CN102254210A - Mobile communication subscriber identity module with stacked chip packaging of capacitance resistance element - Google Patents
Mobile communication subscriber identity module with stacked chip packaging of capacitance resistance element Download PDFInfo
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- CN102254210A CN102254210A CN2010101794594A CN201010179459A CN102254210A CN 102254210 A CN102254210 A CN 102254210A CN 2010101794594 A CN2010101794594 A CN 2010101794594A CN 201010179459 A CN201010179459 A CN 201010179459A CN 102254210 A CN102254210 A CN 102254210A
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Abstract
The invention discloses a mobile communication subscriber identity module with stacked chip packaging of a capacitance resistance element. The subscriber identity module comprises a carrier tape, wherein the carrier tape has a plurality of installation areas, namely a resonator chip installation area which is positioned at the left top of a back surface of the carrier tape, a main controller chip installation area which is positioned at the right top of the back surface of the carrier tape, a resistor and capacitor installation area which is positioned at the left bottom of the back surface of the carrier tape, a flash memory chip installation area which is positioned at the right bottom of the back surface of the carrier tape, a secure digital card interface area which is positioned on the upper part of a front surface of the carrier tape and a smart card interface area which is positioned on the lower part of the front surface of the carrier tape. The invention has the advantages that: a packaging surface of the subscriber identity module can be subjected to 1-kg point pressure experiments; the service life of the subscriber identity module is long, and the reliability is high; the practical performance and functions of the subscriber identity module are improved; the space of chip tiling is saved; the subscriber identity module cannot be thickened; and the subscriber identity module is small in size, light in weight and large in storage space.
Description
Technical field
The present invention relates to a kind of User Recognition card module, be specifically related to a kind of mobile communication User Recognition card module of the laminated chips encapsulation with Resistor-Capacitor Unit.
Background technology
SIM card is (Subscriber Identity Module, client's identification card, abbreviation SIM) abbreviation, be also referred to as smart card, subscriber identification card, GSM (Global System for MobileCommunications, global system for mobile communications, abbreviation GSM) digital mobile telephone must be loaded onto this card and can use, it has stored digital mobile phone client's content such as information, encrypted secret key on a computer chip, can differentiate for GSM network client identity, and the voice messaging the when client conversed is encrypted.The use of SIM card has prevented the behavior that parallel operation and conversation are eavesdropped fully, and the making of SIM card finishes in strict accordance with the GSM international standards, thereby has ensured client's proper communication reliably.
At present, less about SIM card or smart card module Packaging Technique type document with relevant patented technology, and the memory capacity of SIM card or smart card is limited, user demand and stability can't be satisfied the demand, and can not take into account the volume size of SIM card or smart card when improving SIM card or smart card.
In view of the above problems, the invention discloses a kind of mobile communication User Recognition card module of the laminated chips encapsulation with Resistor-Capacitor Unit.It has technical characterictic as mentioned below, to solve existing problem.
Summary of the invention
The mobile communication User Recognition card module that the purpose of this invention is to provide a kind of laminated chips encapsulation with Resistor-Capacitor Unit, it can be mounted on a plurality of control chips, storage chip, a plurality of Resistor-Capacitor Unit the surface of carrier band, and seal one-shot forming by UV glue, directly become SIM card after die-cut.
The purpose of the mobile communication User Recognition card module of the laminated chips of band Resistor-Capacitor Unit of the present invention encapsulation is achieved through the following technical solutions: a kind of mobile communication User Recognition card module of the laminated chips encapsulation with Resistor-Capacitor Unit, comprise carrier band, described carrier band is provided with a plurality of installation regions, and a plurality of installation regions are respectively: resonator chip installation region, master controller chip installation area territory, resistance, electric capacity installation region, flash chip installation region, safe digital card interface area and intelligent card interface zone.
Described resonator chip installation region is positioned at the upper left side at the back side of carrier band; Described master controller chip installation area territory is positioned at the upper right side at the back side of carrier band; Described resistance, electric capacity installation region are positioned at the lower left at the back side of carrier band; Described flash chip installation region is positioned at the lower right at the back side of carrier band; Described safe digital card interface area is positioned at the top in the front of carrier band; Described intelligent card interface zone is positioned at the bottom in the front of printed circuit board (PCB).
