CN102240926B - 锆基块体非晶合金表面研磨方法 - Google Patents

锆基块体非晶合金表面研磨方法 Download PDF

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CN102240926B
CN102240926B CN201010168988.4A CN201010168988A CN102240926B CN 102240926 B CN102240926 B CN 102240926B CN 201010168988 A CN201010168988 A CN 201010168988A CN 102240926 B CN102240926 B CN 102240926B
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grinding
zirconium
amorphous alloy
bulk amorphous
base material
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CN102240926A (zh
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李杨勇
袁晓波
蒋益民
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Shenzhen Fulian Jingjiang Technology Co ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C45/00Amorphous alloys
    • C22C45/10Amorphous alloys with molybdenum, tungsten, niobium, tantalum, titanium, or zirconium or Hf as the major constituent
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12993Surface feature [e.g., rough, mirror]

Abstract

一种锆基块体非晶合金表面研磨方法,其包括如下步骤:提供由锆基块体非晶合金制成的基材,该基材具有待抛光面;提供粗磨研磨机及精磨研磨机分别对基材的待抛光面进行粗磨及精磨,粗磨时,粗磨研磨盘的转速为20-30转/分钟,研磨时间为3-12分钟,研磨压力为1-2千克/平方厘米,动力装置对粗磨研磨液进行循环输送,精磨时,精磨研磨盘的转速为30-40转/分钟,研磨时间为5-7分钟,研磨压力为1-2千克/平方厘米,动力装置对精磨研磨液进行循环输送。上述锆基块体非晶合金表面研磨方法使得基材的抛光面具有镜面效果,并可以避免晶化。

