CN102193002A - Acceleration sensor and manufacturing method thereof - Google Patents
Acceleration sensor and manufacturing method thereof Download PDFInfo
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- CN102193002A CN102193002A CN2010101486771A CN201010148677A CN102193002A CN 102193002 A CN102193002 A CN 102193002A CN 2010101486771 A CN2010101486771 A CN 2010101486771A CN 201010148677 A CN201010148677 A CN 201010148677A CN 102193002 A CN102193002 A CN 102193002A
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- acceleration transducer
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Abstract
The invention discloses an acceleration sensor used for detecting earthquakes and rock noise and a manufacturing method thereof. The acceleration sensor comprises a plurality of sub structures in the form of an array, wherein each sub structure comprises a mass block, an anchoring point connected with the mass block in the transverse direction and comb teeth capable of generating relative displacement in the transverse direction; and the plurality of sub structures are connected with each other through first supporting structures in the transverse direction and connected with each other through second supporting structures in the longitudinal direction vertical to the transverse direction. By using the acceleration sensor, the stress can be released through the first and the second supporting structures connected among the sub structures so that the sensitivity is improved.
Description
[technical field]
The present invention relates to a kind of acceleration transducer and manufacture method thereof, especially a kind of acceleration transducer and manufacture method thereof that is applied to the seismic survey device.
[background technology]
Traditional seismoreceiver is induction wave detector, and its mode by electromagnetic induction is converted to analog electrical signal output with vibration signal, and this mode also is to use the most general wave detector now.Being different from traditional detector, is that the digital geophone of core has been obtained develop rapidly in recent years with the MEMS technology, for the seismoreceiver technology is brought new breakthrough.Along with the continuous maturation of the development of MEMS technology and digital geophone measuring technology and perfect, digital geophone will be the inexorable trend of long-run development.The MEMS technology is substrate with silicon materials, processes in conjunction with micromachined technology and IC technology, is that collection microsensor, actuator, signal processor and control circuit, interface circuit, telecommunication circuit and power supply are the Micro Electro Mechanical System of one.
The seismoreceiver that is made of the MEMS acceleration transducer is with the variation of induction acceleration, and converts vibration signal to high-accuracy digital signal output by the form of closed loop force feedback.Acceleration transducer can equivalence be the second order vibrational system of being made up of mass m, spring k and damping c, and because the acceleration magnitude that seismic event causes is less, therefore requires the design wave detector that dynamic range is big, resolution is high and noise is little.From the angle of structural design,, can realize: 1) improve quality factor, promptly adopt the form of Vacuum Package by two approach if will improve resolution and wish that the noise of device own is less.2) size of increase mass m.
Adopting the typical products of vacuum sealing technique is the MEMS acceleration transducer of Sercel company, and its Q value is 10000, and Vacuum Package pressure is less than 1mTorr.This product adopts comb structure to realize capacitance detecting, and its advantage is that the acceleration transducer technology of comb structure is simple, ripe, and shortcoming is under the high vacuum encapsulation, the stable start-up time of system is long, but existing vacuum sealing technique is not very ripe, is unfavorable for producing in batches.
In addition, the broach processing technology is because factor affecting such as stress, stress gradient and structure gravity are difficult to process large-sized single mass block structure.Up to now, the domestic pertinent literature that similar products or structural design are not arranged at present as yet.The typical products of existing big mass block structure is the Si-FlexTM series wave detector of Colibrys company.Yet its technology is comparatively complicated, to adopt usually the dense boron of wet etching from stop, three layers of bonding of silex glass or four layers of technology such as bonding of silicon silicon.
So be necessary to design a kind of acceleration transducer and manufacture method thereof to solve the problems of the technologies described above.
[summary of the invention]
The method that technical matters to be solved by this invention is to provide a kind of sensitivity higher acceleration sensor and makes this acceleration transducer.