The mobile communication User Recognition card module of the laminated chips encapsulation of above-mentioned band Resistor-Capacitor Unit, wherein, described resonator chip is equipped with the resonator integrated circuit (IC) chip on the installation region, and this resonator integrated circuit (IC) chip is as clock generator; Described master controller chip installation area is equipped with the master controller integrated circuit (IC) chip on the territory, and this master controller integrated circuit (IC) chip is used to control the mobile communication User Recognition card module of the laminated chips encapsulation of described band Resistor-Capacitor Unit; A plurality of resistance and a plurality of capacity cell are installed on described resistance, the electric capacity installation region, and these a plurality of resistance and a plurality of capacity cell are mainly used in power supply decoupling or filtering; Described flash chip is equipped with a plurality of flash chips on the installation region, these a plurality of flash chips are in flash chip installation region superimposed layer encapsulation, are used to enlarge the memory capacity of mobile communication User Recognition card module of the laminated chips encapsulation of described band Resistor-Capacitor Unit; Described this safe digital card interface area is provided with the digital card of multimedia memory-safe, make the mobile communication User Recognition card module of the laminated chips encapsulation of this band Resistor-Capacitor Unit connect the back, or use as the safe digital card module as the use of User Recognition card module; Described this intelligent card interface zone is provided with one group of intelligent card interface.
The mobile communication User Recognition card module of the laminated chips encapsulation of above-mentioned band Resistor-Capacitor Unit, wherein, described this smart card has eight electric connection points, is used for the smart card external interface.
The mobile communication User Recognition card module of the laminated chips encapsulation of above-mentioned band Resistor-Capacitor Unit, wherein, described resonator integrated circuit (IC) chip, master controller integrated circuit (IC) chip, a plurality of resistance and a plurality of capacity cell, a plurality of flash chip, the digital card of multimedia memory-safe and one group of intelligent card interface connect into the loop by carrier band; And this carrier band is the hole wire structures of multilayer, described resonator integrated circuit (IC) chip, master controller integrated circuit (IC) chip, a plurality of resistance and a plurality of capacity cell, a plurality of flash chip are installed in a face of carrier band, a plurality of flash chips are the levels stack and install, the digital card of described multimedia memory-safe and one group of intelligent card interface are arranged on the another side of carrier band, by the hole wiring connection on the carrier band.
The mobile communication User Recognition card module of the laminated chips encapsulation of above-mentioned band Resistor-Capacitor Unit, wherein, the length range of the mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit is the 10-12 millimeter, and width range is the 20-25 millimeter, and thickness range is the 0.6-0.7 millimeter.
The stacking encapsulation method of the mobile communication User Recognition card module that a kind of laminated chips that is applied to above-mentioned band Resistor-Capacitor Unit encapsulates, wherein, this method comprises the steps: at least
Step 1, the carrier band by multilayer wiring is communicated with resonator integrated circuit (IC) chip, master controller integrated circuit (IC) chip, a plurality of flash chip, the digital card of multimedia memory-safe and one group of intelligent card interface.
Step 2 is with big circular slice attenuate, the cutting of integrated circuit.
Step 3 is mounted on a plurality of resistance and the capacity cell mode by welding or coated with conductive glue on the carrier band, and heating simultaneously pressurization is fixed each resistance and capacity cell and be connected on the carrier band.
Step 4 is bonded to resonator integrated circuit (IC) chip, master controller integrated circuit (IC) chip and a plurality of flash chip on the carrier band, and is communicated with the electrode points of carrier band with the electrode points of gold wire bonding with integrated circuit (IC) chip.
Step 5, a ultra-violet curing glue carries out single face to be sealed, and carries out ultraviolet lighting curing.
Step 6, the electrode points on each chip is separated in die-cut disconnected golden hole, tests the mobile communication User Recognition card module of the laminated chips encapsulation of all described band Resistor-Capacitor Units after sealing with the test procedure 100% that has woven.
The stacking encapsulation method of the mobile communication User Recognition card module of the laminated chips encapsulation of above-mentioned band Resistor-Capacitor Unit wherein, also comprises in the described step 2:
Step 2.1 is 70um-90um with the reduced thickness of disk.
Step 2.2 attaches the diallyl fumarate film on the disk of attenuate.
Step 2.3 will attach the disk excision forming of diallyl fumarate film.
