CN102243987B - Substrate processing device and substrate processing system - Google Patents
Substrate processing device and substrate processing system Download PDFInfo
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- CN102243987B CN102243987B CN201110114908.1A CN201110114908A CN102243987B CN 102243987 B CN102243987 B CN 102243987B CN 201110114908 A CN201110114908 A CN 201110114908A CN 102243987 B CN102243987 B CN 102243987B
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- substrate board
- board treatment
- lid
- maintenance area
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- 239000000758 substrate Substances 0.000 title claims abstract description 182
- 230000007246 mechanism Effects 0.000 claims abstract description 54
- 238000011282 treatment Methods 0.000 claims description 99
- 238000000034 method Methods 0.000 claims description 88
- 238000012423 maintenance Methods 0.000 claims description 68
- 230000007723 transport mechanism Effects 0.000 claims description 21
- 238000005452 bending Methods 0.000 description 8
- 239000007921 spray Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004380 ashing Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000009489 vacuum treatment Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 235000004443 Ricinus communis Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a substrate processing device and a substrate processing system which have high maintainability and small configuring spaces. A vacuum conveying chamber (4) which comprises a substrate conveying mechanism (41) for conveying a substrate S of an article to be processed is surrounded by a plurality of side surfaces in a way with a top view having a shape of more than five angles. A plurality of processing chambers (5a-5d) each having a cover body (52) on the upper part are connected to the plurality of side surfaces except an outer side surface having a maintaining area (6). A cover body conveying mechanism (7) is applied for conveying the cover bodies (52) between the processing chambers (5a-5d) and the maintaining area (6).
Description
Technical field
The present invention relates to be connected with at a plurality of vacuum carrying rooms the substrate board treatment and the base plate processing system with many these treatment substrate devices of a plurality of process chambers.
Background technology
The semiconductor substrates (semiconductor wafer) of the glass substrate that flat-panel monitor (FPD:Flat Panel Display) is used and formation semiconductor device etc. are as handled object, process and carry out in the substrate board treatment of processing of ashing processing etc. carrying out film forming by etch processes, CVD (Chemical Vapor Deposition) etc., in order to reach the object etc. that improves output, known having at shared vacuum carrying room connects many substrate board treatments that process chamber is so-called multi-chamber mode.
The side that it is for example dimetric true hole carrying room 4 at plan view shape that Fig. 9 has recorded is connected with three process chamber 5a～5c and as an example of the substrate board treatment 100 of the multi-chamber mode of the load locking room 3 of preparatory vacuum chamber.Nearby side at load locking room 3 disposes the air loader of moving into and taking out of 2 that carries out substrate S between load locking room 3 and outside.The substrate board treatment 100 like this with a plurality of process chamber 5a～5c, even if the situation that for example generation need to be keeped in repair for a process chamber 5a also can be proceeded at remaining process chamber 5b, 5c the processing of substrate S.
For the situation that for example process chamber 5a～5c keeps in repair, consider, this process chamber be provided with stop up in the chamber body be formed on basket shape, above this chamber body the lid of the peristome of a side.Lid is provided with sometimes to the gas spray etc. of supplying with etching gas and film forming gas etc. in process chamber 5a～5c and process gas, and such lid is reversing up and down when chamber body is removed, makes gas spray towards above, improves the operability while keeping in repair.
For example, in patent documentation 1, record following substrate board treatment, the side that this substrate board treatment is managed chamber 5a～5c is throughout provided with the maintenance area 6 of carrying out lid transmission etc., has when the lid of removing from chamber body towards these maintenance area 6 conveyances, makes the guide rail mechanism of this lid reversion.
Outside this, in the substrate board treatment 100 of Fig. 9 shown type, because the surrounding of vacuum carrying room 4 is surrounded by load locking room 3 and process chamber 5a～5c, so when being arranged on substrate transferring mechanism 41 in vacuum carrying room 4 and keeping in repair, need to take off the end face of vacuum carrying room 4, such as needs, by crane Deng Jiang substrate transferring mechanism 41, lift and take out of.Therefore, need to crane be set in operation site, need main equipment, and substrate board treatment 100 need to be configured in to the region that crane can arrive, so the restriction in device layout is also larger.
But, in the substrate board treatment of multi-chamber mode, require to realize higher growing amount, as a method of the such requirement of reply, consider to increase the number of units of the process chamber that is connected to vacuum carrying room.Yet substrate board treatment require to be saved space, on the other hand, when the substrate board treatment 100 as shown in Figure 9 increases set handling chamber, as why not lost maintainability, configuring new process chamber becomes larger problem.
Patent documentation 1: TOHKEMY 2007-67218 communique: the 0024th section, Fig. 1, Fig. 4
Summary of the invention
The present invention In view of the foregoing produces, and its objective is the base plate processing system that the substrate board treatment that a kind of maintainability is high, configuration space (floor space) is little is provided and has this substrate board treatment.
The substrate board treatment the present invention relates to, possesses the substrate transferring mechanism that the substrate as handled object is carried out to conveyance, it is characterized in that, comprising: with plan view shape, be the vacuum carrying room that polygonal mode more than pentagon is surrounded by a plurality of sides; Be connected to and in a plurality of sides of above-mentioned vacuum carrying room, remove a plurality of process chambers that the ， top, side having in outside outside the side of maintenance area has lid; And between above-mentioned process chamber and above-mentioned maintenance area, the lid transport mechanism of the above-mentioned lid of conveyance.
