CN1021874C

CN1021874C - Method of patterning resist for printed wiring boards

Info

Publication number: CN1021874C
Application number: CN 87100339
Authority: CN
Inventors: 哈罗德·莱克; 保罗·E·格兰蒙特
Original assignee: Foxboro Co
Current assignee: Schneider Electric Systems USA Inc
Priority date: 1987-01-19
Filing date: 1987-01-19
Publication date: 1993-08-18
Anticipated expiration: 2002-01-19
Also published as: CN87100339A

Abstract

The present invention relates to a method of drawing the patterns of a photo anti-etching layer or an insulating layer on a printed circuit board. Two kinds of photosensitized reaction coatings are respectively formed in such a way that an ultraviolet light sensitive layer processed by light is coated with a thin unexposure and undeveloped film strip base silver film. A white light X-Y plotter preferably provided with an octagon hole diameter is directly driven by a CAD system, the film on a plate is exposed according to the required pattern, and the underlying ultraviolet light sensitive layer is not affected; the film on the plate is developed, and when an ultraviolet floodlight is used for exposing the plate, the developed pattern is used as a mask of the underlying ultraviolet light layer at the place. The film is stripped after the exposure of ultraviolet light, a selected polymerizing layer is processed by a conventional method.

Description

Method of patterning resist for printed wiring boards

The application relates to Glan and covers special (Grantmoht) and Rec (Lake) and be entitled as: the multilayer circuit board autofrettage " common pending application; application number is 742; 747; the applying date be on June 10th, 1985 (with the application on the same day); this application has transferred the application's assignee, and adds reference here.

The present invention relates generally to the manufacturing of the printed substrate that electric component is used, more particularly, the present invention relates to the optical treatment technology that printed substrate is used.

Over the past two decades, the advancing integrated and miniaturization of electronic circuit component becomes the growing challenge to the printed substrate technological limit.Printed circuit board (PCB) or more properly be called printed substrate (PWB) and play a part aspect several crucial.At first, be installed in or be loaded on the flat firm card-like printing plate surface as the integrated circuit of special package, resistor or the like electric component.So printed substrate plays a part supporting member.Secondly, on the surface of printed panel, use the conductor fig of chemical etching or coating, make printed substrate form interelement required electric interconnection.In addition, printed substrate has also comprised the metallic region of thermolysis.

Conductor fig generally is to adopt the copper-clad epoxy resin fiber glass substrate of photoengraving to form.The photosensitive resist layer of one deck is coated on the Copper Foil, and throws on it exposure to form figure with ultraviolet (UV) light by a mask (being commonly referred to " former figure ").The exposed to the sun zone of light is subjected to polymerization.Do not play the zone of polymerization and removed by chemical solution, the zone (being required conductor fig) that stays copper is positioned under the light anticorrosion protection barrier layer of remaining polymerization sclerosis.Then the copper that exposes is etched away, and remove remaining photosensitive resist layer to expose the conductor fig of gained with chemical method.Another kind of way is to make the passage that the figure of photosensitive resist layer is used with the chemical plating that forms conductor fig.Certainly, this method has many variations, but all changes all need to make by lithography the figure of this resist layer.

Because the use of integrated circuit is day more growth, the interconnection termination of the higher density of input and output (I/O) usefulness just needs with two-sided printed substrate, and its additional interconnection is made in the another side of plate with conductor fig.

Along with the raising of circuit level, surface mounting technology (SMT) has also quickened the densification of electronic circuit.(SMD) directly is placed on the print circuit board surface with surface mounted device, and welds with vapour phase, infrared (IR) or other technology.Surface mounting technology has thoroughly been reformed the electronics process industry, and it is about 50% that assembly cost is descended, and component density increases and surpasses 40%, and has strengthened reliability.The termination that arrange than common component termination on the surface mounted device is arranged with higher density or closeer interval.Because each termination still must correctly be linked the relevant conductor on the plate on electric, surface mounted device alignment request printed substrate lead is had high resolution.In fact, the surface mounted device circuit has become close and can hold any more all to double sided board and need electric connection.Therefore, multilayer board has become the focus of attentiveness, has the technology of several competitions to launch.Those depend on the technology of conductive pattern lamination, except the live width of conductor fig in known layer and spacing are wanted accurately, also need the aligning of each interlayer.Will four or the more multi-layered degree of depth aim at that to make the very hachure that is equivalent to 3 to 5 mils be very difficult.

