JP2009145717A - Method of manufacturing electrooptical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electrooptical device capable of preventing generation of flaws of a substrate due to glass powder generated when a mother substrate is parted. <P>SOLUTION: In the method of manufacturing the electrooptical device by which the mother substrate is parted to form a plurality of substrates for electrooptical devices, prior to a step of parting the mother substrate, coating films 14 and 24 composed of resin coated layers 13 and 23 constituted of a polyurethane or a polyester and silicon based coated layers 12 and 22 as hard coat layers containing a silicon based material are formed on at least one surface of the mother substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electro-optical device in which a light-transmitting substrate is divided to form a plurality of electro-optical device substrates.

  Conventionally, a display device such as a liquid crystal display device is known as an electro-optical device. For example, as a method of manufacturing a liquid crystal display device, a method of manufacturing a liquid crystal display device by so-called multiple chamfering is known in which a plurality of substrates for a liquid crystal display device are cut out from a single bonded mother substrate. When the individual substrates are cut out, for example, as disclosed in Patent Document 1, cutting is performed using a blade at the time of cutting.

JP-A-9-309736

  By the way, glass powder is generated when the groove for dividing is formed on the surface of the mother substrate using the blade as described above. And there exists a problem that a damage | wound may generate | occur | produce on the surface of the board | substrate for each liquid crystal display device by this glass powder. If the surface of the substrate for a liquid crystal display device is damaged, the strength of the substrate will drop dramatically, and the liquid crystal display device may be affected by an impact such as dropping an electronic device equipped with this liquid crystal display device. The risk of breakage increases.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A method for manufacturing an electro-optical device in which a light-transmitting mother substrate is divided to form a plurality of electro-optical device substrates, and the mother substrate is separated prior to the step of dividing the mother substrate. A method of manufacturing an electro-optical device, comprising a step of forming a hard coat layer including a silicon-based material on at least one surface.

  According to such a configuration, prior to the step of dividing the mother substrate, a hard coat layer including a silicon-based material is formed on at least one surface of the mother substrate. Since the hard coat layer can prevent the glass powder generated when the mother substrate is divided from coming into direct contact with the mother substrate, the glass powder can prevent scratches on the surface of the mother substrate. Accordingly, it is possible to provide a method for manufacturing an electro-optical device that can prevent scratches that are the starting points of cracking of individual substrates from which the mother substrate is divided.

  [Application Example 2] A method for manufacturing the electro-optical device, comprising: a step of forming a resin coat layer on at least one surface of the substrate prior to the step of forming the hard coat layer. Manufacturing method.

  According to such a configuration, since the resin coat layer disperses, absorbs, or alleviates the impact applied to the electro-optical device from the outside, an electro-optical device having higher durability against impact and load and higher reliability is provided. It becomes possible to do.

  Application Example 3 A method for manufacturing an electro-optical device, wherein the mother substrate is a glass substrate.

  According to such a configuration, it is possible to provide a method for manufacturing an electro-optical device in which a glass substrate that is likely to be cracked starting from a scratch on the surface is less likely to be damaged by dropping or loading.

  Application Example 4 A method for manufacturing an electro-optical device according to the above-described method, wherein the mother substrate is used as a pair, the pair of mother substrates are bonded together, and then the pair of mother substrates are divided.

  According to such a structure, after bonding a pair of mother substrates, the mother substrates are divided. A hard coat layer including a silicon-based material is formed on at least one surface of the pair of mother substrates. Since the hard coat layer can prevent the glass powder generated when the pair of mother substrates are divided from coming into direct contact with the mother substrate, the glass powder can prevent scratches on the surface of the mother substrate. As a result, it is possible to prevent the scratches that are the starting points of the cracks of the individual substrates from which the pair of bonded mother substrates are separated.

  Application Example 5 A method for manufacturing the electro-optical device, the method including: a step of using the mother substrate as a pair, and bonding the pair of mother substrates, and then forming the hard coat layer. Method.

  According to such a configuration, the hard coat layer is formed on at least one surface of the mother substrate before the pair of bonded mother substrates are divided. Since the hard coat layer can prevent the glass powder generated when the pair of mother substrates are divided from coming into direct contact with the mother substrate, the glass powder can prevent scratches on the surface of the mother substrate. As a result, it is possible to prevent the scratches that are the starting points of the cracks of the individual substrates from which the pair of bonded mother substrates are separated.

  Application Example 6 In the method for manufacturing the electro-optical device, the hard coat layer is formed by a dipping method.

  According to such a configuration, it is possible to form hard coat layers on both sides of the electro-optical device at a time, so that it is possible to efficiently manufacture a highly reliable electro-optical device.

  Application Example 7 In the method for manufacturing the electro-optical device, the hard coat layer is formed by a spin coating method.

  According to such a configuration, it is possible to individually control the film thicknesses of the hard coat layers formed on both surfaces of the electro-optical device. Therefore, by adapting the film thickness of the hard coat layer to the usage pattern of the electro-optical device, it is possible to manufacture an electro-optical device with higher durability and higher reliability.