For solving the problems of the technologies described above, the present invention adopts following technical scheme: a kind of acceleration transducer, comprise the experimental process structure of forming array, each minor structure comprise mass, with the interconnective in the horizontal anchor point of mass and can produce the broach of relative displacement each other in the horizontal; Described experimental process structure interconnects by first supporting construction in the horizontal, and described experimental process structure vertical transverse vertically on interconnect by second supporting construction.
Further, described each minor structure comprises the support portion that is positioned at anchor point one side, described broach comprises movable broach that is connected with mass and first, second fixed fingers that is connected with the support portion, and described movable broach is in the horizontal between first, second fixed fingers.
Further, described each minor structure comprises first, second short beam that is connected with mass and anchor point respectively, reaches between first, second short beam and the tie-beam that is connected with first, second short beam.
Further, described tie-beam is serpentine elastic beam or " U " shape elastic beam or square frame shape elastic beam.
Further, described mass is a square frame shape, comprise first, second connecting portion that is provided with at interval in the vertical and the 3rd, the 4th connecting portion that is provided with at interval in the horizontal, described movable broach is connected on first, second connecting portion, and described first short beam is connected on the 3rd, the 4th connecting portion.
Further, described first supporting construction be transversely elasticity, vertically go up the structure of rigidity, described second supporting construction is for rigidity transversely, vertically go up flexible structure.
Further, described second supporting construction is " Z " ellbeam or " U " ellbeam or square frame ellbeam, and described elastic construction is equipped with the slit along horizontal expansion.
Further, described each minor structure is all identical.
For solving the problems of the technologies described above, the present invention can also adopt following technical scheme: a kind of method of making above-mentioned acceleration transducer comprises the steps:
(a). provide soi wafer as substrate;
(b). at the positive sputter or the evaporation aluminium of soi wafer, and the photoetching post-etching goes out aluminum steel;
(c). at the front surface coated photoresist of soi wafer, and make etching opening by lithography, utilize deep reaction ion etching to go out the part-structure layer of acceleration transducer again;
(d). soi wafer is put into the buffer oxide etching, obtain the movable structure layer of acceleration transducer, and remove photoresist.
Further, the thickness of described aluminium is 1 micron.
Compared to prior art, acceleration transducer of the present invention can carry out stress relief by first, second supporting construction that connects between each minor structure, thereby has improved sensitivity.In addition, the processing technology of acceleration transducer of the present invention is simple, is beneficial to industrialized development.
[description of drawings]
Fig. 1 is the schematic top plan view of acceleration transducer of the present invention.
Fig. 2 is the minor structure synoptic diagram of acceleration transducer shown in Figure 1.
Fig. 3 is the synoptic diagram of minor structure in second embodiment of acceleration transducer of the present invention.
Fig. 4 is the synoptic diagram of minor structure in the 3rd embodiment of acceleration transducer of the present invention.
Fig. 5 is the synoptic diagram that laterally connects between the parton structure of acceleration transducer of the present invention.
Fig. 6 is the synoptic diagram that vertically connects between the parton structure of acceleration transducer of the present invention.
Fig. 7 is the preparation flow synoptic diagram of acceleration transducer of the present invention.
[embodiment]
Please join shown in Figure 1, acceleration transducer 100 of the present invention comprises the experimental process structure 1-9 that forms array, described experimental process structure 1-9 goes up in horizontal (X-direction) and interconnects by first supporting construction, and described experimental process structure 1-9 upward interconnects by second supporting construction in vertical (Y direction) along vertical transverse.Acceleration transducer 100 of the present invention is in order to detect the acceleration of X-axis.In the embodiment of acceleration transducer 100 of the present invention, described array adopts the quadrate array of 3*3, comprises nine minor structure 1-9, and is linked to be an integral body by first, second supporting construction.Certainly, the setting of array is not limited to the quadrate array of 3*3, in other embodiments, also can adopt different arrangement modes according to design requirement, as the rectangular array of 3*2 or the quadrate array of 4*4 etc.
