CN102215630B - Flexible printed board and method of manufacturing same - Google Patents
Flexible printed board and method of manufacturing same Download PDFInfo
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- CN102215630B CN102215630B CN2011100419933A CN201110041993A CN102215630B CN 102215630 B CN102215630 B CN 102215630B CN 2011100419933 A CN2011100419933 A CN 2011100419933A CN 201110041993 A CN201110041993 A CN 201110041993A CN 102215630 B CN102215630 B CN 102215630B
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- layer
- flexible circuit
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000012216 screening Methods 0.000 claims description 90
- 238000010422 painting Methods 0.000 claims description 20
- 238000003475 lamination Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 14
- 230000000052 comparative effect Effects 0.000 description 34
- 238000012360 testing method Methods 0.000 description 22
- 229910052709 silver Inorganic materials 0.000 description 14
- 239000004332 silver Substances 0.000 description 14
- 239000004744 fabric Substances 0.000 description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 10
- 238000005755 formation reaction Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000012141 concentrate Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000005452 bending Methods 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 230000003321 amplification Effects 0.000 description 5
- 238000003199 nucleic acid amplification method Methods 0.000 description 5
- 229920001225 polyester resin Polymers 0.000 description 5
- 239000004645 polyester resin Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 150000003378 silver Chemical class 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 210000003323 beak Anatomy 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a flexible printed board improved in bendability and a method of manufacturing the same. The flexible printed board 2 comprises: an insulating substrate 21; a circuit wiring 22 laid on the insulating substrate 21; a circuit protection layer 23 laid on the circuit wiring 22; a shield conductive layer 24 laid on the circuit protection layer 23; and a shield insulating layer 25 laid on the shield conductive layer 24, and is characterized by meeting the following Expression (1). 0.75<=E2/E1<=1.29... Expression (1) Note that E1 denotes the tensile elastic modulus of the shield conductive layer 24 and E2 denotes the tensile elastic modulus of the shield insulating layer 25.
Description
Technical field
The present invention relates to utilize flexible circuit board and the manufacture method thereof of narrow gap (little radius) bending.
Background technology
Be known to the thickness of the electroconductive resin layer of electromagnetic wave shielding is made as 1[μ m]～20[μ m], similarly the thickness of the insulative resin layer of electromagnetic wave shielding is made as 3[μ m]～20[μ m] flexible printed circuit board (for example with reference to patent documentation 1).
[patent documentation 1] TOHKEMY 2008-98613 communique
In above-mentioned flexible printed circuit board, there is no to discuss the impact that the electroconductive resin layer of the electromagnetic wave shielding formed by screen painting brings to bendability.
For this reason, existence can not make the situation that the bendability of flexible printed circuit board fully improves.
Summary of the invention
The purpose of the problem that the present invention will solve is to provide a kind of flexible circuit board and manufacture method thereof that bendability is improved.
When the inventor is conceived to utilize screen painting to form the screening conductive layer, to forming concavo-convex this point due to the screen cloth of galley on the surface of screening conductive layer and concavo-convex due to this and produce local stress on flexible circuit board during in bending and concentrate this point to scrutinize.As a result, the inventor finds, the ratio of the tensile elasticity rate by the tensile elasticity rate with the screening conductive layer and shield dielectric layer is set in the scope of regulation, can relax because of the concavo-convex stress that causes of screening conductive layer concentrated, thereby realize above-mentioned purpose.
[1] flexible circuit board of the present invention possesses the shield dielectric layer of institute's lamination on the screening conductive layer of institute's lamination on the circuit protecting layer of institute's lamination on the circuit layout of institute's lamination on insulating properties substrate, described insulating properties substrate, described circuit layout, described circuit protecting layer and described screening conductive layer; it is characterized in that, meet following formula (1): 0.75≤E
2/ E
1≤ 1.29 ... formula (1), wherein, E
1The tensile elasticity rate of described screening conductive layer, E
2It is the tensile elasticity rate of described shield dielectric layer.
[2] in foregoing invention, also can meet following formula (2):
1.8GPa≤E
2≤ 3.1GPa... (formula 2)
[3] in foregoing invention, also can meet following formula (3):
0.79≤E
2/ E
1≤ 1.20... formula (3)
[4] in foregoing invention, tensile elasticity rate that also can described screening conductive layer is identical with the tensile elasticity rate of described shield dielectric layer.
[5] in foregoing invention, also can meet following formula (4).