(First embodiment)
A first embodiment of the present invention will be described below with reference to the drawings, taking a transmissive liquid crystal panel as an example of an electro-optical device as an example. FIG. 1 is a perspective view of an electro-optical device. 2 is a cross-sectional view taken along the line II-II in FIG.

  As shown in FIGS. 1 and 2, the electro-optical device 1 according to this embodiment includes a TFT substrate 10 and a counter substrate 20, which are a pair of substrates made of translucent glass, quartz, resin, and the like. A liquid crystal 41 that is an electro-optic material is sandwiched between the two. The electro-optical device 1 is a device that changes the orientation of the liquid crystal 41 based on an image signal input from an external device (not shown) that is electrically connected, and modulates light transmitted through the image display region 1a according to the image signal. It is.

  The TFT substrate 10 and the counter substrate 20 are each a rectangular flat plate in plan view, and are bonded together with a frame-shaped sealing material 40 at a predetermined interval. A liquid crystal 41 is sealed in a region surrounded by both substrates and the sealing material 40.

  In the image display area 1a on the surface of the TFT substrate 10 on the counter substrate 20 side, a plurality of scanning lines and data lines arranged to cross each other, and corresponding to the intersections of the scanning lines and the data lines are provided. A laminated structure 11 such as a pixel electrode and a thin film transistor for switching the pixel electrode is formed. On the other hand, in the image display region 1a on the surface of the counter substrate 20 on the TFT substrate 10 side, a laminated structure 21 such as a color filter provided corresponding to the common electrode or the pixel electrode is formed.

  The TFT substrate 10 is formed larger than the counter substrate 20, and the TFT substrate 10 extends in one direction from the counter substrate 20 in a state where the electro-optical device 1 is viewed from the side of the counter substrate 20. 42.

  A plurality of mounting terminals 32 are formed on the surface of the overhanging portion 42 of the TFT substrate 10 on the counter substrate 20 side. On the mounting terminals 32, a driver IC 30 as a driving circuit and a flexible wiring board (hereinafter referred to as FPC). (Referred to as “Flexible Printed Circuit”) 31 is implemented. The driver IC 30 is electrically connected to an external device via the FPC 31. The driver IC 30 may be mounted on the FPC 31.

  The scanning lines and data lines formed on the TFT substrate 10 are electrically connected to the driver IC 30. The driver IC 30 converts the scanning lines and data lines to the scanning lines and data lines at a predetermined timing in accordance with an image signal supplied from an external device. The electro-optical device 1 is driven by supplying a signal.

  Films 14 and 24 are formed on the surface of the TFT substrate 10 opposite to the counter substrate 20 and on the surface of the counter substrate 20 opposite to the TFT substrate 10, respectively. That is, the electro-optical device 1 of the present embodiment is configured by bonding a TFT substrate 10 as a first substrate and a counter substrate 20 as a second substrate, and has a coating 14 and a coating 14 on the surface thereof. 24 is formed. Further, polarizing plates 15 and 25 are attached to the respective surfaces of the coatings 14 and 24.

  The coatings 14 and 24 both have the same structure consisting of two layers, and the resin coating layers 13 and 23 formed on the side (lower layer side) in contact with the TFT substrate 10 and the counter substrate 20, and the upper layers thereof That is, it is composed of the silicon-based coat layers 12 and 22 formed on the outermost surface.

  The resin coat layers 13 and 23 are transparent thin films made of a resin such as polyester or polyurethane, and have a film thickness of approximately 0.1 μm to 10 μm. In the present embodiment, the resin coat layers 13 and 23 have a film thickness of 1 μm.

On the other hand, the silicon-based coat layers 12 and 22 are so-called hard coat layers made of a silicon-based material, which are transparent and hard thin films in which fine particles of silica (SiO ₂ ) are dispersed in a binder. The film thickness of the silicon-based coat layers 12 and 22 is about 0.1 μm to 10 μm, and in this embodiment, 1 μm. The silicon-based coating layers 12 and 22 are formed by applying and baking a liquid containing a silica-based fine particle, a resin, a binder made of an organic silicon compound, a surfactant, and other additives.

  The electro-optical device 1 according to the present embodiment described above has, on its surface, a coating 14 formed of resin coat layers 13 and 23 made of a resin such as polyester and polyurethane, and silicon coat layers 12 and 22 made of a silicon-based material, and 24.

  Here, the resin coat layers 13 and 23 have an effect of dispersing, absorbing or mitigating the impact applied to the electro-optical device 1 from the outside due to its elasticity. Further, since the silicon-based coating layers 12 and 22 are hard coatings, they have an effect of improving the scratch resistance of the surface of the electro-optical device 1.

  Therefore, the electro-optical device 1 according to the present embodiment has the silicon-based coating layers 12 and 22 formed on the surface thereof, so that no scratches are generated as a starting point for cracking of the substrate made of glass or the like. Since the layers 13 and 23 are formed, the impact applied from the outside is relieved, so that the layer has high impact resistance. That is, according to the present embodiment, it is possible to provide an electro-optical device that is less likely to be damaged due to dropping or load.

