Background technology
The conventional condenser contact panel is outside liquid crystal, colored filter, touch-control circuit need have at least one extra glass substrate, has the ITO of flagpole pattern in described glass substrate both sides, and the ITO of levels is arranged perpendicular, side in glass substrate is formed with plain conductor, as shown in Figure 1.And the formation of ITO electrode and plain conductor is to form in the contact panel process to influence cost of manufacture and the most important key factor of quality.
Fig. 2 shows the method for touch-control circuit in the traditional preparation process contact panel.Traditional method is to utilize the mode of wet etching to form circuit; at first clean the glass substrate of the two-sided ITO of being formed with; on the ITO of substrate first side, apply photoresist; after the pre-process of baking, expose, developing of described photoresist process; ITO on glass substrate second side relative with above-mentioned first side applies photoresist comprehensively, with the ITO of cover glass substrate second side.Afterwards, glass substrate is immersed in the etching solution, to remove the unwanted ITO of substrate first side; Then, remove the photoresist of substrate both sides again, promptly form at first circuit of glass substrate first side.
Then, the method for the repeat patterns glass substrate first side ITO is with the ITO of patterned substrate second side, to form second circuit in substrate second side.
Traditional wet etching mode must be through twice coating photoresist, remove the step of photoresist.If form at existing liquid crystal of a side of substrate or colored filter, the destruction that the step of coating photoresist and immersion etching solution will cause liquid crystal or colored filter, so traditional contact panel production method, touch-control circuit must be formed on the different substrates with liquid crystal and colored filter, will have the substrate combination of substrate and the colored filter and the liquid crystal of touch-control circuit again.
Because the compact demand of electronic installation, many hand-held electronic devices carry for convenience, more require integral thickness more frivolous, and traditional wet etching mode have increased the degree of difficulty of integrated substrate.In sum, tradition having on the glass substrate of ITO not only time-consuming the taking a lot of work of mode that forms circuit, has also increased the integral thickness of electronic installation in the wet etching mode, therefore, is badly in need of a kind of technology that can the integrated package substrate.
In addition, because the contaminant particles that may exist on each substrate, the bubble that substrate attaching may cause and the alignment issues of substrate attaching all will influence the qualification rate of electronic installation manufacturing process, and contact area is big more, the degree of difficulty of fitting is high more, therefore, be badly in need of a kind of process structure that can reduce substrate demand in the contact panel.
Summary of the invention
For effectively reducing the substrate quantity of electronic installation, the present invention with the touch-control circuit of contact panel be integrated on the minute surface, on the substrate of colored filter or on the polaroid, so may reduce the substrate quantity that needs applying, thereby the problem that effectively reduces substrate attaching and caused, and effectively reduce the contact panel integral thickness.
One embodiment of the invention are contact panels, comprise first substrate, comprise first side with first circuit; Second substrate comprises the opposite side on described first side that is disposed at described first substrate, and has second side of second circuit; And the 3rd substrate, be disposed on described second side of described second substrate.
The second embodiment of the present invention is a kind of contact panel, comprises first substrate, comprises first side with first circuit; Second substrate comprises on described first side that is disposed at described first substrate; And the 3rd substrate, comprise the opposite side on second side that is disposed at described second substrate, and described first side has second circuit.
The third embodiment of the present invention is a kind of contact panel, and it comprises first substrate; Second substrate comprises first side that is disposed on described first substrate, has first circuit on described first side; And the 3rd substrate, be disposed on second side of described second substrate, and on a side of described second substrate, have second circuit.
The fourth embodiment of the present invention is a kind of contact panel, and it comprises first substrate; Second substrate is disposed on described first substrate, has first circuit and second circuit respectively in the both sides of described second substrate; And the 3rd substrate, be disposed on described second substrate.
The 5th embodiment provided by the invention is a kind of contact panel, and it comprises first substrate, comprises first side with circuit; Second substrate is disposed on described first side of described first substrate.