The surface mounting technology that is showing for the fullest utilization the benefit that may provide, must make substrate and the new manufacturing process of printed panel aspect developing.A problematic place in making printed substrate once was generation and used former figure to make the figure of photosensitive resist layer in the past.Use photographic negative or glass plate stability can occur, aim at, transport and difficulty that the storage aspect is intrinsic.

Eliminating former figure from the printed panel manufacture method is exactly a manufacturing target for a long time, and it has encouraged the development of high speed Ultra-Violet Laser plotter.Though there are several equipment can buy at present, all very expensive and be the product of early stage of development.These equipment need not former figure, can directly make the resist layer figure of ultraviolet light sensitivity.Conductor fig adopts computer-aided design (CAD) to design, and CAD is the coordinate and the dimension figureization in all paths, and converts them to the signal of control Ultra-Violet Laser X-Y plotter.Except their price was high, these systems also had some limitation, and these limitation become in hachure, high density operation and merit attention.Wherein main limitation is that the resist layer of ultraviolet light sensitivity is the low material of contrast, needs the exposure energy with high level.So the resolution of line edge is restricted.In order to obtain high render speed, these systems all work in the mode of raster scan.The edge that raster scan produces is irregular quite serious, and is very obvious when drawing the turning line.Aspect the limitation of accuracy and minimum lines the characteristics of these drawing of grating systems.The working life that another problematic place is a lasing light emitter in the existing system is short.But another is can not make inspection before polymerization from the problem that CAD draws the light processing layer with ultraviolet light directly.If made error among the figure, mistake just automatically is buried in the responsive layer of ultraviolet light.Under the situation of resist layer, only after removing whole resist layer and plate being made secondary cleaning and dry no moisture, begin again again, just can carry out the remedial efforts of plate.Drawing under the situation of solder mask with ultraviolet light, the malfunctioning monoblock panel that causes of the nib in the graphic making is scrapped.

Therefore, catalogue of the present invention be to eliminate the discrete former figure that in the manufacture method of printed panel, must be controlled, go wrong in edge resolution to avoid directly using the ultraviolet light plotter.Another object of the present invention is to provide cost low velocity high energy to make superfine lines and the figure of interlayer misalignment minimum with intrinsic more reliable device.

These purposes of the present invention can reach with a kind of system, the manufacturing installation of the substrate/printed panel that is directly promoted by the CAD layout that this system provides that a kind of height simplifies.Its manufacture method utilize one as thin as a wafer and the high peelable photosensitive film contact laminating of contrast on a substrate, but this substrate scribbles one deck light processing layer, as the material of resist layer or permanent insulation.But another kind method be with light processing layer and film at the very start common layer force together and use as the combination layer of substrate.Use the conventional low-yield white light plotter of copolymerisation in a kind of resist layer that can appreciable impact do not underlie, resulting structures can be exposed at plate from CAD.After the exposure, use the conventional film development principles of chemistry or the another kind of photomechanical process art that is suitable for used film type that film layers is developed at plate.Develop and can not disturb the resist layer that underlies.The image of the high-contrast film of gained just forms a mask as the resist layer that underlies even ultraviolet floodlight exposure usefulness subsequently at this place.Behind uv-exposure, remove film, preferably it is peeled off substrate.The available usual manner of further processing of substrate carries out.This manufacture method can be the multilayer layering and reuses, can be because of not operating the error that discrete former figure brings out aligning.This system also can use the raster scan plotter.The octangle spotlight makes the straight edges line and the scanning direction is at 45 or 90 °.Because film presents high-contrast, low intensive light just enough is used for exposure, generates high resolution, and to make pattern with direct ultraviolet light different with following resist layer for these.Therefore, the present invention combines the advantage that CAD drives plotter and forms at the direct figure of plate, owing to having used high-contrast, low-energy white light plotter to draw figure clearly.In addition, the visual picture on the film that developed can be checked fully before making uv-exposure, and when needed, can be repaired.If image is defective, film can be peelled off and adds again unexposed film.Identical with the method for handling resist layer, this system also can be used for making the figure or the permanent wafer insulating barrier of solder mask, or the like.

Figure 1A-1G is to use etching figure subtractive processes directly from CAD printed substrate to be carried out the schematic cross-section of the step of the photosensitive resist pattern of a series of making.

Fig. 2 is added to before the substrate operation chart with resist layer and the coarctate system of photographic film presheaf as combination layer.