1.9GPa≤E
2≤ 2.88GPa... formula (4)
[6] in foregoing invention, can be also to form concavo-convex with the face of described shield dielectric layer subtend in described screening conductive layer.
[7] manufacture method of flexible circuit board of the present invention is the manufacture method of above-mentioned flexible circuit board, it is characterized in that, possess: the screening conductive layer forms operation, half tone printing conductive paste on described circuit protecting layer, described conductive paste solidified, thereby form described screening conductive layer; Form operation with shield dielectric layer, screen painting insulating properties ink on described screening conductive layer, thus make described insulating properties ink cured form described shield dielectric layer.
According to the present invention, flexible circuit board meets above-mentioned formula (1), thereby can relax because of the concavo-convex stress that causes of screening conductive layer, concentrates, and therefore can improve the bendability of flexible circuit board.
Description of drawings
Fig. 1 is the stereogram of the sliding type handset of embodiments of the present invention.
Fig. 2 is the amplification view along the flexible circuit board of the II-II line of Fig. 1.
Fig. 3 is the partial sectional view of the III part of Fig. 2.
Fig. 4 means the flow chart of manufacture method of the flexible circuit board of embodiments of the present invention.
Fig. 5 means that the screening conductive layer of Fig. 4 forms the amplification view (its 1) of operation.
Fig. 6 means the photo of the screen cloth of the galley of using in the screening conductive layer formation operation of Fig. 4.
Fig. 7 means that the screening conductive layer of Fig. 4 forms the amplification view (its 2) of operation.
Fig. 8 is the vertical view of the circuit layout of embodiments of the invention and comparative example.
Fig. 9 means the chart of the result of the sliding test in embodiments of the invention 1～5, comparative example 1 and 2.
Figure 10 means the chart of the result of the sliding test in embodiments of the invention 6～10, comparative example 3 and 4.
Figure 11 means the chart of the result of the sliding test in embodiments of the invention 11～15, comparative example 5 and 6.
The explanation of Reference numeral
1... sliding type handset; 2... flexible circuit board; 21... insulating properties substrate; 22... circuit layout; 23... circuit protecting layer; 231... tack coat; 232... insulating film; 24... screening conductive layer; 24A... recess; 24b... protuberance; 25... shield dielectric layer; 30... galley; 31... mask; 32... screen cloth
Embodiment
Below, based on the description of drawings embodiments of the present invention.
Fig. 1 is the stereogram of the sliding type handset of present embodiment, and Fig. 2 is the amplification view along the flexible circuit board of the II-II line of Fig. 1, and Fig. 3 is the partial sectional view of the III part of Fig. 2.
The flexible circuit board of present embodiment (FPC:Flexible Printed Circuit) 2 for example, as shown in Figure 1, be in fact under 180 states that degree bends and clearance G narrows down and be assembled into sliding type handset 1 at the radius R with less (for example 0.7mm left and right).
This flexible circuit board 2, as shown in Figure 2, possess insulating properties substrate 21, circuit layout 22, circuit protecting layer 23, screening conductive layer 24 and shield dielectric layer 25.
Insulating film 232, as shown in Figure 2, by lamination on tack coat 231, protective circuit distribution 22.This insulating film 232 forms such as have flexible material with polyimides etc.
Screening conductive layer 24 is laminated on insulating film 232, from outside to circuit layout 22, carries out the electro permanent magnetic shielding.This screening conductive layer 24 is by carrying out conductive paste screen painting and making it to be solidified to form., at this, in present embodiment, the tensile elasticity rate of this screening conductive layer 24 is made as E
1.
, with the opposed surface of shield dielectric layer 25, as shown in Figure 3, form continuous concavo-convex in this screening conductive layer 24.In addition, this concavo-convex surface is along with the thickness of the screen cloth (mesh) 32 (with reference to Fig. 6) of the galley 30 in screen painting produces.Be described in detail for this concavo-convex surface, when screen painting, be formed with the recess 24a on concavo-convex surface in the position of line 32a (with reference to Fig. 6) subtend with screen cloth 32, be formed with the protuberance 24b on concavo-convex surface in the position of opening portion 32b (with reference to Fig. 6) subtend with screen cloth 32.
In addition, can enumerate silver as the conductive paste that forms screening conductive layer 24 sticks with paste.This silver is stuck with paste and is comprised silver particles and adhesive.Material as adhesive for example can be enumerated polyester resin.In addition, the conductive paste of formation screening conductive layer 24 is not limited to the silver paste.Such as conductive paste being used the formations such as gold paste, copper paste, carbon paste.In addition, the material for adhesive also is not particularly limited.
