CN102278941A - 测试装置 - Google Patents
测试装置 Download PDFInfo
- Publication number
- CN102278941A CN102278941A CN2010102533657A CN201010253365A CN102278941A CN 102278941 A CN102278941 A CN 102278941A CN 2010102533657 A CN2010102533657 A CN 2010102533657A CN 201010253365 A CN201010253365 A CN 201010253365A CN 102278941 A CN102278941 A CN 102278941A
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- China
- Prior art keywords
- module
- proving installation
- probe
- optical path
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 56
- 239000000523 sample Substances 0.000 claims abstract description 90
- 239000004065 semiconductor Substances 0.000 claims abstract description 51
- 230000003287 optical effect Effects 0.000 claims description 66
- 238000000034 method Methods 0.000 claims description 23
- 238000012545 processing Methods 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims 36
- 238000000605 extraction Methods 0.000 claims 8
- 238000007789 sealing Methods 0.000 claims 4
- 230000000007 visual effect Effects 0.000 claims 2
- 230000004913 activation Effects 0.000 claims 1
- 238000007689 inspection Methods 0.000 abstract description 48
- 238000003384 imaging method Methods 0.000 abstract description 37
- 238000013507 mapping Methods 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000003370 grooming effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Microscoopes, Condenser (AREA)
Abstract
Description
Claims (33)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/796,940 US8279451B2 (en) | 2010-06-09 | 2010-06-09 | Probing apparatus with on-probe device-mapping function |
US12/796,940 | 2010-06-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102278941A true CN102278941A (zh) | 2011-12-14 |
CN102278941B CN102278941B (zh) | 2014-09-10 |
Family
ID=45077003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010253365.7A Active CN102278941B (zh) | 2010-06-09 | 2010-08-12 | 测试装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8279451B2 (zh) |
KR (1) | KR101185205B1 (zh) |
CN (1) | CN102278941B (zh) |
TW (2) | TWI430380B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104237239A (zh) * | 2013-06-09 | 2014-12-24 | 致茂电子(苏州)有限公司 | 半导体元件的瑕疵检测方法 |
CN104655998A (zh) * | 2013-11-20 | 2015-05-27 | 西安谊邦电子科技有限公司 | 半导体分立器件特性曲线跟踪仪器 |
CN106716594A (zh) * | 2014-09-23 | 2017-05-24 | 安捷伦科技有限公司 | 带电粒子光学器件与真空室变形的隔离 |
CN108051374A (zh) * | 2012-11-06 | 2018-05-18 | 爱色丽瑞士有限公司 | 用于捕捉测量物体的视觉印象的手持式测量装置及方法 |
CN112585485A (zh) * | 2018-09-07 | 2021-03-30 | 佛姆费克托有限责任公司 | 用于使测试基板、探针和检查单元相对彼此定位的方法以及用于实施该方法的试验机 |
CN112895179A (zh) * | 2021-03-24 | 2021-06-04 | 深圳市东宁数控设备有限公司 | 一种cnc近视片加工设备 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100118297A1 (en) * | 2007-11-21 | 2010-05-13 | Star Technologies Inc. | Microscope having multiple image-outputting devices and probing apparatus for integrated circuit devices using the same |
WO2014020768A1 (ja) * | 2012-08-03 | 2014-02-06 | パイオニア株式会社 | 光量測定装置及び光量測定方法 |
JP2018207008A (ja) * | 2017-06-07 | 2018-12-27 | 住友電気工業株式会社 | 面発光半導体レーザを作製する方法 |
TWI678614B (zh) * | 2018-06-14 | 2019-12-01 | 宏碁股份有限公司 | 測試系統 |
CN110659193B (zh) * | 2018-06-28 | 2022-12-13 | 宏碁股份有限公司 | 测试系统 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1093831A (zh) * | 1994-02-28 | 1994-10-19 | 吉林大学 | 高速电路电光采样分析仪 |