Fig. 3 is the operation chart of the system on the substrate that applies resist layer that photographic film is added to

Fig. 4 A-4F is at the schematic cross-section that permanent wafer is carried out the step of a series of making figures according to a bar printing wiring board of the present invention.

Fig. 5 A-5F is the graphic making order schematic cross-section that utilizes the standard pattern method of coating according to of the present invention.

Fig. 6 A-6B is the schematic diagram according to equilateral octangle optically focused raster scan optical plotter of the present invention.

Fig. 7 A-7B is the schematic diagram according to non-equilateral octangle optically focused raster scan optical plotter of the present invention.

Shown in Figure 1A, the design of bar printing wiring board one deck conductor fig is offered CAD10, the size of printed substrate can be from arbitrary size to typical full-size 18 inches * 24 inches.The coordinate of figure is digitized, and arrives X-Y plotter 12 with the digital form of compatibility as the input transfer of control, for example lattice uncle 35 types (Gerber Model35).The plotter that this quasi-representative is used to make former figure has a workbench (not shown) of fixing film on it.By stepper motor that separates and screw drive, workbench can be simultaneously in X and Y-axis translation.The head of plotter is made up of a white light source 14 and some selectable apertures, here use a yellow filter 16, to remove unwanted ultraviolet light component, plotter is contained in the darkroom, " writes " figure of lines (variable-width usually) down with respect to the light beam 18 that film moves on film.

Shown in Figure 1A, for example an epoxy resin fiber glass substrate 20 is loaded with the even metal layer, and promptly the copper layer 22.Light resist layer 24 to the ultraviolet light sensitivity is superimposed upon on the copper layer 22.One tape base laminagraphy film 26 covers on the light resist layer 24.The thickness of film 26 preferably gets 1/4th or half mil.

The combining structure 30 of Figure 1A can prepare with several distinct methods, and as shown in Figure 2, resist layer 24 and film 26 become the two-ply 34 of combination with hot roll lamination at 32 places, then on the substrate 38 of 36 places roll extrusion at uncoated.Another kind method as shown in Figure 3, photographic film 26 is the substrate of roll extrusion coating resist layer directly.

Under the both of these case, resulting structures 30 is contained on the travelling table (not shown) of plotter 12, and film 26 is with light beam 18 exposures.

Once development,, for example total 30 is immersed in the fixing bath of the desired sequence discharging in the darkroom just with the conventional photographic process principles of chemistry.Image 42 just is apparent in the last emulsion layer of thin film 26.

Film 26 can be a tape base silver hinge sheet.A kind of film that is suitable for negative-working or positive-working can have been bought from 3-M company.The chemical development of film does not influence the completeness of the used resist layer that specifically underlies, but the most handy half resist layer moisture or the solvent shape.

It is a kind of that what be used in aspect of the present invention may be that outstanding film is to do silver-colored imaging film, the film dialogue photaesthesia that this class also can have been bought from 3-M company and quite high contrast is arranged, but need not use the chemicals developed image.Can make film development by heating of high temperature short-term or moderate temperature long period heating film.Just because of this character, even under not too high temperature, the dry-silver film photographic fog that can become after after a while, so its file character is very poor, but this class film may be desirable to the present invention, contacts with substrate (being resist layer or solder mask) down because it can be added with a side of latex.But the side that latex will be arranged is directly facing to the light processing layer, and the mask character at this place can strengthen, because after sheltering, ultraviolet light is unnecessary by being loaded with the film base panel material of latex.In other words, the film image in the latex is just sheltered ultraviolet light before entering the responsive layer of ultraviolet light being right after.A dry-silver film possible shortcoming in the method is that it presents lower contrast than the tape base film that develops with the conventional chemical principle.Although the dry-silver film that developed in addition can check onboard that before with ultraviolet photoetching it is difficult for finishing.

After the photographic fixing, combining structure 30 is in 44 times exposures of ultraviolet floodlight, shown in Fig. 1 C in film 26 for image 42.Deepening district 42 in the image of film 26 absorbs ultraviolet light and covers the resist layer that underlies.But be still clear area place at film 26, ultraviolet light leads to the part 46 that resist layer 24 and polymerization are underlied.In fact, it is believed that and be expected to be used for the ultraviolet luminous energy short pulse light of autoflash lamp to produce more uniform polymerization.