  Note that the TFT substrate 10 and the counter substrate 20 constituting the electro-optical device 1 made of glass are particularly susceptible to cracking due to the presence of scratches on the surface. Therefore, in the above-described embodiment, a film composed of two layers of the resin coat layer and the silicon-based coat layer is formed on the surface of the electro-optical device 1. However, the scratch resistance of the surface of the electro-optical device 1 is improved. Even when only the silicon-based coating layer is formed, the impact resistance of the electro-optical device 1 is improved.

  In the above-described embodiment, the coatings 14 and 24 are formed on both surfaces of the electro-optical device 1, but the same effect is obtained even when the coating 24 is formed only on one side, for example, the counter substrate 20 side. Is.

  Next, a method for manufacturing the above-described electro-optical device, particularly a method for forming the films 14 and 24 will be described below. FIG. 3 is a flowchart illustrating a method for manufacturing the electro-optical device according to the present embodiment. FIG. 4 is a diagram for explaining the bonding of the two mother substrates 51 and 52 constituting the plurality of electro-optical devices 1. Since the manufacturing method of the electro-optical device other than the method of forming the coating films 14 and 24 is well known, the description thereof will be omitted or briefly described.

  In the present embodiment, the electro-optical device is manufactured by so-called multiple chamfering, in which a plurality of electro-optical device substrates are cut out from a single mother substrate. This mother substrate has translucency.

  First, on the mother substrate (TFT array substrate) 51 as shown in FIG. 4, the laminated structure 11 is formed in each of a plurality of TFT substrate forming regions 10a that will later become the TFT substrate 10 (step S1). As described above, the laminated structure 11 includes data lines, scanning lines, TFTs, pixel electrodes, and the like, and is formed by, for example, film formation by CVD or sputtering, patterning by photolithography, heat treatment, or the like.

  On the other hand, on the mother substrate 52, the laminated structure 21 is formed in each of the plurality of counter substrate forming regions 20a that will later become the counter substrate 20 (step S3). The laminated structure 21 includes a common electrode, a color filter, a black matrix, and the like, and is formed by, for example, film formation by CVD or sputtering, patterning by photolithography, heat treatment, or the like.

  Next, a frame-shaped sealing material 40 provided corresponding to the formation regions (10a, 20a) of the individual electro-optical devices on one opposing surface of the mother substrates 51 and 52, and a plurality of electro-optical devices. A frame-like sealing material 53 provided on the outer periphery of the mother substrate is formed so as to surround the formation region and prevent the solution from entering between the mother substrates in the subsequent film forming process (step S2). In the present embodiment, the sealing materials 40 and 53 are formed on the mother substrate 51.

  Then, in a vacuum atmosphere, a predetermined amount of liquid crystal 41 is dropped on the mother substrate 51 and surrounded by the sealing material 40, and the mother substrates 51 and 52 are set in a predetermined manner via the sealing materials 40 and 53. Position and bond together (step S4). As a result, an aggregate in which a plurality of structures that will later become the electro-optical device 1 is formed is created.

  Next, the mother substrates 51 and 52 bonded in step S4 are thinned by a substrate etching process (step S5). The etching process in the substrate etching process is performed by, for example, using an etching solution based on hydrofluoric acid for the mother substrates 51 and 52 using glass and immersing the mother substrates 51 and 52 in the etching solution. The mother substrates 51 and 52 are chemically etched from the outer surface exposed to the etching solution and gradually become thinner. Since the etching amount is determined by the etching time, the thicknesses of the mother substrates 51 and 52 to be obtained by appropriately setting the etching time, in other words, the etching processing amount can be determined.

  As a thinning method, in addition to a chemical method of immersing in an etching solution, a physical method of polishing the substrate surface is well known. Either method may be used to make the mother substrates 51 and 52 thinner, but in this embodiment, a chemical method of immersing in an etching solution is used. According to this method, there is an advantage that the substrate surface is easily flattened as compared with the physical method. Further, by thinning the substrate at this stage, it is possible to remove fine scratches generated up to this stage.

  Next, resin coat layers 13 and 23 are formed on the surface of the aggregate (step S6). Specifically, the aggregate is dipped in a solution containing polyester or polyurethane, and the solution is applied on the surface of the aggregate by pulling up at a predetermined speed, and then dried on the surface of the aggregate. The resin coat layers 13 and 23 having a predetermined film thickness are formed of polyester or polyurethane. At this time, the surfaces of the mother substrates 51 and 52 that have undergone various manufacturing processes, including scratches that could not be completely eliminated in step 5, have been damaged due to contact with the support base, etc. There is. However, by forming the resin coat layers 13 and 23, it is possible to fill the scratches generated on the surfaces of the mother substrates 51 and 52. Therefore, it is possible to prevent the damage caused by this scratch in the subsequent process.

  Next, silicon-based coat layers 12 and 22 as hard coat layers are formed on the resin coat layers 13 and 23 (step S7). Specifically, the silica-based fine particles are dispersed, and the aggregate is immersed in a solution containing a resin, a binder composed of an organosilicon compound, a surfactant, and other additives, and pulled up at a predetermined speed. The solution is applied on the resin coat layers 13 and 23. The silicon coating layers 12 and 22 are formed on the resin coating layers 13 and 23 by baking the solution. When the substrate is divided, which will be described later, the divided glass powder or the like is scattered, and the glass powder may cause scratches on the surfaces of the mother substrates 51 and 52. However, the formation of the silicon-based coating layers 12 and 22 reduces the generation of glass powder during the subsequent cutting process, and even if the glass powder is scattered during the subsequent cutting process, the mother substrate 51. And the surface of 52 can be guarded and generation | occurrence | production of a flaw can be prevented.