Description

锆基块体非晶合金表面研磨方法
技术领域
本发明涉及一种锆基块体非晶合金表面处理方法及产品,特别涉及一种锆基块体非晶合金表面研磨方法及产品。
背景技术
块体非晶合金以其较高的强度、韧性、耐磨性、耐蚀性、优良的软磁性和超导特性等特点,在电子、机械、化工等行业得到了广泛应用。锆基块体非晶合金是块体非晶合金中应用较广泛的一种。由于锆基块体非晶合金具有良好的玻璃成型能力和较宽的过冷液相区,因此能够利用简易设备制备出质量很好的块体非晶合金。由于锆基块体非晶合金材料具有较高的强度、耐磨性及耐蚀性,逐渐被广泛用做于电子产品的内部支撑结构或者外壳。
当锆基块体非晶合金用于制作电子产品的外壳时,为了满足外观件的要求,通常需要对其进行表面处理,然而,非金合金在温度较高时容易被晶化,从而丧失非金合金独特的性能,因此若采用常见的表面处理方法对非金合金进行表面处理,难以达到预想的效果。
发明内容
鉴于上述状况,有必要提供一种使锆基块体非晶合金保持非晶态的表面研磨方法。
一种锆基块体非晶合金表面研磨方法,其包括如下步骤:
提供基材,该基材由锆基块体非晶合金制成,具有待抛光面;提供粗磨研磨机和精磨研磨机,该粗磨研磨机具有粗磨研磨盘、粗磨研磨液及动力装置,精磨研磨机具有精磨研磨盘、精磨研磨液及动力装置;将基材定位于粗磨研磨盘上,对该基材的待抛光面进行粗磨,粗磨研磨盘的转速为20-30转/分钟,研磨时间为3-12分钟,研磨压力为1-2千克/平方厘米,动力装置将粗磨研磨液循环输送至粗磨研磨盘;将基材定位于精磨研磨盘上,对基材粗磨后的待抛光面进行精磨以形成平面度为0.5微米至1.5微米之间且表面粗糙度小于0.1微米的抛光面,其中精磨研磨盘的转速为30-40转/分钟,研磨时间为5-7分钟,研磨压力为1-2千克/平方厘米,动力装置将精磨研磨液循环输送至精磨研磨盘。
上述表面研磨方法可以保证锆基块体非晶合金产品的抛光面具有较好的平面度及较小的表面粗糙度,具有镜面的效果,能满足用于电子产品外观件的要求。此外,采用动力装置对研磨液进行循环输送可以保证基材在表面处理过程中处于温度较低的环境中,因此可以避免晶化现象出现,使基材在表面研磨后仍然能具有非金合金的特殊性能。
附图说明
图1是本发明的锆基块体非晶合金表面研磨方法中的基材的立体示意图。
图2为本发明的锆基块体非晶合金表面研磨方法中夹具夹持基材的立体示意图。
图3为本发明的锆基块体非晶合金表面研磨方法中粗磨研磨机对基材进行研磨的结构示意图。
图4为本发明的锆基块体非晶合金表面研磨方法所形成的锆基块体非晶合金产品的立体示意图。
图5为图4中锆基块体非晶合金产品的抛光面的X射线衍射图片。
主要元件符号说明
Figure GDA00002521316900031
具体实施方式
下面将结合附图及实施方式对本发明的锆基块体非晶合金表面研磨方法作进一步的详细说明。
请参阅图1及图2,本发明实施方式的锆基块体非晶合金表面研磨方法包括如下步骤:提供一基材10,基材10由锆基块体非晶合金制成;采用粗磨研磨机20在一定的参数条件下对基材10进行粗磨,采用精磨研磨机(图未示)对基材10进行精磨。为了保证研磨的精准度,本研磨方法还提供一夹具30对基材10进行夹持定位。
基材10具有待抛光面11。基材10的材质为锆-铜-铝-镍系合金、锆-铜-铝-镍-钛系合金、锆-铜-铝-镍-铌系合金、锆-铜-镍-钛-铍系合金、锆-铜-铝-镍-铍系合金及锆-铜-铝-钛-铍系合金等锆基块体非晶合金。本实施方式中的基材10为锆-铜-铝-镍-铌系合金。
请参阅图3,粗磨研磨机20包括粗磨研磨盘21、粗磨研磨液23及动力装置25。粗磨研磨盘21具有研磨面211。动力装置25为泵,包括收容腔251,第一导管253及第二导管255,第一导管253一端与收容腔251相通,另一端延伸至粗磨研磨盘21的上方,第二导管253一端与收容腔251相通,另一端与粗磨研磨机20的底部相通。粗磨研磨液23装于动力装置25的收容腔251内,收容腔251与第一导管253及第二导管255配合实现对粗磨研磨液23的循环输送。精磨研磨机与粗磨研磨机20结构类似,区别在于研磨机中的研磨盘及研磨液不同,可以根据所需要研磨的产品的精度及尺寸要求选择。本实施方式中,粗磨研磨盘21材料为铸铁,粗磨研磨液23为研磨砂、具有润滑及冷却作用的油及水的混合物,精磨研磨盘材料为树脂抛光皮,精磨研磨液为抛光液。
请再参阅图2,夹具30上开设有夹持槽31,夹持槽31的高度与基材10的高度基本相当。基材10被夹持于夹具30的夹持槽31内,待抛光面11与夹具30其中一个表面平齐。
请同时参阅图2和图3,下面是本发明的锆基块体非晶合金表面研磨方法的具体实施例,首先将基材10夹持于夹具30的夹持槽31内,夹具30搁置于粗磨研磨机20的粗磨研磨盘21上,其中,基材10的待抛光面11与粗磨研磨盘21的研磨面211贴合,夹具30的重力使二者紧密贴合,无需提供其余定位装置。转动粗磨研磨盘21,并启动动力装置25,粗磨研磨液23通过第一导管253输送至粗磨研磨盘21中,并从第二导管255回流至收容腔251中。粗磨过程中,粗磨研磨盘21的转速为20至30转/分钟,研磨时间为3至12分钟,研磨压力为1至2千克/平方厘米。研磨时间、速度及压力根据所需要研磨的加工量及所需要得到的平面度来确定,在上述给定的范围内,基材10的待抛光面在经过粗磨后的平面度在0.5微米之1.5微米之间,以使待抛光面11具有镜面效果。本实施方式中,粗磨研磨盘21的转速为25转/分钟,研磨时间为7分钟,研磨压力为2千克/平方厘米。在粗磨的同时,动力装置25对粗磨研磨液23进行循环输送,以带走研磨过程中产生的热量,并起到润滑作用,使基材10处于温度较低的环境内,避免被晶化。粗磨完成后,对基材10进行清洗,基材10的待抛光面11的平面度为1微米。然后将基材10以与粗磨时相同的方式放置于精磨研磨机的精磨研磨盘上,并转动精磨研磨盘。精磨研磨盘的转速为30至40转/分钟,研磨时间为5至7分钟,研磨压力为1至2千克/平方厘米。本实施方式中,精磨研磨盘的转速为35转/分钟,研磨时间为7分钟,研磨压力为2千克/平方厘米。同样的,在精磨时动力装置对精磨研磨液进行循环输送,以带走研磨过程中产生的热量,并起到润滑作用,使基材10处于温度较低的环境内,避免被晶化。为了保证基材10的待抛光面11在精磨后的表面粗糙度较小,需要保持研磨盘的清洁度较高,并且研磨的过程需要在无尘的环境中进行。本实施方式的基材10的待抛光面11在精磨后的表面粗糙度小于0.1微米。
请参阅图4,经过粗磨及精磨加工后,得到锆基块体非晶合金产品10′,基材10的待抛光面11形成平面度为1微米,表面粗糙度小于0.1微米的抛光面11′。请参阅图5,对锆基块体非晶合金产品10′的抛光面11′进行X射线衍射测试,图中横轴为衍射角度,纵轴为衍射波的强度。从图5可知:锆基块体非晶合金产品10′的抛光面11′的衍射图样无明显衍射峰,全部为漫散峰,因此说明锆基块体非晶合金产品10′的抛光面11′没有被晶化。
本发明的锆基块体非晶合金表面研磨方法可以保证锆基块体非晶合金产品10′的抛光面11′具有较好的平面度及较小的表面粗糙度,具有镜面的效果及满足用于电子产品外观件的要求。此外,采用动力装置对研磨液进行循环输送可以保证基材10在表面处理过程中处于温度较低的环境中,且起到润滑作用,因此可以避免晶化现象出现,使基材10在表面研磨后仍然能具有非金合金的特殊性能。
综上所述,虽然本发明已以实施例披露如上,然其并非仅限定本发明,任何业内人士,在不脱离本发明的实质的情况下,对本发明做各种更动与润饰,都应包含在本发明所要求保护的范围内。