Shield dielectric layer 25 by lamination on screening conductive layer 24, guard shield conductive layer 24.This shield dielectric layer 25, by with insulating properties ink (black ink) screen painting and make it to solidify form organic and formed by overlay film.In addition, the material of insulating properties ink can be enumerated polyester resin, but there is no particular limitation., at this, in the present embodiment, the tensile elasticity rate of this shield dielectric layer 25 is made as E
2.
Surface with sides screening conductive layer 24 subtend this shield dielectric layer 25 forms, and follows shape (concavo-convex) concavo-convex of screening conductive layer 24.On the other hand, the outer surface of a side opposite to screening conductive layer 24 is flat condition formation in shield dielectric layer 25.
At this, in the flexible circuit board 2 of present embodiment, the tensile elasticity rate E of preferable mask conductive layer 24
1Tensile elasticity rate E with shield dielectric layer 25
2Meet following formula (1), more preferably meet following formula (3).In addition, be more preferably the tensile elasticity rate E of screening conductive layer
1Tensile elasticity rate E with shield dielectric layer
2Identical (E
1=E
2).
0.75≤E
2/ E
1≤ 1.29 ... formula (1)
0.79≤E
2/ E
1≤ 1.20 ... formula (3)
In addition, in the flexible circuit board 2 of present embodiment, the tensile elasticity rate E of preferable mask insulating barrier 25
2Meet following formula (2), be more preferably and meet following formula (4).
1.8[GPa]≤E
2≤ 3.1[GPa] ... formula (2)
1.9GPa≤E
2≤ 2.88GPa ... formula (4)
In addition, in the flexible circuit board 2 of present embodiment, lamination has circuit layout 22, circuit protecting layer 23, screening conductive layer 24 and shield dielectric layer 25 on 21 1 (outside) interareas of insulating properties substrate, but there is no particular limitation.For example, also can the lamination circuit layout on the interarea of the inboard of insulating properties substrate, circuit protecting layer, screening conductive layer and shield dielectric layer.Or also can be on the two sides of insulating properties substrate lamination circuit layout, circuit protecting layer, screening conductive layer and shield dielectric layer.
Then, the effect for present embodiment describes.
In the flexible circuit board that has formed the screening conductive layer with screen painting, the surface of screening conductive layer is concavo-convex as mentioned above, therefore when the tensile elasticity rate of the tensile elasticity rate of screening conductive layer and shield dielectric layer had a great difference, the stress that easily produces part on flexible circuit board was concentrated.
Specifically, in such flexible circuit board, the part of hard bed thickness and the hard thin part of layer produce alternately, so all hardness of flexible circuit board becomes inhomogeneous.Therefore, the bending radius of the part (easily curved part) that hard layer is thin diminishes partly, easily produces stress in this part and concentrates.
For example, in the situation that the screening conductive layer is softer, shield dielectric layer is harder, on flexible circuit board, compare the part (part corresponding with the recess of screening conductive layer) of shielding insulation bed thickness, easily bending of the part that shield dielectric layer is thin (part corresponding with the protuberance of screening conductive layer), the part that therefore shield dielectric layer is thin on flexible circuit board can produce local stress and concentrate.Thus, on the circuit layout of the part that generation stress is concentrated, crack is arranged easily, circuit layout easily breaks.
On the other hand, in the present embodiment, as shown in above-mentioned formula (1), with the tensile elasticity rate E of screening conductive layer 24
1Tensile elasticity rate E with shield dielectric layer 25
2Ratio be made as in the scope of regulation, make the hardness coupling of screening conductive layer 24 and shield dielectric layer 25 as far as possible.Thus,, even it is concavo-convex to utilize screen painting that the surface of screening conductive layer 24 is formed, also can suppresses stress raisers and produce.
And, in addition, make the tensile elasticity rate E of shield dielectric layer 25
2Meet following formula (2), stress is concentrated and is further relaxed thus, thereby has further improved the bendability of flexible circuit board.
Then, the manufacture method for the flexible circuit board of present embodiment describes.
Fig. 4 means the flow chart of manufacture method of the flexible circuit board of present embodiment, and Fig. 5 and Fig. 7 mean that amplification view, Fig. 6 that the screening conductive layer of Fig. 4 forms operation mean that screening conductive layer at Fig. 4 forms the photo of the screen cloth of the galley that operation uses.
