CN102254841A - Air duct device - Google Patents
Air duct device Download PDFInfo
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- CN102254841A CN102254841A CN2010101889984A CN201010188998A CN102254841A CN 102254841 A CN102254841 A CN 102254841A CN 2010101889984 A CN2010101889984 A CN 2010101889984A CN 201010188998 A CN201010188998 A CN 201010188998A CN 102254841 A CN102254841 A CN 102254841A
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- 239000011148 porous material Substances 0.000 claims description 162
- 238000007789 sealing Methods 0.000 claims description 13
- 239000000919 ceramic Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000007789 gas Substances 0.000 description 71
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 54
- 230000001681 protective effect Effects 0.000 description 46
- 229910052757 nitrogen Inorganic materials 0.000 description 27
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 24
- 239000002184 metal Substances 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 19
- 238000005245 sintering Methods 0.000 description 17
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 14
- 239000001257 hydrogen Substances 0.000 description 14
- 229910052739 hydrogen Inorganic materials 0.000 description 14
- 239000000203 mixture Substances 0.000 description 13
- 229910052786 argon Inorganic materials 0.000 description 12
- 238000000465 moulding Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000004927 fusion Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000033001 locomotion Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 206010044565 Tremor Diseases 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000005570 vertical transmission Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Turbine Rotor Nozzle Sealing (AREA)
- Wire Bonding (AREA)
Abstract
The invention provides an air duct device, which has structures along a first axial direction, a second axial direction and a third axial direction, wherein the first axial direction, the second axial direction and the third axial direction are orthogonal mutually. The air duct device comprises a body and a tail pipe, wherein two ends of the body along the second axial direction are a head end and a tail end and two ends of the body along the third axial direction are two side walls; a perforative first through hole is formed near the head end of the body along the first axial direction; the body also comprises a first air hole and a bypass air hole; the first air hole is formed along the second axial direction and penetrates the tail end of the body and the first through hole; one end of the bypass air hole is connected with the first air hole and the opposite other end of the bypass air hole is connected with the first through hole; the tail pipe is jointed to the tail end of the body; and a perforative second through hole is formed along the second axial direction and is connected with the first air hole.
Description
Technical field
The relevant a kind of airway device of the present invention particularly relevantly a kind ofly is applied to semi-conductive routing and engages on (Wirebonder) board airway device for the protective gas circulation.
Background technology
In semiconductor package process, the conduction of signal can be passed through routing (wire bond) operation on the chip, with the signal on the chip utilize bonding wire conduct to carrier (for example: lead frame (leadframe), substrate (substrate) ... etc.) on, again by outside terminal (for example: the pin of WU ball or lead frame ... etc.) be connected on the printed circuit board (PCB) (PCB).And the formation of bonding wire mainly is to utilize transmission metal wire in the capillary; for example: copper cash; silver line or gold thread ... etc.; its end fusion is formed a soldered ball (FAB/Free Air Ball); in this simultaneously; the supply protective gas that utilizes an air delivery device to continue; be shaped with the protection soldered ball; aforesaid protective gas is preferable can be nitrogen; argon or nitrogen and hydrogen mixture; nitrogen wherein; argon gas can coat the protection soldered ball and avoid oxidation; and already oxidised part on the more reducible soldered ball of the hydrogen in the nitrogen and hydrogen mixture; help to protect the moulding of soldered ball, last, the soldered ball that will be connected with bonding wire again is engaged on the weld pad of chip or carrier.Therefore can control routing procedure effectively, to guarantee the semiconductor packages high yield.In routing procedure; US6234376 and US4575602 propose with airway device protective gas to be blowed to copper cash in the fusion or gold thread to promote spherical sintering in the prior art; yet; case all can flow by the single direction supply because of protective gas before above-mentioned; make that shield gas flow rate shakiness or generation in the airway device are turbulent; thereby it is unusual to cause soldered ball to burn ball; the unusual condition that soldered ball burns ball comprise soldered ball break, eccentric, weigh wounded, unfilled corner, crystallization be unusual ... etc.; all can cause the quality abnormal that carries out behind the routing procedure, chip can't be used.
In addition; other have prior art for allow soldered ball make after the moulding, before the routing; can not make the soldered ball oxidation because of leaving protective gas; and then it is unusual that soldered ball is produced; therefore, can be in addition blow to the soldered ball of moulding with an appendix that is connected with nitrogen or protective gas such as argon gas or nitrogen and hydrogen mixture, yet; being provided with because of needs of breather pipe controlled with machine in addition, causes the increase on the cost and operates more not convenient.