  Next, the electro-optical device 1 formed by bonding the pair of TFT substrates 10 and the counter substrate 20 is cut into individual pieces by dividing the aggregate formed by bonding the pair of mother substrates 51 and 52 into predetermined pieces (step) S8). In this division, for example, a mother substrate is cut using a rotating blade or the like, and a piece of electro-optical device 1 is cut. A similar blade or the like is used to cut the mother substrate, and then along the cut. A method of folding the electro-optical device 1 into individual pieces is used.

  At this time, since the mother substrates 51 and 52 are bonded to each other at the outer peripheral portion by the sealing material 53, the coatings 14 and 24 are not formed on the overhanging portion 42 of the electro-optical device 1. The driver IC 30 and the FPC 31 are mounted on the mounting terminal 32 of the overhanging portion 42, and the polarizing plates 15 and 25 are attached to the coating films 14 and 24 formed on the surface of the electro-optical device 1, respectively. The electro-optical device 1 shown in FIG. 4 is completed (step S9).

  In the electro-optical device manufacturing method described above, the coatings 14 and 24 are formed on the surface of the electro-optical device before it is cut out from the mother substrate. For this reason, glass powder is generated, and in the cutting process, which is a process in which the surface is easily damaged by this glass powder, a hard and highly scratch-resistant silicon-based coating layer has already been formed on the surface of the mother substrate. Thus, it is possible to prevent the occurrence of defects that cause scratches on the surface of the electro-optical device 1 in the cutting process.

  In the above-described embodiment, the coatings 14 and 24 are formed by a so-called dipping method. However, the coatings are formed by other known methods such as a spin coating method and a spray coating method. It may be a thing. For example, when a film is formed by a spin coating method, the film thickness can be different between the TFT substrate side and the counter substrate side, and the durability is further optimized in accordance with the use state of the electro-optical device. It is possible.

  In the above-described embodiment, the coatings 14 and 24 are described as being formed on the surface of the TFT substrate 10 opposite to the counter substrate 20 and on the surface of the counter substrate 20 opposite to the TFT substrate 10. However, it is not limited to this. The coatings 14 and 24 are formed on the surface of the TFT substrate 10 on the counter substrate 20 side and on the surface of the counter substrate 20 on the TFT substrate 10 side, or any one of the four surfaces described above. Even the structure formed in the above has the same effect.

  Further, the silicon-based coating layers 12 and 22 as the hard coating layer may be removed after the individual piece cutting (dividing) step (step S8), but if left as it is, scratches in the subsequent steps are generated. Can be further prevented.

  In this example, the method of forming the resin coat layers 13 and 23 and the silicon-based coat layers 12 and 22 after bonding the mother substrates 51 and 52 is described, but the present invention is not limited thereto. The resin coat layers 13 and 23 and the silicon-based coat layers 12 and 22 may be formed before the mother substrates 51 and 52 are divided. For example, the resin coat layers 13 and 23 are formed on the mother substrates 51 and 52, respectively. After forming the silicon-based coating layers 12 and 22, it is also possible to bond them together.

(Second Embodiment)
Below, the 2nd Embodiment of this invention is described with reference to FIG.5 and FIG.6. In this embodiment, a configuration of a display device with an input function as an electro-optical device to which the present invention is applied and a manufacturing method thereof will be described. FIG. 5 is a front sectional view showing a configuration of a display device with an input function as an electro-optical device according to the second embodiment, and FIG. 6 is a flowchart showing a manufacturing method of the display device with an input function.

  As shown in FIG. 5, the display device with an input function 100 according to the present embodiment is generally arranged so as to overlap with a liquid crystal device 105 as an image generation device and a surface on the display light emitting side of the liquid crystal device 105. A touch panel 101 (input device).

  The liquid crystal device 105 includes a transmissive active matrix liquid crystal panel (hereinafter simply referred to as a liquid crystal panel 105a). In the case of the transmissive liquid crystal panel 105a, a backlight device ( (Not shown). In the liquid crystal device 105, a first polarizing plate 181 is formed on the display light emission side with respect to the liquid crystal panel 105a, and a second polarizing plate 182 is formed on the opposite side.

  The liquid crystal panel 105 a includes a light-transmitting element substrate 150, a light-transmitting counter substrate 160 that is bonded to the element substrate 150 with a sealant 171, a counter substrate 160, and the element substrate 150. And a liquid crystal layer 155 held between them. In the element substrate 150, a driving IC 175 is COG mounted in an overhang region 159 that projects from the edge of the counter substrate 160, and a flexible substrate 173 is connected to the overhang region 159. Note that a drive circuit may be formed on the element substrate 150 at the same time as the switching elements on the element substrate 150.