After plate moved apart ultraviolet photoetching device 44, next procedure was to divest film 26 shown in Fig. 1 D.Film has the light of figure resist layer 24 once removing to expose.Remaining processing substrate belongs to conventional measure (resist layer development, etching or plated film, or the like).As shown in Fig. 1 E, 1F and the 1G, light resist layer 24 not polymeric part can be removed with chemical action.And in the selection district of copper floor 22, only stay the part 46 of polymerization.Subsequent with the copper etching to form copper conductor figure 48, simultaneously, shown in Fig. 1 G, remove the part of resist layer 46 polymerizations and stay copper conductor figure 48 by former CAD designing institute regulation with chemical method.

The present invention also can be used for preparing solder mask and insulating barrier.Shown in Fig. 4 A-4E, the coating foil substrate 20 of epoxy resin fiber glass or other suitable material ' design producing be to use routine techniques or the technology of the present invention shown in Figure 1A-1G.Conductor foil figure 50 is shown in Fig. 4 A.The combination layer 52 of tape base elargol sheet 26 and permanent wafer (PDF) 54 is in the same place with the mode roll extrusion of Fig. 2, directly is added to substrate 20 ' to cover conductor fig 50.Another kind method is, can earlier permanent wafer be added up to form the substrate of coating, and the mode with Fig. 3 is added to film 26 on the substrate then.

Shown in Fig. 4 C, the combining structure that covers will be carried out the same steps as shown in Figure 1A, 1B, 1C and 1D.Directly on conductive foil pattern 50, selectively cover the zone of underliing of permanent wafer, as the mask at this place from the image that the emulsion layer of film 26, forms 55 that CAD painted.In Fig. 4-D, the permanent wafer insulating barrier 60 of hardening that the unexposed unpolymerized zone of permanent wafer stays polymerization on the conductive pattern 50 after chemical method is removed.

The metal of the light that exposed to the sun among Fig. 4 D is immersed in the solder bath of fusing with solder-coating, and the blank passage or aperture (Fig. 4 E) that fill in the insulating barriers 60 with scolder 62.For the surface that obtains to flush, the top layer of structure is exposed in the hot air knife (hot air knife) upper surface with soft heat scolder 62.The result obtains being easy to the smooth surface of face of weld installing device.In fact, soldering paste is given on the body structure surface of sieve in Fig. 4 E, surface mounted device is loaded onto and heating arrangement in vapor-phase process for example, is electrically connected so that form between the conductor of plate and surface mounted device.

Another kind of way shown in Fig. 4 F can be with permanent wafer as one deck interlevel insulator in the sandwich construction, and this structure type is disclosed in our the common unsettled multilayer application above-mentioned.The copper clad patterns 50 of Fig. 4 D forms the catalytic site that chemical plating is used.The passage that forms in permanent wafer insulating barrier 60 is with the firm copper conductor 64(Fig. 4 F of chemical plating method coating).Layer afterwards is added in the structure top shown in Fig. 4 F and goes up to have made up multilayer circuit.

Fig. 5 A-5F illustrates figure plating method, and this method is used directly from of the present invention photomask technology of CAD at this place.Shown in Fig. 5 A, substrate 20 is loaded with one deck upper strata metal forming 22, one deck resist layer 24 and a tomographic image and manifests film layers 26.Except when using the resist layer of negative-working, film is preferred outside the tape base film rather than the positive type tape base film shown in Figure 1A with the negativity type, this version identical with shown in Figure 1A.

Shown in Fig. 5 B, with film layers exposure (draftings) and development onboard with generation image 70.Then plate is exposed with the unscreened part of polymerization resist layer 24 under ultraviolet source.Pointed as Fig. 5 B, after reaching its purpose, film 26 peelled off lose.The subsequent unpolymerized resist layer of removing in Fig. 5 C stays the resist layer district 72 of hardening on uniform copper floor 22.

Because the copper layer is complete, so available electroplating.The through hole of plating exposes resist layer with the copper passage.Those zones that cover for resist layer 72 are not electroplated to be influenced.Because have only conductor fig (and hole), so the advantage of this way is not have extra copper electroplating layer to remove by plating.

Shown in Fig. 5 D, electroplating copper conductor 22 ' after, in a suitable groove, tin solder coating 72 electroplated copper conductor 22 ' upper surface.Tin solder coating 74 coats required conductor fig.Shown in Fig. 5 E, after the resist layer 72 of the polymerization of removing hardening, put this structure into etching tank, tin solder coating 74 works to do copper etchant against corrosion.The result is that copper foil layer 22 all is removed except the figure place of plating tin solder, and stays the required tinning copper figure shown in Fig. 5 F.In accompanying drawing (Fig. 5 F), after the final step of explanation, structure is heated with infrared or hot oil processing method, at the etching edge of copper figure 76(Fig. 5 F) the last soft heat soldering bed of material 74.

