CN102256446A - Pressing film method of flexible printed circuit - Google Patents
Pressing film method of flexible printed circuit Download PDFInfo
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- CN102256446A CN102256446A CN2011102138898A CN201110213889A CN102256446A CN 102256446 A CN102256446 A CN 102256446A CN 2011102138898 A CN2011102138898 A CN 2011102138898A CN 201110213889 A CN201110213889 A CN 201110213889A CN 102256446 A CN102256446 A CN 102256446A
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- film
- press mold
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- pressing film
- thin layer
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Abstract
The invention provides a pressing film method of a flexible printed circuit. The method comprises the following steps: smearing a thin layer of water with a wet cloth on a material to be pressed with a film, sending the material into a pressing film device, and pressing a photosensitive film on the material by an upper roller and a lower roller. Since a surface of the material has a thin layer of water before pressing film, the thin layer of water just fills uneven points of the material surface, there is no air bubbles between the material and the film, thus after pressing the film, a line made of the material will not be disconnected. Technical effect of the invention is that: a bubble problem in a pressing film process caused by an uneven surface of a material is eliminated, and a line disconnection problem of a produced line caused by the above problem is eliminated too, thus a rate of good product is greatly raised.
Description
Technical field
The present invention relates to the making of flexible circuit board, relate in particular to a kind of press mold method of flexible circuit board.
Background technology
Flexible circuit board (claiming soft board again) is widely used in the connecting portion of electronic product, such as flex cable, liquid crystal module etc., in the making initial procedure of flexible circuit board, need on material, to overlay one deck light-sensitive surface, this process is called press mold, press mold at first is to overlay one deck light-sensitive surface on the surface of material, this layer light-sensitive surface initially is semi liquid state, can form a kind of solid matter under strong illumination, is close to form picture on the material.The prior art scheme of flexible circuit board press mold is 95 ° ± ℃ of temperature, speed is about 1.5 meters/minute, pressure is about under the condition of 50psi with roller bearing up and down light-sensitive surface is overlayed on material, again the exposure of taking away of the material behind the press mold, there are the following problems for this press mold method: because of material surface more or less has uneven point, then also has via for bilayer or multi-layer sheet, and also there is raised points at the via edge, will there be bubble at uneven place during press mold like this, these bubble points are exactly break point after material is made circuit, cause product function bad.
Summary of the invention
Purpose of the present invention just provides a kind of press mold method of flexible circuit board, and this press mold method is treating can not produce bubble between press mold material and the light-sensitive surface, and the rate of finished products of product improves greatly.
The object of the present invention is achieved like this, its method step is: at first treating that using wet cloth to get wet on the press mold material smears the very thin water layer of one deck, send into press mold in the film pressing device then, 95 ± 5 ℃ of press mold temperature, 1.5 meters/minute of press mold speed, pressure is about 20Psi, and roller bearing overlays light-sensitive surface on material up and down.Owing at material surface the very thin water layer of one deck is arranged before the press mold, this layer water layer just in time filled up the not flat spot of material surface, between material and film, just no longer have bubble behind the press mold, behind the press mold static 15 minutes, light-sensitive surface will blot water, film will be tightly attached on the material then, and the material behind the press mold just can not break after making circuit more like this, thereby yield of products just improves greatly.
Technique effect of the present invention is: eliminated the air bubble problem that causes because of material surface is uneven in the press mold process, reached the broken string problem of material after making circuit that causes therefrom, improved the percentage of A-class goods of product greatly.
Description of drawings
Fig. 1 is a work schematic diagram of the present invention.
Embodiment
As shown in Figure 1, method step of the present invention is: at first treating that using wet cloth to get wet on the press mold material 3 smears the very thin water layer of one deck 4, send into press mold in the film pressing device then, 95 ± 5 ℃ of press mold temperature, 1.5 meters/minute of press mold speed, pressure is about 20Psi, and roller bearing 2 overlays light-sensitive surface 1 on material up and down.Owing at material surface the very thin water layer of one deck is arranged before the press mold, this layer water layer just in time filled up the not flat spot of material surface, between material and film, just no longer have bubble behind the press mold, behind the press mold static 15 minutes, light-sensitive surface will blot water, film will be tightly attached on the material then, and the material behind the press mold just can not break after making circuit more like this, thereby yield of products just improves greatly.
Claims (1)
1. the press mold method of a flexible circuit board, its method step is: at first treating that using wet cloth to get wet on the press mold material smears the very thin water layer of one deck, send into press mold in the film pressing device then, 95 ± 5 ℃ of press mold temperature, 1.5 meters/minute of press mold speed, pressure is about 20Psi, and roller bearing overlays light-sensitive surface on material up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102138898A CN102256446A (en) | 2011-07-29 | 2011-07-29 | Pressing film method of flexible printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102138898A CN102256446A (en) | 2011-07-29 | 2011-07-29 | Pressing film method of flexible printed circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102256446A true CN102256446A (en) | 2011-11-23 |
Family
ID=44983344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102138898A Pending CN102256446A (en) | 2011-07-29 | 2011-07-29 | Pressing film method of flexible printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102256446A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104168715A (en) * | 2014-07-30 | 2014-11-26 | 东莞市五株电子科技有限公司 | Soft board photosensitive film attaching method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4069076A (en) * | 1976-11-29 | 1978-01-17 | E. I. Du Pont De Nemours And Company | Liquid lamination process |
| CN1043799A (en) * | 1988-12-23 | 1990-07-11 | 纳幕尔杜邦公司 | Do not have bubble with the pressurized with fluid manufactured, the printed circuit board (PCB) of film/liquid solder mask coating is arranged |
| CN201563301U (en) * | 2009-12-10 | 2010-08-25 | 昆山市线路板厂 | Dry film laminating device for flexible circuit boards |
-
2011
- 2011-07-29 CN CN2011102138898A patent/CN102256446A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4069076A (en) * | 1976-11-29 | 1978-01-17 | E. I. Du Pont De Nemours And Company | Liquid lamination process |
| CN1043799A (en) * | 1988-12-23 | 1990-07-11 | 纳幕尔杜邦公司 | Do not have bubble with the pressurized with fluid manufactured, the printed circuit board (PCB) of film/liquid solder mask coating is arranged |
| CN201563301U (en) * | 2009-12-10 | 2010-08-25 | 昆山市线路板厂 | Dry film laminating device for flexible circuit boards |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104168715A (en) * | 2014-07-30 | 2014-11-26 | 东莞市五株电子科技有限公司 | Soft board photosensitive film attaching method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20111123 |