CN1970291A (en) * | 2005-11-25 | 2007-05-30 | 丰和工业株式会社 | Production method and device of sheet lamination |
| CN101179101A (en) * | 2006-11-07 | 2008-05-14 | 株式会社Npc | Laminating apparatus |
| CN201245586Y (en) * | 2008-08-25 | 2009-05-27 | 文峰 | Novel bonding laminating apparatus |
| CN201317149Y (en) * | 2008-12-17 | 2009-09-30 | 李锦泉 | Two-patch lining device |
| CN202053641U (en) * | 2011-05-05 | 2011-11-30 | 邢皓宇 | Foam bonding device |
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| CN102285553A (en) | 2011-12-21 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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Inventor after: Zhang Caiyun Inventor before: Xing Haoyu |
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| CB03 | Change of inventor or designer information | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170815 Address after: 225721 Jiangsu province Xinghua City Dainan town in Ying Village five group No. 6 Patentee after: Zhang Caiyun Address before: 518000 Shenzhen City, Futian District province Hongling building,, 1 25B Patentee before: Xing Haoyu |
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| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160127 Termination date: 20180505 |
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| CF01 | Termination of patent right due to non-payment of annual fee |