The manufacture method of the flexible circuit board of present embodiment, as shown in Figure 4, possess circuit layout and form operation S10, circuit protecting layer formation operation S11, screening conductive layer formation operation S12 and shield dielectric layer formation operation S13.In addition, when making flexible circuit board 2, being ready on the single face of insulating properties substrate 21 lamination has the single face copper foil laminate of Copper Foil.
At first, at circuit layout, form in operation S10, the Copper Foil of etching single face copper foil laminate forms circuit layout 22.
Then, in circuit protecting layer, form in operation S11, the overlay film lamination is formed circuit protecting layer 23 on circuit layout 22.At this moment, from the mode that overlay film exposes, the tack coat 231 of overlay film is bonded on circuit layout 22 with the two ends of circuit layout 22.
Form in operation S12 at the screening conductive layer, with the conductive paste screen painting to the insulating film 232 of overlay film and make it to solidify and form screening conductive layer 24.Form the detailed explanation of operation S12 for this screening conductive layer, as shown in Figure 5, utilizing emulsion to form above the galley 30 of mask 31, with squeegee 40, push conductive paste A and make it mobile.
This galley 30, as shown in Figure 6, possess line 32a be the screen cloth 32 that the clathrate braiding forms.The thickness of this screen cloth 32 is for example 200 order left and right.On the other hand, the adhesive of the conductive paste by this screen cloth 32 for example has, 25 ℃ of 200[dPaS at]～25 ℃ of 300[[dPaSat] the higher viscosity of left and right.
, at the screening conductive layer of present embodiment, form in operation S12 for this reason, as shown in Figure 7, on insulating film 232 with the part of the opening portion 32b subtend of screen cloth 32 than heavy back lamination conductive paste A, in the part with line 32A subtend than unfertile land lamination conductive paste A.Then, when this electroconductive paste A solidifies, just form surface and be continuous concavo-convex screening conductive layer 24.
Then, in shield dielectric layer, form in operation S13, the insulating properties ink that will be formed by polyester resin, screen painting is to the surface of the screening conductive layer 24 of concave-convex surface and make it curing.
The screen painting that the screen painting that this shield dielectric layer forms operation S13 also forms operation S12 with the screening conductive layer similarly, uses the galley of utilizing line to form screen cloth.And the rugosity that forms the screen cloth of the galley that operation S13 uses in this shield dielectric layer is for example 150 orders left and right.
In addition, forming the viscosity of the insulating properties ink that operation S13 uses in this shield dielectric layer, compare relatively lowly with the viscosity of the adhesive of above-mentioned conductive paste A, be for example 50[dPaS at25 ℃]～25 ℃ of 150[dPaS at] about.
Therefore, when printing the insulating properties ink on the screening conductive layer 24 that forms at concave-convex surface, on the face that contacts with screening conductive layer 24 in shield dielectric layer 25, the insulating properties ink enters in screening conductive layer 24 concavo-convex, simultaneously the outer surface of shield dielectric layer 25 become smooth (Fig. 3 with reference to).
Like this, in the manufacture method of the flexible circuit board that utilizes screen painting formation screening conductive layer, the surface of screening conductive layer must become concavo-convex.Therefore, as the tensile elasticity rate E of screening conductive layer
1Tensile elasticity rate E with shield dielectric layer
2When a great difference is arranged, can produce the thick part of hard layer (for example shield dielectric layer) and the hard thin part of layer on flexible circuit board, the bending radius part of the part that hard layer is thin diminishes, and easily produces local stress and concentrate on flexible circuit board.
With respect to this, as shown in above-mentioned formula (1) or formula (3), with the tensile elasticity rate E of screening conductive layer 24
1Tensile elasticity rate E with shield dielectric layer 25
2Ratio be set as in the scope of regulation, relax thus the stress of part as described above and concentrate, the bendability of flexible circuit board 2 is improved.
Specifically, with tensile elasticity rate E
1, E
2The mode that meets above-mentioned formula (1) or (formula 3) selects to form the conductive paste of screening conductive layer 2 and the insulating properties ink of formation shield dielectric layer 25.In addition, more preferably, with tensile elasticity rate E
1, E
2Identical (E becomes
1=E
2) mode select to form the conductive paste of screening conductive layer 24 and form the insulating properties ink of shield dielectric layer 25.
