CN102222605A - Wafer conveying device with fragment detection - Google Patents

Wafer conveying device with fragment detection Download PDF

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Publication number
CN102222605A
CN102222605A CN2011101516409A CN201110151640A CN102222605A CN 102222605 A CN102222605 A CN 102222605A CN 2011101516409 A CN2011101516409 A CN 2011101516409A CN 201110151640 A CN201110151640 A CN 201110151640A CN 102222605 A CN102222605 A CN 102222605A
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CN
China
Prior art keywords
wafer
fragmentation
conveyer belt
conveying equipment
group
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Granted
Application number
CN2011101516409A
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Chinese (zh)
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CN102222605B (en
Inventor
吴惠荣
许力仁
李允仁
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Chroma ATE Suzhou Co Ltd
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Chroma ATE Suzhou Co Ltd
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Priority to CN 201110151640 priority Critical patent/CN102222605B/en
Publication of CN102222605A publication Critical patent/CN102222605A/en
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Publication of CN102222605B publication Critical patent/CN102222605B/en
Expired - Fee Related legal-status Critical Current
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Abstract

A wafer conveying device with fragment detection is used for detecting wafers output by a wafer supporting device, and comprises a drawing device for conveying the wafers, at least one set of wafer conveying device for conveying the wafers, a plurality of fragment detectors and a set of wafer transferring device, wherein the fragment detectors are arranged below both sides of a conveying belt for detecting the wafers conveyed on the conveying belt and judging whether the wafers are broken; then, the wafers on the wafer conveying device after detection are drawn through the wafer drawing device of the wafer transferring device; and the wafers are transferred and distributed on a plurality of sets of output orbits of the wafer transferring device by means of transverse or longitudinal movement.