Aforesaid substrate processing unit also can possess following feature.
(a) removing the side in outside with the side of above-mentioned maintenance area and above-mentioned vacuum carrying room outside the side being connected with above-mentioned process chamber, be connected with the preparatory vacuum chamber switching being placed with the atmosphere of aforesaid substrate between normal pressure atmosphere and vacuum atmosphere.
(b) be connected with the side of above-mentioned process chamber relative with the side in outside with above-mentioned maintenance area.
(c) side that has a maintenance area in above-mentioned outside is provided with: for peristome and the switching parts for this peristome is opened and closed that aforesaid substrate transport mechanism is moved into and taken out of.
(d) above-mentioned vacuum carrying room can be divided into three above parts.
In addition, the base plate processing system that other inventions relate to is the base plate processing system with the substrate board treatment of above-mentioned (b) record, and its feature is as follows, comprising:
Make above-mentioned preparatory vacuum chamber towards identical direction and the first row that forms at many aforesaid substrate processing unit of left and right directions configuration; With
So that the above-mentioned preparatory vacuum chamber preparatory vacuum chamber in above-mentioned first row towards the opposite towards direction and in outside, there is the side of the vacuum carrying room of maintenance area, the mode relative with the side of the vacuum carrying room with maintenance area of above-mentioned first row, the secondary series that many aforesaid substrate processing unit is parallel to above-mentioned first row configuration and forms
Between above-mentioned first row and secondary series, form the conveyance passage that connects above-mentioned maintenance area.
Aforesaid substrate treatment system also can possess following feature.
In above-mentioned first row, the interval of substrate board treatment adjacent one another are in the interval of substrate board treatment adjacent one another are and above-mentioned secondary series, narrower than above-mentioned conveyance passage.
Adopt the present invention, the side that is polygonal vacuum carrying room more than pentagon at plan view shape is connected with a plurality of process chambers, due to the maintenance area of the conveyance destination of the total lid that becomes chambers between a plurality of process chambers etc., so substrate board treatment can be saved space.And, owing to thering is the lid transport mechanism of the lid from chambers to maintenance area conveyance process chamber, so even if having maintenance area, also can simply process chamber be opened.
Accompanying drawing explanation
Fig. 1 means the stereogram of the surface structure of the substrate board treatment that execution mode relates to.
Fig. 2 is the vertical view of aforesaid substrate processing unit.
Fig. 3 means the first key diagram of the action that the lid that is arranged on the process chamber of aforesaid substrate processing unit is taken off.
Fig. 4 means the second key diagram of the action that above-mentioned lid is taken off.
Fig. 5 means the first key diagram of the action that the substrate transferring mechanism that is arranged on the vacuum carrying room of aforesaid substrate processing unit is taken off.
Fig. 6 means the second key diagram of the action that aforesaid substrate transport mechanism is taken off.
Fig. 7 means the vertical view of example of the base plate processing system of the substrate board treatment with many execution modes and conventional example.
Fig. 8 means that the plan view shape of vacuum carrying room forms the vertical view of the example of flat hexagonal substrate board treatment.
Fig. 9 represents the vertical view of an example of existing substrate board treatment.Symbol description
S substrate
1,100 substrate board treatments
2 air loaders
3,3a, 3b load locking room
4,4a vacuum carrying room
41 substrate transferring mechanisms
421,422 open and close parts
431,432 peristomes
5,5a～5d process chamber
51 chamber body
52 lids
6 maintenance area
61 lid conveyance fixtures
7 lid transport mechanisms
8 control parts
Embodiment
With reference to Fig. 1, Fig. 2, an example of the substrate board treatment of the multi-chamber type relating to for embodiments of the present invention, it is that the overall structure of the device of etch processes describes that the glass substrate that FPD is used (only claiming below substrate) carries out vacuum treatment.Fig. 1 means the stereogram of the surface structure of substrate board treatment 1, and Fig. 2 means the vertical view of its internal structure.
The substrate board treatment 1 that present embodiment relates to has following structure: between support C 1, C2 and the load locking room 3 of accommodating many pieces of substrate S that come from outside conveyance, carry out air loader 2 that substrate S moves into and take out of, the atmosphere that is placed with the substrate S being moved into by air loader 2 is load locking room 3 and between process chamber 5a～5d, substrate S is being carried out the vacuum carrying room 4 of conveyance under vacuum atmosphere at the preparatory vacuum chamber switching between normal pressure atmosphere and vacuum atmosphere.Vacuum carrying room 4 is connected with four process chamber 5a～5d that substrate S carried out to etch processes.
Air loader 2 possesses: mounting support C 1, two carrier mounting portions 201,202 of C2 and the atmospheric side substrate transferring mechanism 23 that substrate S is carried out conveyance between these support C 1, C2 and load locking room 3.Each carrier mounting portion 201,202 possesses for support C 1, C2 being carried out to the elevating mechanism 21 of lifting, carrier mounting portion 201 mountings of the side's side in this example have the support C 1 of the substrate S before the processing of accommodating, have the support C 2 of the substrate S after the processing of accommodating in carrier mounting portion 201 mountings of the opposing party's side.
