CN87100339A - Pattern corrosion-resistant method for printed wiring board - Google Patents

Abstract

A method for patterning a photoresist layer or insulating layer on a printed circuit board utilizes two photosensitive reactive coatings consisting of a photoprocessable UV-sensitive layer overlaid with a thin unexposed undeveloped silver-based film. A white light X-Y plotter, preferably with octagonal apertures, is driven directly by the CAD system to expose the film on the plate in the desired pattern without affecting the underlying uv sensitive layer, and the film on the plate is developed and used as a mask for the underlying uv layer at that location when the plate is exposed by a uv flood lamp. After exposure to UV light, the film is stripped and the selected polymeric layer is treated by conventional methods.

Description

The application relates to Glan and covers the common pending application that special (Grantmont) and Rec (Lake) is entitled as " multilayer circuit board autofrettage ", application number is 742,747, the applying date be on June 10th, 1985 (with the application on the same day), this application has transferred the application's assignee, and adds reference here.

The present invention relates generally to the manufacturing of the printed substrate that electric component is used, more particularly, the present invention relates to the optical treatment technology that printed substrate is used.

Over the past two decades, the advancing integrated and miniaturization of electronic circuit component becomes the growing challenge to the printed substrate technological limit.Printed circuit board (PCB) or more properly be called printed substrate (PWB) and play a part aspect several crucial.At first, be installed in or be loaded on the flat firm card-like printing plate surface as the integrated circuit of special package, resistor or the like electric component.So printed substrate plays a part supporting member.Secondly, on the surface of printed panel, use the conductive pattern of chemical etching or coating, make printed substrate form interelement required electric interconnection.In addition, printed substrate has also comprised the metallic region of thermolysis.

Conductive pattern generally is to adopt the copper-clad epoxy resin fiber glass substrate of photoengraving to form.The photosensitive resist layer of one deck is coated on the Copper Foil, and throws on it exposure to form pattern with ultraviolet (UV) light by a mask (being commonly referred to " former figure ").The exposed to the sun zone of light is subjected to polymerization.Do not play the zone of polymerization and removed by chemical solution, the zone (being required conductive pattern) that stays copper is positioned under the light anticorrosion protection barrier layer of remaining polymerization sclerosis.Then the copper that exposes is etched away, and remove remaining photosensitive resist layer to expose the conductive pattern of gained with chemical method.Another kind of way is to make the passage that the pattern of photosensitive resist layer is used with the chemical plating that forms conductive pattern.Certainly, this method has many variations, but all changes all need to make by lithography the pattern of this resist layer.

Because the use of integrated circuit is day more growth, the interconnection termination of the higher density of input and output (I/O) usefulness just needs with two-sided printed substrate, and its additional interconnection is made in the another side of plate with conductive pattern.

Along with the integrated increase of circuit, SMT (SMT) has also quickened the densification of electronic circuit.(SMD) directly is placed on the print circuit board surface with the face installing device, and welds with vapour phase, infrared (IR) or other technology.SMT has thoroughly been reformed the electronics process industry, and it is about 50% that assembly cost is descended, and component density increases and surpasses 40%, and has strengthened reliability.The termination that arrange than common component termination on the face installing device is arranged with higher density or closeer interval.Because each termination still must correctly be linked the relevant conductor on the plate on electric, the face installing device alignment request printed substrate lead is had high resolution.In fact, face installing device circuit has become close and can hold any more all to double sided board and need electric connection.Therefore, multilayer board has become the focus of attentiveness, has the technology of several competitions to launch.Those depend on the technology of conductive pattern lamination, except the live width of conductive pattern in known layer and spacing are wanted accurately, also need the aligning of each interlayer.Will four or the more multi-layered degree of depth aim at that to make the very hachure that is equivalent to 3 to 5 mils be very difficult.