Claims (8)

1.一种锆基块体非晶合金表面研磨方法,其包括如下步骤:
提供基材,该基材由锆基块体非晶合金制成,具有待抛光面;
提供粗磨研磨机和精磨研磨机,该粗磨研磨机具有粗磨研磨盘、粗磨研磨液及动力装置,精磨研磨机具有精磨研磨盘、精磨研磨液及动力装置;
将基材定位于粗磨研磨盘上,对该基材的待抛光面进行粗磨,粗磨研磨盘的转速为20-30转/分钟,研磨时间为3-12分钟,研磨压力为1-2千克/平方厘米,动力装置将粗磨研磨液循环输送至粗磨研磨盘上;
将基材定位于精磨研磨盘上,对基材粗磨后的待抛光面进行精磨以形成平面度为0.5微米至1.5微米之间且表面粗糙度小于0.1微米的抛光面,其中精磨研磨盘的转速为30-40转/分钟,研磨时间为5-7分钟,研磨压力为1-2千克/平方厘米,动力装置将精磨研磨液循环输送至精磨研磨盘上。
2.如权利要求1所述的锆基块体非晶合金表面研磨方法,其特征在于:该方法还包括提供夹具,基材固定于所述夹具上,该夹具抵押基材,使基材的抛光面与研磨盘的表面贴合。
3.如权利要求1所述的锆基块体非晶合金表面研磨方法,其特征在于:该锆基块体非晶合金选自锆-铜-铝-镍系合金、锆-铜-铝-镍-钛系合金、锆-铜-铝-镍-铌系合金、锆-铜-镍-钛-铍系合金、锆-铜-铝-镍-铍系合金及锆-铜-铝-钛-铍系合金中的一种。
4.如权利要求3所述的锆基块体非晶合金表面研磨方法,其特征在于:该锆基块体非晶合金为锆-铜-铝-镍-铌系合金。
5.如权利要求1所述的锆基块体非晶合金表面研磨方法,其特征在于:粗磨研磨盘的转速为25转/分钟,研磨时间为7分钟,研磨压力为2千克/平方厘米。
6.如权利要求1所述的锆基块体非晶合金表面研磨方法,其特征在于:精磨研磨盘的转速为35转/分钟,研磨时间为7分钟,研磨压力为2千克/平方厘米。
7.如权利要求1所述的锆基块体非晶合金表面研磨方法,其特征在于:粗磨研磨盘的材料为铸铁,研磨液为研磨砂、油及水的混合物。
8.如权利要求1所述的锆基块体非晶合金表面研磨方法,其特征在于:精磨研磨盘的材料为树脂抛光皮,所述研磨液为抛光液。
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