Carrier mounting portion 201,202 is across under air atmosphere, substrate S being carried out to the atmospheric side substrate transferring mechanism 23 of conveyance and arranging.Atmospheric side substrate transferring mechanism 23 possesses and is for example set to continuously the carrying arm 231 of two sections and supports the abutment portion 232 that these carrying arms 231 are freely advanced and retreat and rotated freely.In Fig. 1 22 is support platforms of supporting atmospheric side substrate transferring mechanism 23.
As shown in Fig. 6 (a), the bottom of ， substrate transferring mechanism 41 is provided with the driving mechanism 411 driving for Dui Gai substrate transferring mechanism 41.The space and the space that disposes driving mechanism 411 that dispose the main body of substrate transferring mechanism 41, be divided into respectively 401He Machine Room, conveyance space 402 up and down by base plate 44.In this example, the conveyance space 401 of top one side of base plate 44 maintains vacuum atmosphere as mentioned above, and on the other hand, the Machine Room 402 of below one side of base plate 44 is air atmosphere.Substrate transferring mechanism 41 and driving mechanism 411 are separated up and down when maintenance etc., can remove respectively from 401He Machine Room, conveyance space 402.In addition, in Fig. 6 (a), the 413rd, to for substrate transferring mechanism 41 is stretched out and the peristome of retracting seals from base plate 44, for conveyance space 401 being maintained to the bellows of vacuum state.
As shown in the vertical view of Fig. 2, the plan view shape of the vacuum carrying room 4 that this example relates to is regular hexagons roughly, in a side of this vacuum carrying room 4, is connected with above-mentioned load locking room 3.And, to remove and be connected with outside a relative side of the He Yugai side, side of load locking room 3, remaining four sides are connected with process chamber 5a～5d.Its result, as shown in Figure 2, these load locking rooms 3 and four process chamber 5a～5d are configured to radial centered by hexagonal vacuum carrying room 4.
The inside of managing throughout chamber 5a～5d is provided with: in mounting, have substrate S and become the mounting table of lower electrode, and arrange with above-mentioned mounting table mode opposing upper and lower, form to supplying with in process chamber 5a～5d such as the gas supply part of the etching gas of chlorine etc. and becoming the gas spray etc. of upper electrode.And, by for example applying High frequency power to mounting table side, by by the etching gas plasma being supplied in process chamber 5a～5d, plant for active of generation substrate S is carried out to etching.In Fig. 1, Fig. 2, for convenient, represent the record of having omitted described mounting table and gas supply part.
In addition, in from air loader 2 to load locking room 3, move into and take out of between peristome, load locking room 3 and the vacuum carrying room 4 of substrate S, be provided with family of power and influence G1～G3 that these unit are sealed airtightly and can be opened and closed between vacuum carrying room 4 and process chamber 5a～5d.
And, as shown in Figure 1, chambers 5a～5d that present embodiment relates to can be divided into up and down: form and to carry out the space of etch processes, the chamber body 51 of a side opening above it, and be arranged on this chamber body 51 above and cover the peristome of this chamber body 51 and be formed with the lid 52 of routine gas spray described above etc.Its result, as the mode having illustrated in background technology, when gas spray etc. is keeped in repair, can remove lids 52 from chamber body 51.
The substrate board treatment 1 more than illustrating possesses: for example, when the substrate transferring mechanism 41 to taking out of from vacuum carrying room 4 and driving mechanism 411, the shared maintenance area 6 that can use when the lid 52 of removing from chambers 5a～5d is keeped in repair.Also have, substrate board treatment 1 possess for to maintenance area 6 conveyances from chambers 5a～the lid transport mechanism 7 of the lid 52 that 5d removes.Below, for the allocation position of maintenance area 6 and the mechanism of lid transport mechanism 7, describe.
As shown in Figure 2, in the substrate board treatment 1 relating in this example, the relative side, the side with being connected with load locking room 3 forming in six sides of hexagonal vacuum carrying room 4 at plan view shape is not connected with load locking room 3 and process chamber 5a～5d, to guarantee becoming maintenance area 6 in the outside of this side.If this side is called to maintenance surface, the position of foreign side one side that maintenance area 6 is formed on this maintenance surface to this maintenance surface.In other words, maintenance surface can be described as the side that possesses maintenance area 6 in outside.And this maintenance area 6 is also identical with other load locking room 3, process chamber 5a～5d, is configured to radial centered by vacuum carrying room 4.
In maintenance area 6, guarantee to have the area that conveyance to the lid 52 of this maintenance area 6 can be transmitted, lid 52 is passed to the lid conveyance fixture 61 as special-purpose transport table.With reference to Fig. 2, Fig. 4, for the simple in structure of lid conveyance fixture 61, describe.Lid conveyance fixture 61 possesses: keep lid 52 outer Monday side bottom surface sections frame 611, support rotary supporting part 613 that the central portion on the both sides relative with this frame 611 can rotate at trunnion axis around, the pillar part 612 of the height and position that by this rotary supporting part 613, frame 611 remained on to regulation and be arranged on the vehicle frame portion 614 of the lower end of this pillar part 612.