For the possible benefit that SMT provided that the fullest utilization is coming up, substrate and the new manufacturing process of printed panel aspect developing must made.A problematic place in making printed substrate once was generation and used former figure to make the pattern of photosensitive resist layer in the past.Use photographic negative or glass plate stability can occur, aim at, transport and difficulty that the storage aspect is intrinsic.

Eliminating former figure from the printed panel manufacture method is exactly a manufacturing target for a long time, and it has encouraged the development of high speed Ultra-Violet Laser plotter.Though there are several equipment can buy at present, all very expensive and be the product of early stage of development.These equipment need not former figure, can directly make the resist layer pattern of ultraviolet light sensitivity.Conductive pattern adopts computer-aided design (CAD) to design, and CAD is the coordinate and the dimension figureization in all paths, and converts them to the signal of control Ultra-Violet Laser X-Y plotter.Except their price was high, these systems also had some limitation, and these limitation become in hachure, high density operation and merit attention.Wherein main limitation is that the resist layer of ultraviolet light sensitivity is the low material of contrast, needs the exposure energy with high level.So the resolution of line edge is restricted.In order to obtain high render speed, these systems all work in the mode of raster scan.The edge that raster scan produces is irregular quite serious, and is very obvious when drawing the turning line.Aspect the limitation of accuracy and minimum lines the characteristics of these drawing of grating systems.The working life that another problematic place is a lasing light emitter in the existing system is short.But another is can not make inspection before polymerization from the problem that CAD draws the light processing layer with ultraviolet light directly.If made error among the figure, mistake just automatically is buried in the responsive layer of ultraviolet light.Under the situation of resist layer, only after removing whole resist layer and plate being made secondary cleaning and dry no moisture, begin again again, just can carry out the remedial efforts of plate.Drawing under the situation of solder mask with ultraviolet light, the malfunctioning monoblock panel that causes of the nib in the design producing is scrapped.

Therefore, catalogue of the present invention be to eliminate the discrete reason that in the manufacture method of printed panel, must be controlled, go wrong in edge resolution to avoid directly using the ultraviolet light plotter.Another object of the present invention is to provide cost low velocity high energy to make superfine lines and the pattern of interlayer misalignment minimum with intrinsic more reliable device.

These purposes of the present invention can reach with a kind of system, the manufacturing installation of the substrate/printed panel that is directly promoted by the CAD layout that this system provides that a kind of height simplifies.Its manufacture method utilize one as thin as a wafer and the high peelable photosensitive film contact laminating of contrast on a substrate, but this substrate scribbles one deck light processing layer, as the material of resist layer or permanent insulation.But another kind method be with light processing layer and film at the very start common layer force together and use as the combination layer of substrate.Use the conventional low-yield white light plotter of copolymerisation in a kind of resist layer that can appreciable impact do not underlie, resulting structures can be exposed at plate from CAD.After the exposure, use the conventional film development principles of chemistry or the another kind of photomechanical process art that is suitable for used film type that film layers is developed at plate.Develop and can not disturb the resist layer that underlies.The image of the high-contrast film of gained just forms a mask as the resist layer that underlies even ultraviolet floodlight exposure usefulness subsequently at this place.Behind uv-exposure, remove film, preferably it is peeled off substrate.The available usual manner of further processing of substrate carries out.This manufacture method can be the multilayer layering and reuses, can be because of not operating the error that discrete former figure brings out aligning.This system also can use the raster scan plotter.The octangle spotlight makes the straight edges line and the scanning direction is at 45 or 90 °.Because film presents high-contrast, low intensive light just enough is used for exposure, generates high resolution, and to make pattern with direct ultraviolet light different with following resist layer for these.Therefore, the present invention combines the advantage that CAD drives plotter and forms at the direct pattern of plate, owing to having used high-contrast, low-energy white light plotter to draw clear pattern.In addition, the visual picture on the film that developed can be checked fully before making uv-exposure, and when needed, can be repaired.If image is defective, film can be peelled off and adds again unexposed film.Identical with the method for handling resist layer, this system also can be used for making the pattern or the permanent wafer insulating barrier of solder mask, or the like.