Description

A kind of wafer conveying equipment with fragmentation detection
Technical field
The present invention has a wafer conveying equipment that fragmentation detects about a kind of, especially a kind of wafer conveying equipment that is used between wafer bearing device, and fragmentation detects and fragmentation is got rid of and this wafer conveying equipment more can carry out the wafer of its carrying.
Background technology
The at present main material of solar cell is mainly silicon and as GaAs (GaAs), cadmium telluride (CdTe), germanium ... wait element or compound, transfer solar energy to electric energy or heat energy conversion efficient with raising.Consider meeting based on different application and adopt different element or compound, for example: people's livelihood consumer products normally utilize the non-crystal silicon solar cell plate; What use in the space is gallium arsenide solar cell; If be used in desert, ocean etc. is that large-scale power supplys such as purpose then use polycrystalline silicon solar cell with the generating.
In addition, be applied to the solar panel of people's livelihood consumer products, also can be because of different electronic products, and the voltages of the different sizes of output.Simultaneously, also can measure the defective, flaw, fragmentation degree etc. at electrical functionality, the positive back side of substrate of solar panel.
Be referred to as solar wafer as last forming solar cell, dependence test and classification are carried out in the solar wafer sector-meeting, no matter be between board move or because of the shipment demand, the capital is with the laminated storing of solar wafer, and common wafer bearing device mainly contains two kinds of different designs at present, a kind of is wafer cassette (Gassette), has the top, bottom and left and right sides sidewall, and on the two side, be formed with a plurality of flanges, wafer is then from above-mentioned top, the side direction gateway turnover that bottom and left and right sides sidewall institute one common peripheral lay out, and another kind of wafer bearing device is wafer film magazine (magaz ine), is that a kind of top is formed with a top and draws the bogey of putting mouthful.
Because the mode of two kinds of wafer bearing device institute transfer wafers has very big-difference, belong to two kinds of different bearer devices, therefore in actual user's the process of setting up factories, tend to get its required and combination utilization voluntarily, and the running transform between of the same race or the two kinds of wafer bearing devices also is frequent the appearance, but because of wafer in the process of transporting, be easy to produce slight structure flaw because of collision, even inspect the place that also can't pinpoint the problems easily with naked eyes, but when waiting to finish all manufacturing handling processes, situation about will break because of crystal column surface, and cause side circuit to be subjected to the impaired influence of indefinite degree;
Therefore, if the fragmentation of can be in the automation testing process or particular demands being set between the different bearer device detects, and there is the wafer of the situation of breaking on property eliminating surface stage by stage, so can avoid unnecessary processing procedure and the test item behind the processing procedure effectively, to save more manufacturing cost and human cost, should be a best solution.
Summary of the invention
The object of the present invention is to provide a kind of wafer conveying equipment that fragmentation detects that has, it is easy and simple to handle, carries out fragmentation in the handling process that can import, export in bogey and detects, and the wafer of the situation of breaking is arranged with eliminating.
For reaching the foregoing invention purpose, the invention discloses a kind of wafer conveying equipment that fragmentation detects that has, be used to detect wafer from the output of wafer bogey, this wafer conveying equipment with fragmentation detection comprises:
One group of drawing device that moves between this wafer bearing device and wafer conveying equipment position is used to carry wafer;
At least one group of wafer conveyance device includes a conveyer belt and a driving mechanism, and this driving mechanism can drive this conveyer belt, so that this wafer can be handled upside down on this conveyer belt;
A plurality of fragmentation detectors are arranged at this conveyer belt down either side, are handled upside down wafer on this conveyer belt in order to detection, and judge whether wafer has the situation of breaking to take place; And
One group of wafer transfer device, be arranged at this conveyer belt other end, this wafer transfer device comprises at least one wafer drawing device, at least one group of horizontal moving track, at least one group and vertically moves track and many group output tracks, wherein this wafer drawing device can be displaced into this horizontal moving track and this vertically moves on the track, therefore when this wafer drawing device draws wafer on this wafer conveyance device, can carry out laterally or vertically move, this wafer transfer is allocated on this many group output tracks.
Wherein, have at least one light receiving terminal and at least one light transmitting terminal on this fragmentation detector, this light transmitting terminal is in order to shining this crystal column surface, and this light receiving terminal of reflected back receives, and to judge wafer whether the situation generation of breaking arranged.
Wherein, this wafer bearing device is for carrying the wafer cassette or the wafer film magazine of wafer.
Also disclose a kind of wafer conveying equipment that fragmentation detects that has, be used to detect the wafer from the output of wafer bogey, this wafer conveying equipment with fragmentation detection comprises:
One group of drawing device that moves between this wafer bearing device and wafer conveying equipment position is used to carry wafer;
A plurality of fragmentation removers include the cylinder that a conveyer belt, a driving mechanism, are connected in the conveyer belt below, and wherein this cylinder can change the location status of this conveyer belt through this driving mechanism;
