CN102206098B - 一种陶瓷覆铜基板及其制备方法 - Google Patents
一种陶瓷覆铜基板及其制备方法 Download PDFInfo
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- CN102206098B CN102206098B CN 201010139347 CN201010139347A CN102206098B CN 102206098 B CN102206098 B CN 102206098B CN 201010139347 CN201010139347 CN 201010139347 CN 201010139347 A CN201010139347 A CN 201010139347A CN 102206098 B CN102206098 B CN 102206098B
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- copper foil
- copper
- ceramic
- base plate
- ceramic substrate
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- 239000000919 ceramic Substances 0.000 title claims abstract description 106
- 239000000758 substrate Substances 0.000 title claims abstract description 65
- 238000002360 preparation method Methods 0.000 title claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 163
- 239000011889 copper foil Substances 0.000 claims abstract description 152
- 239000010949 copper Substances 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims abstract description 42
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 claims abstract description 35
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229940112669 cuprous oxide Drugs 0.000 claims abstract description 35
- 238000004070 electrodeposition Methods 0.000 claims abstract description 23
- 239000008151 electrolyte solution Substances 0.000 claims abstract description 19
- 239000000243 solution Substances 0.000 claims description 20
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 14
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 13
- 239000003960 organic solvent Substances 0.000 claims description 12
- 238000007254 oxidation reaction Methods 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- 238000000354 decomposition reaction Methods 0.000 claims description 9
- 239000012670 alkaline solution Substances 0.000 claims description 7
- 230000003647 oxidation Effects 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 238000004062 sedimentation Methods 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 4
- 239000002283 diesel fuel Substances 0.000 claims description 3
- 239000003502 gasoline Substances 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 2
- 238000002203 pretreatment Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 abstract description 27
- 239000010410 layer Substances 0.000 abstract 3
- 239000011241 protective layer Substances 0.000 abstract 2
- 239000005751 Copper oxide Substances 0.000 abstract 1
- 229910000431 copper oxide Inorganic materials 0.000 abstract 1
- 230000005496 eutectics Effects 0.000 description 15
- 239000007791 liquid phase Substances 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 239000011148 porous material Substances 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 229960004643 cupric oxide Drugs 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 238000011010 flushing procedure Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007719 peel strength test Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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- Ceramic Products (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
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CN 201010139347 CN102206098B (zh) | 2010-03-30 | 2010-03-30 | 一种陶瓷覆铜基板及其制备方法 |
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CN 201010139347 CN102206098B (zh) | 2010-03-30 | 2010-03-30 | 一种陶瓷覆铜基板及其制备方法 |
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CN102206098A CN102206098A (zh) | 2011-10-05 |
CN102206098B true CN102206098B (zh) | 2013-04-10 |
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CN 201010139347 Expired - Fee Related CN102206098B (zh) | 2010-03-30 | 2010-03-30 | 一种陶瓷覆铜基板及其制备方法 |
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Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103117256A (zh) * | 2011-11-17 | 2013-05-22 | 上海申和热磁电子有限公司 | 陶瓷覆铜基板及其制造方法 |