Figure 1A-1G is to use the etching pattern subtractive processes directly from CAD printed substrate to be carried out the schematic cross-section that a sequence is made the step of photosensitive corrosion-resisting pattern.

Fig. 2 is added to before the substrate resist layer and the coarctate system operation presentation graphs of photographic film presheaf as combination layer.

Fig. 3 be with photographic film be added to the coating resist layer substrate on the system operation presentation graphs.

Fig. 4 A-4F is at the schematic cross-section that permanent wafer is carried out the step of a sequence pattern-making according to a bar printing wiring board of the present invention.

Fig. 5 A-5F is the design producing order schematic cross-section that utilizes the standard pattern method of coating according to of the present invention.

Fig. 6 A-6B is the schematic diagram according to equilateral octangle optically focused raster scan optical plotter of the present invention.

Fig. 7 A-7B is the schematic diagram according to non-equilateral octangle optically focused raster scan optical plotter of the present invention.

Shown in Figure 1A, the design of bar printing wiring board one deck conductive pattern is offered CAD10.The size of printed substrate can be from arbitrary size to typical full-size 18 inches * 24 inches.The coordinate of pattern is digitized, and arrives X-Y plotter 12 with the digital form of compatibility as the input transfer of control, for example lattice uncle 35 types (Gerber Model 35).The plotter that this quasi-representative is used to make former figure has a workbench (not shown) of fixing film on it.By stepper motor that separates and screw drive, workbench can be simultaneously in X and Y-axis translation.The head of plotter is made up of a white light source 14 and some selectable apertures, uses a yellow filter 16 here, to remove unwanted ultraviolet light component.Plotter is contained in the darkroom, " writes " pattern of lines (variable-width usually) down with respect to the light beam 18 that film moves on film.

Shown in Figure 1A, for example an epoxy resin fiber glass substrate 20 is loaded with the even metal layer, and promptly the copper layer 22.Light resist layer 24 to the ultraviolet light sensitivity is superimposed upon on the copper layer 22.One tape base laminagraphy film 26 covers on the light resist layer 24.The thickness of film 26 preferably gets 1/4th or half mil.

The combining structure 30 of Figure 1A can prepare with several distinct methods.As shown in Figure 2, resist layer 24 and film 26 become the two-ply 34 of combination with hot roll lamination at 32 places, then on the substrate 38 of 36 places roll extrusion at uncoated.Another kind method as shown in Figure 3, photographic film 26 is the substrate of roll extrusion coating resist layer directly.

Under the both of these case, resulting structures 30 is contained on the travelling table (not shown) of plotter 12, and film 26 is with light beam 18 exposures.

Once development,, for example total 30 is immersed in the fixing bath of the desired sequence discharging in the darkroom just with the conventional photographic process principles of chemistry.Image 42 just is apparent in the last emulsion layer of thin film 26.

Film 26 can be a tape base elargol sheet.A kind of film that is suitable for negative-working or positive-working can have been bought from 3-M company.The chemical development of film does not influence the integrality of the used resist layer that specifically underlies, but the most handy half resist layer moisture or the solvent shape.

It is a kind of that what be used in aspect of the present invention may be that outstanding film is to do silver-colored imaging film.The film dialogue photaesthesia that this class also can have been bought from 3-M company and quite high contrast is arranged, but do not need to use the chemicals developed image.Can make film development by heating of high temperature short-term or moderate temperature long period heating film.Just because of this character, even under not too high temperature, the dry-silver film photographic fog that can become after after a while is so its file character is very poor.But this class film may be desirable to the present invention, because a side that it can be added with latex down and substrate, i.e. and resist layer or solder mask contact.But the side that latex will be arranged is directly facing to the light processing layer, and the mask character at this place can strengthen, because after sheltering, ultraviolet light is unnecessary by being loaded with the film base panel material of latex.In other words, the film image in the latex is just sheltered ultraviolet light before entering the responsive layer of ultraviolet light being right after.A dry-silver film possible shortcoming in the method is that it presents lower contrast than the tape base film that develops with the conventional chemical principle.In addition, although the dry-silver film that developed can check onboard that before with ultraviolet photoetching it is difficult for finishing.