The 6th embodiment provided by the invention is a kind of contact panel, and it comprises first substrate; Second substrate is disposed on described first substrate, has circuit on a side of described second substrate; And the 3rd substrate, be disposed on described second substrate.
The seventh embodiment of the present invention is a kind of contact panel, and it comprises first substrate; Second substrate is disposed on described first substrate; And the 3rd substrate, be disposed on described second substrate, on a side of described second substrate, have circuit in described the 3rd substrate surface.
Embodiment
Fig. 3 shows disclosed a kind of touch panel structure provided, have first substrate 301, second substrate 302 and the 3rd substrate 303, in such structure, circuit can consider to be formed on first substrate 301 towards first side of second substrate 302, the both sides and the 3rd substrate 303 inboards of second substrate 302, promptly towards a side of second substrate.
The embodiment that provides of the present invention utilizes jet printing technique in first side of first substrate 301, with first side of conductive material spray printing to first substrate, and utilize the laser beam marking method, the conductive material of spray printing is carved except that unwanted part, to form first circuit 3011 in first substrate, 301 first sides; Second substrate 302 is disposed on first side of described first substrate, is formed with second circuit 3021 in the side with respect to described first substrate, and the method that forms second circuit 3021 can be identical with the method that forms first circuit 3011; And the 3rd substrate 303 is disposed at described second substrate 302 and is formed with on the side of second circuit 3021.
In other embodiment, first circuit 3011 and second circuit 3021 are configurable in different layers, and reach function of multi-spot touch.
In addition, the other method that forms first circuit is that first side at first substrate 301 is pre-formed indium tin oxide (ITO), utilizes the laser beam marking method, ITO is carved remove unwanted part, to form first circuit 3011 in first substrate, 301 first sides.The method of above-mentioned two kinds of dry type patternings is different from the method that the conventional wet etching forms circuit, and the substrate that is suitable for being pre-formed with other assembly is integrated.
In an embodiment, first substrate 301 has had preformed colored filter 3012 in second side relative with first side, be pre-formed planarization resin 3013 in colored filter 3012 outsides even, reached the ITO back electrode 3014 that joins with below liquid crystal 304.Therefore, the substrate of the substrate of colored filter 3012 and first circuit 3011 is integrated, must form first circuit 3011 by the mode of dry type patterning, if utilize the etched mode of conventional wet, form circuit at substrate back, will destroy assemblies such as preformed colored filter with colored filter 3012.Therefore, by the mode of dry type patterning, can the substrate of colored filter substrate and circuit to be formed is integrated, the quantity required of substrate be can effectively reduce, and then substrate attaching and effective integral thickness that reduces contact panel reduced.
In a preferred embodiment, above-mentioned first circuit 3011 is driving circuits of contact panel, and second circuit 3021 is sensing circuits.In another embodiment, above-mentioned second substrate 302 is polaroids of contact panel, and the minute surface (cover lens) that above-mentioned the 3rd substrate 303 is contact panel surfaces has the function of optical characteristics and protection touch control component.
In another embodiment, above-mentioned second substrate 302 can be extra plastic, is disposed between polaroid and the eyeglass 303, and so above-mentioned second circuit 3021 can be formed on the plastic by wet etching or dry type patterning method.
In addition, but additional configuration one deck UV film optical cement is between above-mentioned second substrate and the 3rd substrate, utilize vacuum mode with two substrate attachings again, can reduce the problems such as unevenness, space, alignment error or assembly injury that may cause because of the attaching process between two substrates, to reduce the degree of difficulty of substrate attaching.
Fig. 4 shows that disclosed another is touch panel structure provided, include first substrate 401, second substrate 402 and the 3rd substrate 403, wherein be used in the formula patterning method and form first circuit 4011 in first side of first substrate 401, on first side of first substrate 401, dispose second substrate 402, on described second substrate 402, dispose the 3rd substrate 403 again, and on the 3rd substrate, side towards second substrate, be formed with second circuit 4031, described second circuit 4031 utilizes the dry type patterning method to form.
