CN102263009A - Visual wafer centering unit - Google Patents
Visual wafer centering unit Download PDFInfo
- Publication number
- CN102263009A CN102263009A CN2011100221392A CN201110022139A CN102263009A CN 102263009 A CN102263009 A CN 102263009A CN 2011100221392 A CN2011100221392 A CN 2011100221392A CN 201110022139 A CN201110022139 A CN 201110022139A CN 102263009 A CN102263009 A CN 102263009A
- Authority
- CN
- China
- Prior art keywords
- wafer
- centering unit
- centering
- unit
- vision
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to the field of semiconductor equipment, in particular to a visual wafer centering unit. The visual wafer centering unit is a unit that a wafer is required to pass through before entering and after leaving a fabrication processing unit and is used for ensuring subsequent safety. The visual wafer centering unit is mainly used for gluing equipment, developing equipment, washing equipment, etching equipment and the like requiring the high speed rotation of the wafer in a semiconductor manufacturing procedure. The unit is provided with a substrate, an upper partition board, a lower partition board, a frame and a peripheral metal plate, wherein a wafer position correction platform is arranged on the substrate; a wafer loading platform is arranged on the wafer position correction platform; the frame is fixed on the substrate; the upper partition board, the lower partition board and a smart camera are arranged bottom up; the peripheral metal plate is arranged on the periphery of the frame; the upper partition board is provided with a wafer position correction controller; the lower partition board is provided with an infrared diffuse reflection light source; and the top layer of the frame is provided with the smart camera. The visual wafer centering unit comprises all the functions of conventional mechanical centering, is applied to a centering procedure before the semiconductor manufacturing procedure, and solves the problems of low centering accuracy, high failure rate, high fragmentation rate and the like in the prior art.
Description
Technical field
The present invention relates to field of semiconductor devices, be specially a kind of wafer vision centering unit, it be must process before and after the wafer turnover PROCESS FOR TREATMENT unit the follow-up safe unit of guaranteeing.The present invention is used for the equipment that gluing, development, cleaning, etching of manufacture of semiconductor etc. needs the wafer high speed rotating more.
Background technology
At present, the mechanical type centering unit formed by cylinder, centering guide pillar, wafer carriage etc., the centering unit of semiconductor equipment.Along with the fast development of manufacture of semiconductor technology, the accuracy of alignment that wafer is entered the PROCESS FOR TREATMENT unit requires more and more higher, and mechanical type centering can not be satisfied the manufacturing process requirement.And the wafer of some processing procedure is more and more thinner, and bent set-back is increasing, and mechanical type centering can apply active force to wafer, very easily causes the wafer fragmentation.In addition, the photoresist that applies on the wafer easily is stained with stickingly with the centering guide pillar, causes the centering inefficacy, hits sheet fragment accident when wafer returns film magazine.
Summary of the invention
In order to address the above problem, the invention provides a kind of wafer vision centering unit, solve problems such as the accuracy of alignment that exists in the prior art is low, easy fragment.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of wafer vision centering unit, this unit is provided with substrate, two dividing plates, framework, peripheral panel beating up and down, substrate is provided with the wafer position dressing plate, the wafer position dressing plate is provided with the wafer load platform, and frame fixation is on substrate, and lower clapboard, upper spacer, smart camera are provided with from bottom to top, peripheral panel beating is arranged at the periphery of framework, upper spacer is provided with the wafer position correcting controller, and lower clapboard is provided with the infrared diffuse light source, and the framework top layer is provided with smart camera.
Described wafer vision centering unit, the wafer position correcting controller is connected with the wafer position dressing plate with smart camera, is used to receive the smart camera signal, according to the motion of the signal controlling wafer position dressing plate that receives.
Described wafer vision centering unit, the wafer position dressing plate is made up of X-axis linear actuator and Y-axis linear actuator, realizes translation in X-direction and Y direction.
Described wafer vision centering unit, the wafer load platform is fixed on the wafer position dressing plate, moves with the wafer dressing plate.
Described wafer vision centering unit, the wafer load platform is provided with vacuum passage, uses the vacuum suction wafer.
Described wafer vision centering unit, the wafer load platform is provided with photoelectric sensor, and the loading that is used to detect wafer is whether.
Described wafer vision centering unit, wafer load platform upper surface is higher than the infrared diffuse light source upper surface on the lower clapboard, makes things convenient for manipulator to fetch and deliver wafer, when avoiding wafer to move simultaneously and the light source mantle friction.
Advantage of the present invention and beneficial effect are:
1, the present invention utilizes optical principle to realize the centering of wafer, improves accuracy of alignment greatly, guarantees that the wafer handled through centering all is positioned at the center of sucker to follow-up each technique unit, flies out when avoiding the wafer high speed rotating, accident such as fragment.