The stacking encapsulation method of the mobile communication User Recognition card module of the laminated chips encapsulation of above-mentioned band Resistor-Capacitor Unit wherein, also comprises in the described step 4:
Step 4.1 is bonded in the integrated circuit (IC) chip of bottom on the carrier band that mounted resistance, capacity cell.
Step 4.2 is with electric connection point on the integrated circuit (IC) chip of bottom and the electric connection point gold wire bonding on the carrier band.
Step 4.3 is bonded to the integrated circuit (IC) chip on upper strata on the bottom chip.
Step 4.4 is with the electric connection point of the integrated circuit (IC) chip on upper strata and the electric connection point gold wire bonding of carrier band (01).
The stacking encapsulation method of the mobile communication User Recognition card module of the laminated chips encapsulation of above-mentioned band Resistor-Capacitor Unit wherein, also comprises in the described step 5:
Step 5.1, the scope of on carrier band, deciding sealing by a cushion rubber.
Step 5.2 is inserted ultra-violet curing glue in the sealing scope of delineation, and solidifies by the ultraviolet radiation ultraviolet glue.
The mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit of the present invention makes it compared with prior art owing to adopted such scheme, has following advantage and good effect:
1, the mobile communication User Recognition card module of the laminated chips of band Resistor-Capacitor Unit of the present invention encapsulation is according to the point pressure method of testing of ISO10373, encapsulating face can be tested by the point pressure of 1kg, and is not fragile, long service life, the reliability height has improved the Practical Performance and the function of module greatly.
2, the mobile communication User Recognition card module of the laminated chips of band Resistor-Capacitor Unit of the present invention encapsulation adopts the stacked package mode, has not only saved the space of chip tiling, also can not thicken the thickness of module simultaneously, and volume is little, and is in light weight.
3, the mobile communication User Recognition card module of the laminated chips of band Resistor-Capacitor Unit of the present invention encapsulation improves the storage space of module owing to be provided with the polylith flash chip greatly.
Below, will be described further by specific embodiment, yet embodiment only is giving an example of alternative embodiment of the present invention that its disclosed feature only is used for explanation and sets forth technical scheme of the present invention, and is not intended to limit the scope of the invention.
Description of drawings
For a better understanding of the present invention, the accompanying drawing for your guidance that can quote with reference to this instructions, in the accompanying drawing:
Fig. 1 is the front view of mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit of the present invention.
Fig. 2 is the rear view of mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit of the present invention.
Fig. 3 is the process flow diagram of stacking encapsulation method of mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit of the present invention.
Fig. 4 is the process flow diagram step by step of step 2 of stacking encapsulation method of mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit of the present invention.
Fig. 5 is the process flow diagram step by step of step 4 of stacking encapsulation method of mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit of the present invention.
Fig. 6 is the process flow diagram step by step of step 5 of stacking encapsulation method of mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit of the present invention.
Embodiment
According to claim of the present invention and the disclosed content of summary of the invention, technical scheme of the present invention is specific as follows described.
See also shown in the accompanying drawing 1, and in conjunction with the accompanying drawings shown in 2, the mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit of the present invention comprises carrier band 01, this carrier band 01 is provided with a plurality of installation regions, and a plurality of installation regions are respectively: resonator chip installation region 02, master controller chip installation area territory 03, resistance, electric capacity installation region 04, flash chip installation region 05, safe digital card interface area 06 and intelligent card interface area 07.
Resonator chip installation region 02 is positioned at the upper left side at the back side of carrier band 01, and resonator integrated circuit (IC) chip (not shown) is installed on the resonator chip installation region 02, and this resonator integrated circuit (IC) chip is as clock generator; Master controller chip installation area territory 03 is positioned at the upper right side at the back side of carrier band 01, master controller integrated circuit (IC) chip (not shown) is installed on the master controller chip installation area territory 03, and this master controller integrated circuit (IC) chip is used to control the mobile communication User Recognition card module of the laminated chips encapsulation of being with Resistor-Capacitor Unit; Resistance, electric capacity installation region 04 are positioned at the lower left at the back side of carrier band 01, and a plurality of resistance and a plurality of capacity cell (not shown) are installed on resistance, the electric capacity installation region 04, and these a plurality of resistance and a plurality of capacity cell are mainly used in power supply decoupling or filtering; Flash chip installation region 05 is positioned at the lower right at the back side of carrier band 01, a plurality of flash chip (not shown)s are installed on the flash chip installation region 05, these a plurality of flash chips encapsulate at flash chip installation region 05 superimposed layer, be used to enlarge the memory capacity of the mobile communication User Recognition card module of the laminated chips encapsulation of being with Resistor-Capacitor Unit, memory capacity can extend to 2G from 512K.Above-mentioned each chip level and vertical direction mount the offset angle less than 1.5 °.