In a preferred embodiment, first substrate 401 has had preformed colored filter 4012 in second side relative with first side, has been pre-formed planarization resin 4013 and ITO back electrode 4014 in colored filter 4012 outsides even.Therefore, by the mode of dry type patterning, can the substrate of the colored filter substrate and first circuit 4011 is integrated, and then effectively reduce the integral thickness of contact panel.
In a preferred embodiment, above-mentioned first circuit 4012 is driving circuits of contact panel, and second circuit 4031 is sensing circuits.In another embodiment, above-mentioned second substrate 402 is polaroids of contact panel, and above-mentioned the 3rd substrate 403 is the minute surfaces on contact panel surface.
In addition, but additional configuration one deck UV film optical cement utilizes vacuum mode with two substrate attachings between above-mentioned second substrate 402 and the 3rd substrate 403 again, to reduce the degree of difficulty of substrate attaching.
Fig. 5 shows that disclosed another is touch panel structure provided, comprise first substrate 501, second substrate 502 and the 3rd substrate 503, wherein on first side of first substrate 501, utilize the dry type patterning method to form first circuit 5021 at second substrate 502, and on the 3rd substrate 503, side towards second substrate 502, be formed with second circuit 5031, described second circuit 5031 also can utilize the dry type patterning method to form.
In a preferred embodiment, second substrate 502 has polaroid, the 3rd substrate 503 is eyeglasses, therefore, utilize dry type patterning mode to form first circuit 5021 and second circuit 5031, just can not destroy the optical characteristics of polaroid and eyeglass, therefore, the polaroid and first circuitry substrate are able to integrated, and eyeglass can be integrated with the second circuit substrate, effectively reduces the contact panel integral thickness.
The first above-mentioned circuit 5021 can be the driving circuit of contact panel, and second circuit 5031 is sensing circuits.In another embodiment, above-mentioned second substrate 502 is extra plastic, is disposed between polaroid and the 3rd substrate 503 (eyeglass).
Moreover, but additional configuration one deck UV film optical cement utilizes vacuum mode with two substrate attachings between above-mentioned second substrate 502 and the 3rd substrate 503 again.
Fig. 6 shows the structure of another disclosed contact panel, it comprises first substrate 601, second substrate 602 and the 3rd substrate 603, wherein second substrate 602 is disposed on first substrate 601, and the both sides of second substrate 602 have first circuit 6021 and second circuit 6022 respectively, dispose three substrate 603 with first substrate 601 on offside at second substrate 602.In an embodiment, above-mentioned first substrate 601 has had preformed colored filter 6012 at the opposite side that will dispose second substrate 602.Planarization resin 6013 and ITO back electrode 6014 may be pre-formed in colored filter 6012 outsides even.In addition, above-mentioned second substrate 602 can be a colored filter, therefore, utilizes the dry type patterning method to form first circuit 6021 and second circuit 6022 in the both sides of second substrate 602 and will can not destroy original colored filter.And can make the circuitry substrate of contact panel and colored filter substrate integrated, and then effectively reduce the integral thickness of contact panel.
In another preferred embodiment, above-mentioned second substrate 602 can be a plastic, utilizes dry type patterning mode to form circuit in the plastic both sides, can improve the qualification rate of technology.In an embodiment, above-mentioned first circuit 6021 is driving circuits of contact panel, and second circuit 6022 is sensing circuits.In addition, the 3rd substrate 603 that is disposed on described second substrate 602 is the minute surfaces on contact panel surface.
The present invention provides the embodiment of another contact panel in addition, comprises first substrate 701 and second substrate 703 of contact panel, wherein disposes second substrate 703 on first side of first substrate 701, and is formed with circuit 7011 on first side of first substrate 701.Described circuit 7011 can utilize the dry type patterning method to form.