2, the present invention does not have active force with mechanical type centering was different in the past to wafer, can avoid wafer at centering process fragment.
3, apparatus of the present invention have not only comprised all functions of former mechanical type centering, but also are applicable to the preceding road of manufacture of semiconductor centering operation.
Description of drawings
Fig. 1 is a general structure stereogram of the present invention.
Fig. 2 is a general structure front view of the present invention.
Fig. 3 is a wafer position dressing plate vertical view.
Fig. 4 is a wafer load platform vertical view.
Each number designation among the figure is represented respectively:
101, substrate; 102, lower clapboard; 103, peripheral panel beating; 104, upper spacer; 105, framework; 106, wafer position correcting controller; 107, infrared diffuse light source; 201, wafer position dressing plate; 202, wafer load platform; 203, wafer turnover window; 204, smart camera; 301, X-axis linear actuator; 302, Y-axis linear actuator; 401, vacuum passage; 402, photoelectric sensor.
Embodiment
The present invention is further described below in conjunction with drawings and Examples.
As shown in Figure 1, 2, vision centering of the present invention unit mainly comprises: substrate 101, lower clapboard 102, peripheral panel beating 103, upper spacer 104, framework 105, wafer position correcting controller 106, infrared diffuse light source 107, wafer position dressing plate 201, wafer load platform 202, smart camera 204 etc., and concrete structure is as follows:
As shown in Figure 3, wafer position dressing plate 201 is made up of X-axis linear actuator 301 and Y-axis linear actuator 302, X-axis linear actuator 301 and the 302 vertical settings of Y-axis linear actuator, wafer position dressing plate 201 can be realized the translation of wafer in X-axis and Y direction.
As shown in Figure 4, wafer load platform 202 is provided with vacuum passage 401, photoelectric sensor 402, described vacuum passage 401 is used to adsorb fixedly wafer, the loading that described photoelectric sensor 402 is used to detect wafer whether, photoelectric sensor 402 upper surfaces are lower than wafer load platform 202 upper surfaces.
The course of work of the present invention is as follows:
The virtual reference position of vision centering unit determining unit is as the standard value of wafer position dressing plate 201 motion controls; Wafer is positioned on the wafer load platform 202, place, vision centering unit equipment is issued smart camera 204 signals, smart camera 204 is taken wafer, and the wafer picture issued wafer position correcting controller 106, wafer position correcting controller 106 extracts crystal round fringes and home position data, and compares with standard value, and difference is as control signal, be used to control the amount of exercise of wafer position dressing plate 201, whole centering process is finished.
Claims (7)
1. wafer vision centering unit, it is characterized in that: this unit is provided with substrate, two dividing plates, framework, peripheral panel beating up and down, substrate is provided with the wafer position dressing plate, the wafer position dressing plate is provided with the wafer load platform, and frame fixation is on substrate, and lower clapboard, upper spacer, smart camera are provided with from bottom to top, peripheral panel beating is arranged at the periphery of framework, upper spacer is provided with the wafer position correcting controller, and lower clapboard is provided with the infrared diffuse light source, and the framework top layer is provided with smart camera.
2. according to the described wafer vision of claim 1 centering unit, it is characterized in that: the wafer position correcting controller is connected with the wafer position dressing plate with smart camera, be used to receive the smart camera signal, according to the motion of the signal controlling wafer position dressing plate that receives.
3. according to the described wafer vision of claim 1 centering unit, it is characterized in that: the wafer position dressing plate is made up of X-axis linear actuator and Y-axis linear actuator, realizes translation in X-direction and Y direction.
4. according to the described wafer vision of claim 1 centering unit, it is characterized in that: the wafer load platform is fixed on the wafer position dressing plate, moves with the wafer dressing plate.
5. according to the described wafer vision of claim 1 centering unit, it is characterized in that: the wafer load platform is provided with vacuum passage, uses the vacuum suction wafer.
6. according to the described wafer vision of claim 1 centering unit, it is characterized in that: the wafer load platform is provided with photoelectric sensor, and the loading that is used to detect wafer whether.