Lateral circle surface at lid 52 has the not shown support being positioned on described frame 611, at this support, is provided with bolt hole.In addition, in frame 611 1 sides, also in the position corresponding with this support, be provided with bolt hole, these supports and frame 611 are by bolted, and lid 52 remains fixed on frame 611.In addition, at rotary supporting part 613, be provided with not shown rotational positioner, make the frame 611 that maintains lid 52 carry out 180 degree rotations, by lid 52 is reversed up and down, can make gas spray towards a side above, thus, the operability in the time of can improving maintenance.
Secondly, the structure about lid transport mechanism 7 describes.Lid transport mechanism 7 has the effect of conveyance lid 52 between above-mentioned lid conveyance fixture 61 in being configured in maintenance area 6 and chambers 5a～5d.As shown in Fig. 1, Fig. 3, Fig. 4, lid transport mechanism 7 comprises: be arranged on the rotating platform 721 being rotated at vertical axis on the courtyard plate of vacuum carrying room 4, on this courtyard plate around; Be fixed on the support arm 71 that this selects on rotating platform 721, arranges with the footpath direction towards this rotating platform 721, the mode of stretching out towards the direction that chambers 5a～5d is set from the vacuum carrying room 4 of center; Be arranged on bottom one side of this support arm 71, for by making 721 rotations of above-mentioned rotating platform make support arm 71 be rotated mobile driving mechanism 73; Be arranged on top one side of above-mentioned support arm 71, for keeping the chuck segment 741 of lid 52.
Two longer beam slabs that support arm 71 is for example linked by connecting member 711 form, its top one side is stretched out towards being connected to vacuum carrying room 4 process chamber 5a～5d around, on the other hand, bottom one side is fixed on this rotating platform 721 in the mode at the cross-section rotating platform 721 of diametric(al).As Figure 1 and Figure 4, chuck segment 741 is that bottom bending is two hook-shaped parts of L font, in the part mode respect to one another of these bendings, is configured in inner side and the outer fix of the footpath direction that supporting arm 71 stretches out.
On the other hand, manage throughout the handle portion 53 that two hook-shaped parts that to be provided with above by bending be contrary L font of the lid 52 of chamber 5a～5d form, handle portion 53 is configured to make the contrary towards each other direction of part of these bendings.Chuck segment 741 is by elevating mechanism 742 free liftings, by the state that the bending part of the bending part of chuck segment 741 sides and handle portion 53 sides of lid 52 is engaged with each other, make chuck segment 741 increase, lid 52 can be promoted to the position of the hands-off height of process chamber 5a～5d with other.In addition, the mode of rigidity when support arm 71 keeps lid 52 to remain on top ends, forms bottom one side thicker, and top one side is thinner.
As shown in Figure 1, the gear 722 in the wheel ring-type of the surrounding of rotating platform 721 is fixed on the top board of vacuum carrying room 4.On the other hand, the beam slab in support arm 71 1 side's one sides is fixed with the driving mechanism 73 with small-sized gear 731.By making to take turns the gear 722 of ring-type and 731 engagements of the gear of driving mechanism 73 sides are rotated the gear 731 of driving mechanism 73, the gear 731 of driving mechanism 73 moves in the surrounding of gear 722 of wheel ring-type, can make thus rotating platform 721 and fixed thereon 's support arm 71 be rotated.Its result, as shown in Fig. 3 (a), with chuck segment 741 by be provided with chambers 5a～5d handle portion 53 position and be configured in the mode of top position of the lid conveyance fixture 61 of maintenance area 6, can make support arm 71 be rotated.
In addition, mode described above, because maintenance area 6 is arranged in the face of facing the position of maintenance area face in the position of one of them side of vacuum carrying room 4, so be not the end face that the mode of the existing substrate board treatment 100 to have illustrated in background technology is removed vacuum carrying room 4, by crane etc., lifting substrate transferring mechanism 41 takes out of, but only the parts that form above-mentioned access surface are removed, just substrate transferring mechanism 41 and driving mechanism 411 transverse directions can be pulled out.Therefore, at the vacuum carrying room 4 of present embodiment, as shown in Figure 6, at access surface, be provided with the peristome 431 for removing from conveyance space 401Jiang substrate transferring mechanism 41, and for 402 peristomes 432 that driving mechanism 411 is removed from Machine Room.These peristomes 431,432 in the run duration of substrate board treatment 1, open and close parts 421,422 and close by each.
As shown in Figure 2, the substrate board treatment 1 that has an above structure is connected with control part 8.Control part 8 consists of the computer that possesses not shown CPU and storage part, has the program that possesses following steps group in storage portion stores: the action when substrate board treatment 1 carries out the etch processes of substrate S and while carrying out the maintenance of process chamber 5a～5d, by lid transport mechanism 7 by lid 52 conveyances step (order) group to the related control of the action of maintenance area 6.This program, such as the storage medium that is housed in hard disk, CD, magneto optical disk, storage card etc., is installed to computer by these storage mediums.
Below, with reference to Fig. 1～Fig. 6, for the effect of the substrate board treatment 1 of present embodiment, describe.Suppose that process chamber 5a need to keep in repair.Now, to guarantee that vacuum carrying room 4 is modes of vacuum, close family of power and influence G3, remove the vacuum state in process chamber 5a, prepare to remove lid 52 from chamber body 51.Now, can proceed at other process chamber 5b～5d the etch processes of substrate S.