Summary of the invention
In order to solve the desirable not to the utmost part of above-mentioned prior art, the purpose of this invention is to provide a kind of airway device, can avoid soldered ball to produce unusual and guarantee chip quality, the lifting operation ease can reduce cost simultaneously.
The invention provides a kind of airway device, have along first axially, second axially with the 3rd axial configuration, wherein, first axially, second axially be quadrature each other axially with the 3rd.Airway device includes body and tail pipe.Body is head end and tail end along the second axial two ends, be the two side along the 3rd axial two ends.Axially be formed with first through hole that runs through along first near the head end of body.Body further includes first pore and bypass pore, and first pore is along second axial arrangement, and connects the tail end and first through hole of body, and bypass pore one end is communicated to first pore, and the other end is communicated to first through hole.Tail pipe is engaged to the tail end of this body, axially is formed with second through hole that runs through along second, and second through hole is communicated to first pore.
Therefore; above-mentioned airway device of the present invention; protective gas guiding by first pore and bypass pore (second pore, the 3rd pore and the 4th pore); can destroy the disorderly air-flow of the interior protective gas of first through hole in the airway device; and then coat at the outside comparatively stable protective gas of one deck that forms of soldered ball when making the soldered ball molten sintering, and the spheroid uniformity of the soldered ball molten sintering moulding that makes is better.
The present invention further provides another kind of airway device, have along first axially, second axially with the 3rd axial configuration, first axially, second axially be quadrature each other axially with the 3rd.Airway device comprises body, tail pipe and airtight coating member.Body is made with porous ceramics, has outer surface, is head end and tail end along the second axial two ends.Along first axial first through hole that runs through that forms, axially be formed with first pore, the tail end and first through hole of first pore perforation body near the head end of body along second.Tail pipe is engaged to the tail end of body and along second axial second through hole that runs through that forms, second through hole is communicated to first pore.Airtight coating member is coated on the outer surface beyond first through hole on the body.
Therefore; above-mentioned another kind of airway device of the present invention; by body change material structure is that porous ceramics is made; again by the evenly guiding of protective gas in the body; can destroy the disorderly air-flow in first through hole in the airway device; and then coat at the outside comparatively stable protective gas of one deck that forms of soldered ball when making the soldered ball molten sintering, and the spheroid uniformity of the soldered ball molten sintering moulding that makes is better.
The present invention further provides another airway device, have along first axially, second axially with the 3rd axial configuration, first axially, second be quadrature each other axially with the 3rd axial three.Airway device comprises body, tail pipe and outer tube.Being head end and tail end along the second axial two ends in the body, is the two side along the 3rd axial two ends.Axially form first through hole that runs through along first near the head end of body.Body further comprises first pore and bypass pore, and first pore is along the tail end and first through hole of second axial arrangement and perforation body, and bypass pore one end is communicated to this first pore, and the other end is communicated with first through hole.Tail pipe is engaged to the tail end of body, and along second axial second through hole that runs through that forms, second through hole is communicated to first pore.Outer tube has bottom tube and two side pipes that are connected the bottom tube two ends, becomes a U-shaped pipe by this, body is in harmony is placed in the formed zone of U-shaped pipe.The head end of body is near bottom tube.Outer tube further comprises bypass runner and a plurality of steam vent, and the bypass runner is disposed at the inside of bottom tube and two side pipes, and a plurality of steam vent one ends are circulated to the bypass runner, and the other end is communicated to the outside of outer tube.
Therefore; above-mentioned another airway device of the present invention; protective gas guiding by first pore and bypass pore (second pore, the 3rd pore and the 4th pore); can destroy the disorderly air-flow of the interior protective gas of first through hole in the airway device; and then coat at the outside comparatively stable protective gas of one deck that forms of soldered ball when making the soldered ball molten sintering, and the spheroid uniformity of the soldered ball molten sintering moulding that makes is better.
Another airway device that the present invention is above-mentioned by the configuration of outer tube, replaces the appendix of original nitrogen or protective gas such as argon gas or nitrogen and hydrogen mixture, in order to reduce cost and to promote the convenience of operation.