7. according to the described wafer vision of claim 1 centering unit, it is characterized in that: wafer load platform upper surface is higher than the infrared diffuse light source upper surface on the lower clapboard, makes things convenient for manipulator to fetch and deliver wafer, when avoiding wafer to move simultaneously and the light source mantle friction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100221392A CN102263009A (en) | 2011-01-19 | 2011-01-19 | Visual wafer centering unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100221392A CN102263009A (en) | 2011-01-19 | 2011-01-19 | Visual wafer centering unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102263009A true CN102263009A (en) | 2011-11-30 |
Family
ID=45009603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100221392A Pending CN102263009A (en) | 2011-01-19 | 2011-01-19 | Visual wafer centering unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102263009A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103117241A (en) * | 2013-01-31 | 2013-05-22 | 中国科学院上海技术物理研究所 | Coating method in physical etching technology |
| CN104142128B (en) * | 2014-06-25 | 2016-09-14 | 上海功源自动化技术有限公司 | A kind of measuring method of silicon wafer warpage degree |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007047721A2 (en) * | 2005-10-18 | 2007-04-26 | Gsi Group Corporation | Methods and apparatus for utilizing an optical reference |
| CN1975997A (en) * | 2005-12-02 | 2007-06-06 | 日东电工株式会社 | Method for determining position of semiconductor wafer, and apparatus using the same |
| CN101339896A (en) * | 2007-07-02 | 2009-01-07 | 日东电工株式会社 | Method for joining adhesive tape to semiconductor wafer and method for separating protective tape |
| CN101436563A (en) * | 2007-11-16 | 2009-05-20 | 沈阳芯源微电子设备有限公司 | Self-centering mechanism for semiconductor chip |
| CN101494187A (en) * | 2008-01-25 | 2009-07-29 | 沈阳芯源微电子设备有限公司 | Centering system |
-
2011
- 2011-01-19 CN CN2011100221392A patent/CN102263009A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007047721A2 (en) * | 2005-10-18 | 2007-04-26 | Gsi Group Corporation | Methods and apparatus for utilizing an optical reference |
| CN1975997A (en) * | 2005-12-02 | 2007-06-06 | 日东电工株式会社 | Method for determining position of semiconductor wafer, and apparatus using the same |
| CN101339896A (en) * | 2007-07-02 | 2009-01-07 | 日东电工株式会社 | Method for joining adhesive tape to semiconductor wafer and method for separating protective tape |
| CN101436563A (en) * | 2007-11-16 | 2009-05-20 | 沈阳芯源微电子设备有限公司 | Self-centering mechanism for semiconductor chip |
| CN101494187A (en) * | 2008-01-25 | 2009-07-29 | 沈阳芯源微电子设备有限公司 | Centering system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103117241A (en) * | 2013-01-31 | 2013-05-22 | 中国科学院上海技术物理研究所 | Coating method in physical etching technology |
| CN104142128B (en) * | 2014-06-25 | 2016-09-14 | 上海功源自动化技术有限公司 | A kind of measuring method of silicon wafer warpage degree |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102285975B1 (en) | Aligner structure, and method for aligning substrate and mask | |
| TWI646613B (en) | Robot with integrated aligner | |
| CN106647005B (en) | Color film substrate and manufacturing method thereof, display device and manufacturing method thereof | |
| CN103336381B (en) | A kind of method of stereoscopic film laminating contraposition | |
| WO2013159418A1 (en) | Substrate unpacking device | |
| CN109555766B (en) | Full-lamination manufacturing method of display module | |
| CN210906769U (en) | Novel liquid crystal display panel dispensing device | |
| JP2010027793A (en) | Alignment apparatus | |
| CN102263009A (en) | Visual wafer centering unit | |
| KR101337551B1 (en) | Bonding apparatus | |
| JP5793457B2 (en) | Transfer method and transfer apparatus | |
| WO2017219802A1 (en) | Touch control display device and manufacturing method therefor | |
| KR101394312B1 (en) | Wafer alignment apparatus | |
| CN103167792A (en) | Aligning method and aligning system of unmarked different-space substrate assembly | |
| CN205374982U (en) | Light beam adjusting device | |
| KR101855625B1 (en) | A Method for Laminating a Touch Screen Panel Having a Small Size in a Rolling Way | |
| TWI496233B (en) | Substrate positioning device | |
| CN206470537U (en) | Multi-functional exposure stage | |
| KR101363083B1 (en) | Apparatus for aligning plate | |
| KR101742595B1 (en) | A Laminating Apparatus for A Touch Screen Panel in a Small Size | |
| CN105538874A (en) | Capacitive touch screen glue addition adhesion method | |
| CN103616804B (en) | A kind ofly piece the dynamic mask plate system of legal system for single-chip integration capacitance touch screen together | |
| CN107461387A (en) | One kind point glue laminating equipment and dispensing applying method | |
| TWM421880U (en) | Position alignment mechanism for touch panel laminator | |
| CN103579059A (en) | Substrate slice loading system special for substrate machine table and slice loading method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111130 |