Directly the film mask that is plotted in this from CAD light has many advantages.What particularly the high-contrast layer as thin as a wafer of the one deck in this film mask produced directly draws resist layer from CAD with ultraviolet light far away surpassing of high-resolution drawing ability.Can use the ultraviolet light drawing system (it requires the often ultraviolet laser of displacement of high-octane palpus) of the high complexity of the low-cost white light drawing instrument of standard rather than use cost to finish directly and expose from CAD.In addition, the white light of high-contrast is drawn and is better than the ultraviolet light drafting, because light activated film has higher contrast ratio at the low-lying level place.

The mask of drawing at this place's light is that high-precision level to level alignment and multilayer printed circuit board provide the foundation.The exposure of film before resist layer exposure be can check with stable.

Can check that this point is the advantage that is better than a particular importance of ultraviolet light drafting.Error in the uv photopolymerization figure or artificial disturbance are difficult for removing in operation.But must go resist layer is molten, and behind cleaning and drying plate, again resist layer is coated, perhaps simply blackboard newspaper is given up.Be used in when disclosed method is come manufacturing chemistry plating multi-layer sheet in the above-mentioned common pending application, the consequence that mistake is drawn the permanent wafer layer of ultraviolet light sensitivity is strictly seriously.But use this method, can check the problem at the plate developed film of the artificial disturbance of generations such as nib is malfunctioning, hair, dust easily by drawing.In many cases, not to peel off old film and reuse new film, come but can use the fountain pen of saturating ultraviolet light not or repair with the photomask that a trickle part of latex that accurate pocket knife (exactoknife) deletion error is exposed will be located.When needing, can peel off bad mask in any case rapidly and also attempt again with a new film.Even important different places are the responsive layer of ultraviolet light plates is directly by also still maintaining the original state that a CAD layout is drawn.

High-speed grating scanning system in the time of this system can also being used to produce and existing laser equipment is not added any restriction.White light source in the research is a kind of xenon stroke light of beam collimation.

The raster scan light beam uses the octangle aperture not only can eliminate arbitrary edge irregularity of 45 ° and 90 ° lines, also can eliminate arbitrary edge irregularity that 0 ° of lines promptly is parallel to the lines of scanning direction.Shown in Fig. 6 A and 6B, the raster scan drawing instrument can be equipped with the band octangle preferably with the simple white light source in the aperture of the form of masterplate.The octangle spotlight focuses on the latex in the film.Among Fig. 6 A, the scanning direction is along the Y direction of indication, and purpose is will be at the directions X lines that draw.For this reason, at the Y coordinate (Y among Fig. 6 A that accurately proofreaies and correct ₁) locate to trigger stroboscopic lamp, so that when scanning for the first time, on film, expose to an octangle 90.In next one scanning, stroboscopic lamp is still at position Y ₁Place's flash of light is to expose to the octangle image 92 shown in second.The interval of scanning room approximately be as shown octangle wide 1/3rd, make

limit

90a and 92a aim at and contact or just in time overlapping.After continuous scanning, resulting staggered, overlapping octangle draw out good straight flange lines.In addition, shown in Fig. 6 B, by the octangle spotlight the Y direction at interval the wide continuous sweep of 1/3rd spotlights also can cause figure with straight flange 94a, 96a.

Because the octangle shown in Fig. 6 A and the 6B is equilateral, thus the lap on its limit when 90 ° of paths (Fig. 6 A) than when 45 ° of paths (Fig. 6 B) greatly.Make hypotenuse just can eliminate the influence that this lap does not wait with respect to scanning direction isometric (they and vertical edges have one to be about 2 subduplicate proportionate relationship, shown in Fig. 7 A and 7B).In the design, octangle will be divided into trisection, make that when making oblique line bar and vertical bar, lap equates.But as the vertical bar width is 3 units, then the width of gained oblique line bar is 2.828 units, but the autozoom mirror is arranged as the grating drawing instrument, then change amplification quantity, perhaps suitably regulate the length of exposure, make the hypotenuse width that light is can be when the Y direction scans out big slightly octangle and sets up the oblique line bar with compensation reduced.