Many group wafer conveyance devices include a conveyer belt and a driving mechanism, and wherein this conveyer belt is connected with conveyer belt one end of this fragmentation remover, so this driving mechanism can drive this conveyer belt, so that this wafer can be handled upside down on this conveyer belt;
A plurality of fragmentation detectors that are arranged at this conveyer belt down either side; And
One group of wafer transfer device, be arranged at the conveyer belt other end of this fragmentation remover, and this wafer transfer device comprises at least one wafer drawing device, at least one group of horizontal moving track, at least one group and vertically moves track and many group output tracks, wherein this wafer drawing device can be handled upside down in this horizontal moving track and this and vertically move on the track, therefore when this wafer drawing device draws wafer on this wafer conveyance device, can carry out laterally or vertically move, this wafer transfer is allocated on this many group output tracks.
Wherein, at least one sensor is set on the conveyer belt of this fragmentation remover, stretches in order to drive this cylinder that to change this conveyer belt be level or bottom state.
Wherein, have at least one light receiving terminal and at least one light transmitting terminal on this fragmentation detector, this light transmitting terminal is in order to shining this crystal column surface, and this light receiving terminal of reflected back receives, and to judge wafer whether the situation generation of breaking arranged.
Wherein, this wafer bearing device is for carrying the wafer cassette or the wafer film magazine of wafer.
Wherein, can add below the conveyer belt of this fragmentation remover that a waste material container being set, have the wafer that breaks in order to ccontaining crystal column surface.
By said structure, the present invention has realized following technique effect:
1. the present invention can carry out the fragmentation detection between the different bearer device, and therefore the handling process that can import, export in bogey is carried out the fragmentation detection, and the wafer of the situation of breaking is arranged with eliminating.
2. the present invention can be with avoiding unnecessary processing procedure and the test item behind the processing procedure effectively, to save more manufacturing cost and human cost.
Description of drawings
Fig. 1: the first enforcement configuration diagram that has the wafer conveying equipment of fragmentation detection for the present invention is a kind of;
Fig. 2: the fragmentation that has the wafer conveying equipment of fragmentation detection for the present invention is a kind of detects schematic perspective view;
Fig. 3: the fragmentation detection side view that has the wafer conveying equipment of fragmentation detection for the present invention is a kind of;
Fig. 4: the second enforcement configuration diagram that has the wafer conveying equipment of fragmentation detection for the present invention is a kind of reaches;
Fig. 5: the fragmentation that has the wafer conveying equipment of fragmentation detection for the present invention is a kind of is got rid of schematic perspective view;
Fig. 6 A: the fragmentation that has the wafer conveying equipment of fragmentation detection for the present invention is a kind of is got rid of the enforcement illustration; And
Fig. 6 B: the fragmentation that has the wafer conveying equipment of fragmentation detection for the present invention is a kind of is got rid of the enforcement illustration.
Embodiment
Relevant for aforementioned and other technology contents, characteristics and effect of the present invention, in the following detailed description that cooperates with reference to graphic preferred embodiment, can clearly present.
See also Fig. 1, Fig. 2 and Fig. 3, the first enforcement configuration diagram, the fragmentation that have the wafer conveying equipment of fragmentation detection for the present invention is a kind of detect schematic perspective view and fragmentation detection side view, and this wafer conveying equipment is used to detect the wafer 3 from 1 output of wafer bogey, by among the figure as can be known, this has wafer conveying equipment that fragmentation detects and comprises:
One group of drawing device 21 is displaced between this wafer bearing device 1 and the wafer conveying equipment position, and this drawing device 21 is used to carry wafer 3;
At least one group of wafer conveyance device 22 includes a conveyer belt 221 and a driving mechanism 222, and this driving mechanism 222 can drive this conveyer belt 221, so that this wafer 3 can be handled upside down on this conveyer belt 221;
A plurality of fragmentation detectors 23 are arranged at this conveyer belt 221 down either side, are handled upside down wafer 3 on this conveyer belt 221 in order to detection, and judge whether wafer 3 has the situation of breaking to take place;
One group of wafer transfer device 24, be arranged at this conveyer belt 221 other ends, this wafer transfer device 24 comprises at least one wafer drawing device 241, at least one group of horizontal moving track 242, at least one group and vertically moves track 243 and many group output tracks 244, and wherein this wafer drawing device 241 can be displaced into this horizontal moving track 242 and this vertically moves on the track 243;
Therefore, when drawing device 21 is carried a wafer 3 on the conveyer belt 221 of this wafer conveyance device 22, the driving mechanism 222 of this wafer conveyance device 22 can drive this conveyer belt 221 and move, on this conveyer belt 221, to be handled upside down this wafer 3 mobile, when this wafer 3 moved to this fragmentation detector 23 regional, this fragmentation detector 23 can judge whether this wafer 3 has the situation generation of breaking simultaneously; At last, the wafer drawing device 241 of this wafer transfer device 24 can draw the wafer 3 on this wafer conveyance device 22, this wafer drawing device 241 carries out horizontal or vertically moves and can see through this horizontal moving track 242 and vertically move track 243, and again this wafer transfer is allocated on these many group output tracks 244, to carry out follow-up fabrication process.