After the photographic fixing, combining structure 30 is in 44 times exposures of ultraviolet floodlight, shown in Fig. 1 C in gel 26 for image 42.Deepening district 42 in the image of film 26 absorbs ultraviolet light and shields the resist layer that underlies.But be still clear area place at film 26, ultraviolet light leads to the part 46 that resist layer 24 and polymerization are underlied.In fact, it is believed that and be expected to be used for the ultraviolet luminous energy short pulse light of autoflash lamp to produce more uniform polymerization.

After plate moved apart ultraviolet photoetching device 44, next procedure was to divest film 26 shown in Fig. 1 D.Film exposes figuratum smooth resist layer 24 once removing.Remaining processing substrate belongs to conventional measure (resist layer development, etching or plated film, or the like).As shown in Fig. 1 E, 1F and the 1G, light resist layer 24 not polymeric part can be removed with chemical action.And in the selection district of copper floor 22, only stay the part 46 of polymerization.Subsequent with the copper etching to form copper conductor pattern 48, simultaneously, shown in Fig. 1 G, remove the part of resist layer 46 polymerizations and stay copper conductor pattern 48 by former CAD designing institute regulation with chemical method.

The present invention also can be used for preparing solder mask and insulating barrier.Shown in Fig. 4 A-4E, the coating foil substrate 20 of epoxy resin fiber glass or other suitable material ' design producing be to use routine techniques or the technology of the present invention shown in Figure 1A-1G.Conductor foil pattern 50 is shown in Fig. 4 A.The combination layer 52 of tape base elargol sheet 26 and permanent wafer (PDF) 54 is in the same place with the mode roll extrusion of Fig. 2, directly is added to substrate 20 ' to cover conductive pattern 50.Another kind method is, can earlier permanent wafer be added up to form the substrate of coating, and the mode with Fig. 3 is added to film 26 on the substrate then.

Shown in Fig. 4 C, the combining structure that covers will be carried out the same steps as shown in Figure 1A, 1B, 1C and 1D.Directly on conductive foil pattern 50, selectively shield the zone of underliing of permanent wafer, as the mask at this place from the image that the emulsion layer of film 26, forms 55 that CAD painted.In Fig. 4 D, the permanent wafer insulating barrier 60 of hardening that the unexposed unpolymerized zone of permanent wafer stays polymerization on the conductive pattern 50 after chemical method is removed.

The metal of the light that exposed to the sun among Fig. 4 D is immersed in the solder bath of fusing with solder-coating, and the blank passage or aperture (Fig. 4 E) that fill in the insulating barriers 60 with scolder 62.For the surface that obtains to flush, the top layer of structure is exposed to the upper surface of hot air knife (hot air knife) with soft heat scolder 62.The result obtains being easy to the smooth surface of face of weld installing device.In fact, soldering paste is given on the body structure surface of sieve in Fig. 4 E, surface mounted device is loaded onto and heating arrangement in vapor-phase process for example, is electrically connected so that form between the conductor of plate and surface mounted device.

Another kind of way shown in Fig. 4 F can be with permanent wafer as one deck interlevel insulator in the sandwich construction, and this structure type is disclosed in our the common multilayer application of determining above-mentioned.The copper foil pattern 50 of Fig. 4 D forms the catalytic site that chemical plating is used.The passage that forms in permanent wafer insulating barrier 60 is with the firm copper conductor 64(Fig. 4 F of chemical plating method coating).Layer afterwards is added in the structure top shown in Fig. 4 F and goes up to have made up multilayer circuit.