Then, as shown in Figure 1, after the chuck segment 741 that makes the top of support arm 71 declines, make support arm 71 rotate, make the bending part of chuck segment 741 enter the lower position of bending part of the handle portion 53 of the lid 52 that is arranged on process chamber 5a.So by making chuck segment 741 increase, the lid 52 that the dogleg section that makes chuck segment 741 and handle portion 53 is engaged with each other rises to top.At this, can be by bolt, this handle portion 53 is fastening with chuck segment 741, the handle portion 53 of lid 52 when conveyance is not fallen from chuck segment 741.
Like this, the lid of process chamber 5a 52 is promoted to and the adjacent hands-off height and position of process chamber 5b, make driving mechanism 73 operation, the top position by lid 52 from the top position conveyance of the process chamber 5a shown in Fig. 3 (a) to the lid conveyance fixture 61 in maintenance area 6 standbies.So, as shown in Fig. 4 (a), chuck segment 741 is declined, by lid 52 mountings to the frame 611 of lid conveyance fixture 61 and lid 52 and frame 611 is fastening, then make chuck segment 741 further decline, remove the fastening state of handle portion 53 and chuck segment 741.In addition, the convenience of Fig. 4 (a)～Fig. 4 (c) in order to represent, has omitted the record that is connected to vacuum carrying room 5c, 5d.
Then, making support arm 71 rotations and after hide the top position of handle portion 53, as shown in Fig. 4 (b), by making frame 611 carry out 180 degree rotations, lid 52 being reversed up and down, make gas spray towards above, keep in repair.In addition, as required, also can make lid conveyance fixture 61 move, the Maintenance Room (Fig. 4 (c)) by lid 52 conveyances to regulation.
In addition, even in the situation that other process chamber 5b～5d opens, also can from chamber body 51, remove lids 52 by the identical action of action of having carried out illustrating with each figure that adopts Fig. 3, Fig. 4, chambers main body 51 sides, lid 52 sides are keeped in repair.
When maintenance finishes, the order with contrary when removing, makes lid conveyance fixture 61 and 7 operations of lid transport mechanism, by lid 52, the peristome of chamber body 51 is stopped up airtightly.Then, recover the connection of etching gas and gas exhaust piping, making in process chamber 5a is vacuum state, after completing the preparation of operation beginning, opens family of power and influence G3, from vacuum carrying room 4, accepts substrate S, again starts to carry out etching.
Secondly, the action when substrate transferring mechanism 41 and its driving mechanism 411 are removed describes.In this situation, in the operation that stops substrate board treatment 1 integral body, after the vacuum state in vacuum carrying room 4 is removed, the switching parts 421 that are arranged on for example conveyance space 401 sides of access surface are removed to (Fig. 5 (a), Fig. 6 (a)).Then, by making the main body of substrate transferring mechanism 41 be pulled to access surface one side with the separated ，Jiang substrate transferring of its driving mechanism 411 mechanism 41, can not use 41 conveyances of crane Deng Erjiang substrate transferring mechanism to maintenance area 6.Now, for example, can castor be set in the bottom surface sections of substrate transferring mechanism 41, also can lay guide rail at the base plate 44 in conveyance space 401, make the operation of pulling out of substrate transferring mechanism 41 become easy.In addition, when removing driving mechanism 411 too, by removing the switching parts 422 (Fig. 5 (a), Fig. 6 (a)) of Machine Room 402, the driving mechanism 411 of the main body after separating of Jiang Yu substrate transferring mechanism 41 is pulled to access surface one side, thus can make driving mechanism 411 from Machine Room 402 to taking out of of maintenance area 6 become simply (Fig. 6 (c)).
Secondly, by thering is many above examples of base plate processing system of substrate board treatment 1 as above and the situation of the base plate processing system of existing substrate board treatment 100, compare, describe.Fig. 7 (a), Fig. 7 (b) are respectively the routine key diagrams of the base plate processing system that schematically represents that substrate board treatment 100 that substrate board treatment 1 that execution mode relates to and the conventional example shown in Fig. 9 relate to relates to.In these figure, omitted the record of the air loader 2 of each substrate board treatment 1,100, air loader configuring area 20 represents to dispose the region of these air loaders 2 blanketly.
Base plate processing system shown in Fig. 7 (a), by making the load locking room 3 of the substrate board treatment 1 that execution mode relates to towards identical direction, at many substrate board treatments 1 of left and right directions configuration, forms first row 11.In addition, direction with the load locking room 3 of substrate board treatment 1 towards the opposite direction of the load locking room 3 with first row 11, the mode that maintenance area 6 is relative with the maintenance area 6 of first row 11, configures many substrate board treatments 1 abreast with described first row 11, forms secondary series 12.That is, the relative toward each other direction of access surface of the substrate board treatment 1 of first row 11 in being configured to abreast each row 11,12 with secondary series 12.And, for the device of removing from substrate board treatment 1 etc. is carried out to conveyance, between described first row 11 and secondary series 12, form the conveyance passage 60 that connects above-mentioned maintenance area.