And, in addition, by the tensile elasticity rate E of shield dielectric layer 25
2Meet above-mentioned formula (2) or formula (4) and further relaxed above-mentioned stress and concentrate, further improved the bendability of flexible circuit board.
In addition, execution mode described above is easily put down in writing for understanding of the present invention is become, and is not to limit record of the present invention.Therefore, be disclosed each key element of above-mentioned execution mode also comprise belong to technology of the present invention scope in whole design alterations and the meaning of equivalent.
[embodiment]
Below, utilize embodiment and comparative example that the present invention has further been specialized to confirm effect of the present invention.Following examples and comparative example are the contents of confirming for the raising effect of the bendability of the flexible circuit board of the execution mode for above-mentioned.
Fig. 8 is the vertical view of the circuit layout of embodiment and comparative example, and Fig. 9～Figure 11 means the chart of result of the sliding test of embodiment and comparative example.
＜embodiment 1 〉
In embodiment 1,10 samples (sample 1～10) with the flexible circuit board of above-mentioned execution mode same configuration have been made.
In the sample of these embodiment 1, formed the insulating properties substrate with polyimides, formed circuit layout with copper, formed circuit protecting layer with overlay film, stick with paste and formed the screening conductive layer with silver, formed shield dielectric layer with the insulating properties ink.In addition, use the binding agent that is formed by epoxylite to form the tack coat of overlay film, with polyimides, formed insulating film.In addition, the adhesive stuck with paste of silver has used viscosity to be 25 ℃ of 200[dPaS at]～25 ℃ of 300[dPaS at] polyester resin of left and right.In addition, the insulating properties ink has used viscosity to be 25 ℃ of 50[dPaS at]～25 ℃ of 150[dPaS at] polyester resin of left and right.
In the sample of these embodiment 1, the thickness of insulating properties substrate is made as 12.5[μ m], the thickness of circuit layout is made as 12[μ m], the thickness of tack coat is made as 20[μ m], the thickness of insulating film is made as 12.5[μ m].In addition, the average thickness of screening conductive layer is made as 10 μ m, the average thickness of shield dielectric layer is made as 10[μ m].
In addition, in the sample of embodiment 1, by being etched with pattern forming circuit distribution 22 as shown in Figure 8.In addition, make the width l of circuit layout 22
1Be 75 μ m, make between circuit layout 22 interval l
2Be also 75 μ m.
In addition, in the sample of embodiment 1, silver is stuck with paste screen painting to insulating film, and make this silver stick with paste curing, formed thus the screening conductive layer.In addition, the screen painting of silver paste uses 200 purpose galleys.
In addition, in the sample of embodiment 1, insulating properties ink screen painting to the screening conductive layer, and is made this insulating properties ink cured, formed thus shield dielectric layer.In addition, the screen painting of insulating properties ink has used 150 purpose galleys.
Sample for this embodiment 1 has carried out sliding test.In this sliding test, the insulating properties substrate being placed in inboard, with flexible circuit board take radius 0.7[mm] be under the crooked state of 180 degree (gap G shown in Figure 2 is 1.4[mm] state), one end of flexible circuit board is fixed, and the other end is reciprocatingly slided mobile (maximum 400,000 times) repeatedly, mobile cycle-index reciprocatingly slides during investigation circuit layout broken string.
In this sliding test, making the mobile stroke that reciprocatingly slides is 20[mm], on one side with the movement that reciprocatingly slides of the ratio of a circulation in 2 seconds, Yi Bian measure the resistance value of circuit layout (between B and C in Fig. 8).In the present embodiment, this resistance value is compared with initial value and is being risen the moment more than 20%, regard circuit layout as and produce broken string, with the cycle-index of this moment as " cycle-index during broken string ".The measurement result of embodiment 1 is shown in table 1 and Fig. 9.
[table 1]
In addition, in " evaluation " in table 1, the cycle-index while in 10 samples, even 1 broken string being arranged less than 200,000 times also as defective " * ", if the cycle-index when 10 samples all break is more than 200,000 times as qualified " zero ", if the cycle-index when 10 samples all break is more than 250,000 times as preferred " ◎ " (identical in embodiment 2～15 and comparative example 1～6) in qualified.In addition, be (at the embodiment 2～5, identical in comparative example 1 and 2) that each cycle-index while having drawn sample 1～10 broken string of embodiment 1 forms at the chart of Fig. 9.