What deserves to be mentioned is, as shown in Figure 3, have at least one light receiving terminal 231 and at least one light transmitting terminal 232 on this fragmentation detector 23, this light transmitting terminal 232 is in order to shine this wafer 3 surfaces, and these light receiving terminal 231 receptions of reflected back, whether there is the situation of breaking to take place to judge wafer 3.
What deserves to be mentioned is that this wafer bearing device 1 can carry the container of wafer for wafer cassette, wafer film magazine or the like.
See also Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6 A and Fig. 6 B, the fragmentation that has the wafer conveying equipment of fragmentation detection for the present invention is a kind of detects schematic perspective view, configuration diagram implemented by fragmentation detection side view, second and fragmentation is got rid of the enforcement illustration, and this wafer conveying equipment is used to detect the wafer 3 from 1 output of wafer bogey, by among the figure as can be known, this has wafer conveying equipment that fragmentation detects and comprises:
One group of drawing device 21 is displaced between this wafer bearing device 1 and the wafer conveying equipment position, and this drawing device 21 is used to carry wafer 3;
A plurality of fragmentation removers 25 include the cylinder 253 that a conveyer belt 251, a driving mechanism 252, are connected in conveyer belt 251 belows, and wherein this cylinder 253 can see through the location status that this driving mechanism 252 changes these conveyer belts 251;
Many group wafer conveyance devices 22, include a conveyer belt 221 and a driving mechanism 222, wherein the conveyer belt 221 of this wafer conveyance device 22 is connected with conveyer belt 251 1 ends of this fragmentation remover 25, so this driving mechanism 222 can drive this conveyer belt 221, so that this wafer 3 can be handled upside down on this conveyer belt 221;
A plurality of fragmentation detectors 23 are arranged at this conveyer belt down either side, so these fragmentation detector 23 set positions can be positioned at conveyer belt 221 down either side of this wafer conveyance device 22 or conveyer belt 251 down either side of this fragmentation remover 25; In this enforcement fragmentation detector 23 is arranged at conveyer belt 221 down either side of this wafer conveyance device 22;
One group of wafer transfer device 24, be arranged at conveyer belt 251 other ends of this fragmentation remover 25, and this wafer transfer device 24 comprises at least one wafer drawing device 241, at least one group of horizontal moving track 242, at least one group and vertically moves track 243 and many group output tracks 244, and wherein this wafer drawing device 241 can be handled upside down in this horizontal moving track 242 and this and vertically move on the track 243;
Therefore, when drawing device 21 is carried a wafer 3 on the conveyer belt 221 of this wafer conveyance device 22, the driving mechanism 222 of this wafer conveyance device 22 can drive this conveyer belt 221 and move, on this conveyer belt 221, to be handled upside down this wafer 3 mobile, simultaneously when this wafer 3 moves to this fragmentation detector 23 regional, this fragmentation detector 23 can judge whether this wafer 3 has the situation of breaking to take place, and when the wafer 3 that breaks passes through this fragmentation remover 25 (shown in Fig. 6 A and Fig. 6 B), the cylinder 253 of this fragmentation remover 25 can see through this driving mechanism 252 and inwardly shrink, and the conveyer belt 251 that causes being connected with this cylinder 253 presents bottom state, so the wafer 3 that this conveyer belt 251 is carried can directly be excluded;
If this fragmentation detector 23 judges that this wafer 3 is just often, this wafer 3 can normally pass through this fragmentation remover 25, and draw this wafer 3 by the wafer drawing device 241 of this wafer transfer device 24 again, this wafer drawing device 241 carries out horizontal or vertically moves and can see through this horizontal moving track 242 and vertically move track 243, and again this wafer transfer is allocated on these many group output tracks 244, to carry out follow-up fabrication process.
What deserves to be mentioned is, at least one sensor 254 is set on the conveyer belt 251 of this fragmentation remover 25, stretch and change this conveyer belt 251 and be level or bottom state in order to drive this cylinder 253.
What deserves to be mentioned is, as shown in Figure 3, have at least one light receiving terminal 231 and at least one light transmitting terminal 232 on this fragmentation detector 23, this light transmitting terminal 232 is in order to shine this wafer 3 surfaces, and these light receiving terminal 231 receptions of reflected back, whether there is the situation of breaking to take place to judge wafer 3.
What deserves to be mentioned is that this wafer bearing device 1 can carry the container of wafer for wafer cassette, wafer film magazine or the like.
What deserves to be mentioned is that conveyer belt 251 belows of this fragmentation remover 25 can be added a waste material container (not shown) is set, and have the wafer that breaks in order to ccontaining crystal column surface.
A kind of wafer conveying equipment that fragmentation detects that has provided by the present invention when comparing mutually with other located by prior art, has more and gets the row advantage ready:
1. the present invention can carry out the fragmentation detection between the different bearer device, and therefore the handling process that can import, export in bogey is carried out the fragmentation detection, and the wafer of the situation of breaking is arranged with eliminating.
2. the present invention can be with avoiding unnecessary processing procedure and the test item behind the processing procedure effectively, to save more manufacturing cost and human cost.
By the above detailed description of preferred embodiments, hope can be known description feature of the present invention and spirit more, and is not to come category of the present invention is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain in the category of claim of being arranged in of various changes and tool equality institute of the present invention desire application.