  A touch panel 101 as an input function device is a resistance film type, and includes a translucent first substrate 110 in which a translucent first electrode 115 made of an ITO film (Indium Tin Oxide) is formed on a first surface 111. A sealing material is provided so that the first electrode 111 and 121 are opposed to each other with a predetermined gap between the light-transmitting second substrate 120 having the second electrode 125 made of an ITO film formed on the first surface 121. It is bonded together at 131, and the inside is an air layer. As the first substrate 110 and the second substrate 120, a light-transmitting thin plastic substrate or a thin glass substrate can be used. In this embodiment, both the first substrate 110 and the second substrate 120 are thin glass substrates. Is used. In the first substrate 110, a flexible substrate 133 is connected to an overhang region 119 that projects from the edge of the second substrate 120. A coating 143 is formed on the second surface 112 of the first substrate 110. The coating 143 has a two-layer structure, and includes a resin coating layer 141 formed in contact with the second surface 112 of the first substrate 110 and a silicon-based coating as a hard coating layer formed thereon. Layer 142.

  The touch panel 101 configured as described above is arranged so as to overlap the first polarizing plate 181 of the liquid crystal device 105 to constitute the display device 100 with an input function. In the display device with an input function 100, the liquid crystal device 105 can display a moving image or a still image in the image display area, and an instruction image when inputting to the display device with an input function 100 via the touch panel 101. Etc. are also displayed. Therefore, if the user views the instruction image displayed on the liquid crystal device 105 and presses the touch panel 101 with a finger, the second substrate 120 is bent, and the first electrode 115 and the second electrode 125 are pressed at the pressed position. Touch. Therefore, if the portion where the first electrode 115 and the second electrode 125 are in contact with each other is detected, the input information can be determined.

  Next, a method for manufacturing the display device with an input function according to the present embodiment will be described with reference to FIG. In the manufacturing method described below, a display device with a force function is manufactured by so-called multi-chamfering, in which a plurality of substrates for a display device with an input function are cut out from a single mother substrate. Further, since the manufacturing method of the liquid crystal device 105 is well known, the description thereof is omitted.

  First, on the mother substrate (not shown), the first electrode 115 is formed in a plurality of regions that will later become the first substrate 110 (step S101). The surface on which the first electrode 115 is formed becomes the first surface 111 of the first substrate 110. The first electrode 115 is formed by, for example, film formation by CVD or sputtering, patterning by photolithography, heat treatment, or the like.

  Next, on the mother substrate on which the first electrode 115 has already been formed, the sealing material 131 is applied to a plurality of regions that will be the individual first substrates 110 later (step S102).

  On the other hand, the second electrode 125 is formed on the first surface 121 of the second substrate 120 by, for example, forming an ITO film using a sputtering method or patterning using a photolithography technique (step S103).

  Next, the second substrate 120 is bonded to the mother substrate on which the sealing material 131 has already been applied so that the second electrode 125 faces the first electrode (step S104).

  Next, the resin coat layer 141 is formed on the second surface 112 of the mother substrate (step S105). Specifically, the aggregate is dipped in a solution containing polyester or polyurethane, and the solution is applied on the surface of the aggregate by pulling up at a predetermined speed, and then dried on the surface of the aggregate. A resin coat layer 141 made of polyester or polyurethane and having a predetermined thickness is formed. At this time, the surface of the mother substrate that has undergone various manufacturing processes may be damaged due to contact with the support base. However, by forming the resin coat layer 141, it is possible to fill the scratches generated on the surface of the mother substrate. Therefore, it is possible to prevent the damage caused by this scratch in the subsequent process.

  Next, a silicon-based coat layer 142 is formed on the resin coat layer 141 (step S106). Specifically, the silica-based fine particles are dispersed, and the aggregate is immersed in a solution containing a resin, a binder composed of an organosilicon compound, a surfactant, and other additives, and pulled up at a predetermined speed. The solution is applied on the resin coat layer 141. Then, the silicon coating layer 142 is formed by baking the solution.

  Next, the touch panel 101 formed by bonding the first substrate 110 and the second substrate 120 is cut into individual pieces by dividing the aggregate formed by bonding the mother substrate and the second substrate 120 into predetermined pieces (step S107). ). The mother substrate is divided by, for example, a method in which the mother substrate is cut into individual touch panels 101 using a rotating blade or the like, and a method in which a cut is made in the mother substrate using a similar blade or the like, and then folded along the cut. Etc. are used. When the substrate is divided, glass powder or the like generated by cutting or breaking is scattered, and the glass powder may damage the surface of the mother substrate. However, by forming the silicon-based coating layer 142 described above, the generation of glass powder and the like can be reduced, and the surface of the mother substrate can be guarded, and the generation of scratches due to the scattered glass powder. Can be prevented.

  Next, the flexible substrate 133 is connected to the first substrate 110 (step S108). The touch panel 101 is completed through the steps so far.

  Next, the display device 100 with an input function is completed by arranging and bonding the touch panel 101 to the liquid crystal device 105 that has been assembled in another process that is not described (step S109).

  According to the present embodiment, the silicon-based coating layer 142 formed on the mother substrate can guard the surface of the mother substrate from scattering of glass powder or the like generated by cutting or breaking when the substrate is divided. . Therefore, it is possible to prevent the surface of the mother substrate from being damaged by the scattered glass powder.