In addition, in the sample of embodiment 1, infer the tensile elasticity rate E of screening conductive layer
12.4[GPa], the tensile elasticity rate E of shield dielectric layer
21.8[GPa].In addition, inferring as follows of the tensile elasticity rate of screening conductive layer and shield dielectric layer carried out (identical in embodiment 2～15 and comparative example 1～6).
For the screening conductive layer, make infer different from the sample of embodiment 1 and use sample, this is inferred and uses sample, carry out tension test based on the standard of the JIS K 7127 of Japanese Industrial Standards (JIS) and infer tensile elasticity rate E
1.
Specifically, inferring of screening conductive layer used sample, use beak shaped sword type stamping-out to be processed as the shape of the test film type 2 of same specification, the inferring with sample of shape that will become test film type 2 answered 50[mm/min] draw speed be stretched to and break.
At this moment, measure and to infer with the elongation of sample with respect to the load that applies, make the longitudinal axis as stress (load), with transverse axis as the stress that is out of shape (elongation)-distortion line chart.In this example,, in the interval of the initial point from this stress-distortion line chart to yield point, connect initial point and each determination data with straight line respectively, the maximum in the inclination angle of each straight line is estimated as the tensile elasticity rate E of screening conductive layer
1.
In addition, make inferring of this screening conductive layer with following method and used sample.At first, silver that will be identical with the sample of embodiment 1 is stuck with paste and is printed on film, with the same temperature of the sample with embodiment 1, silver is stuck with paste and solidified, and then with the same insulating properties ink cured temperature of the sample with embodiment 1 (imposing on the temperature of the heat of sample for making the insulating properties ink cured) Heating Silver, stick with paste.That is, stick with paste for this silver and apply the hot resume identical with the screening conductive layer of embodiment 1.By from film peel off the silver that solidified paste make the inferring of screening conductive layer use sample thereafter.
For shield dielectric layer, the inferring with sample of other that the sample from embodiment 1 is different carried out tension test, use the method same with above-mentioned screening conductive layer to infer the tensile elasticity rate E of shield dielectric layer
2.In addition, inferring with the tension test of sample of this shield dielectric layer is also same with inferring with the tension test of sample of above-mentioned screening conductive layer, is based on that the standard of the JIS K 7127 of Japanese Industrial Standards (JIS) carries out.
In addition, shield dielectric layer infers with following such making of sample.At first, insulating properties ink that will be same with the sample of embodiment 1 is printed on film, with the same temperature of the sample with embodiment 1, makes the insulating properties ink cured.That is, this insulating properties ink is applied the hot resume identical with the screening conductive layer of embodiment 1.By from film peel off the insulating properties ink that solidified make the inferring of screening conductive layer use sample thereafter.
＜embodiment 2～5 〉
In embodiment 2～5, as shown in table 1, made respectively 10 E of the tensile elasticity rate except shield dielectric layer
2Be respectively 1.9[GPa], 2.4[GPa], 2.88[GPa], 3.1[GPa] in addition with the sample of embodiment 1 same configuration.
, for the sample of these embodiment 2～5, with main points similarly to Example 1, carried out sliding test.For the result of embodiment 2～5 shown in table 1 and Fig. 9.
＜embodiment 6 〉
In embodiment 6, having made respectively 10 thickness except the tack coat that makes overlay film is 30[μ m], the sample (sample 1～10) of structure similarly to Example 1., for the sample of these embodiment 6, with main points similarly to Example 1, carried out sliding test.For the result of embodiment 6 shown in table 2 and Figure 10.In addition, the chart of Figure 10 is (identical in embodiment 7～10, comparative example 3 and 4) that each cycle-index while having drawn sample 1～10 broken string of embodiment 6 forms.
[table 2]
＜embodiment 7～10 〉
In embodiment 7～10, as shown in table 2, made respectively 10 except making the tensile elasticity rate E of shield dielectric layer
2Be respectively 1.9[GPa], 2.4[GPA], 2.88[GPa], 3.1[GPa] and to make the thickness of the tack coat of overlay film be 30[μ m] in addition with the sample (sample 1～10) of embodiment 1 same configuration.
, for each sample of these embodiment 7～10, with main points similarly to Example 1, carried out sliding test.For the result of embodiment 7～10 shown in table 2 and Figure 10.