Comprise that above-mentioned improved existing optical-mechanical system and the elargol sheet mask system at this place will produce practicable high-quality manufacture of substrates.Its speed of production is in fact near per five seconds figure.

Mask system at this place can adapt to positive type or negativity type tape base film, because the current available resist layer that uses is a negative-working, but for the operation that loses lustre, the most handy positivity tape base film.If use a kind of figure plating process (shown in Fig. 5 A-5F) of the resist layer with negative-working to make printed panel, then use negativity type tape base film in the same way.

The above-mentioned descriptive provision of the film mask printed substrate system at this place for explanation with rather than restriction use.For example, be single sided board though above-mentioned example only indicates, in the two-sided while of substrate or identical to two-sided use one after another operation, also can make double sided board.Do not departing under purport of the present invention or the spirit, certainly step described herein or material are being made multiple variation or additional, scope of the present invention is pointed out by claims and equivalent thereof.

Claims

But 1, a kind of method of the light processing layer making figure on the printed wire base board, its feature comprises:

Required figure is carried out digitized representations,

Prepare a substrate, the light on its upper strata can be handled the first spectral energy sensitivity of material to projection,

But unexposed, the undeveloped photographing imaging film of one deck to the second spectral energy sensitivity that projects substrate is coated on the light processing layer,

, film is excited and do not influence the light that underlies and can handle material layer selectively with the said exposure on the substrate with a low-energy radiation bundle that is longer than ultraviolet light by a branch of its wavelength of the automatic optical plotter emission of described digitized representations control,

With the film development on the substrate,

The image that by developing in said film layers is as the mask at this place, but the light processing layer is being exposed under the energy of said first spectrum that distributes substantially equably on the substrate,

Peel off said film layers from described substrate, and

But handle said light processing layer,

Thereby available low-yield drafting creates high-resolution the inspection at the plate mask.
2, the method for claim 1, but but it is characterized in that the said light processing layer of post-exposure processes is to remove exposing of said light processing layer or unexposed part is finished by chemical method.
3, the method for claim 1 it is characterized in that said first spectrum is ultraviolet light, and said second spectrum is visible light.
4, the method for claim 1 is characterized in that said optical plotter is an X-Y plotter.
5, the method for claim 1 is characterized in that said optical plotter is one and has the raster scan plotter that can trigger radiation source.
6, the method for claim 5, it is characterized in that said source is added on the film with octagonal shape, sweep span to make the octagonal limit of adjacent scanning aligned with each other with contact basically so that the straight flange lines that form become the angle of 0 °, 45 ° or 90 ° with the scanning direction.
7, the method for claim 1 is characterized in that said film has a latex side, but and prepares this at said light processing layer adjacent the latex side is arranged.
8, the method for claim 1 is characterized in that said film is a dry-silver film.
9, the method for claim 1, but it is characterized in that said film is the heat developed film.
10, the method for claim 1, but but it is characterized in that said film is a latex side to be arranged and prepare the heat developed film that this has the latex side at said light processing layer adjacent.
11, the method for claim 1 is characterized in that said substrate comprises metal.
But 12, a kind of method of making figure of the light processing layer of using for substrate, its feature comprises: required figure is carried out digitized representations,

But one deck is laminated together forming a combination layer to unexposed, the undeveloped photographing imaging film layers of the second spectral energy sensitivity of projection to the light processing layer of the first spectral energy sensitivity of projection and one deck,

Said combination layer is added on the substrate in last ground mode with film layers,

The low-energy radiation that is longer than ultraviolet light with a branch of its wavelength by the automatic optical plotter emission of described digitized representations control is selectively with said film layers exposure, and film is excited and do not influence the light that underlies and can handle material layer,

With the film development on the substrate,

The image that by developing in said film layers is as the mask at this place, exposes but make under the energy in said first spectrum that the light processing layer distributes on substrate substantially equably,