In a preferred embodiment, second substrate 703 is eyeglass (cover lens), has optical property and protection touch-control circuit.
In a preferred embodiment, first substrate 701 has had preformed colored filter 7012 in second side relative with first side, has been pre-formed planarization resin 7013 and ITO back electrode 7014 in colored filter 7012 outsides even.Therefore, by the mode of dry type patterning, can the substrate of colored filter substrate and circuit 7011 is integrated, and then effectively reduce the integral thickness of contact panel.
The ITO that present embodiment can utilize laser beam marking will be formed at first substrate, 701 first sides is patterned as list structure, form the touch pattern of configured in parallel, utilize jet printing technique again, with insulating material and conductive material spray printing in adjacent or parallel touch pattern, making between two touch pattern can conducting, last again with the insulating material and the conductive material of laser beam marking patterning spray printing, to form circuit 7011.Belong to single-point touch at the individual layer touch-control circuit that present embodiment provided.In a preferred embodiment, foregoing circuit 7011 includes the driving circuit and the sensing circuit of contact panel.
In another embodiment, as shown in Figure 7, between first substrate 701 and second substrate 703, have the 3rd substrate 702 in addition, it is the polaroid of contact panel.
Fig. 8 shows the structure of another disclosed contact panel, first substrate 801, second substrate 802 and the 3rd substrate 803 that comprise contact panel, wherein on first side of first substrate 801, dispose second substrate 802, and dispose the 3rd substrate 803 at the opposite side of second substrate 802, and a wherein side of second substrate 802 is formed with circuit 8021, and described circuit forms with the dry type patterning.
In a preferred embodiment, second substrate 802 is polaroids, will can not destroy the optical characteristics of polaroid by the mode of dry type patterning, can polaroid and circuit 8021 is integrated, and then effectively reduce the integral thickness of contact panel.And above-mentioned the 3rd substrate 803 can be the minute surface on contact panel surface.
In an embodiment, circuit 8021 driving circuit that comprises contact panel is ridden sensing circuit.In addition between second substrate 802 and the 3rd substrate 803, but additional configuration one deck UV film optical cement utilizes vacuum mode with two substrate attachings between above-mentioned second substrate 802 and the 3rd substrate 803 again.
Fig. 9 shows the structure of disclosed another contact panel, it comprises first substrate 901, second substrate 902 and the 3rd substrate 903, wherein second substrate 902 is disposed on first substrate 901, the 3rd substrate 903 is disposed on second substrate 902 again, be formed with circuit 9031 at described the 3rd substrate 903 towards a side of second substrate 902, described circuit forms with the dry type patterning.
In a preferred embodiment, the 3rd substrate 903 is the minute surfaces on contact panel surface, utilize the dry type Patternized technique to form circuit, can avoid conventional wet etching mode etching solution to damage to specular surface, therefore can the substrate and the minute surface of circuit 9031 is integrated, and then effectively reduce the integral thickness of contact panel.
In addition, circuit 9031 comprises the driving circuit and the sensing circuit of contact panel.First substrate 901 can comprise colored filter again, and second substrate 902 can be a polaroid.Moreover, between second substrate 902 and the 3rd substrate 903, can utilize vacuum with two substrate attachings by UV film optical cement.
Disclosed contact panel can be integrated into the touch-control circuit of contact panel on the minute surface, on the substrate of colored filter or on the polaroid, so may reduce the substrate quantity that needs applying, thereby the problem that effectively reduces substrate attaching and caused, and effectively reduce the contact panel integral thickness.
Though technology contents of the present invention and feature are as mentioned above, yet the those skilled in the art still can carry out many variations and modification under the situation that does not deviate from teaching of the present invention and disclosure.Therefore, scope of the present invention is not to be defined in the embodiment that has disclosed, does not deviate from other variation of the present invention and revises and comprise, its scope for containing as appended claims.