CN102249177A - 微机电传感器及其形成方法 - Google Patents
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- CN102249177A CN102249177A CN2011101299924A CN201110129992A CN102249177A CN 102249177 A CN102249177 A CN 102249177A CN 2011101299924 A CN2011101299924 A CN 2011101299924A CN 201110129992 A CN201110129992 A CN 201110129992A CN 102249177 A CN102249177 A CN 102249177A
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Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102967407A (zh) * | 2012-10-23 | 2013-03-13 | 深圳先进技术研究院 | 一种绝对压力传感器芯片及其制作方法 |
CN103063351A (zh) * | 2012-12-21 | 2013-04-24 | 上海宏力半导体制造有限公司 | 微机电系统压力传感器及其制作方法、微机电系统 |
CN103900740A (zh) * | 2014-03-24 | 2014-07-02 | 上海丽恒光微电子科技有限公司 | 压力传感器及其制造方法 |
CN103940535A (zh) * | 2014-03-24 | 2014-07-23 | 上海丽恒光微电子科技有限公司 | 压力传感器的制造方法 |
JP2014533983A (ja) * | 2011-10-07 | 2014-12-18 | スンシル ユニバーシティー リサーチ コンソルティウム テクノーパークSoongsil University Research Consortium Techno−Park | 眼圧センサー及びその製造方法 |
WO2015051729A1 (zh) * | 2013-10-08 | 2015-04-16 | 无锡华润上华半导体有限公司 | 电容式mems压力传感器 |
CN104655333A (zh) * | 2013-11-21 | 2015-05-27 | 中芯国际集成电路制造(上海)有限公司 | 一种压力传感器及其制备方法 |
CN104897334A (zh) * | 2015-06-29 | 2015-09-09 | 歌尔声学股份有限公司 | 一种mems压力传感元件 |
CN105120417A (zh) * | 2015-09-23 | 2015-12-02 | 苏州敏芯微电子技术有限公司 | 单片集成芯片及其制作方法 |
CN105307080A (zh) * | 2010-06-01 | 2016-02-03 | 船井电机株式会社 | 麦克风单元以及设有该麦克风单元的声音输入装置 |
CN105323686A (zh) * | 2014-06-30 | 2016-02-10 | 上海丽恒光微电子科技有限公司 | 微机电麦克风及其制造方法 |
CN105651450A (zh) * | 2014-11-14 | 2016-06-08 | 中芯国际集成电路制造(上海)有限公司 | 压力传感器及其形成方法 |
CN105874312A (zh) * | 2013-08-05 | 2016-08-17 | 罗伯特·博世有限公司 | 在单芯片上的惯性和压力传感器 |
CN102967407B (zh) * | 2012-10-23 | 2016-11-30 | 深圳先进技术研究院 | 一种绝对压力传感器芯片及其制作方法 |
CN110411614A (zh) * | 2018-04-27 | 2019-11-05 | 苏州明皜传感科技有限公司 | 力量传感器以及其制造方法 |
WO2020057218A1 (zh) * | 2018-09-17 | 2020-03-26 | 胡耿 | 微小极间距电容式力敏传感器及其制造方法 |
CN111348615A (zh) * | 2020-03-16 | 2020-06-30 | 潍坊歌尔微电子有限公司 | 电容式集成传感器及其加工工艺 |
CN112995448A (zh) * | 2019-12-16 | 2021-06-18 | 中芯集成电路(宁波)有限公司 | 成像模组及其制造方法 |
CN115479582A (zh) * | 2022-11-03 | 2022-12-16 | 湖南大学 | 一种用于导航的气压高度计 |
US11623861B2 (en) | 2020-02-10 | 2023-04-11 | Robert Bosch Gmbh | Micromechanical component for a sensor device and manufacturing method for a micromechanical component for a sensor device |
DE102020008095B3 (de) | 2020-02-10 | 2023-05-17 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikromechanisches Bauteil für eine Sensorvorrichtung und Herstellungsverfahren für ein mikromechanisches Bauteil für eine Sensorvorrichtung |
CN117990240A (zh) * | 2024-04-07 | 2024-05-07 | 华景传感科技(无锡)有限公司 | 一种微机电系统压力传感器和微机电系统压力换能器 |
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JPH0943083A (ja) * | 1995-08-02 | 1997-02-14 | Omron Corp | 静電容量型圧力センサ及びそれを用いた血圧計,圧力測定装置並びにガスメータ |
CN1764328A (zh) * | 2004-10-18 | 2006-04-26 | 财团法人工业技术研究院 | 动态压力感测结构 |