Fig. 5 A-5F illustrates pattern plating method, and this method is used directly from of the present invention photomask technology of CAD at this place.Shown in Fig. 5 A, substrate 20 is loaded with one deck upper strata metal forming 22, one deck resist layer 24 and a tomographic image and manifests film layers 26.Except when using the resist layer of negative-working, film is preferred outside the tape base film rather than the positive type tape base film shown in Figure 1A with the negativity type, this version identical with shown in Figure 1A.

Shown in Fig. 5 B, with film layers exposure (draftings) and development onboard with generation image 70.Then plate is exposed with the unscreened part of polymerization resist layer 24 under ultraviolet source.Pointed as Fig. 5 B, after reaching its purpose, film 26 peelled off lose.The subsequent unpolymerized resist layer of removing in Fig. 5 C stays the resist layer district 72 of hardening on uniform copper floor 22.

Because the copper layer is complete, so available electroplating.The through hole of plating exposes resist layer with the copper passage.Those zones that cover for resist layer 72 are not electroplated to be influenced.Because have only conductive pattern (and hole), so the advantage of this way is not have extra copper electroplating layer to remove by plating.

Shown in Fig. 5 D, electroplating copper conductor 22 ' after, in a suitable groove, tin solder coating 74 electroplated copper conductor 22 ' upper surface.Tin solder coating 74 coats required conductive pattern.Shown in Fig. 5 E, after the resist layer 72 of the polymerization of removing hardening, put this structure into etching tank.Tin solder coating 74 works to do copper etchant against corrosion.The result is that copper foil layer 22 all is removed except the pattern place of plating tin solder, and stays the required tinning copper pattern shown in Fig. 5 F.In accompanying drawing (Fig. 5 F), after the final step of explanation, structure is heated with infrared or hot oil processing method, at the etching edge of copper pattern 76(Fig. 5 F) the last soft heat soldering bed of material 74.

Directly the film mask that is plotted in this from CAD light has many advantages.What particularly the high-contrast layer as thin as a wafer of the one deck in this film mask produced directly draws resist layer from CAD with ultraviolet light far away victory of high-resolution drawing ability.Can use the ultraviolet light drawing system (it requires the often ultraviolet laser of displacement of high-octane palpus) of the high complexity of the low-cost white light drawing instrument of standard rather than use cost to finish directly and expose from CAD.In addition, the white light of high-contrast is drawn and is better than the ultraviolet light drafting, because light activated film has higher contrast ratio at the low-lying level place.

The mask of drawing at this place's light is that high-precision level to level alignment and multilayer printed circuit board provide the foundation.The exposure of film before resist layer exposure be can check with stable.

Can check that this point is the advantage that is better than a particular importance of ultraviolet light drafting.Error in the uv photopolymerization pattern or artificial disturbance are difficult for removing in operation.But must go resist layer is molten, and behind cleaning and drying plate, again resist layer is coated, perhaps simply blackboard newspaper is given up.Be used in when disclosed method is come manufacturing chemistry plating multi-layer sheet in the above-mentioned common pending application, the consequence that mistake is drawn the permanent wafer layer of ultraviolet light sensitivity is strictly seriously.But use this method, can check the problem at the plate developed film of the artificial disturbance of generations such as nib is malfunctioning, hair, dust easily by drawing.In many cases, not to peel off old film and reuse new film, come but can use the fountain pen of saturating ultraviolet light not or repair with the photomask that a trickle part of latex that accurate pocket knife (exacto knife) deletion error is exposed will be located.When needing, can peel off bad mask in any case rapidly and also attempt again with a new film.Even important different places are the responsive layer of ultraviolet light plates is directly by also still maintaining the original state that a CAD layout is drawn.

High-speed grating scanning system in the time of this system can also being used to produce and existing laser equipment is not added any restriction.White light source in the research is a kind of xenon stroke light of beam collimation.