＜embodiment 11 〉
In embodiment 11, made respectively 10 except the average thickness that makes the screening conductive layer is 20 μ m with the sample (sample 1～10) of embodiment 1 same configuration., for the sample of these embodiment 11, with main points similarly to Example 1, carried out sliding test.For the result of embodiment 11 shown in table 3 and Figure 11.In addition, the chart of Figure 11 is (identical in embodiment 12～15, comparative example 5 and 6) that each cycle-index while having drawn sample 1～10 broken string of embodiment 11 forms.
[table 3]
＜embodiment 12～15 〉
In embodiment 12～15, having made respectively 10 is 20[μ m except the average thickness that makes the screening conductive layer] and the tensile elasticity rate E that makes shield dielectric layer as shown in table 3
2Be respectively 1.9[GPa], 2.4[GPa], 2.88[GPa], 3.1[GPa] in addition with the sample (sample 1～10) of embodiment 1 same configuration.
, for each sample of these embodiment 12～15, with main points similarly to Example 1, carried out sliding test.For the result of embodiment 12～15 shown in table 3 and Figure 11.
＜comparative example 1 〉
In comparative example 1, as shown in table 1, made respectively 10 except making the tensile elasticity rate E of shield dielectric layer
2For 1.5[GPA] sample (sample 1～10) identical with embodiment 1 in addition.
, for the sample of these comparative examples 1, with main points similarly to Example 1, carried out sliding test.For the result of comparative example 1 shown in table 1 and Fig. 9.
＜comparative example 2 〉
In comparative example 2, as shown in table 1, made respectively 10 except making the tensile elasticity rate E of shield dielectric layer
2For 3.5[GPA] in addition, the sample identical with embodiment 1 (sample 1～10).
, for the sample of these comparative examples 2, with main points similarly to Example 1, carried out sliding test.For the result of comparative example 2 shown in table 1 and Fig. 9.
＜comparative example 3 and 4 〉
In comparative example 3 and 4, as shown in table 2, made respectively 10 except making the tensile elasticity rate E of shield dielectric layer
2Be respectively 1.5[GPa], 3.5[GPa] and to make the thickness of the tack coat of overlay film be 30[μ m] in addition with the sample (sample 1～10) of embodiment 1 same configuration.
, for each sample of these comparative examples 3 and 4, with the main points identical with embodiment 1, carried out sliding test.For the result of comparative example 3 and 4 shown in table 2 and Figure 10.
＜comparative example 5 and 6 〉
In comparative example 5 and 6, having made respectively 10 is 20[μ m except the average thickness that makes the screening conductive layer] and the tensile elasticity rate E that makes shield dielectric layer as shown in table 3
2Be respectively 1.5[GPa], 3.5[GPa] in addition similarly to Example 1 the structure sample (sample 1～10).
, for each sample of these comparative examples 5 and 6, with main points similarly to Example 1, carried out sliding test.For the result of comparative example 5 and 6 shown in table 3 and Figure 11.
＜research 〉
In embodiment 1～5, as shown in table 1, mean qualified " ◎ " or " zero ".On the contrary, in comparative example 1 and 2, as shown in table 1, most of sample is less than 200,000 cycle-indexes, just having broken, and is defective.
According to above content as can be known, improve the bendability of flexible circuit board by meeting following formula (1), further improved the bendability of flexible circuit board by meeting following formula (3).
0.75≤E
2/ E
1≤ 1.29 ... formula (1)
0.79≤E
2/ E
1≤ 1.20 ... formula (3)
In addition, as described above, E
1The tensile elasticity rate of screening conductive layer, E
2It is the tensile elasticity rate of shield dielectric layer.
And then, as table 1 and embodiment 3 shown in Figure 9 as can be known, as the tensile elasticity rate E of screening conductive layer
1Tensile elasticity rate E with shield dielectric layer
2(E when identical
1=E
2) bendability of flexible circuit board can significantly improve.
In addition, meet following formula (2) by flexible circuit board and improved the bendability of flexible circuit board, and further improved the bendability of flexible circuit board by meeting following formula (4).
1.8[GPA]≤E
2≤ 3.1[GPa] ... formula (2)
1.9[GPA]≤E
2≤ 2.88[GPa] ... formula (4)
In addition, according to the result of embodiment 6～10, comparative example 3 and 4 as can be known,, even the thickness of the tack coat of coverlay changes, also become and the above embodiments 1～5, comparative example 1 and 2 same tendencies.
In addition, according to embodiment 11～15 and comparative example 5,6 result as can be known,, even the average thickness of screening conductive layer changes, also become with above-described embodiment 1～5, comparative example 1 and 2 and have same tendency.