The present invention further provides another airway device, have along first axially, second axially with the 3rd axial configuration, wherein, first axially, second axially be quadrature each other axially with the 3rd.Airway device comprises body, tail pipe and outer tube.Body is made with porous ceramics, has an outer surface, and body is head end and tail end along the second axial two ends, axially be formed with first through hole that runs through along first near the head end of body, body axially is formed with one first pore, the tail end and first through hole of first pore perforation body along second.Tail pipe is engaged to the tail end of body, axially is formed with second through hole that runs through along second, and second through hole is communicated to first pore.Airtight coating member is coated on the outer surface beyond first through hole on the body.Outer tube has a bottom tube and two side pipes that are connected in the bottom tube two ends, form a U-shaped pipe by this, body just is placed in the formed zone of U-shaped pipe, and the head end of body is near bottom tube, outer tube further includes bypass runner and a plurality of steam vent, the bypass runner is disposed at the inside of bottom tube and two side pipes, and a plurality of steam vent one ends are communicated to the bypass runner, and the other end is communicated to the outside of outer tube.
Another airway device that the present invention is above-mentioned; by body change material structure is that porous ceramics is made; again by the evenly guiding of protective gas in the body; can destroy the disorderly air-flow of the interior protective gas of first through hole in the airway device; and then coat at the outside comparatively stable protective gas of one deck that forms of soldered ball when making the soldered ball molten sintering, and the spheroid uniformity of the soldered ball molten sintering moulding that makes is better.
Above-mentioned another airway device of the present invention by the configuration of outer tube, replaces the appendix of original nitrogen or protective gas such as argon gas or nitrogen and hydrogen mixture, in order to reduce cost and to promote the convenience of operation.
The present invention further provides another kind of airway device, have along first axially, second axially with the 3rd axial configuration, wherein, first axially, second axially be quadrature each other axially with the 3rd.Airway device comprises body, tail pipe and outer tube.Body is head end and tail end along the second axial two ends, be the two side along the 3rd axial two ends, axially be formed with first through hole that runs through along first near the head end of body, body axially is formed with one first pore, the tail end and first through hole of first pore perforation body along second.Tail pipe is engaged to the tail end of body, axially is formed with second through hole that runs through along second, and second through hole is communicated to first pore.Outer tube has a bottom tube and two side pipes that are connected in the bottom tube two ends, form a U-shaped pipe by this, body just is placed in the zone of U-shaped pipe institute shape, and the head end of body is near bottom tube, outer tube further includes bypass runner and a plurality of steam vent, the bypass runner is disposed at the inside of bottom tube and two side pipes, and a plurality of steam vent one ends are communicated to the bypass runner, and the other end is communicated to the outside of outer tube.
The another kind of airway device that the present invention is above-mentioned by the configuration of outer tube, replaces in original prior art the nitrogen that needs installing in addition or the appendix of protective gas such as argon gas or nitrogen and hydrogen mixture, in order to reduce cost and to promote the convenience of operation.
Description of drawings
Figure 1A is the schematic perspective view according to the airway device of first preferred embodiment provided by the invention.
Figure 1B is the vertical view according to the airway device of first preferred embodiment provided by the invention.
Fig. 2 A is the schematic perspective view according to the airway device of second preferred embodiment provided by the invention.
Fig. 2 B is the vertical view according to the airway device of second preferred embodiment provided by the invention.
Fig. 3 is the schematic perspective view according to the airway device of the 3rd preferred embodiment provided by the invention.
Fig. 4 is the schematic perspective view according to the airway device of the 4th preferred embodiment provided by the invention.
Fig. 5 is the schematic perspective view according to the airway device of the 5th preferred embodiment provided by the invention.
Embodiment
Because the present invention discloses a kind of airway device, the wire bonding machine table that is used for semiconductor element, wherein the making principle and the basic function of routing technology know usually that for correlative technology field has the knowledgeable can understand, so, no longer do complete description with explanation hereinafter.Simultaneously, with the accompanying drawing that is hereinafter contrasted, be to express the structural representation relevant with feature of the present invention, also do not need according to the complete drafting of actual size, close chat earlier bright.
At first please refer to Figure 1A, first preferred embodiment that the present invention proposes is shown, is a kind of airway device 1, have along the configuration of the first axial A1, the second axial A2 and the 3rd axial A3, wherein, the first axial A1, the second axial A2 and the 3rd axial A3 are quadrature each other.Airway device 1 consists predominantly of body 11 and tail pipe 12.