In the example shown in Fig. 7 (a), the width of conveyance passage 60 is can be by the degree of above-mentioned lid conveyance fixture 61, is set as adapting to the width of the width of this lid conveyance fixture 61.Now, in this example, as shown in Fig. 7 (a), due to the maintenance area 6 with respect to the works of load locking room 3 and vacuum carrying room 4 etc. is not set, configure abreast first row 11 and secondary series 12, so can make first row 11 and secondary series 12 approach until lid conveyance fixture 61 is not in contact with the degree of the process chamber 5 of each substrate board treatment 1 that maintenance area 6 sides stretch out.
In each substrate board treatment 1, owing to possessing, make each lids 52 of four process chambers 5 move to the lid transport mechanism 7 (omitting diagram in Fig. 7 (a)) of maintenance area, so at the adjacent substrate board treatment 1 of left and right directions each other, do not need to be provided for the conveyance passage 60 that lid conveyance fixture 61 is passed through in each row 11,12.
At this, in example shown in Fig. 7 (a), although the substrate board treatment of the substrate board treatment 1 of first row 11 1 sides and secondary series 12 1 sides is that substrate board treatment 1 can be to stagger at left and right directions (transverse direction) between first row 11 and secondary series 12 in the upper mode point-blank arranged side by side of fore-and-aft direction (longitudinal direction).
On the other hand, Fig. 7 (b) represents the example of following substrate system: the identical idea of situation of the substrate board treatment 1 based on relating to present embodiment, by making the load locking room 3 of many substrate board treatments 100 form first row 101 towards identical direction configuration, by making load locking room 3 towards the direction of the opposite direction of the load locking room 3 with this first row 101, many substrate board treatments 100 and above-mentioned first row 101 are configured abreast and form the substrate system of secondary series 102.Even in this example, also between two row 101,102, form the conveyance passage 60 with conveyance passage 60 same widths of Fig. 7 (a).At this, in the substrate board treatment 100 relating in the conventional example shown in Fig. 9, in the position adjacent with chambers 5, be provided with maintenance area 6.And, according to circumstances, owing to need to making lid conveyance fixture 61 move to whole maintenance area 6, so the adjacent substrate board treatment 100 of left and right directions in each row 101,102 is also provided with conveyance passage 60 each other.
The base plate processing system that the substrate board treatment illustrating above 1,100 is related to compares, owing to having maintenance area 6 with respect to a plurality of process chambers 5 in the base plate processing system 1 relating at execution mode, so different from the situation of substrate board treatment 100, need between the adjacent substrate board treatment 1 in left and right, conveyance passage 60 be set.Therefore, by comparing known to Fig. 7 (a) and Fig. 7 (b), can be 5 of each row 11,12 configurations in the scope of the transverse width " B " of configuring area, the total of two row 11,12 is 10 (sum of process chamber 5 is 40) substrate board treatments 1.On the other hand, the in the situation that of substrate board treatment 100, owing between the substrate board treatment 100 adjacent, conveyance passage 60 being also set, so the configuration number of units of substrate board treatment 100 is that each row 101,102 are 4, the total of two row is 8 (sum of process chamber 5 is 24).
In addition, even in the situation that watch the transverse width of substrate board treatment 1,100 by each device monomer, the vacuum carrying room 4 in the substrate board treatment 100 of conventional example and two process chambers 5 being arranged on its left and right are also side by side point-blank.To this, in this routine substrate board treatment 1, because chambers 5 is configured to tilt with respect to the straight line extending at left and right directions, so diminish with this transverse width that tilts corresponding left and right directions.Therefore, for example, in each substrate board treatment 1,100, if equal to the distance of the link position of process chamber 5 from the center of vacuum carrying room 4, the transverse width of substrate board treatment 1 " b1 " is less than the transverse width " b2 " of substrate board treatment 100.
Secondly, width about longitudinal direction, base plate processing system shown in Fig. 7 (a), Fig. 7 (b) is compared, be configured to tilt to compare with respect to the straight line extending at longitudinal direction with chambers 5 in the situation of substrate board treatment 1, in the situation of substrate board treatment 100, load locking room 3, vacuum carrying room 4, process chamber 5 are along longitudinal direction configuration point-blank.Therefore, if make the width of the conveyance passage 60 between each row 11,12 and between each row 101,102 identical, when the width " A2 " of the longitudinal direction of the base plate processing system of the substrate board treatment 100 shown in the width " A1 " of the longitudinal direction of the base plate processing system of the substrate board treatment 1 shown in Fig. 7 (a) and Fig. 7 (b) is compared, if the width of the longitudinal direction of vacuum carrying room 4 is identical, the width of " A1 " is less.
In addition, by each device monomer, watch substrate board treatment 1,100, in the substrate board treatment 100 of conventional example, load locking room 3, vacuum carrying room 4, process chamber 5 are listed as linearity along longitudinal direction, on the other hand, in this routine substrate board treatment 1, load locking room 3, vacuum carrying room 4, maintenance area 6 are listed as linearity along longitudinal direction.And, because maintenance area 6 can have the part of conveyance passage 60, so if the width of the longitudinal direction of vacuum carrying room 4 is identical, the width of the longitudinal direction of substrate board treatment 1 " a1 " can be less than the width " a2 " of the longitudinal direction of substrate board treatment 100.