Claims (6)
1. flexible circuit board; it is characterized in that; possess: the shield dielectric layer of institute's lamination on the screening conductive layer of institute's lamination and described screening conductive layer on the circuit protecting layer of institute's lamination, described circuit protecting layer on the circuit layout of institute's lamination, described circuit layout on insulating properties substrate, described insulating properties substrate meets following formula (1): 0.75≤E
2/ E
1≤ 1.29 ... formula (1), wherein, E
1The tensile elasticity rate of described screening conductive layer, E
2The tensile elasticity rate of described shield dielectric layer,
Form concavo-convex with the face of described shield dielectric layer subtend in described screening conductive layer.
2. flexible circuit board according to claim 1, is characterized in that, meets following formula (2): 1.8GPa≤E
2≤ 3.1GPa ... formula (2).
3. flexible circuit board according to claim 1, is characterized in that, meets following formula (3): 0.79≤E
2/ E
1≤ 1.20 ... formula (3).
4. flexible circuit board according to claim 1, is characterized in that,
The tensile elasticity rate of described screening conductive layer is identical with the tensile elasticity rate of described shield dielectric layer.
5. flexible circuit board according to claim 2, is characterized in that, meets following formula (4): 1.9GPa≤E
2≤ 2.88GPa ... formula (4).
6. the manufacture method of a flexible circuit board, is characterized in that, this flexible circuit board is the described flexible circuit board of any one in claim 1～5, and the manufacture method of described flexible circuit board possesses:
The screening conductive layer forms operation, on described circuit protecting layer, and described conductive paste is solidified the conductive paste screen painting, thereby forms described screening conductive layer; And
Shield dielectric layer forms operation, insulating properties ink screen painting to described screening conductive layer, and is made described insulating properties ink cured, thereby form described shield dielectric layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010088694A JP5355478B2 (en) | 2010-04-07 | 2010-04-07 | Flexible printed circuit board and manufacturing method thereof |
| JP2010-088694 | 2010-04-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102215630A CN102215630A (en) | 2011-10-12 |
| CN102215630B true CN102215630B (en) | 2013-11-13 |
Family
ID=44746685
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100419933A Expired - Fee Related CN102215630B (en) | 2010-04-07 | 2011-02-18 | Flexible printed board and method of manufacturing same |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8809687B2 (en) |
| JP (1) | JP5355478B2 (en) |
| CN (1) | CN102215630B (en) |
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| JP2015038908A (en) * | 2012-03-06 | 2015-02-26 | イビデン株式会社 | Flex-rigid wiring board |
| JP2015038907A (en) * | 2012-03-06 | 2015-02-26 | イビデン株式会社 | Flex-rigid wiring board |
| US9238118B2 (en) * | 2012-08-28 | 2016-01-19 | Carefusion Corporation | Multiple lumen hose |
| JP5849036B2 (en) * | 2012-09-27 | 2016-01-27 | 富士フイルム株式会社 | Conductive paste, printed wiring board |
| US9585238B2 (en) | 2012-10-30 | 2017-02-28 | Fujikura Ltd. | Printed circuit board |
| KR101991892B1 (en) | 2013-02-18 | 2019-06-24 | 삼성디스플레이 주식회사 | Tape package and flat panel display with the same |
| US9955614B2 (en) * | 2015-05-22 | 2018-04-24 | Samsung Electro-Mechanics Co., Ltd. | Sheet for shielding against electromagnetic waves and wireless power charging device |
| US10028420B2 (en) * | 2015-05-22 | 2018-07-17 | Samsung Electro-Mechanics Co., Ltd. | Sheet for shielding against electromagnetic waves and wireless power charging device |
| CN107241855B (en) * | 2015-08-24 | 2019-07-30 | 浙江展邦电子科技有限公司 | A kind of wiring board with shielding construction |
| JP6710053B2 (en) * | 2016-01-26 | 2020-06-17 | 日本メクトロン株式会社 | Flexible printed circuit board and method for manufacturing flexible printed circuit board |
| KR102500279B1 (en) * | 2017-12-27 | 2023-02-16 | 삼성디스플레이 주식회사 | Printed circuit board and display device having the same |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20110247863A1 (en) | 2011-10-13 |
| US8809687B2 (en) | 2014-08-19 |
| CN102215630A (en) | 2011-10-12 |
| JP2011222664A (en) | 2011-11-04 |
| JP5355478B2 (en) | 2013-11-27 |
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