Safe digital card (Secure Digital Memory Card, abbreviation SD card) interface area 06 is positioned at the top in the front of carrier band 01, this safe digital card interface area 06 is provided with multimedia storer SD card, both can be used as the User Recognition card module after the mobile communication User Recognition card module of the laminated chips encapsulation of this band Resistor-Capacitor Unit is connected and used, and also can be used as the SD card module and use; Intelligent card interface area 07 is positioned at the bottom in the front of carrier band 01, this intelligent card interface area 07 is provided with one group of intelligent card interface, this intelligent card interface is the standard intelligent card interface that meets IS07816, this smart card externally has eight electric connection points, be respectively C1, C2, C3, C4, C5, C6, C7, C8, be used for the smart card external interface.
The resonator integrated circuit (IC) chip, the master controller integrated circuit (IC) chip, a plurality of resistance and a plurality of capacity cell, a plurality of flash chips, multimedia storer SD card and one group of intelligent card interface connect into the loop by carrier band 01, and the hole wire structures that this carrier band 01 is a multilayer, the resonator integrated circuit (IC) chip, the master controller integrated circuit (IC) chip, a plurality of resistance and a plurality of capacity cell, a plurality of flash chips are installed in a face of carrier band 01, a plurality of flash chips are the levels stack and install, the digital card of multimedia memory-safe and one group of intelligent card interface are arranged on the another side of carrier band 01, by the hole wiring connection on the carrier band 01.Carrier band 01 adopts propidium iodide (Propidium Iodide is called for short PI) material, and copper is applied on the two sides, and the thickness of copper is greatly about about 35um, and the gross thickness of carrier band 01 is about 130um-150um, can continue to bear in 10 minutes 250 ℃ high temperature.
The mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit of the present invention and common SIM card homotype, the length range of the mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit is the 10-12 millimeter, width range is the 20-25 millimeter, and thickness range is the 0.6-0.7 millimeter.
See also shown in accompanying drawing 3, accompanying drawing 4, accompanying drawing 5 and the accompanying drawing 6, the stacking encapsulation method step of the mobile communication User Recognition card module of the laminated chips of band Resistor-Capacitor Unit of the present invention encapsulation is as follows:
Step 1, the carrier band 01 by multilayer wiring is communicated with resonator integrated circuit (IC) chip, master controller integrated circuit (IC) chip, a plurality of flash chip, multimedia storer SD card and one group of intelligent card interface.
Step 2 is with the disk attenuate of each adhesive integrated circuit, cut into satisfactory size and thickness.
Step 2.1 is 70um-90um with the reduced thickness of disk.
Step 2.2 attaches diallyl fumarate (DAF) film on the disk of attenuate.The thickness of DAF film is approximately 80um.
Step 2.3 will attach the disk excision forming of DAF film.
Step 3 is installed in a plurality of resistance and capacity cell on the carrier band 01 by Reflow Soldering.Also can a plurality of resistance and capacity cell be mounted on the carrier band 01 by the method for coated with conductive glue, the pressurization of heating is simultaneously fixed each resistance and capacity cell and be connected on the carrier band 01.The shearing force of surface-pasted a plurality of resistance, capacity cell is greater than 150g (metric system 0603 type).
Step 4 is with resonator integrated circuit (IC) chip, master controller integrated circuit (IC) chip, a plurality of flash chip and a plurality of resistance, capacity cell bonding.
Step 4.1 is bonded in the integrated circuit (IC) chip of bottom on the carrier band 01 that mounted resistance, capacity cell.
Step 4.2 is with the electric connection point gold wire bonding on electric connection point on the integrated circuit (IC) chip of bottom and the carrier band 01.The camber of this spun gold is lower than 60um, and the pulling force of spun gold is greater than 4g.
Step 4.3 is bonded to the integrated circuit (IC) chip on upper strata on the bottom chip.
Step 4.4 is with the electric connection point of the integrated circuit (IC) chip on upper strata and the electric connection point gold wire bonding of carrier band 01.The camber of this spun gold is lower than 150um, and the pulling force of spun gold is greater than 4g.