Described film on the described substrate is peeled off substrate, and

But handle said light processing layer,

Thereby available low-yield drafting creates high-resolution checkable plate mask.
13, the method for claim 12, but but it is characterized in that the said light processing layer of post-exposure processes is exposure or a unexposed portion of removing said light processing layer by chemical method.
14, the method for claim 12 it is characterized in that said first spectrum is ultraviolet light, and said second spectrum is visible light.
15, the method for claim 12 is characterized in that said optical plotter is an X-Y optical plotter.
16, the method for claim 12 is characterized in that said optical plotter is one and has the raster scan plotter that can trigger radiating light source.
17, the method for claim 16 is characterized in that light source is added on the film with octagonal shape, sweep span to make octagonal limit aligned with each other with contact basically so that the straight flange lines that form become the angle of 0 °, 45 ° and 90 ° with the scanning direction.
18, the method for claim 12, but it is characterized in that said film has a latex side and prepares this at said light processing layer adjacent the latex side is arranged.
19, the method for claim 12 is characterized in that said film is a dry-silver film.
20, the method for claim 12, but it is characterized in that said film is the heat developed film.
21, the method for claim 12, but but it is characterized in that said film is a latex side to be arranged and have the heat developed film that this has the latex side at said light processing layer adjacent.
22, the method for claim 12 is characterized in that said substrate comprises metal.
23, a kind of method of making printed substrate is characterized in that comprising:

Utilize CAD system design conductor fig, and produce corresponding digitalization and represent,

The combination layer of preparation multilayer, it comprises a nonconducting substrate, topped on it by responsive but can handle the upper strata that material is formed to the insensitive light of low-energy radiation that wavelength is longer than ultra-violet radiation to the high energy ultra-violet radiation, the space layer of at least one conducting metal places said substrate and said light to handle between the material layer

One deck is longer than wavelength ultra-violet radiation the low-energy radiation sensitivity, but tape base film layers strippable, unexposed, undeveloped photographing imaging is pressed onto on the light processing layer,

, film is excited and do not influence the light that underlies and can handle material layer selectively with the described exposure on the substrate with a low-energy radiation that is longer than ultra-violet radiation by a branch of its wavelength of the automatic optical plotter emission of described digitized representations control,

With the film development on the substrate,

The image that to develop on said film is as the mask at this place, and equally distributed substantially high energy ultra-violet radiation exposes to the light processing layer on the substrate but be used in,

Described film is peeled off from described substrate,

But handle described light processing layer removing, the perforate that exposes with the appropriate section of determining to make described the above conductive metal layer of substrate corresponding to the part of described conductor fig.
24, a kind of method of making printed substrate is characterized in that comprising;

Utilize CAD system design conductor fig, and produce corresponding digitalization and represent,

Form the combination layer of multilayer, it comprise one deck to high energy ultra-violet radiation sensitivity but can handle material layer to the insensitive light of low-energy radiation that wavelength is longer than ultra-violet radiation, and adjacent one deck is longer than the tape base film low-energy radiation sensitivity, strippable, unexposed, undeveloped photographing imaging of ultra-violet radiation to wavelength

Film layers is laminated on the surface of nonconducting substrate at last described combination layer, but and between described substrate and described light processing layer, have one deck conducting metal space layer at least,

The low-energy radiation that is longer than ultra-violet radiation with a branch of its wavelength by the automatic optical plotter emission of described digitized representations control is selectively to described film layers exposure, and film is excited and do not influence the light that underlies and can handle material layer,

With the film development on the substrate,

The image that to develop on described film is as at this place's mask, but is used on the substrate equally distributed substantially high energy ultra-violet radiation to the exposure of light processing layer,

With described film from described substrate peel off and

But handle the light processing layer, removing part selectively corresponding to described conductor fig, thereby but determine perforate on the light processing layer, this perforate exposes the appropriate section of the metal level that underlies on the described substrate to the open air.
25, a kind of method of making printed substrate is characterized in that comprising:

Utilize CAD system design conductor fig, and produce corresponding digitalization and represent,

The combination layer of preparation multilayer, it comprises a non-conductive substrate, be covered with conducting metal on it, but the resist layer that wavelength is longer than the insensitive uv photopolymerization of low-energy radiation of ultraviolet light is stacked on the conducting metal, cover the low-energy radiation sensitivity, strippable, tape base, unexposed, the undeveloped photographic film that wavelength are longer than ultraviolet light then

, film excited and do not influence the ultraviolet resist layer that underlies selectively to the described exposure on the described combination layer with a low-energy radiation that is longer than ultra-violet radiation by a branch of its wavelength of the automatic optical plotter emission of described digitized representations control,

With the film development on the substrate,

The figure that to develop on described film is exposed to the ultraviolet resist layer under the high energy ultraviolet floodlight as the mask at this place, makes the appropriate section polymerization of described ultraviolet light resist layer,

Described film is peeled off from described substrate,

Remove the not polymeric part of described resist layer, determining to expose the perforate of the appropriate section of the described metal that covers on the described substrate by described resist layer,