CN103528075B (zh) * | 2013-09-30 | 2016-07-06 | 广德龙泰电子科技有限公司 | 一种覆铜板生产用回风综合吸收装置 |
CN104605695B (zh) * | 2013-11-03 | 2017-09-15 | 邱莉 | 紫砂壶及其打磨方法 |
CN103715101A (zh) * | 2013-12-23 | 2014-04-09 | 上海申和热磁电子有限公司 | 直接覆铜陶瓷基板的热压方法 |
CN103819214B (zh) * | 2014-01-10 | 2015-04-01 | 南京中江新材料科技有限公司 | 一种AlN陶瓷敷铜基板及其制备方法 |
CN103819215B (zh) * | 2014-03-20 | 2015-04-15 | 李磊 | 氮化铝基陶瓷覆铜板的制备方法 |
US9287106B1 (en) | 2014-11-10 | 2016-03-15 | Corning Incorporated | Translucent alumina filaments and tape cast methods for making |
CN105390662B (zh) * | 2015-11-23 | 2017-12-19 | 安徽恒利机电科技股份有限公司 | 一种汽车电池连接铜片生产工艺 |
CN107602158A (zh) * | 2017-09-25 | 2018-01-19 | 江苏时瑞电子科技有限公司 | 一种热敏电阻铜电极的制备方法 |
CN108218463A (zh) * | 2018-02-01 | 2018-06-29 | 深圳市宏钢机械设备有限公司 | 一种AlN陶瓷与无氧铜封接的方法 |
CN108484200B (zh) * | 2018-06-26 | 2021-08-31 | 烟台柳鑫新材料科技有限公司 | 一种陶瓷覆铜板及其制备方法 |
CN110246819B (zh) * | 2019-06-23 | 2024-12-13 | 许昌市森洋电子材料有限公司 | 一种生产致冷件用的瓷板和制造方法 |
CN110243874A (zh) * | 2019-07-02 | 2019-09-17 | 上海应用技术大学 | 一种测量高温下固体电解质电阻率的方法 |
CN112533388B (zh) * | 2019-09-19 | 2022-10-18 | 比亚迪股份有限公司 | 陶瓷覆铜板及其制备方法 |
CN111454080B (zh) * | 2020-05-12 | 2021-10-26 | 清华大学 | 一种敷铜或敷铜合金氧化铝陶瓷基板及其制备方法 |
CN112047728A (zh) * | 2020-09-28 | 2020-12-08 | 成都万士达瓷业有限公司 | 一种Al2O3陶瓷基片的制造方法 |
CN112271139A (zh) * | 2020-11-16 | 2021-01-26 | 深圳思睿辰新材料有限公司 | 覆铜氮化物陶瓷基板的制造方法 |
CN114214623B (zh) * | 2021-12-16 | 2023-08-29 | 九江德福科技股份有限公司 | 一种rtf反转处理铜箔的方法 |
CN115286415A (zh) * | 2022-06-28 | 2022-11-04 | 中国科学院合肥物质科学研究院 | 氮化铝覆铜陶瓷及其制备方法和应用 |
CN116120084B (zh) * | 2023-01-15 | 2024-02-27 | 福建华清电子材料科技有限公司 | 高效生产带引脚陶瓷覆铜基板的方法 |
CN115849934A (zh) * | 2023-02-23 | 2023-03-28 | 江苏富乐华半导体科技股份有限公司 | 一种覆铜陶瓷基板双层同时烧结的方法 |
CN119263869A (zh) * | 2024-12-09 | 2025-01-07 | 南京中江新材料科技有限公司 | 陶瓷覆铜基板及其制备方法和半导体器件 |
Citations (5)
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JP2002050873A (ja) * | 2000-07-27 | 2002-02-15 | Kermel | 導電路、パッド及びマイクロビアより成る回路の製造方法、並びにプリント回路及び高集積密度を有する多層モジュールの製造へのこの方法の使用方法 |
TW512186B (en) * | 1999-05-31 | 2002-12-01 | Alfachimici Spa | Process for promoting adhesion between an inorganic substrate and an organic polymer |
CN1807688A (zh) * | 2005-12-20 | 2006-07-26 | 厦门大学 | 电化学沉积制备形状可控的氧化亚铜微/纳米晶体的方法 |
CN101445386A (zh) * | 2007-11-27 | 2009-06-03 | 比亚迪股份有限公司 | 一种陶瓷覆铜基板的制备方法 |
CN101483217A (zh) * | 2009-02-04 | 2009-07-15 | 宋立峰 | 一种led高导热陶瓷覆铜散热电路板 |
-
2010
- 2010-03-30 CN CN 201010139347 patent/CN102206098B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW512186B (en) * | 1999-05-31 | 2002-12-01 | Alfachimici Spa | Process for promoting adhesion between an inorganic substrate and an organic polymer |
JP2002050873A (ja) * | 2000-07-27 | 2002-02-15 | Kermel | 導電路、パッド及びマイクロビアより成る回路の製造方法、並びにプリント回路及び高集積密度を有する多層モジュールの製造へのこの方法の使用方法 |
CN1807688A (zh) * | 2005-12-20 | 2006-07-26 | 厦门大学 | 电化学沉积制备形状可控的氧化亚铜微/纳米晶体的方法 |
CN101445386A (zh) * | 2007-11-27 | 2009-06-03 | 比亚迪股份有限公司 | 一种陶瓷覆铜基板的制备方法 |
CN101483217A (zh) * | 2009-02-04 | 2009-07-15 | 宋立峰 | 一种led高导热陶瓷覆铜散热电路板 |
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Effective date of registration: 20201125 Address after: 215500 No.13, Caotang Road, Changshu, Suzhou, Jiangsu Province Patentee after: Changshu intellectual property operation center Co.,Ltd. Address before: Room 3a12, building A1, 1983 creative Town, No.29 Nanxin street, Nanling village community, Nanwan street, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Chengze Information Technology Co.,Ltd. Effective date of registration: 20201125 Address after: Room 3a12, building A1, 1983 creative Town, No.29 Nanxin street, Nanling village community, Nanwan street, Longgang District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Chengze Information Technology Co.,Ltd. Address before: 518118 Pingshan Road, Pingshan Town, Shenzhen, Guangdong, No. 3001, No. Patentee before: BYD Co.,Ltd. |
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