Because the structure of all minor structure 1-9 is all identical, below only minor structure 1 is elaborated.Please join shown in Figure 2, described minor structure 1 comprise square frame shape mass 11, with the interconnective in the horizontal anchor point 15 of mass 11, be positioned at support portion 14a, the 14b of anchor point 15 both sides and can produce the broach 16 of relative displacement each other in the horizontal.Described mass 11 comprises first, second connecting portion 11a, the 11b that is parallel to each other and is provided with at interval in the vertical, and the 3rd, the 4th connecting portion 11c, the 11d that are provided with at interval in the horizontal.Described broach 16 comprises the some movable broach 12a, the 12b that are connected on first, second connecting portion 11a, the 11b, is connected in first, second fixed fingers 13a, 13c on the 14a of support portion, and be connected in the 3rd, the 4th fixed fingers 13b, 13d on the 14b of support portion, between first, second fixed fingers 13a, 13c, movable broach 12b is in the horizontal between the 3rd, the 4th fixed fingers 13b, 13d in the horizontal for wherein movable broach 12a.Between described movable broach 12a and first, second fixed fingers 13a, the 13c, and can produce relative displacement in the horizontal between movable broach 12b and the 3rd, the 4th fixed fingers 13b, the 13d, in order to detect the acceleration (being detailed later) on the X-direction.
Described the 3rd, the 4th connecting portion 11c, 11d are connected with anchor point 15 by four first short beam 16a, 16b, 16c, 16d, four the second short beam 17a, 17b, 17c, 17d and two tie-beam 10a, 10b.Described tie-beam 10a connects the first short beam 16a, 16b and the second short beam 17a, 17b and between them.Described tie-beam 10b connects the first short beam 16c, 16d and the second short beam 17c, 17d and between them.Described tie-beam 10b has elasticity, fundamental purpose is that to be implemented in the elasticity of its direction of motion (in the present embodiment for X-direction) bigger, the rigidity of all the other directions is bigger, when realizing the direction of motion acceleration detection, suppresses the interference of other directional accelerations.In the present embodiment, described tie- beam 10a, 10b are roughly the serpentine elastic beam, and it is provided with two slit 10c that extend longitudinally.Please join Fig. 3 and shown in Figure 4, in other embodiments, described tie- beam 10a, 10b also can be " U " shape elastic beam 20a, 20b or square frame shape elastic beam 21a, 21b." U " shape elastic beam 20a, 20b and square frame shape elastic beam 21a, 21b are respectively equipped with slit 20c and the 21c that extends longitudinally equally.
In minor structure 1, anchor point 15 is fixed on the substrate (not shown) with support portion 14a, 14b, and remainder is suspended in the substrate top, is moving part.When the X axis acceleration acted on the minor structure 1, under the support of tie- beam 10a, 10b, mass 11 drive activity broach 12a, 12b produced certain displacement at X axis. Movable broach 12a, 12b and corresponding first, second fixed fingers 13a, 13c and the 3rd, the electric capacity between the 4th fixed fingers 13b, the 13d just change accordingly, just can record accekeration by detecting this changes in capacitance amount.In conjunction with existing processing technology, movable broach 12a, 12b and first, second fixed fingers 13a, 13c and the 3rd, the 4th fixed fingers 13b, 13d can pass through to become the form symmetry arrangement of spacing, difference in the two ends of mass 11.As shown in Figure 2, when the acceleration along the X-axis positive dirction acted on the minor structure 1, it is big that the spacing between the movable broach 12a and the first fixed fingers 13a and movable broach 12b and the 3rd fixed fingers 13b becomes; And the pitch smaller between the movable broach 12a and the second fixed fingers 13c and movable broach 12b and the 4th fixed fingers 13d, thereby form the difference output form.