Step 5 for protecting exposed integrated circuit (IC) chip and lead-in wire, is dripped and is gone up ultra-violet curing glue and carry out that single face is sealed and carry out ultraviolet lighting solidifies.
Step 5.1, the scope of on carrier band 01, deciding sealing by a cushion rubber.
Step 5.2 is inserted UV glue, and is made the UV adhesive curing by ultraviolet light in the sealing scope of delineation, the thickness range of the UV glue after the curing is 0.74mm ± 30um.
Step 6, die-cut disconnected golden hole, separate the electrode points on each chip, the electrical quantity of the mobile communication User Recognition card module that the laminated chips of using the test procedure 100% that has woven to test all band Resistor-Capacitor Units after sealing encapsulates, function, electrical property, outward appearance etc.
In sum, the mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit of the present invention is according to the point pressure method of testing of ISO10373, encapsulating face can be by the point pressure experiment of 1kg, not fragile, long service life, the reliability height has improved the Practical Performance and the function of module greatly; The present invention adopts the stacked package mode, has not only saved the space of chip tiling, also can not thicken the thickness of module simultaneously, and volume is little, and is in light weight; The present invention improves the storage space of module owing to be provided with the polylith flash chip greatly.
Foregoing is enumerated for the specific embodiment of the mobile communication User Recognition card module of the laminated chips of band Resistor-Capacitor Unit of the present invention encapsulation, for the wherein not equipment of detailed description and structure, should be understood to take existing common apparatus in this area and universal method to be implemented.
Claims (9)
1. mobile communication User Recognition card module with the encapsulation of the laminated chips of Resistor-Capacitor Unit, it is characterized in that: comprise carrier band (01), described carrier band (01) is provided with a plurality of installation regions, and a plurality of installation regions are respectively: resonator chip installation region (02), master controller chip installation area territory (03), resistance, electric capacity installation region (04), flash chip installation region (05), safe digital card interface area (06) and intelligent card interface zone (07);
Described resonator chip installation region (02) is positioned at the upper left side at the back side of carrier band (01); Described master controller chip installation area territory (03) is positioned at the upper right side at the back side of carrier band (01); Described resistance, electric capacity installation region (04) are positioned at the lower left at the back side of carrier band (01); Described flash chip installation region (05) is positioned at the lower right at the back side of carrier band (01); Described safe digital card interface area (06) is positioned at the top in the front of carrier band (01); Described intelligent card interface zone (07) is positioned at the bottom in the front of printed circuit board (PCB) (01).
2. the mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit according to claim 1, it is characterized in that: on the described resonator chip installation region (02) the resonator integrated circuit (IC) chip is installed, this resonator integrated circuit (IC) chip is as clock generator; On the described master controller chip installation area territory (03) the master controller integrated circuit (IC) chip is installed, this master controller integrated circuit (IC) chip is used to control the mobile communication User Recognition card module of the laminated chips encapsulation of described band Resistor-Capacitor Unit; On described resistance, electric capacity installation region (04) a plurality of resistance and a plurality of capacity cell are installed, these a plurality of resistance and a plurality of capacity cell are mainly used in power supply decoupling or filtering; On the described flash chip installation region (05) a plurality of flash chips are installed, these a plurality of flash chips are in flash chip installation region (05) superimposed layer encapsulation, are used to enlarge the memory capacity of mobile communication User Recognition card module of the laminated chips encapsulation of described band Resistor-Capacitor Unit; Described this safe digital card interface area (06) is provided with the digital card of multimedia memory-safe, make the mobile communication User Recognition card module of the laminated chips encapsulation of this band Resistor-Capacitor Unit connect the back, or use as the safe digital card module as the use of User Recognition card module; Described this intelligent card interface zone (07) is provided with one group of intelligent card interface.
3. the mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit according to claim 2, it is characterized in that: described this smart card has eight electric connection points, is used for the smart card external interface.
4. the mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit according to claim 1 is characterized in that: described resonator integrated circuit (IC) chip, master controller integrated circuit (IC) chip, a plurality of resistance and a plurality of capacity cell, a plurality of flash chip, the digital card of multimedia memory-safe and one group of intelligent card interface connect into the loop by carrier band (01); And this carrier band (01) is the hole wire structures of multilayer, described resonator integrated circuit (IC) chip, master controller integrated circuit (IC) chip, a plurality of resistance and a plurality of capacity cell, a plurality of flash chip are installed in a face of carrier band (01), a plurality of flash chips are the levels stack and install, the digital card of described multimedia memory-safe and one group of intelligent card interface are arranged on the another side of carrier band (01), by the hole wiring connection on the carrier band (01).