The raster scan light beam uses the octangle aperture not only can eliminate arbitrary edge irregularity of 45 ° and 90 ° lines, also can eliminate arbitrary edge irregularity that 0 ° of lines promptly is parallel to the lines of scanning direction.Shown in Fig. 6 A and 6B, the raster scan drawing instrument can be equipped with the band octangle preferably with the simple white light source in the aperture of the form of masterplate.The octangle spotlight focuses on the latex in the film.Among Fig. 6 A, the scanning direction is along the Y direction of indication, and purpose is will be at the directions X lines that draw.For this reason, at the Y coordinate (Y among Fig. 6 A that accurately proofreaies and correct ₁) locate to trigger stroboscopic lamp, so that when scanning for the first time, on film, expose to an octangle 90.In next one scanning, stroboscopic lamp is still at position Y ₁Place's flash of light is to expose to the octangle image 92 shown in second.The interval of scanning room approximately be as shown octangle wide 1/3rd, make limit 90a and 92a aim at and contact or just in time overlapping.After continuous scanning, resulting staggered, overlapping octangle draw out good straight flange lines.In addition, shown in Fig. 6 B, by the octangle spotlight the Y direction at interval the wide continuous sweep of 1/3rd spotlights also can cause pattern with straight flange 94a, 96a.

Because the octangle shown in Fig. 6 A and the 6B is equilateral, thus the lap on its limit when 90 ° of paths (Fig. 6 A) than when 45 ° of paths (Fig. 6 B) greatly.Make hypotenuse just can eliminate the influence that this lap does not wait with respect to scanning direction isometric (they and vertical edges have one to be about 2 subduplicate proportionate relationship, shown in Fig. 7 A and 7B).In the design, octangle will be divided into trisection, make that when making oblique line bar and vertical bar, lap equates.But as the vertical bar width is 3 units, and then the width of gained oblique line bar is 2.828 units.But as the grating drawing instrument autozoom mirror is arranged, then change amplification quantity, perhaps suitably regulate the length of exposure, make the hypotenuse width that light is can be when the Y direction scans out big slightly octangle and sets up the oblique line bar with compensation reduced.

Comprise that above-mentioned improved existing optical-mechanical system and the elargol sheet mask system at this place will produce practicable high-quality manufacture of substrates, its speed of production is in fact near per five seconds figure.

Mask system at this place can adapt to positive type or negativity type tape base film, because the current available resist layer that uses is a negative-working, but for the operation that loses lustre, the most handy positivity tape base film.If use a kind of pattern plating process (shown in Fig. 5 A-5F) of the resist layer with negative-working to make printed panel, then use negativity type tape base film in the same way.

The above-mentioned descriptive provision of the film mask printed substrate system at this place for explanation with rather than restriction use.For example, be single sided board though above-mentioned example only indicates, in the two-sided while of substrate or identical to two-sided use one after another operation, also can make double sided board.Do not departing under purport of the present invention or the spirit, certainly step described herein or material are being made multiple variation or additional, scope of the present invention is pointed out by claims and equivalent thereof.

Claims (41)

1. But 1, a kind of method of the light processing layer pattern-making on the printed wire base board, its feature comprises:

   Prepare a substrate, the light on its upper strata can be handled the first spectral energy sensitivity of material to projection,

   But unexposed, the undeveloped photographing imaging film of one deck to the second spectral energy sensitivity that projects substrate is coated on the light processing layer,

   , film is excited and do not influence the light that underlies and can handle material layer selectively with the said exposure on the substrate with a branch of light beam that comprises said second spectrum but repel said first spectrum basically of an automatic optical plotter emission,

   With the film development on the substrate,

   The image that by developing in said film layers is as the mask at this place, exposes but make under the energy in said first spectrum that the light processing layer distributes on substrate substantially equably,