Claims (8)

1. one kind has the wafer conveying equipment that fragmentation detects, and is used to detect the wafer from the output of wafer bogey, and this wafer conveying equipment with fragmentation detection comprises:
One group of drawing device that moves between this wafer bearing device and wafer conveying equipment position is used to carry wafer;
At least one group of wafer conveyance device includes a conveyer belt and a driving mechanism, and this driving mechanism can drive this conveyer belt, so that this wafer can be handled upside down on this conveyer belt;
A plurality of fragmentation detectors are arranged at this conveyer belt down either side, are handled upside down wafer on this conveyer belt in order to detection, and judge whether wafer has the situation of breaking to take place; And
One group of wafer transfer device, be arranged at this conveyer belt other end, this wafer transfer device comprises at least one wafer drawing device, at least one group of horizontal moving track, at least one group and vertically moves track and many group output tracks, wherein this wafer drawing device can be displaced into this horizontal moving track and this vertically moves on the track, therefore when this wafer drawing device draws wafer on this wafer conveyance device, can carry out laterally or vertically move, this wafer transfer is allocated on this many group output tracks.
2. has the wafer conveying equipment that fragmentation detects according to claim 1, it is characterized in that, have at least one light receiving terminal and at least one light transmitting terminal on this fragmentation detector, this light transmitting terminal is in order to shine this crystal column surface, and this light receiving terminal reception of reflected back, whether there is the situation of breaking to take place to judge wafer.
3. have the wafer conveying equipment that fragmentation detects according to claim 1, it is characterized in that, this wafer bearing device is for carrying the wafer cassette or the wafer film magazine of wafer.
4. one kind has the wafer conveying equipment that fragmentation detects, and is used to detect the wafer from the output of wafer bogey, and this wafer conveying equipment with fragmentation detection comprises:
One group of drawing device that moves between this wafer bearing device and wafer conveying equipment position is used to carry wafer;
A plurality of fragmentation removers include the cylinder that a conveyer belt, a driving mechanism, are connected in the conveyer belt below, and wherein this cylinder can change the location status of this conveyer belt through this driving mechanism;
Many group wafer conveyance devices include a conveyer belt and a driving mechanism, and wherein this conveyer belt is connected with conveyer belt one end of this fragmentation remover, so this driving mechanism can drive this conveyer belt, so that this wafer can be handled upside down on this conveyer belt;
A plurality of fragmentation detectors that are arranged at this conveyer belt down either side; And
One group of wafer transfer device, be arranged at the conveyer belt other end of this fragmentation remover, and this wafer transfer device comprises at least one wafer drawing device, at least one group of horizontal moving track, at least one group and vertically moves track and many group output tracks, wherein this wafer drawing device can be handled upside down in this horizontal moving track and this and vertically move on the track, therefore when this wafer drawing device draws wafer on this wafer conveyance device, can carry out laterally or vertically move, this wafer transfer is allocated on this many group output tracks.
5. as wafer turning device as described in the claim 4, it is characterized in that, at least one sensor is set on the conveyer belt of this fragmentation remover, stretch in order to drive this cylinder that to change this conveyer belt be level or bottom state.
6. as described in claim 4, has the wafer conveying equipment that fragmentation detects, it is characterized in that, have at least one light receiving terminal and at least one light transmitting terminal on this fragmentation detector, this light transmitting terminal is in order to shine this crystal column surface, and this light receiving terminal reception of reflected back, whether there is the situation of breaking to take place to judge wafer.
7. have the wafer conveying equipment that fragmentation detects as described in claim 4, it is characterized in that, this wafer bearing device is for carrying the wafer cassette or the wafer film magazine of wafer.
8. as described in claim 4, have the wafer conveying equipment that fragmentation detects, it is characterized in that, can add below the conveyer belt of this fragmentation remover that a waste material container being set, have the wafer that breaks in order to ccontaining crystal column surface.
CN 201110151640 2011-06-08 2011-06-08 Wafer conveying device with fragment detection Expired - Fee Related CN102222605B (en)