Please refer to Figure 1B, body 11 further includes first pore 116 and bypass pore.First pore 116 is along the second axial A2 configuration, and connects the tail end 113 and first through hole 115 of body.The bypass pore comprises a pair of second pore 117 along the second axial A2 configuration, a pair of the 3rd pore 118 and a pair of the 4th pore 119 along the 3rd axial A3 configuration along the 3rd axial A3 configuration, wherein the two ends of second pore 117 are sealing, and the 3rd pore 118 also is all sealing near sidewall 114 places of body and sidewall 114 places of the 4th pore 119 close bodies.Simultaneously, the 3rd pore 118 is communicated with second pore 117 and first pore 116; The 4th pore 119 is communicated with second pore 117 and first through hole, 115, the first through holes 115 dispose between two second pores 117.By this; one end of bypass pore is communicated to first pore 116; the relative other end is communicated to first through hole 115; therefore the protective gas in first pore 116 is except can directly importing first through hole 115; again by the bypass pore, be directed to first through hole 115 simultaneously by the 3rd pore 118, second pore 117 and the 4th pore 119.What give special heed to is that the aperture of second pore 117, the 3rd pore 118 and the 4th pore 119 is all less than first through hole 115 and first pore 116.
In addition, tail pipe 12 in the airway device 1, be engaged to the tail end 113 of body 11, tail pipe 12 is formed with second through hole 121 that runs through along the second axial A2, and second through hole 121 is communicated to first pore 116, and the purpose that is provided with of this tail pipe 12 is in order to be connected with the air supply system (not icon) and the electric discharge device (not icon) of outside.By this, the protective gas that tail pipe 12 second through holes 121 are introduced can produce gas shield by the guiding of first pore 116 with bypass pore (second pore 117, the 3rd pore 118 and the 4th pore 119) in first through hole 115.Above-mentioned structure has its significant physical meaning, and according to Bernoulli's theorem, pressure was lower when gas flow rate was very fast, and pressure was higher when gas flow rate was slow, and simultaneously, the speed of related movement between two objects can cause two fluids between the object to produce flow phenomenons.When the metal wire of adorning in the capillary in first through hole, 115 molten sinterings of turnover body 11 when becoming soldered ball; because metal wire itself has concrete volume; when metal wire enters first through hole 115; gas volume in first through hole 115 reduces immediately; when metal wire withdraws from first through hole 115; gas volumes in first through hole 115 increase again again and revert to original state; when therefore metal wire passes in and out first through hole 115 fast; the protective gas that the metal wire and first through hole are 115 produces and flows; again because metal wire enters and withdraws from the direction of motion difference of first through hole 115; cause protective gas pressure difference; therefore the speed of fluid is also different and fast suddenly slow suddenly; cause the disorderly air-flow in first through hole 115 at last, form defective products easily to such an extent as to make metal wire when molten sintering becomes soldered ball, cause the spheroid form inequality of soldered ball because of the instability that the influence protective gas of the disorderly air-flow of protective gas coats.Protective gas guiding by first pore 116 with bypass pore (second pore 117, the 3rd pore 118 and the 4th pore 119) proposed by the invention; can destroy the disorderly air-flow in above-mentioned first through hole 115; and when the soldered ball molten sintering, coat at the outside comparatively stable protective gas of one deck that forms of soldered ball, and the spheroid uniformity of the soldered ball molten sintering moulding that makes is better.
Above-mentioned body head end 112 is in second pore, 117 places; can further be formed with the shoulder 14 of a pair of depression; these shoulder 14 purposes to depression are to allow other appendix (not icon) be relied on placement; make appendix exactly protective gas such as nitrogen, argon gas or nitrogen and hydrogen mixture to be blown on the soldered ball that completes, in order to the protection soldered ball, avoid the quick oxidation of soldered ball that completes.
In addition; if second pore 117; the 3rd pore 118 and the 4th pore 119 are to adopt machining be made (for example boring); outside protective gas flows out the body 11 of airway device 1; and reach aforementioned carrying: the two ends of second pore 117 are sealing; sidewall 114 places of the 3rd pore 118 close bodies and the 4th pore 119 also are all the effect of sealing near sidewall 114 places of bodies; can further use gas seal member 13, be arranged at second pore 117 near body head end 112 places; the 3rd pore 118 is near body sidewall 114 places; and the 4th pore 119 close body sidewall 114 places.This gas seal member 13 can be air-locked adhesive tape, plastics, rubber or resin etc.If but body 11 be adopt molded and will " two ends of second pore 117 be sealing; the 3rd pore 118 also is all sealing near sidewall 114 places of sidewall 114 places of bodies and the 4th pore 119 close bodies " just feature when moulding, complete, just do not need additional gas confidential paper at this moment.