Please join shown in Figure 5ly, acceleration transducer of the present invention 100 is by first supporting construction connexon structure 1 and minor structure 2 in the horizontal.Because acceleration transducer 100 one-piece constructions shown in Figure 1 are bigger in X-direction elasticity, discharged the stress on the X-direction to a certain extent.First supporting construction be transversely elasticity, vertically go up the structure (in the present embodiment for short beam 18) of rigidity, as the coupling part of transversely adjacent two masses 11, also can play the effect that discharges stress.Similarly, minor structure 2 also links to each other by short beam 18 with the mass 11 of minor structure 5 etc. in the horizontal with minor structure 3, minor structure 4.Concrete shape, size, number and the connected mode etc. of short beam 18 can be according to the specific requirement flexible design.
Please join shown in Figure 6ly, acceleration transducer of the present invention 100 is by second supporting construction mass 11 of connexon structure 1 and minor structure 4 in the vertical.Described second supporting construction is for rigidity transversely, vertically go up flexible structure.Because acceleration transducer 100 one-piece constructions shown in Figure 1 are bigger in the rigidity of Y direction, this vertically goes up the stress that flexible structure can discharge Y direction preferably.Described second supporting construction is " Z " ellbeam 19 or " U " ellbeam 22 or square frame ellbeam 23 (with Fig. 3 and " U " shape elastic beam 20a, 20b shown in Figure 4 and square frame shape elastic beam 21a, 21b similar).Described second supporting construction is equipped with the slit 24 along horizontal expansion, makes second supporting construction vertically have elasticity preferably.Similarly, the mass 11 of minor structure 2 and minor structure 5, minor structure 3 and minor structure 6 etc. also links to each other by vertically going up flexible structure in the vertical.
Fig. 7 has disclosed the manufacture method of acceleration transducer 100 of the present invention, may further comprise the steps:
(a). provide soi wafer as substrate, described soi wafer comprises bottom silicon layer A1, top silicon layer A2 and interlayer silicon dioxide layer A3;
(b). at the positive sputter or the evaporation aluminium of soi wafer, thickness is 1 micron, and the photoetching post-etching goes out aluminum steel A4;
(c). the front surface coated photoresist at soi wafer, make etching opening A5 by lithography, deep reaction ion etching (DRIE) goes out the part-structure layer of acceleration transducer 100;
(d). soi wafer is put into buffer oxide etch (BOE), obtain the movable structure layer of acceleration transducer 100, and remove photoresist.
Compared to prior art, under the same size condition, array acceleration transducer 100 of the present invention is compared with the acceleration transducer of single mass and single support system version, can carry out stress relief by first, second supporting construction between the mass 11, thereby improve sensitivity.Simultaneously, array acceleration transducer 100 of the present invention has adopted experimental process structure 1-9 and has been unified into the form of an integral body, thereby has increased output signal.In addition, acceleration transducer 100 integrally-built mass ratioes of the present invention are bigger, reduced Blang's thermonoise to a certain extent, simultaneously by vacuum sealing technique, to realize high resolving power.
In sum, it below only is preferred embodiment of the present invention, should not limit the scope of the invention with this, promptly every simple equivalent of being done according to claims of the present invention and description of the invention content changes and modifies, and all should still belong in the scope that patent of the present invention contains.
Claims (10)
1. acceleration transducer is characterized in that: comprise the experimental process structure of forming array, each minor structure comprises mass, with the interconnective in the horizontal anchor point of mass and can produce the broach of relative displacement each other in the horizontal; Described experimental process structure interconnects by first supporting construction in the horizontal, and described experimental process structure vertical transverse vertically on interconnect by second supporting construction.
2. acceleration transducer as claimed in claim 1, it is characterized in that: described each minor structure comprises the support portion that is positioned at anchor point one side, described broach comprises movable broach that is connected with mass and first, second fixed fingers that is connected with the support portion, and described movable broach is in the horizontal between first, second fixed fingers.
3. acceleration transducer as claimed in claim 2 is characterized in that: described each minor structure comprises first, second short beam that is connected with mass and anchor point respectively, reaches between first, second short beam and the tie-beam that is connected with first, second short beam.