  Further, the resin coat layer 141 has an effect of dispersing and absorbing or mitigating the impact applied to the display device with an input function 100 from the outside due to its elasticity. Further, since the silicon-based coat layer 142 is a hard film, it has an effect of improving the scratch resistance of the surface of the display device 100 with an input function.

  Therefore, the display device with an input function 100 according to the present embodiment has no silicon scratches as starting points for cracking of the substrate made of glass or the like because the silicon-based coat layer 142 is formed on the surface thereof. Moreover, since the impact applied from the outside is relieved by forming the resin coat layer 141, it has high impact resistance. That is, according to the present embodiment, it is possible to provide the display device with an input function 100 that is less likely to be damaged by dropping or loading.

  The first substrate 110, the element substrate 150, and the counter substrate 160 made of glass are particularly susceptible to cracking due to the presence of scratches on the surface. Therefore, in the above-described embodiment, a film composed of two layers of the resin coat layer and the silicon-based coat layer is formed on the surface of each substrate. However, the surfaces of the first substrate 110, the element substrate 150, and the counter substrate 160 Even when only the silicon-based coating layer that improves the scratch resistance is formed, the impact resistance of the display device 100 with an input function is improved.

  In the second embodiment described above, the configuration in which the film 143 is formed on the first substrate 110 has been described. However, the present invention is not limited to this, and the film may be formed on the element substrate 150 and the counter substrate 160.

  The coating may be formed on the first surface 111 of the first substrate 110 or the surface of the element substrate 150 and the counter substrate 160 on the liquid crystal layer 155 side.

  In this example, the coating 143 is formed by a so-called dipping method, but the coating is formed by other known methods such as spin coating and spray coating. Also good.

  Further, the silicon-based coat layer 142 as the hard coat layer may be removed after the individual piece cutting (dividing) step (step S107), but if left as it is, the occurrence of scratches in the subsequent steps is further increased. It becomes possible to prevent.

  In this example, the method of forming the resin coat layer 141 and the silicon coat layer 142 after the bonding step (step S104) has been described, but the present invention is not limited to this. The resin coat layer 141 and the silicon-based coat layer 142 may be formed before the assembly dividing step (step S107). For example, the resin coat layer 141 and the silicon-based coat layer 142 are formed on the mother substrate. After that, the second substrate 120 can be attached.

(Third embodiment)
Below, the 3rd Embodiment of this invention is described with reference to FIG.7 and FIG.8. In the present embodiment, a configuration of an organic EL device as an electro-optical device to which the present invention is applied and a manufacturing method thereof will be described. FIG. 7 is a front sectional view showing the configuration of the organic EL device according to the third embodiment, and FIG. 8 is a flowchart showing the method for manufacturing the organic EL device. In the drawings shown below, the dimensions and ratios of the components are appropriately different from the actual ones in order to make the components large enough to be recognized on the drawings.

  First, the configuration of the organic EL device will be described with reference to FIG. The organic EL device 201 has a structure in which a light-transmitting glass substrate 210 is used as a base and each component is stacked thereon. A circuit element layer 219 including a TFT (Thin Film Transistor) element and various wirings (not shown) is formed on the glass substrate 210. Further, a coating 223 is formed on the surface of the glass substrate 210 opposite to the surface on which the circuit element layer 219 is formed. The coating 223 has a two-layer structure, and includes a resin coating layer 221 formed in contact with the glass substrate 210 and a silicon-based coating layer 222 formed thereon.

  A light-transmissive pixel electrode 211 made of ITO (Indium Tin Oxide) is formed on the circuit element layer 219 for each light emitting element 205. The light emitting elements 205 are formed at equal intervals so as to form a row along the longitudinal direction of the glass substrate 210. The pixel electrode 211 is connected to a TFT element formed on the circuit element layer 219.

  An inorganic bank 212 made of an inorganic material is formed on the circuit element layer 219. The inorganic bank 212 is disposed so as to surround the pixel electrode 211, and is formed in a state where a part thereof overlaps with the outer edge portion of the pixel electrode 211 when viewed from the normal direction of the glass substrate 210. On the inorganic bank 212, an organic bank 213 made of an organic material having water repellency is provided. The organic bank 213 is formed so as to surround the light emitting element 205.

  On the pixel electrode 211 and the inorganic bank 212, a hole transport layer 214 and a light emitting layer 215 are arranged in this order. A cathode 216 that is a laminate of calcium (Ca) and aluminum (Al) is formed on the light emitting layer 215 so as to cover the light emitting layer 215 and the hole transport layer 214. On the cathode 216, a sealing member 217 made of a resin or the like is laminated to prevent water and oxygen from entering and to prevent oxidation of the cathode 216 or the organic EL element 203.

  In addition, the light emitting layer 215 is a layer of an organic light emitting material that exhibits an electroluminescence phenomenon. By applying a voltage between the pixel electrode 211 and the cathode 216, holes are injected from the hole transport layer 214 and electrons are injected from the cathode 216 into the light emitting layer 215. The light emitting layer 215 emits light when they are combined. The emission spectrum from the light emitting layer 215 depends on the light emission characteristics and film thickness of the material. In the present embodiment, the light emitting layer 215 emits red light, and the main emission wavelength, that is, the wavelength at which the emission intensity is maximum in the emission spectrum is about 630 nm.