Please refer to Fig. 2 A, second preferred embodiment that the present invention proposes is shown, is another kind of airway device 2, have along the configuration of the first axial A1, the second axial A2 and the 3rd axial A3, wherein, the first axial A1, the second axial A2 and the 3rd axial A3 are quadrature each other.Airway device 2 consists predominantly of body 21, tail pipe 22 and airtight coating member 23, and the material of body 21 is a porous ceramics.
Please refer to Fig. 2 B, body 21 includes outer surface 211, head end 212 and tail end 213.Be formed with first through hole 215 that runs through along the first axial A1 near the head end 212, it is in order to allow capillary (not icon) pass through first through hole 215 that first through hole 215 is provided with purpose, be provided with the metal wire of vertical transmission in the capillary, and this metal wire drops to when height discharge and will touch electric discharge device (not icon) and be heated fusion in body 21, can fire in metal wire ends and form a soldered ball.
Please continue the 2B with reference to figure, it is along the second axial A2 configuration that body 21 further includes first pore, 216, the first pores 216, and connects the tail end 213 and first through hole 215 of body 21.In addition, tail pipe 22 is engaged to the tail end 213 of body 21, be formed with second through hole 221 that runs through along the second axial A2, and second through hole 221 is communicated to first pore 216.Importantly; because the material of body 21 is a porous ceramics; protective gas in first pore 216 does not flow out outside the body 21 on Be Controlled ground; airtight coating member 23 is coated on this external surface 211 beyond first through hole 215, makes the protective gas in the pore 216 of winning can only flow to first through hole 215.Simultaneously; again because the material of body 21 is a porous ceramics; the protective gas of tail pipe 22 second through hole 221 first pores 216 of introducing; can be by the loose structure of porous ceramics, infiltrate in first through hole 215 and produce the gas shield of protective gas from the wall of periphery from all directions of first through hole 215.
Above-mentioned structure has its significant physical meaning; carry in first preferred embodiment as described above; when the metal wire of adorning in the capillary when the first through hole molten sintering of quick turnover body becomes soldered ball; because metal wire enters and withdraws from the direction of motion difference of first through hole 215; cause protective gas pressure difference; therefore the speed of fluid is also different and fast suddenly slow suddenly; cause the disorderly air-flow in first through hole 215 at last; make metal wire when molten sintering becomes soldered ball because the influence of the disorderly air-flow of protective gas, to such an extent as to the coating instability of protective gas; cause the spheroid form inequality of soldered ball and form defective products easily.Body 21 by porous ceramics proposed by the invention; protective gas infiltrates in first through hole 215 and produces gas shield from the wall of periphery from all directions of first through hole 215; can destroy the disorderly air-flow in above-mentioned first through hole 215; and when the soldered ball molten sintering, coat at the outside comparatively stable protective gas of one deck that forms of soldered ball, and the spheroid uniformity of the soldered ball molten sintering moulding that makes is better.
Please refer to Fig. 3, the 3rd preferred embodiment that the present invention proposes is shown, be another kind of airway device 3, have along the configuration of the first axial A1, the second axial A2 and the 3rd axial A3, wherein, the first axial A1, the second axial A2 and the 3rd axial A3 are quadrature each other.Airway device 3 consists predominantly of body 11, tail pipe 12 and outer tube 34.Wherein the principal character of body 11 and tail pipe 12 and effect essence are same as body 11 and the tail pipe 12 in first preferred embodiment as described above, please refer to Figure 1A and Figure 1B, do not add at this and give unnecessary details.