4. acceleration transducer as claimed in claim 3 is characterized in that: described tie-beam is serpentine elastic beam or " U " shape elastic beam or square frame shape elastic beam.
5. acceleration transducer as claimed in claim 3, it is characterized in that: described mass is a square frame shape, comprise first, second connecting portion that is provided with at interval in the vertical and the 3rd, the 4th connecting portion that is provided with at interval in the horizontal, described movable broach is connected on first, second connecting portion, and described first short beam is connected on the 3rd, the 4th connecting portion.
6. acceleration transducer as claimed in claim 1 is characterized in that: described first supporting construction is for elasticity transversely, vertically go up the structure of rigidity, and described second supporting construction is for rigidity transversely, vertically go up flexible structure.
7. acceleration transducer as claimed in claim 6 is characterized in that: described second supporting construction is " Z " ellbeam or " U " ellbeam or square frame ellbeam.
8. acceleration transducer as claimed in claim 1 is characterized in that: described each minor structure is all identical.
9. a method of making claim 1 acceleration transducer comprises the steps:
(a). provide soi wafer as substrate;
(b). at the positive sputter or the evaporation aluminium of soi wafer, and the photoetching post-etching goes out aluminum steel;
(c). at the front surface coated photoresist of soi wafer, and make etching opening by lithography, utilize deep reaction ion etching to go out the part-structure layer of acceleration transducer again;
(d). soi wafer is put into the buffer oxide etching, obtain the movable structure layer of acceleration transducer, and remove photoresist.
10. method as claimed in claim 9 is characterized in that: the thickness of described aluminium is 1 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101486771A CN102193002A (en) | 2010-03-11 | 2010-03-11 | Acceleration sensor and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101486771A CN102193002A (en) | 2010-03-11 | 2010-03-11 | Acceleration sensor and manufacturing method thereof |
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| CN102193002A true CN102193002A (en) | 2011-09-21 |
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| CN2010101486771A Pending CN102193002A (en) | 2010-03-11 | 2010-03-11 | Acceleration sensor and manufacturing method thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103901228A (en) * | 2014-04-08 | 2014-07-02 | 清华大学 | Accelerometer |
| CN104597287A (en) * | 2015-01-30 | 2015-05-06 | 歌尔声学股份有限公司 | Inertia measurement module and triaxial accelerometer |
| CN105606841A (en) * | 2015-12-18 | 2016-05-25 | 苏州权素船舶电子有限公司 | Speed sensor |
| WO2016101611A1 (en) * | 2014-12-25 | 2016-06-30 | 歌尔声学股份有限公司 | Inertia measurement module and three-axis accelerometer |
| CN105785072A (en) * | 2014-12-25 | 2016-07-20 | 中芯国际集成电路制造(上海)有限公司 | MEMS accelerometers and manufacturing method thereof |
| CN106241730A (en) * | 2016-08-02 | 2016-12-21 | 电子科技大学 | A kind of vertical comb teeth manufacturing process based on SOI |
| CN108169515A (en) * | 2016-12-07 | 2018-06-15 | 精工爱普生株式会社 | Physical quantity transducer, physical quantity sensor device, electronic equipment and moving body |
| TWI809380B (en) * | 2021-02-22 | 2023-07-21 | 台灣積體電路製造股份有限公司 | Micro-electromechanical system device, micro-electromechanical system accelemeter and methods for forming the same |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001004658A (en) * | 1999-06-25 | 2001-01-12 | Matsushita Electric Works Ltd | Dual-shaft semiconductor acceleration sensor and manufacture thereof |