  The light emitted from the light emitting layer 215 downward in FIG. 7 passes through the glass substrate 210 as it is, and the light emitted upward in FIG. 7 travels downward after being reflected by the cathode 216, and also passes through the glass substrate 210. To do. The organic EL device 201 having such a configuration is called a bottom emission type.

  When the organic EL device 201 is a top emission type that emits display light toward the side opposite to the glass substrate 210, the cathode 216 includes, for example, a thin calcium layer and an ITO layer to transmit light. Therefore, a light reflecting layer made of an aluminum film or the like is formed on the lower layer side of the pixel electrode 211 so as to overlap with the entire pixel electrode 211.

  Next, a method for manufacturing the display device with an input function of this embodiment will be described with reference to FIG. In addition, the manufacturing method described below manufactures an organic EL device by so-called multi-surface cutting, in which a plurality of substrates for organic EL devices (glass substrates 210) are cut out from a single mother substrate (TFT array substrate). .

  First, on a TFT array substrate (not shown) made of glass as a mother substrate, light emitting elements 205 are formed in a plurality of regions that will later become the glass substrate 210 (step S201). More specifically, first, on a TFT array substrate (not shown), a plurality of regions that will later become the glass substrate 210 are formed by, for example, film formation such as CVD or sputtering, patterning by photolithography, or heat treatment. Thus, the circuit element layer 219 is formed. Then, the pixel electrode 211 and the inorganic bank 212 are formed on the circuit element layer 219 by using a spin coating method, and then oxygen plasma treatment is performed to improve foreign matter removal and hydrophilicity. Further, an ink as a material for the hole transport layer 214 is applied onto the pixel electrode 211 and the inorganic bank 212 by using a spin coating method, and dried to form the hole transport layer 214. Next, an ink as a material of the light emitting layer 215 is applied onto the hole transport layer 214 by using a spin coating method, and dried to form the light emitting layer 215. Subsequently, calcium and aluminum are sequentially deposited to form the cathode 216.

  Next, the sealing member 217 is formed so as to cover the light emitting element 205 (step S202). Note that the sealing method is not limited to the method using the sealing member 217, and a can sealing method in which a glass substrate or the like is bonded through a sealant may be used.

  Next, a resin coat layer 221 is formed on the surface of the TFT array substrate opposite to the side on which the light emitting elements 205 are formed (hereinafter referred to as “back surface”). Specifically, the aggregate is immersed in a solution containing polyester or polyurethane, and the solution is applied on the surface of the aggregate by pulling up at a predetermined speed. Then, by drying the solution, a resin coat layer 221 having a predetermined thickness made of polyester or polyurethane is formed on the surface of the aggregate (step S203). At this time, the surface of the TFT array substrate that has undergone various manufacturing processes may be damaged due to contact with the support table. However, by forming the resin coat layer 221, it is possible to fill a scratch generated on the surface of the TFT array substrate. Therefore, it is possible to prevent the damage caused by this scratch in the subsequent process.

  Next, a silicon-based coat layer 222 is formed on the resin coat layer 221 (step S204). Specifically, the silica-based fine particles are dispersed, and the aggregate is immersed in a solution containing a resin, a binder composed of an organosilicon compound, a surfactant, and other additives, and pulled up at a predetermined speed. The solution is applied on the resin coat layer 221. Then, the silicon-based coat layer 222 is formed by baking the solution.

  In step S203 and step S204 described above, the surface of the sealing member 217 is masked, and the resin coat layer 221 and the silicon-based coat layer 222 are not formed on the surface of the sealing member 217. However, if the resin coat layer 221 and the silicon-based coat layer 222 are translucent members, the resin coat layer 221 and the silicon-based coat layer 222 may be formed on the sealing member 217 surface.

  Next, by dividing the TFT array substrate into a predetermined shape, the glass substrate 210 on which the light emitting element 205 is formed is divided into individual pieces and cut out (step S205). The TFT array substrate is divided by, for example, a method of cutting the TFT array substrate into individual glass substrates 210 using a rotating blade or the like, and cutting (scribing) into the TFT array substrate using a similar blade or the like. After that, a method of folding along the cut is used. When the substrate is divided, glass powder or the like generated by cutting or breaking is scattered, and the glass powder may damage the surface of the TFT array substrate. However, by forming the silicon-based coating layer 222 described above, the generation of glass powder and the like can be reduced, and the surface of the TFT array substrate can be guarded from the scattered glass powder and the like. It is possible to prevent the generation of scratches caused by glass powder.

  Next, a flexible substrate (not shown) or the like is connected to the glass substrate 210 to complete the organic EL device 201 (step S206).

  According to the present embodiment, the silicon-based coat layer 222 formed on the TFT array substrate guards the surface of the TFT array substrate from scattering of glass powder or the like generated by cutting or breaking the substrate. Can do. Therefore, it is possible to prevent the surface of the TFT array substrate from being damaged by the scattered glass powder.