In the present embodiment; airway device 3 further comprises an outer tube 34; this outer tube 34 and a supply of nitrogen; the appendix of protective gas such as argon gas or nitrogen and hydrogen mixture (not icon) joins; wherein; this outer tube 34 has bottom tube 341 and the side pipe 342 that is connected in bottom tube 341 two ends; form a U-shaped pipe by this; making body 11 just be placed in the U-shaped pipe centers in the U-shaped territory that forms and is subjected to outer tube 34 and be coated on body 11 peripheries; and the head end 312 of body 11 is towards bottom tube 341; the purpose that is provided with of this U type zone outer tube 34 is for guiding protective gas (nitrogen for example; argon gas or nitrogen and hydrogen mixture) blow to the soldered ball of making moulding; with the protection soldered ball; when making it be unlikely because of the capillary vertical up-or-down movement; extraneous air is directed in first through hole 115; thereby cause protective gas to be full of extraneous air and to produce soldered ball unusual; can replace air delivery devices such as nitrogen tube that needs originally control with machine in addition or tunger tube by this, can be in order to reduce cost and to promote the convenience of operation.
Please continue with reference to figure 3, because in this preferred embodiment, had outer tube 34, do not need to be provided with in addition as appendixs such as nitrogen tube of the prior art, tunger tube or nitrogen and hydrogen mixture, so the body 11 in this preferred embodiment just not necessarily needs to set up in addition the depression shoulder 14 (please refer to Figure 1B) described in first embodiment again.
What specify is that outer tube 34 further includes bypass runner and a plurality of steam vent 345.The bypass runner is disposed at the inside of bottom tube 341 and side pipe 342, and the bypass runner further includes the 5th pore 343 and a pair of the 6th pore 344 along the second axial A2 configuration along the 3rd axial A3 configuration, wherein the 5th pore 343 two ends are sealing, and the 6th pore 344 1 ends are sealing, and the 6th pore 344 all is communicated to the 5th pore 343.Therefore, an end of a plurality of steam vents 345 is communicated to the bypass runner, and the other end then is communicated to the outside of outer tube 34.Again, the setting of outer tube 34 is not limited to the disclosed scope of the present invention, can oppositely be provided with the demand on the actual job.
Further; please continue with reference to figure 3; outer tube 34 is connected with an air inlet 346; one end is in order to connect nitrogen, argon gas or nitrogen and hydrogen mixture; the other end is connected with the 6th pore 344; also have a runner in the air inlet 346, this runner can be connected with the bypass runner in the side pipe 342, makes nitrogen, argon gas or nitrogen and hydrogen mixture be able to discharge protective gas such as nitrogen, argon gas or nitrogen and hydrogen mixture along bypass runner stream from a plurality of steam vents 345 after air inlet 346 enters.Wherein, the position of air inlet 346 is not limited to the disclosed scope of the present invention, and air inlet 346 can face upward or downward, also can be identical with tail pipe 12 directions, can be provided with the demand on the actual job.
In addition,, outside protective gas flows out outer tube 34, can further use gas seal member 33, be arranged at the 5th pore 343 near outer tube 34 places if the 5th pore 343 is to adopt the machining person of being made (for example boring).This gas seal member 33 can be air-locked adhesive tape, plastics, rubber or resin etc.If but outer tube 34 be adopt molded, just do not need additional gas confidential paper this moment.
Please refer to Fig. 4, the 4th preferred embodiment that the present invention proposes is shown, be another kind of airway device 4, have along the configuration of the first axial A1, the second axial A2 and the 3rd axial A3, wherein, the first axial A1, the second axial A2 and the 3rd axial A3 are quadrature each other.Airway device 4 consists predominantly of body 21, tail pipe 22, airtight coating member 23 and outer tube 34.
Wherein the material of body 21 is a porous ceramics; protective gas in first pore 216 does not flow out outside the body 21 on Be Controlled ground; airtight coating member 23 is coated on this external surface 211 beyond first through hole 215; the principal character of its body 21 and tail pipe 22 and effect essence are same as body 21 and the tail pipe 22 in second preferred embodiment as described above; please refer to Fig. 2 A and Fig. 2 B, do not add at this and give unnecessary details.As for the principal character of outer tube 34 and effect then essence manage 34 outside being same as in the 3rd preferred embodiment as described above, also do not add at this and give unnecessary details.