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Application Number Priority Date Filing Date Title
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CN102222605B CN102222605B (en) 2013-05-15

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102679890A (en) * 2012-04-28 2012-09-19 亚亚科技股份有限公司 Crystal column detecting device
CN104477634A (en) * 2014-11-28 2015-04-01 苏州晟成光伏设备有限公司 Guide structure of final inspection blanking device
TWI484585B (en) * 2011-12-20 2015-05-11 Chroma Ate Inc Substrate transfer equipment
CN105609456A (en) * 2015-12-24 2016-05-25 中国电子科技集团公司第四十八研究所 Graphite boat carrying apparatus and interconnection type graphite boat loading and unloading sheet production line
CN106057698A (en) * 2016-07-21 2016-10-26 无锡宏纳科技有限公司 Wafer cracking place skipping method in wafer manufacturing process
CN106298567A (en) * 2016-07-21 2017-01-04 无锡宏纳科技有限公司 The device of wafer rent is detected in chip manufacturing proces
CN109119364A (en) * 2018-08-27 2019-01-01 苏州精濑光电有限公司 A kind of wafer detection equipment
CN109597284A (en) * 2019-02-02 2019-04-09 东旭(昆山)显示材料有限公司 A kind of pre- alignment device of exposure machine and exposure machine
CN109874309A (en) * 2018-04-24 2019-06-11 君泰创新(北京)科技有限公司 Two-sided coating equipment and its support plate processing unit
WO2019205351A1 (en) * 2018-04-24 2019-10-31 君泰创新(北京)科技有限公司 Double-sided coating apparatus and carrier plate processing unit thereof
WO2019205350A1 (en) * 2018-04-24 2019-10-31 君泰创新(北京)科技有限公司 Apparatus for double-sided coating and detection unit for bearing plate thereof

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CN1294410A (en) * 1999-10-26 2001-05-09 日本电气株式会社 Semiconductor mfg. appts.
US20030091409A1 (en) * 2001-07-16 2003-05-15 Mark Danna Integrated system for tool front-end workpiece handling
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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI484585B (en) * 2011-12-20 2015-05-11 Chroma Ate Inc Substrate transfer equipment
CN102679890A (en) * 2012-04-28 2012-09-19 亚亚科技股份有限公司 Crystal column detecting device
CN104477634A (en) * 2014-11-28 2015-04-01 苏州晟成光伏设备有限公司 Guide structure of final inspection blanking device
CN105609456B (en) * 2015-12-24 2018-07-06 中国电子科技集团公司第四十八研究所 A kind of graphite boat bogey and interconnection type graphite boat loading-unloading plate production line
CN105609456A (en) * 2015-12-24 2016-05-25 中国电子科技集团公司第四十八研究所 Graphite boat carrying apparatus and interconnection type graphite boat loading and unloading sheet production line
CN106057698A (en) * 2016-07-21 2016-10-26 无锡宏纳科技有限公司 Wafer cracking place skipping method in wafer manufacturing process
CN106298567A (en) * 2016-07-21 2017-01-04 无锡宏纳科技有限公司 The device of wafer rent is detected in chip manufacturing proces
CN109874309A (en) * 2018-04-24 2019-06-11 君泰创新(北京)科技有限公司 Two-sided coating equipment and its support plate processing unit
WO2019205351A1 (en) * 2018-04-24 2019-10-31 君泰创新(北京)科技有限公司 Double-sided coating apparatus and carrier plate processing unit thereof
WO2019205350A1 (en) * 2018-04-24 2019-10-31 君泰创新(北京)科技有限公司 Apparatus for double-sided coating and detection unit for bearing plate thereof
CN109119364A (en) * 2018-08-27 2019-01-01 苏州精濑光电有限公司 A kind of wafer detection equipment
CN109119364B (en) * 2018-08-27 2024-04-16 苏州精濑光电有限公司 Wafer detection equipment
CN109597284A (en) * 2019-02-02 2019-04-09 东旭(昆山)显示材料有限公司 A kind of pre- alignment device of exposure machine and exposure machine

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