CN102240926B - 锆基块体非晶合金表面研磨方法 - Google Patents
锆基块体非晶合金表面研磨方法 Download PDFInfo
- Publication number
- CN102240926B CN102240926B CN201010168988.4A CN201010168988A CN102240926B CN 102240926 B CN102240926 B CN 102240926B CN 201010168988 A CN201010168988 A CN 201010168988A CN 102240926 B CN102240926 B CN 102240926B
- Authority
- CN
- China
- Prior art keywords
- grinding
- zirconium
- amorphous alloy
- bulk amorphous
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000227 grinding Methods 0.000 title claims abstract description 78
- 229910000808 amorphous metal alloy Inorganic materials 0.000 title claims abstract description 46
- 229910052726 zirconium Inorganic materials 0.000 title claims abstract description 44
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 52
- 239000007788 liquid Substances 0.000 claims abstract description 23
- 208000001840 Dandruff Diseases 0.000 claims description 57
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 12
- 229910052737 gold Inorganic materials 0.000 claims description 12
- 239000010931 gold Substances 0.000 claims description 12
- 238000003801 milling Methods 0.000 claims description 11
- 230000003746 surface roughness Effects 0.000 claims description 7
- 229910052790 beryllium Inorganic materials 0.000 claims description 6
- -1 zirconium-copper-aluminium-nickel Chemical compound 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 229910001018 Cast iron Inorganic materials 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims description 2
- 239000010985 leather Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910001000 nickel titanium Inorganic materials 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004576 sand Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 150000003754 zirconium Chemical class 0.000 claims 2
- 239000003921 oil Substances 0.000 claims 1
- 238000002425 crystallisation Methods 0.000 abstract description 7
- 230000008025 crystallization Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 238000004381 surface treatment Methods 0.000 description 6
- 238000005461 lubrication Methods 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004781 supercooling Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C45/00—Amorphous alloys
- C22C45/10—Amorphous alloys with molybdenum, tungsten, niobium, tantalum, titanium, or zirconium or Hf as the major constituent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12993—Surface feature [e.g., rough, mirror]
Abstract
Description
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010168988.4A CN102240926B (zh) | 2010-05-13 | 2010-05-13 | 锆基块体非晶合金表面研磨方法 |
US12/854,309 US8070559B1 (en) | 2010-05-13 | 2010-08-11 | Zr-rich bulk amorphous alloy article and method of surface grinding thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010168988.4A CN102240926B (zh) | 2010-05-13 | 2010-05-13 | 锆基块体非晶合金表面研磨方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102240926A CN102240926A (zh) | 2011-11-16 |
CN102240926B true CN102240926B (zh) | 2013-06-05 |
Family
ID=44912055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010168988.4A Active CN102240926B (zh) | 2010-05-13 | 2010-05-13 | 锆基块体非晶合金表面研磨方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8070559B1 (zh) |
CN (1) | CN102240926B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8323072B1 (en) * | 2007-03-21 | 2012-12-04 | 3M Innovative Properties Company | Method of polishing transparent armor |
CN101987396B (zh) * | 2009-07-31 | 2014-02-19 | 鸿富锦精密工业(深圳)有限公司 | 锆基块体非晶合金激光焊接方法及焊接结构 |
CN102560304B (zh) * | 2010-12-28 | 2014-02-19 | 鸿富锦精密工业(深圳)有限公司 | 非晶合金表面处理方法及采用该方法制得的非晶合金件 |
CN102634840B (zh) * | 2012-05-02 | 2014-08-13 | 浙江大学 | 锆合金的电化学抛光电解液及其电化学抛光方法 |
CN102962756B (zh) * | 2012-12-12 | 2015-01-21 | 天津中环领先材料技术有限公司 | 一种可获得高抛光速率的单晶硅晶圆片抛光工艺 |
CN103273384B (zh) * | 2013-04-29 | 2015-07-01 | 云南昆钢重型装备制造集团有限公司 | 钛金属表面镜面抛光方法 |
CN105171536B (zh) * | 2015-08-11 | 2017-10-17 | 上海华虹宏力半导体制造有限公司 | 化学机械研磨方法 |
JP2018075700A (ja) * | 2016-11-11 | 2018-05-17 | 株式会社フジミインコーポレーテッド | 物品の製造方法 |
CN108214282B (zh) * | 2016-12-14 | 2020-12-15 | 邱瑛杰 | 平面研磨机 |
CN106975929B (zh) * | 2017-06-01 | 2019-01-04 | 山东华晶新材料股份有限公司 | 一种三头机 |
CN108247432A (zh) * | 2017-12-29 | 2018-07-06 | 上海驰声新材料有限公司 | 一种非晶合金镜面效果的抛光方法 |
CN108068003A (zh) * | 2017-12-29 | 2018-05-25 | 上海驰声新材料有限公司 | 一种非晶合金进胶口快速研磨去除的方法和装置 |
Citations (6)
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US6203412B1 (en) * | 1999-11-19 | 2001-03-20 | Chartered Semiconductor Manufacturing Ltd. | Submerge chemical-mechanical polishing |
US6431959B1 (en) * | 1999-12-20 | 2002-08-13 | Lam Research Corporation | System and method of defect optimization for chemical mechanical planarization of polysilicon |
CN1456401A (zh) * | 2003-06-23 | 2003-11-19 | 北京科技大学 | 一种非晶合金精密零部件超塑性模锻成形装置及方法 |
US6769961B1 (en) * | 2003-01-15 | 2004-08-03 | Lam Research Corporation | Chemical mechanical planarization (CMP) apparatus |