| CN1401080A (en) * | 2000-01-13 | 2003-03-05 | Bae系统公共有限公司 | Accelerometer |
| US20030115960A1 (en) * | 2000-01-07 | 2003-06-26 | Jochen Franz | Micromechanical structure, in particular for an acceleration sensor or yaw rate sensor and a corresponding method for producing the same |
| CN1763549A (en) * | 2004-10-21 | 2006-04-26 | 电子科技大学 | Array type micro-piezoresistive acceleration transducer |
| JP2006308353A (en) * | 2005-04-27 | 2006-11-09 | Matsushita Electric Ind Co Ltd | Acceleration sensor and its manufacturing method |
| CN101386400A (en) * | 2007-09-13 | 2009-03-18 | 李刚 | Capacitance single mass three-shaft acceleration transducer and preparation method |
| CN100520413C (en) * | 2007-03-06 | 2009-07-29 | 中北大学 | Combined micro-accelerometer |
| CN201716326U (en) * | 2010-03-11 | 2011-01-19 | 苏州敏芯微电子技术有限公司 | Acceleration sensor |
-
2010
- 2010-03-11 CN CN2010101486771A patent/CN102193002A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001004658A (en) * | 1999-06-25 | 2001-01-12 | Matsushita Electric Works Ltd | Dual-shaft semiconductor acceleration sensor and manufacture thereof |
| US20030115960A1 (en) * | 2000-01-07 | 2003-06-26 | Jochen Franz | Micromechanical structure, in particular for an acceleration sensor or yaw rate sensor and a corresponding method for producing the same |
| CN1401080A (en) * | 2000-01-13 | 2003-03-05 | Bae系统公共有限公司 | Accelerometer |
| CN1763549A (en) * | 2004-10-21 | 2006-04-26 | 电子科技大学 | Array type micro-piezoresistive acceleration transducer |
| JP2006308353A (en) * | 2005-04-27 | 2006-11-09 | Matsushita Electric Ind Co Ltd | Acceleration sensor and its manufacturing method |
| CN100520413C (en) * | 2007-03-06 | 2009-07-29 | 中北大学 | Combined micro-accelerometer |
| CN101386400A (en) * | 2007-09-13 | 2009-03-18 | 李刚 | Capacitance single mass three-shaft acceleration transducer and preparation method |
| CN201716326U (en) * | 2010-03-11 | 2011-01-19 | 苏州敏芯微电子技术有限公司 | Acceleration sensor |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103901228A (en) * | 2014-04-08 | 2014-07-02 | 清华大学 | Accelerometer |
| CN103901228B (en) * | 2014-04-08 | 2017-01-04 | 清华大学 | A kind of accelerometer |
| WO2016101611A1 (en) * | 2014-12-25 | 2016-06-30 | 歌尔声学股份有限公司 | Inertia measurement module and three-axis accelerometer |
| CN105785072A (en) * | 2014-12-25 | 2016-07-20 | 中芯国际集成电路制造(上海)有限公司 | MEMS accelerometers and manufacturing method thereof |
| US10473686B2 (en) | 2014-12-25 | 2019-11-12 | Goertek Inc. | Inertia measurement module and triaxial accelerometer |
| CN104597287A (en) * | 2015-01-30 | 2015-05-06 | 歌尔声学股份有限公司 | Inertia measurement module and triaxial accelerometer |
| CN104597287B (en) * | 2015-01-30 | 2017-09-05 | 歌尔股份有限公司 | Inertia measuring module and three axis accelerometer |
| CN105606841A (en) * | 2015-12-18 | 2016-05-25 | 苏州权素船舶电子有限公司 | Speed sensor |
| CN105606841B (en) * | 2015-12-18 | 2018-10-30 | 浙江日雅摩托车有限公司 | A kind of velocity sensor |
| CN106241730A (en) * | 2016-08-02 | 2016-12-21 | 电子科技大学 | A kind of vertical comb teeth manufacturing process based on SOI |
| CN108169515A (en) * | 2016-12-07 | 2018-06-15 | 精工爱普生株式会社 | Physical quantity transducer, physical quantity sensor device, electronic equipment and moving body |
| TWI809380B (en) * | 2021-02-22 | 2023-07-21 | 台灣積體電路製造股份有限公司 | Micro-electromechanical system device, micro-electromechanical system accelemeter and methods for forming the same |
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Application publication date: 20110921 |