Adopt the substrate board treatment 1 of present embodiment to there is following effect.The side that is hexagonal vacuum carrying room 4 at plan view shape connects a plurality of process chambers 5, between a plurality of process chambers 5, the total conveyance destination that becomes the lid 52He substrate transferring mechanism 41 of chambers 5 is maintenance area 6, so substrate board treatment 1 can be saved space.And, owing to possessing the lid transport mechanism 7 from chambers 5 to maintenance area 6 conveyances by the lid of process chamber 5 52, so even if total maintenance area 6 also can be opened process chamber 5 simply.
At this, vacuum carrying room 4 is not limited to be configured to the situation that plan view shape is regular hexagon.For example, as shown in Figure 8, can make vacuum carrying room 4 is flat hexagons, one side move into use for example arranging of its wider width, take out of two load locking room 3a, 3b of use, the speed high speed that moving into of substrate S taken out of.
In addition, can be at the octagonal vacuum carrying room separately between process chamber 5a, 5b and between process chamber 5c, 5d with other process chamber.Or, can be also a side and the mechanism that is only provided with a process chamber for making to be provided with two sides of process chamber 5c, 5d.
The shape of vacuum carrying room is not limited to hexagon, so long as polygonal more than pentagon.Particularly, if there is the polygonal that the normal angulation of two sides that are connected with adjacent process chamber is sides of 90 ° of less thaies, can more connect in rotund region configuration process chamber effectively comparing with dimetric situation.
In addition, because vacuum carrying room becomes large-scalely, so form by a plurality of parts and connecting member and seal member, for example, also can be divided into three above parts.
In addition, the structure of lid transport mechanism 7 is not restricted to the example of the lid transport mechanism 7 of the beam type shown in Fig. 1.For example, by making the support arm 71 of the lid transport mechanism 7 shown in Fig. 9 at footpath direction free-extension, or small-sized crane is set and operating radius is changed at the upper surface of vacuum carrying room 4, even the vacuum carrying room 4 shown in Fig. 8 is flat hexagonal situations, also can manage throughout between chamber 5a～5d and maintenance area 6 freely conveyance lid 52.In addition, for example can form by following mode lid transport mechanism 7: from vacuum carrying room 4, watch, with the position in the outside with chambers 5a～5d and the upper surface mode parallel to each other of vacuum carrying room 4, lay guide rail, the gantry crane (bridge type crane) moving on this guide rail is managed throughout the top position of chamber 5a～5d and maintenance area 6 and is moved.
And the position that forms maintenance area 6 is not limited to following situation: the mode of substrate board treatment 1 as shown in Figure 2, is formed on the outside of relative side, the side with being connected with load locking room 3 in six sides of vacuum carrying room 4.For example, in Fig. 2, in the set handling chamber, position 5 that is provided with maintenance area 6, substitute which, the position in outside that also can be connected with any one side of process chamber 5a～5d in Fig. 2 forms maintenance area 6.Even if in this case, also can obtain and make substrate board treatment 1 joint space-efficient effect.
In addition, although publicity in this example at process chamber 5a～5d, substrate S is carried out the example of etch processes, but the vacuum treated kind of carrying out in these process chambers 5a～5d is not limited thereto, such as the film forming that also can carry out CVD (Chemical Vapor Deposition) etc., process or ashing is processed.Also have, manage throughout the vacuum treated kind of carrying out in the 5a～5d of chamber and be not limited to processing of the same race, for example can, in the mode of carrying out in the substrate board treatment 1 identical can carrying out ashing processing after etch processes, carry out different types of vacuum treatment.Also having, remove the side that is connected to load locking room 3 and remaining four sides of facing the vacuum carrying room 4 outside the side of maintenance area 6, can not be to be all connected with process chamber 5, and the number of process chamber 5 can be 2～3.
And the kind of the substrate S that substrate board treatment 1 is processed is not limited to the glass substrate of the angle type shown in execution mode, such as the circular substrate that is certainly also applicable to semiconductor wafer etc.
Claims (7)
1. a substrate board treatment, is characterized in that, comprising:
There is conveyance as the substrate transferring mechanism of the substrate of handled object, with plan view shape, be the vacuum carrying room that polygonal mode more than pentagon is surrounded by a plurality of sides;
Be connected to and in a plurality of sides of described vacuum carrying room, remove a plurality of process chambers that the ，Bing top, side having in outside outside the side of maintenance area has lid; With
The lid transport mechanism of lid described in conveyance between described process chamber and maintenance area,
Described lid transport mechanism is arranged on described vacuum carrying room,
Described lid transport mechanism comprises: the rotating platform being around rotated at vertical axis; From described rotating platform, extend radially support arm; With by making the rotation of described rotating platform make described support arm be rotated mobile driving mechanism.
2. substrate board treatment as claimed in claim 1, is characterized in that:
In outside, there is the side of described maintenance area and be connected with the side of the described vacuum carrying room outside the side of described process chamber, be connected with the preparatory vacuum chamber that the atmosphere of placing described substrate is switched between normal pressure atmosphere and vacuum atmosphere.
3. substrate board treatment as claimed in claim 2, is characterized in that:
Be connected with the side of described preparatory vacuum chamber relative with the side in outside with described maintenance area.