US20090236506A1 (en) * | 2007-11-20 | 2009-09-24 | Luminus Devices, Inc. | Light-emitting device on-wafer test systems and methods |
US20100045970A1 (en) * | 2008-08-12 | 2010-02-25 | Raschke Markus B | Infrared imaging using thermal radiation from a scanning probe tip |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4721247B2 (ja) | 2001-03-16 | 2011-07-13 | 東京エレクトロン株式会社 | プローブ方法及びプローブ装置 |
JP2007103787A (ja) | 2005-10-06 | 2007-04-19 | Fujifilm Corp | 固体撮像素子の検査装置 |
US7538564B2 (en) | 2005-10-18 | 2009-05-26 | Gsi Group Corporation | Methods and apparatus for utilizing an optical reference |
TW201011298A (en) | 2008-09-04 | 2010-03-16 | Star Techn Inc | Low tempeature probe apparatus |
-
2010
- 2010-06-09 US US12/796,940 patent/US8279451B2/en active Active
- 2010-07-22 TW TW099124105A patent/TWI430380B/zh active
- 2010-07-22 TW TW099213958U patent/TWM400657U/zh not_active IP Right Cessation
- 2010-08-12 CN CN201010253365.7A patent/CN102278941B/zh active Active
- 2010-08-23 KR KR1020100081471A patent/KR101185205B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1093831A (zh) * | 1994-02-28 | 1994-10-19 | 吉林大学 | 高速电路电光采样分析仪 |
US20090236506A1 (en) * | 2007-11-20 | 2009-09-24 | Luminus Devices, Inc. | Light-emitting device on-wafer test systems and methods |
US20100045970A1 (en) * | 2008-08-12 | 2010-02-25 | Raschke Markus B | Infrared imaging using thermal radiation from a scanning probe tip |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108051374A (zh) * | 2012-11-06 | 2018-05-18 | 爱色丽瑞士有限公司 | 用于捕捉测量物体的视觉印象的手持式测量装置及方法 |
CN108051374B (zh) * | 2012-11-06 | 2020-12-08 | 爱色丽瑞士有限公司 | 用于捕捉测量物体的视觉印象的手持式测量装置及方法 |
CN104237239A (zh) * | 2013-06-09 | 2014-12-24 | 致茂电子(苏州)有限公司 | 半导体元件的瑕疵检测方法 |
CN104237239B (zh) * | 2013-06-09 | 2017-02-08 | 致茂电子(苏州)有限公司 | 半导体元件的瑕疵检测方法 |
CN104655998A (zh) * | 2013-11-20 | 2015-05-27 | 西安谊邦电子科技有限公司 | 半导体分立器件特性曲线跟踪仪器 |
CN106716594A (zh) * | 2014-09-23 | 2017-05-24 | 安捷伦科技有限公司 | 带电粒子光学器件与真空室变形的隔离 |
CN106716594B (zh) * | 2014-09-23 | 2019-10-15 | 安捷伦科技有限公司 | 带电粒子光学器件与真空室变形的隔离 |
CN112585485A (zh) * | 2018-09-07 | 2021-03-30 | 佛姆费克托有限责任公司 | 用于使测试基板、探针和检查单元相对彼此定位的方法以及用于实施该方法的试验机 |
CN112585485B (zh) * | 2018-09-07 | 2024-09-06 | 佛姆费克托有限责任公司 | 用于使测试基板、探针和检查单元相对彼此定位的方法以及用于实施该方法的试验机 |
CN112895179A (zh) * | 2021-03-24 | 2021-06-04 | 深圳市东宁数控设备有限公司 | 一种cnc近视片加工设备 |
Also Published As
Publication number | Publication date |
---|---|
TWM400657U (en) | 2011-03-21 |
KR101185205B1 (ko) | 2012-09-21 |
CN102278941B (zh) | 2014-09-10 |
KR20110134809A (ko) | 2011-12-15 |
US8279451B2 (en) | 2012-10-02 |
US20110304857A1 (en) | 2011-12-15 |
TW201145420A (en) | 2011-12-16 |
TWI430380B (zh) | 2014-03-11 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20181212 Address after: Room 1106, 11F Comet Valley Space-time Building, No. 4 Luyu East Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province Patentee after: Starr Technology (Wuhan) Co., Ltd. Address before: Hsinchu City, Taiwan, China Patentee before: Sida Science and Technology Co., Ltd. |
|
EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20111214 Assignee: Decott Testing Technology (Suzhou) Co., Ltd Assignor: Starr Technology (Wuhan) Co.,Ltd. Contract record no.: X2020980003101 Denomination of invention: Combined part-testing device Granted publication date: 20140910 License type: Exclusive License Record date: 20200616 |