Remove the metal backing that exposes to the open air, and

Remove remaining polymeric part on the described resist layer, expose desired conductor fig.
26, a kind of method of making printed substrate is characterized in that comprising:

Utilize CAD system design conductor fig, and produce corresponding digitalization and represent,

The combination layer of preparation multilayer, comprise a non-conductive substrate, be covered with conductive metal foil on it, stack ultraviolet sensitivity resist layer on the paper tinsel, cover the tape base film low-energy radiation sensitivity, strippable, unexposed, undeveloped photographing imaging that wavelength is longer than ultraviolet light then

, film excited and do not influence the ultraviolet resist layer that underlies selectively to the described exposure on the described combination layer with a low power radiation that is longer than ultra-violet radiation by a branch of its wavelength of the automatic optical plotter emission of described digitized representations control,

With the film development on the substrate,

By the picture that develops on the film, the ultraviolet resist layer is exposed under the ultraviolet floodlight, the appropriate section polymerization of described ultraviolet resist layer,

Described film is peeled off from described substrate,

Remove the not polymeric part of described resist layer, the perforate that exposes with the appropriate section of determining to make the multiple layer of described paper tinsel,

The described expose portion of described metal coating is arrived in metal plating, thereby fills the perforate of described resist layer basically,

Remove remaining polymeric part on the described resist layer, and remove the residue of the paper tinsel coating of exposure.
27, the method for claim 26 is characterized in that also comprising:

After described plating step, tin solder is added to the plate surface of exposure,

The described residue paper tinsel step of cladding of removing adopts etching to finish.
28, a kind of method of making printed substrate is characterized in that comprising:

Utilize CAD system design conductor fig, and produce corresponding digitalization and represent,

The combination layer of preparation multilayer, comprise a nonconducting substrate, the conductive foil layer of figure corresponding to described conductive pattern arranged on it, but cover again with ultraviolet sensitivity light processing layer, next be tape base film one deck low-energy radiation sensitivity of wavelength being longer than ultra-violet radiation, strippable, unexposed, undeveloped, photographing imaging

The low-energy radiation that is longer than ultra-violet radiation with a branch of its wavelength that is sent by the automatic optical plotter of described digitized representations control is selectively to the described exposure on the described combination layer, and film is excited and does not influence the light that underlies and can handle material layer,

With the film development on the substrate,

With the mask of the image that develops on the described film, but the light processing layer is exposed under the ultraviolet floodlight, but makes appropriate section polymerization on the light processing layer as this place,

Described film is peeled off from described substrate,

But remove the not polymeric part on the described light processing layer, with the described passage that graphic foil is arranged of definite exposure, and

With metal filled described passage, finish described conductor fig.
29, the method for claim 28 is characterized in that, the step of the metal filled passage of described usefulness comprises that the combination layer with described processing contacts with solder bath.
30, the method for claim 28 is characterized in that, the step of the metal filled passage of described usefulness is that metallochemistry is plated on the paper tinsel figure of described exposure.
31, the method for claim 28 is characterized in that, but described light processing layer is the ultraviolet resist layer, and it further comprises:

After with metal filled described passage, remove the residue polymeric part of described resist layer.
32, the method for claim 28 is characterized in that, but described light processing layer is permanent in film.
33, a kind of method of making printed substrate is characterized in that comprising:

Utilize CAD system design conductor fig, and produce corresponding digitalization and represent,

The combination layer of preparation multilayer, comprise a non-conductive substrate, be covered with the conductive pattern of conducting metal on it, cover the permanent of ultraviolet sensitivity again in film layers, cover the tape base film that wavelength is longer than radiosensitive, strippable, unexposed, undeveloped, the photographing imaging of ultraviolet light then

Be longer than the low-energy radiation of ultra-violet radiation selectively to the described photographic film exposure on the described combination layer with a branch of its wavelength that sends by the automatic optical plotter of described digitized representations control, photographic film is excited and do not influence the nonvolatil wafer layer that underlies

Photographic film on the substrate is developed,

With the mask of the developed image on the described photographic film as this place, permanent wafer layer is exposed under the ultraviolet floodlight, the appropriate section polymerization of described permanent wafer,

Described photographic film is peeled off from described substrate,

Remove the not polymeric part of described permanent wafer, the perforate that exposes with the appropriate section of determining to make described conductor fig,

Thereby electric connection line can be accomplished on the described conductor fig by the perforate of described permanent wafer.