Please refer to Fig. 5, the 5th preferred embodiment that the present invention proposes is shown, be another kind of airway device 5, have along the configuration of the first axial A1, the second axial A2 and the 3rd axial A3, wherein, the first axial A1, the second axial A2 and the 3rd axial A3 are quadrature each other.Airway device 5 consists predominantly of body 51, tail pipe 52 and outer tube 54.Body 51 is head end 512 along the two ends of the second axial A2 with tail end 513, along the two ends of the 3rd axial A3 is two side 514, and the head end of body 512 is neighbouring to be formed with first through hole 515 that runs through along the first axial A1.It is in order to allow capillary (not icon) pass through first through hole 515 that first through hole 515 is provided with purpose, and capillary contains metal wire, and this metal wire touches electric discharge device (not icon) and when being heated fusion, can fire the formation soldered ball.In addition, the tail pipe 52 in the airway device 5 is engaged to the tail end 513 of body, be formed with second through hole 521 that runs through along the second axial A2, and second through hole 521 is communicated to first pore 516.Among this embodiment, the principal character of outer tube 34 and effect then essence are same as outer tube 34 in the 3rd preferred embodiment as described above, do not add at this and give unnecessary details.
The above is preferred embodiment of the present invention only, is not in order to limit the right of applying for a patent of the present invention; Simultaneously above description should be understood and be implemented for the special personage who knows the present technique field, so other does not break away from the equivalence of being finished under the disclosed spirit and change or modification, all should be included in the claim.
Claims (10)
1. airway device, have along first axially, second axially with the 3rd axial configuration, wherein, this first axially, second be quadrature each other axially axially with the 3rd, this airway device includes:
One body, be head end and tail end along the second axial two ends, be the two side along the 3rd axial two ends, axially be formed with first through hole that runs through along first near the head end of this body, this body further includes first pore and bypass pore, this first pore is along second axial arrangement, and connect tail end and this first through hole of this body, this bypass pore one end is communicated to this first pore, and the other end is communicated to this first through hole; And
One tail pipe is engaged to the tail end of this body, axially is formed with second through hole that runs through along second, and this second through hole is communicated to this first pore.
2. airway device according to claim 1, it is characterized in that, this bypass pore comprises a pair of second pore, a pair of the 3rd pore and a pair of the 4th pore, wherein the two ends of these second pores are sealing, the side-walls that these grade in an imperial examination three pores and the 4th pore are close to this body is sealing, each the 3rd pore is communicated with each second pore and this first pore simultaneously, each the 4th pore is communicated with each second pore and this first through hole simultaneously, these second pores are along second axial arrangement, these the 3rd pores and these the 4th pores are along the 3rd axial arrangement, this first through hole is between these second pores, and this body head end further is formed with the shoulder of a pair of depression in these second pore places.
3. airway device according to claim 2, it is characterized in that, further comprise a plurality of gas seal members, be arranged at these second pores near this body head end place, close this body side-walls of these the 3rd pores and close this body side-walls of these the 4th pores, and the aperture of these second pores, the 3rd pore and the 4th pore is all less than this first through hole and first pore.
4. airway device, have along first axially, second axially with the 3rd axial configuration, wherein, this first axially, second be quadrature each other axially axially with the 3rd, this airway device includes:
One body, be made with porous ceramics, this body has an outer surface, and this body is head end and tail end along the second axial two ends, axially be formed with first through hole that runs through along first near the head end of this body, this body axially is formed with one first pore along second, and this first pore connects tail end and this first through hole of this body;
One tail pipe is engaged to the tail end of this body, axially is formed with second through hole that runs through along second, and this second through hole is communicated to this first pore; And
Airtight coating member is coated on the outer surface of this body beyond this first through hole.
5. airway device, have along first axially, second axially with the 3rd axial configuration, wherein, this first axially, second be quadrature each other axially axially with the 3rd, this airway device includes:
One body, be head end and tail end along the second axial two ends, be the two side along the 3rd axial two ends, axially be formed with first through hole that runs through along first near the head end of this body, this body further includes first pore and bypass pore, this first pore is along second axial arrangement, and connect tail end and this first through hole of this body, this bypass pore one end is communicated to this first pore, and the other end is communicated to this first through hole;
One tail pipe is engaged to the tail end of this body, axially is formed with second through hole that runs through along second, and this second through hole is communicated to this first pore; And
One outer tube, have a bottom tube and two side pipes that are connected in the bottom tube two ends, form a U-shaped pipe by this, this body just is placed in this formed zone of U-shaped pipe, and the head end of this body is near this bottom tube, and this outer tube further includes bypass runner and a plurality of steam vent, and this bypass runner is disposed at the inside of this bottom tube and these side pipes, these steam vent one ends are communicated to this bypass runner, and the other end is communicated to the outside of outer tube.