5. the mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit according to claim 1, it is characterized in that: the length range of the mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit is the 10-12 millimeter, width range is the 20-25 millimeter, and thickness range is the 0.6-0.7 millimeter.
6. the stacking encapsulation method of the mobile communication User Recognition card module of a laminated chips encapsulation that is applied to the described band Resistor-Capacitor Unit of claim 1, it is characterized in that: this method comprises the steps: at least
Step 1, the carrier band (01) by multilayer wiring is communicated with resonator integrated circuit (IC) chip, master controller integrated circuit (IC) chip, a plurality of flash chip, the digital card of multimedia memory-safe and one group of intelligent card interface;
Step 2 is with big circular slice attenuate, the cutting of integrated circuit;
Step 3 is mounted on a plurality of resistance and the capacity cell mode by welding or coated with conductive glue on the carrier band (01), and heating simultaneously pressurization is fixed each resistance and capacity cell and be connected on the carrier band (01);
Step 4 is bonded to resonator integrated circuit (IC) chip, master controller integrated circuit (IC) chip and a plurality of flash chip on the carrier band (01), and is communicated with the electrode points of carrier band (01) with the electrode points of gold wire bonding with integrated circuit (IC) chip;
Step 5, a ultra-violet curing glue carries out single face to be sealed, and carries out ultraviolet lighting curing;
Step 6, the electrode points on each chip is separated in die-cut disconnected golden hole, tests the mobile communication User Recognition card module of the laminated chips encapsulation of all described band Resistor-Capacitor Units after sealing with the test procedure 100% that has woven.
7. the stacking encapsulation method of the mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit according to claim 6 is characterized in that: also comprise in the described step 2:
Step 2.1 is 70um-90um with the reduced thickness of disk;
Step 2.2 attaches the diallyl fumarate film on the disk of attenuate;
Step 2.3 will attach the disk excision forming of diallyl fumarate film.
8. the stacking encapsulation method of the mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit according to claim 6 is characterized in that: also comprise in the described step 4:
Step 4.1 is bonded in the integrated circuit (IC) chip of bottom on the carrier band (01) that mounted resistance, capacity cell;
Step 4.2 is with the electric connection point gold wire bonding on electric connection point on the integrated circuit (IC) chip of bottom and the carrier band (01);
Step 4.3 is bonded to the integrated circuit (IC) chip on upper strata on the bottom chip;
Step 4.4 is with the electric connection point of the integrated circuit (IC) chip on upper strata and the electric connection point gold wire bonding of carrier band (01).
9. the stacking encapsulation method of the mobile communication User Recognition card module of the laminated chips encapsulation of band Resistor-Capacitor Unit according to claim 6 is characterized in that: also comprise in the described step 5:
Step 5.1 goes up the scope of deciding sealing by the some cushion rubber at carrier band (01);
Step 5.2 is inserted ultra-violet curing glue in the sealing scope of delineation, and solidifies by the ultraviolet radiation ultraviolet glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101794594A CN102254210A (en) | 2010-05-20 | 2010-05-20 | Mobile communication subscriber identity module with stacked chip packaging of capacitance resistance element |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101794594A CN102254210A (en) | 2010-05-20 | 2010-05-20 | Mobile communication subscriber identity module with stacked chip packaging of capacitance resistance element |
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| CN102254210A true CN102254210A (en) | 2011-11-23 |
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| CN2010101794594A Pending CN102254210A (en) | 2010-05-20 | 2010-05-20 | Mobile communication subscriber identity module with stacked chip packaging of capacitance resistance element |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112017972A (en) * | 2020-08-05 | 2020-12-01 | 黄石市星光电子有限公司 | Manufacturing method of novel smart card double-interface inverted packaging module |
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| EP1596326A2 (en) * | 2004-05-11 | 2005-11-16 | Renesas Technology Corp. | IC card module |
| CN101398913A (en) * | 2007-09-29 | 2009-04-01 | 上海奕华信息技术有限公司 | Double-interface and large-capacity storage security smart card |
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Application publication date: 20111123 |