CN101191184A (zh) * | 2006-11-30 | 2008-06-04 | 中国科学院物理研究所 | 一种塑性增强的大块金属玻璃材料及其制备方法 |
CN101613845A (zh) * | 2008-06-25 | 2009-12-30 | 比亚迪股份有限公司 | 一种锆基非晶合金复合材料及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
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DE69015652T2 (de) * | 1989-01-26 | 1995-05-11 | Fuji Photo Film Co Ltd | Weichmagnetischer dünner Film, Verfahren zu seiner Herstellung und Magnetkopf. |
US5655954A (en) * | 1994-11-29 | 1997-08-12 | Toshiba Kikai Kabushiki Kaisha | Polishing apparatus |
US5934980A (en) * | 1997-06-09 | 1999-08-10 | Micron Technology, Inc. | Method of chemical mechanical polishing |
CA2240535C (en) * | 1997-06-20 | 2003-04-29 | Cd Repairman, Inc. | Method and apparatus for re-conditioning compact discs |
JP3428899B2 (ja) * | 1997-07-09 | 2003-07-22 | 明久 井上 | ゴルフクラブ |
JP3374055B2 (ja) * | 1997-08-19 | 2003-02-04 | 住友ゴム工業株式会社 | ゴルフクラブヘッド |
JP3852805B2 (ja) * | 1998-07-08 | 2006-12-06 | 独立行政法人科学技術振興機構 | 曲げ強度および衝撃強度に優れたZr基非晶質合金とその製法 |
US6227949B1 (en) * | 1999-06-03 | 2001-05-08 | Promos Technologies, Inc. | Two-slurry CMP polishing with different particle size abrasives |
US6376009B1 (en) * | 1999-11-01 | 2002-04-23 | Hans Bergvall | Display unit and method of preparing same |
US6957511B1 (en) * | 1999-11-12 | 2005-10-25 | Seagate Technology Llc | Single-step electromechanical mechanical polishing on Ni-P plated discs |
US20020004358A1 (en) * | 2000-03-17 | 2002-01-10 | Krishna Vepa | Cluster tool systems and methods to eliminate wafer waviness during grinding |
US6558238B1 (en) * | 2000-09-19 | 2003-05-06 | Agere Systems Inc. | Apparatus and method for reclamation of used polishing slurry |
US7077728B1 (en) * | 2005-04-07 | 2006-07-18 | Advanced Micro Devices, Inc. | Method for reducing edge array erosion in a high-density array |
US7799689B2 (en) * | 2006-11-17 | 2010-09-21 | Taiwan Semiconductor Manufacturing Company, Ltd | Method and apparatus for chemical mechanical polishing including first and second polishing |
-
2010
- 2010-05-13 CN CN201010168988.4A patent/CN102240926B/zh active Active
- 2010-08-11 US US12/854,309 patent/US8070559B1/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6203412B1 (en) * | 1999-11-19 | 2001-03-20 | Chartered Semiconductor Manufacturing Ltd. | Submerge chemical-mechanical polishing |
US6431959B1 (en) * | 1999-12-20 | 2002-08-13 | Lam Research Corporation | System and method of defect optimization for chemical mechanical planarization of polysilicon |
US6769961B1 (en) * | 2003-01-15 | 2004-08-03 | Lam Research Corporation | Chemical mechanical planarization (CMP) apparatus |
CN1456401A (zh) * | 2003-06-23 | 2003-11-19 | 北京科技大学 | 一种非晶合金精密零部件超塑性模锻成形装置及方法 |
CN101191184A (zh) * | 2006-11-30 | 2008-06-04 | 中国科学院物理研究所 | 一种塑性增强的大块金属玻璃材料及其制备方法 |
CN101613845A (zh) * | 2008-06-25 | 2009-12-30 | 比亚迪股份有限公司 | 一种锆基非晶合金复合材料及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
US8070559B1 (en) | 2011-12-06 |
CN102240926A (zh) | 2011-11-16 |
US20110281137A1 (en) | 2011-11-17 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: JIZHUN PRECISION INDUSTRY (HUIZHOU) CO., LTD. Free format text: FORMER OWNER: HONGFUJIN PRECISE INDUSTRY (SHENZHEN) CO., LTD. Effective date: 20150428 Free format text: FORMER OWNER: HONGFUJIN PRECISE INDUSTRY CO., LTD. Effective date: 20150428 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 516100 HUIZHOU, GUANGDONG PROVINCE |
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TR01 | Transfer of patent right |
Effective date of registration: 20150428 Address after: 516100 Guangdong County of Boluo Province town of Huizhou city dragon Xia Liao Village Gate Village Group Twelve ditch area Patentee after: JI ZHUN PRECISION INDUSTRY (HUI ZHOU) Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) Co.,Ltd. Patentee before: HON HAI PRECISION INDUSTRY Co.,Ltd. |
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Effective date of registration: 20180810 Address after: 518109 Zone A and Zone 1 of Foxconn Science Park Zone D1 Plastic Mould Factory, No.2 East Ring Road, Longhua Street, Longhua District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN JINGJIANG YUNCHUANG TECHNOLOGY Co.,Ltd. Address before: 516100 twelve village section of gate village group of Xia Liao village, Longxi Town, Boluo County, Huizhou, Guangdong Patentee before: JI ZHUN PRECISION INDUSTRY (HUI ZHOU) Co.,Ltd. |
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Address after: 518109, 1st Floor, Building B3, Foxconn Industrial Park, No. 2 East Ring 2nd Road, Fukang Community, Longhua Street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Fulian Jingjiang Technology Co.,Ltd. Address before: 518109 Zone A and Zone 1 of Foxconn Science Park Zone D1 Plastic Mould Factory, No.2 East Ring Road, Longhua Street, Longhua District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN JINGJIANG YUNCHUANG TECHNOLOGY Co.,Ltd. |
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CP03 | Change of name, title or address |