CN202150936U (zh) * | 2011-05-18 | 2012-02-22 | 上海丽恒光微电子科技有限公司 | 微机电传感器 |
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2011
- 2011-05-18 CN CN201110129992.4A patent/CN102249177B/zh active Active
Patent Citations (3)
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JPH0943083A (ja) * | 1995-08-02 | 1997-02-14 | Omron Corp | 静電容量型圧力センサ及びそれを用いた血圧計,圧力測定装置並びにガスメータ |
CN1764328A (zh) * | 2004-10-18 | 2006-04-26 | 财团法人工业技术研究院 | 动态压力感测结构 |
CN202150936U (zh) * | 2011-05-18 | 2012-02-22 | 上海丽恒光微电子科技有限公司 | 微机电传感器 |
Cited By (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105307080B (zh) * | 2010-06-01 | 2018-10-16 | 船井电机株式会社 | 麦克风单元以及设有该麦克风单元的声音输入装置 |
CN105307080A (zh) * | 2010-06-01 | 2016-02-03 | 船井电机株式会社 | 麦克风单元以及设有该麦克风单元的声音输入装置 |
JP2014533983A (ja) * | 2011-10-07 | 2014-12-18 | スンシル ユニバーシティー リサーチ コンソルティウム テクノーパークSoongsil University Research Consortium Techno−Park | 眼圧センサー及びその製造方法 |
CN102967407A (zh) * | 2012-10-23 | 2013-03-13 | 深圳先进技术研究院 | 一种绝对压力传感器芯片及其制作方法 |
CN102967407B (zh) * | 2012-10-23 | 2016-11-30 | 深圳先进技术研究院 | 一种绝对压力传感器芯片及其制作方法 |
CN103063351A (zh) * | 2012-12-21 | 2013-04-24 | 上海宏力半导体制造有限公司 | 微机电系统压力传感器及其制作方法、微机电系统 |
CN103063351B (zh) * | 2012-12-21 | 2016-05-11 | 上海华虹宏力半导体制造有限公司 | 微机电系统压力传感器及其制作方法、微机电系统 |
CN105874312A (zh) * | 2013-08-05 | 2016-08-17 | 罗伯特·博世有限公司 | 在单芯片上的惯性和压力传感器 |
CN105874312B (zh) * | 2013-08-05 | 2019-04-12 | 罗伯特·博世有限公司 | 在单芯片上的惯性和压力传感器 |
WO2015051729A1 (zh) * | 2013-10-08 | 2015-04-16 | 无锡华润上华半导体有限公司 | 电容式mems压力传感器 |
CN104655333B (zh) * | 2013-11-21 | 2017-04-05 | 中芯国际集成电路制造(上海)有限公司 | 一种压力传感器及其制备方法 |
CN104655333A (zh) * | 2013-11-21 | 2015-05-27 | 中芯国际集成电路制造(上海)有限公司 | 一种压力传感器及其制备方法 |
CN103900740B (zh) * | 2014-03-24 | 2015-12-30 | 上海丽恒光微电子科技有限公司 | 压力传感器及其制造方法 |
CN103940535B (zh) * | 2014-03-24 | 2016-03-09 | 上海丽恒光微电子科技有限公司 | 压力传感器的制造方法 |
CN103900740A (zh) * | 2014-03-24 | 2014-07-02 | 上海丽恒光微电子科技有限公司 | 压力传感器及其制造方法 |
CN103940535A (zh) * | 2014-03-24 | 2014-07-23 | 上海丽恒光微电子科技有限公司 | 压力传感器的制造方法 |
CN105323686A (zh) * | 2014-06-30 | 2016-02-10 | 上海丽恒光微电子科技有限公司 | 微机电麦克风及其制造方法 |
CN105323686B (zh) * | 2014-06-30 | 2018-10-16 | 上海丽恒光微电子科技有限公司 | 微机电麦克风及其制造方法 |
CN105651450A (zh) * | 2014-11-14 | 2016-06-08 | 中芯国际集成电路制造(上海)有限公司 | 压力传感器及其形成方法 |
CN105651450B (zh) * | 2014-11-14 | 2018-07-06 | 中芯国际集成电路制造(上海)有限公司 | 压力传感器及其形成方法 |
WO2017000501A1 (zh) * | 2015-06-29 | 2017-01-05 | 歌尔声学股份有限公司 | 一种mems压力传感元件 |
CN104897334A (zh) * | 2015-06-29 | 2015-09-09 | 歌尔声学股份有限公司 | 一种mems压力传感元件 |
CN105120417A (zh) * | 2015-09-23 | 2015-12-02 | 苏州敏芯微电子技术有限公司 | 单片集成芯片及其制作方法 |
CN110411614A (zh) * | 2018-04-27 | 2019-11-05 | 苏州明皜传感科技有限公司 | 力量传感器以及其制造方法 |
WO2020057218A1 (zh) * | 2018-09-17 | 2020-03-26 | 胡耿 | 微小极间距电容式力敏传感器及其制造方法 |
CN112995448A (zh) * | 2019-12-16 | 2021-06-18 | 中芯集成电路(宁波)有限公司 | 成像模组及其制造方法 |