6. airway device according to claim 5, it is characterized in that, wherein this bypass runner further includes the 5th pore and a pair of the 6th pore, the 5th pore is in bottom tube along the 3rd axial arrangement, and two ends are sealing, each the 6th pore be along second axial arrangement in each side pipe, and these the 6th pores all are communicated to the 5th pore.
7. airway device, have along first axially, second axially with the 3rd axial configuration, wherein, this first axially, second be quadrature each other axially axially with the 3rd, this airway device includes:
One body, be made with porous ceramics, this body has an outer surface, and this body is head end and tail end along the second axial two ends, axially be formed with first through hole that runs through along first near the head end of this body, this body axially is formed with one first pore along second, and this first pore connects tail end and this first through hole of this body;
One tail pipe is engaged to the tail end of this body, axially is formed with second through hole that runs through along second, and this second through hole is communicated to this first pore;
Airtight coating member is coated on the outer surface of this body beyond this first through hole; And
One outer tube, have a bottom tube and two side pipes that are connected in the bottom tube two ends, form a U-shaped pipe by this, this body just is placed in this formed zone of U-shaped pipe, and the head end of this body is near this bottom tube, and this outer tube further includes bypass runner and a plurality of steam vent, and this bypass runner is disposed at the inside of this bottom tube and these side pipes, these steam vent one ends are communicated to this bypass runner, and the other end is communicated to the outside of outer tube.
8. airway device according to claim 7, it is characterized in that, wherein this bypass runner further includes the 5th pore and a pair of the 6th pore, the 5th pore is in bottom tube along the 3rd axial arrangement, and two ends are sealing, each the 6th pore be along second axial arrangement in each side pipe, and these the 6th pores all are communicated to the 5th pore.
9. airway device, have along first axially, second axially with the 3rd axial configuration, wherein, this first axially, second be quadrature each other axially axially with the 3rd, this airway device includes:
One body, be head end and tail end along the second axial two ends, be the two side along the 3rd axial two ends, axially be formed with first through hole that runs through along first near the head end of this body, this body axially is formed with one first pore along second, and this first pore connects tail end and this first through hole of this body;
One tail pipe is engaged to the tail end of this body, axially is formed with second through hole that runs through along second, and this second through hole is communicated to this first pore; And
One outer tube, have a bottom tube and two side pipes that are connected in the bottom tube two ends, form a U-shaped pipe by this, this body just is placed in this formed zone of U-shaped pipe, and the head end of this body is near this bottom tube, and this outer tube further includes bypass runner and a plurality of steam vent, and this bypass runner is disposed at the inside of this bottom tube and these side pipes, these steam vent one ends are communicated to this bypass runner, and the other end is communicated to the outside of outer tube.
10. airway device according to claim 9, it is characterized in that, wherein this bypass runner further includes the 5th pore and a pair of the 6th pore, the 5th pore is in bottom tube along the 3rd axial arrangement, and two ends are sealing, each the 6th pore be along second axial arrangement in each side pipe, and these the 6th pores all are communicated to the 5th pore.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010101889984A CN102254841B (en) | 2010-05-17 | 2010-05-17 | Air duct device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2010101889984A CN102254841B (en) | 2010-05-17 | 2010-05-17 | Air duct device |
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CN102254841A true CN102254841A (en) | 2011-11-23 |
CN102254841B CN102254841B (en) | 2013-04-03 |
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CN2010101889984A Expired - Fee Related CN102254841B (en) | 2010-05-17 | 2010-05-17 | Air duct device |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6230344A (en) * | 1985-07-30 | 1987-02-09 | Nec Kansai Ltd | Metal ball forming method |
US6234376B1 (en) * | 1999-07-13 | 2001-05-22 | Kulicke & Soffa Investments, Inc. | Supplying a cover gas for wire ball bonding |
CN101064263A (en) * | 2006-04-26 | 2007-10-31 | 库利克和索夫工业公司 | Reduced oxidation system for wire bonding |
-
2010
- 2010-05-17 CN CN2010101889984A patent/CN102254841B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6230344A (en) * | 1985-07-30 | 1987-02-09 | Nec Kansai Ltd | Metal ball forming method |
US6234376B1 (en) * | 1999-07-13 | 2001-05-22 | Kulicke & Soffa Investments, Inc. | Supplying a cover gas for wire ball bonding |
CN101064263A (en) * | 2006-04-26 | 2007-10-31 | 库利克和索夫工业公司 | Reduced oxidation system for wire bonding |
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