  Further, the resin coat layer 221 has an effect of dispersing and absorbing or mitigating impact applied to the organic EL device 201 from the outside due to its elasticity. Further, since the silicon-based coat layer 222 is a hard film, it has an effect of improving the scratch resistance of the surface of the organic EL device 201.

  Therefore, the organic EL device 201 according to the present embodiment has no silicon scratch layer as a starting point of cracking of the substrate made of glass or the like because the silicon-based coating layer 222 is formed on the surface thereof. Moreover, since the impact applied from the outside is relieved by forming the resin coat layer 221, it has high impact resistance. That is, according to the present embodiment, it is possible to provide the organic EL device 201 that is less likely to be damaged due to dropping or load.

  The glass substrate 210 is particularly easily broken due to the presence of scratches on the surface. Therefore, in the above-described embodiment, the coating 223 composed of the two layers of the resin coat layer 221 and the silicon-based coat layer 222 is formed on the surface of the glass substrate 210. However, the scratch resistance on the surface of the glass substrate 210 is improved. Even when only the silicon-based coat layer 222 is formed, the impact resistance of the organic EL device 201 is improved.

  Further, in the present embodiment, the configuration in which the coating 223 is formed on the surface of the glass substrate 210 opposite to the surface on which the circuit element layer 219 is formed has been described. The structure in which the surface in which the layer 219 is formed may be sufficient.

  In this example, the coating 223 is formed by a so-called dipping method, but the coating is formed by other known methods such as spin coating and spray coating. Also good.

  In addition, the silicon-based coat layer 222 as the hard coat layer may be removed after the piece cutting (dividing) step (step S205), but if left as it is, the occurrence of scratches in the subsequent steps is further increased. It becomes possible to prevent.

  In this example, the method of forming the resin coat layer 221 and the silicon-based coat layer 222 after the sealing step (step S202) has been described, but the present invention is not limited to this. The resin coat layer 221 and the silicon-based coat layer 222 may be formed before the TFT array substrate dividing step (step S205). For example, the resin coat layer 141 and the silicon-based coat layer 142 are formed on the mother substrate in advance. The light-emitting element 205 and the like may be formed after the formation.

  Note that the electro-optical device manufacturing method of the present invention can be applied only to the active matrix liquid crystal display device according to the above-described embodiment (for example, a liquid crystal display panel including a TFT (thin film transistor) or a TFD (thin film diode)) as a switching element. In addition, the present invention can be similarly applied to a passive matrix liquid crystal display device. In addition to liquid crystal display panels, various electro-optical devices such as electroluminescence devices, plasma display devices, electrophoretic display devices, and devices using electroluminescent elements (Field Emission Display, Surface-Conduction Electron-Emission Display, etc.) The present invention can be similarly applied to the manufacturing method.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit or idea of the invention that can be read from the claims and the entire specification, and an electro-optical device with such a change. These manufacturing methods are also included in the technical scope of the present invention.

1 is a perspective view of an electro-optical device. II-II sectional drawing of FIG. 5 is a flowchart showing a method for manufacturing an electro-optical device. The figure for demonstrating bonding of the two mother board | substrates which comprise several electro-optical apparatuses. FIG. 6 is a front sectional view showing a configuration of a display device with an input function as an electro-optical device according to a second embodiment. The flowchart which shows the manufacturing method of the display apparatus with an input function of 2nd Embodiment. FIG. 10 is a front sectional view showing an organic EL device as an electro-optical device according to a third embodiment. The flowchart which shows the manufacturing method of the organic electroluminescent apparatus of 3rd Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Electro-optical apparatus, 10 ... TFT substrate, 12 ... Silicon-type coating layer, 13 ... Resin coating layer, 14 ... Film, 20 ... Opposite substrate, 22 ... Silicon-type coating layer, 23 ... Resin coating layer, 24 ... Film, 30 ... Driver IC, 31 ... FPC, 32 ... Mounting terminal, 40 ... Sealing material, 41 ... Liquid crystal, 42 ... Overhang part.

Claims (7)

A method for manufacturing an electro-optical device, in which a translucent mother substrate is divided to form a plurality of electro-optical device substrates,
An electro-optical device comprising a step of forming a hard coat layer including a silicon-based material on at least one surface of the mother substrate prior to the step of dividing the mother substrate. Manufacturing method.   The method of manufacturing an electro-optical device according to claim 1, further comprising a step of forming a resin coat layer on at least one surface of the substrate prior to the step of forming the hard coat layer.   The method of manufacturing an electro-optical device according to claim 1, wherein the mother substrate is a glass substrate.   2. The method of manufacturing an electro-optical device according to claim 1, wherein a pair of the mother substrates are used, and the pair of mother substrates are separated after the pair of mother substrates are bonded together.   2. The method of manufacturing an electro-optical device according to claim 1, further comprising a step of forming the hard coat layer after bonding the pair of mother substrates together using the mother substrates.   The method of manufacturing an electro-optical device according to claim 1, wherein the hard coat layer is formed by a dipping method.   The method of manufacturing an electro-optical device according to claim 1, wherein the hard coat layer is formed by a spin coat method.

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