US11623861B2 (en) | 2020-02-10 | 2023-04-11 | Robert Bosch Gmbh | Micromechanical component for a sensor device and manufacturing method for a micromechanical component for a sensor device |
DE102020008095B3 (de) | 2020-02-10 | 2023-05-17 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikromechanisches Bauteil für eine Sensorvorrichtung und Herstellungsverfahren für ein mikromechanisches Bauteil für eine Sensorvorrichtung |
CN111348615A (zh) * | 2020-03-16 | 2020-06-30 | 潍坊歌尔微电子有限公司 | 电容式集成传感器及其加工工艺 |
CN115479582A (zh) * | 2022-11-03 | 2022-12-16 | 湖南大学 | 一种用于导航的气压高度计 |
CN115479582B (zh) * | 2022-11-03 | 2023-02-14 | 湖南大学 | 一种用于导航的气压高度计 |
CN117990240A (zh) * | 2024-04-07 | 2024-05-07 | 华景传感科技(无锡)有限公司 | 一种微机电系统压力传感器和微机电系统压力换能器 |
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Effective date of registration: 20200323 Address after: 323000 Room 307, Block B, 268 Shiniu Road, Nanmingshan Street, Liandu District, Lishui City, Zhejiang Province Patentee after: Zhejiang Core Microelectronics Co.,Ltd. Address before: 323000 room 303-6, block B, building 1, No. 268, Shiniu Road, nanmingshan street, Liandu District, Lishui City, Zhejiang Province Patentee before: Lishui Jue yixincheng electronic technology partnership (L.P.) |
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Effective date of registration: 20230317 Address after: Room 303-6, Block B, Building 1, No. 268, Shiniu Road, Nanmingshan Street, Liandu District, Lishui City, Zhejiang Province, 323000 Patentee after: Lishui Jue yixincheng electronic technology partnership (L.P.) Address before: 323000 room 307, block B, building 1, No.268 Shiniu Road, nanmingshan street, Liandu District, Lishui City, Zhejiang Province Patentee before: Zhejiang Core Microelectronics Co.,Ltd. |
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Effective date of registration: 20230406 Address after: 201203 501b, building 5, No. 3000, Longdong Avenue, Pudong New Area, Shanghai Patentee after: LEXVU OPTO MICROELECTRONICS TECHNOLOGY (SHANGHAI) Ltd. Address before: Room 303-6, Block B, Building 1, No. 268, Shiniu Road, Nanmingshan Street, Liandu District, Lishui City, Zhejiang Province, 323000 Patentee before: Lishui Jue yixincheng electronic technology partnership (L.P.) |
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Effective date of registration: 20230529 Address after: 323000 room 307, block B, building 1, No.268 Shiniu Road, nanmingshan street, Liandu District, Lishui City, Zhejiang Province Patentee after: Zhejiang Core Microelectronics Co.,Ltd. Address before: 201203 501b, building 5, No. 3000, Longdong Avenue, Pudong New Area, Shanghai Patentee before: LEXVU OPTO MICROELECTRONICS TECHNOLOGY (SHANGHAI) Ltd. |
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