4. substrate board treatment as claimed in claim 1, is characterized in that:
The described side in outside with described maintenance area is provided with for moving into and take out of the peristome of described substrate transferring mechanism and for opening and closing the switching parts of this peristome.
5. the substrate board treatment as described in any one of claim 1 to 4, is characterized in that:
Described vacuum carrying room can be divided into three above parts.
6. a base plate processing system, has many substrate board treatments as claimed in claim 3, and described base plate processing system is characterised in that, comprising:
Make described preparatory vacuum chamber towards identical direction the first row that forms at many described substrate board treatments of left and right directions configuration; With
So that towards the opposite towards the preparatory vacuum chamber with described first row of described preparatory vacuum chamber, and make to have in outside the side of vacuum carrying room of the maintenance area mode relative with the side of the vacuum carrying room with maintenance area of described first row, make many described substrate board treatments be parallel to described first row and configure formed secondary series
Wherein, between described first row and described secondary series, form the conveyance passage that links described maintenance area.
7. base plate processing system as claimed in claim 6, is characterized in that:
The interval of substrate board treatment adjacent one another are in described first row, and the interval of substrate board treatment adjacent one another are in described secondary series, narrower than described conveyance passage.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-104513 | 2010-04-28 | ||
| JP2010104513A JP5526988B2 (en) | 2010-04-28 | 2010-04-28 | Substrate processing apparatus and substrate processing system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102243987A CN102243987A (en) | 2011-11-16 |
| CN102243987B true CN102243987B (en) | 2014-03-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110114908.1A Expired - Fee Related CN102243987B (en) | 2010-04-28 | 2011-04-28 | Substrate processing device and substrate processing system |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5526988B2 (en) |
| KR (1) | KR101289971B1 (en) |
| CN (1) | CN102243987B (en) |
| TW (1) | TW201212147A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5585238B2 (en) * | 2010-06-24 | 2014-09-10 | 東京エレクトロン株式会社 | Substrate processing equipment |
| JP5575558B2 (en) * | 2010-06-30 | 2014-08-20 | 東京エレクトロン株式会社 | Processing equipment |
| CN103556126A (en) * | 2013-10-14 | 2014-02-05 | 中国科学院半导体研究所 | Multi-chamber MOCVD reaction system with optimal configuration |
| WO2019161169A1 (en) * | 2018-02-15 | 2019-08-22 | Lam Research Corporation | Moving substrate transfer chamber |
| JP7210960B2 (en) * | 2018-09-21 | 2023-01-24 | 東京エレクトロン株式会社 | Vacuum processing apparatus and substrate transfer method |
| JP2023083962A (en) | 2021-12-06 | 2023-06-16 | 東京エレクトロン株式会社 | System for processing substrate and maintenance method therefor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1790611A (en) * | 2004-10-06 | 2006-06-21 | 爱德牌工程有限公司 | Apparatus for manufacturing flat-panel display |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3335831B2 (en) * | 1996-01-29 | 2002-10-21 | 株式会社日立製作所 | Vacuum processing equipment |
| JPH1140643A (en) * | 1997-07-22 | 1999-02-12 | Dainippon Screen Mfg Co Ltd | Substrate processor |
| JP2002313690A (en) | 2001-04-10 | 2002-10-25 | Canon Inc | Device production apparatus |
| CN200990756Y (en) * | 2005-06-02 | 2007-12-12 | 应用材料公司 | Electronic device producing room |
| JP4791110B2 (en) * | 2005-09-02 | 2011-10-12 | 東京エレクトロン株式会社 | Vacuum chamber and vacuum processing equipment |
| JP4355314B2 (en) * | 2005-12-14 | 2009-10-28 | 東京エレクトロン株式会社 | Substrate processing apparatus and lid fishing support apparatus |
| JP5030542B2 (en) * | 2006-11-10 | 2012-09-19 | 株式会社日立ハイテクノロジーズ | Vacuum processing equipment |
| US8758514B2 (en) * | 2007-03-02 | 2014-06-24 | Asm Japan K.K. | Cluster type semiconductor processing apparatus |
| JP4784599B2 (en) * | 2007-12-28 | 2011-10-05 | 東京エレクトロン株式会社 | Vacuum processing apparatus, vacuum processing method, and storage medium |
| JP4903728B2 (en) | 2008-01-11 | 2012-03-28 | 株式会社アルバック | A transfer chamber in which a transfer robot is installed and a maintenance method thereof. |
-
2010
- 2010-04-28 JP JP2010104513A patent/JP5526988B2/en not_active Expired - Fee Related
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2011
- 2011-04-27 TW TW100114634A patent/TW201212147A/en unknown
- 2011-04-27 KR KR1020110039339A patent/KR101289971B1/en not_active IP Right Cessation
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1790611A (en) * | 2004-10-06 | 2006-06-21 | 爱德牌工程有限公司 | Apparatus for manufacturing flat-panel display |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102243987A (en) | 2011-11-16 |
| TW201212147A (en) | 2012-03-16 |
| JP5526988B2 (en) | 2014-06-18 |
| KR101289971B1 (en) | 2013-07-26 |
| JP2011233788A (en) | 2011-11-17 |
| KR20110120235A (en) | 2011-11-03 |
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