   Remove said film layers, and

   But handle said light processing layer,

   Thereby available low-yield drafting creates high-resolution the inspection at the plate mask.
2. 2, the method for claim 1 is characterized in that the said step of removing said film finishes by said film is peeled off said substrate.
3. 3, the method for claim 1, but but it is characterized in that the said light processing layer of post-exposure processes is to remove exposing of said light processing layer or unexposed part is finished by chemical method.
4. 4, the method for claim 1 it is characterized in that said first spectrum is ultraviolet light, and said second spectrum is visible light.
5. 5, the method for claim 1 is characterized in that with an automatic optical plotter the said step of said exposure being comprised digital representation for preparing a conductive pattern and the preparation process of controlling said optical plotter with said digital representation.
6. 6, the method for claim 5 is characterized in that said optical plotter is a white light X-Y plotter.
7. 7, the method for claim 5 is characterized in that said optical plotter is one and has the grating that can trigger white light source and sweep plotter.
8. 8, the method for claim 5, it is characterized in that said white light source is added on the film with octagonal shape, sweep span to make the octagonal limit of adjacent scanning aligned with each other with contact basically so that the straight flange lines that form become 0,45 or 90 ° angle with the scanning direction.
9. 9, the method for claim 1, but it is characterized in that said film has the latex side at said light processing layer adjacent.
10. 10, the method for claim 1 is characterized in that said film is a dry-silver film.
11. 11, the method for claim 1, but it is characterized in that said film is the heat developed film.
12. 12, the method for claim 1, but but it is characterized in that said film has the heat developed film of latex side at said light processing layer adjacent.
13. But 13, a kind of method of pattern-making of the light processing layer of using for printed substrate, its feature comprises:

    But one deck is laminated together forming a combination layer to unexposed, the undeveloped photographing imaging film layers of the second spectral energy sensitivity of projection to the light processing layer of the first spectral energy sensitivity of projection and one deck,

    The said combination layer that has film layers on it is added on the substrate,

    , film is excited and do not influence the light that underlies and can handle material layer selectively with said film layers exposure with a branch of light beam that comprises said second spectrum but repel said first spectrum basically of an automatic optical plotter emission,

    With the film development on the substrate,

    The image that by developing in said film layers is as the mask at this place, exposes but make under the energy in said first spectrum that the light processing layer distributes on substrate substantially equably,

    Remove said film layers, and

    But handle said light processing layer,

    Thereby available low-yield drafting creates high-resolution the inspection at the plate mask.
14. 14, the method in the claim 13 is characterized in that the said step of removing said film layers finishes by said film is peeled off said substrate.
15. 15, the method for claim 13, but but it is characterized in that the said light processing layer of post-exposure processes is exposure or a unexposed portion of removing said light processing layer by chemical method.
16. 16, the method for claim 13 it is characterized in that said first spectrum is ultraviolet light, and said second spectrum is visible light.
17. 17, the method for claim 13 is characterized in that being the digital representation by setting up a conductive pattern with the said step of said exposure and controlling said optical plotter with said digital representation and finish with an automatic optical plotter.
18. 18, the method for claim 17 is characterized in that said optical plotter is a white light X-Y optical plotter.
19. 19, the method for claim 17 is characterized in that said optical plotter is one and has the raster scan plotter that can trigger white light source.
20. 20, the method for claim 19, being added on the film with octagonal shape of its feature in light source, sweep span to make octagonal limit aligned with each other with contact basically so that the straight flange lines that form become the angle of 0,45 ° and 90 ° with the scanning direction.
21. 21, the method for claim 13, it is characterized in that said film said light can outside manage a layer adjacent and have the latex side.
22. 22, the method for claim 13 is characterized in that said film is a dry-silver film.
23. 23, the method for claim 13, but it is characterized in that said film is the heat developed film.
24. 24, the method for claim 13, but but it is characterized in that said film has the heat developed film of latex side at said light processing layer adjacent.
25. 25, a kind of raster scan lines method for drafting, its feature comprises the following steps:

    One beam that can trigger is projected on the film to the said energy-sensitive that is polygonal shape, and

    Trigger said beam to form lines in the respective sequence position in the continuous sweep mode, sweep span should make the polygonal aligning adjacent edge that is exposed contact, so that form continuous straight flange to depict said lines when lines become a predetermined angular with the scanning direction.
26. 26, the method for claim 25 is characterized in that said polygon is an octangle.
27. 27, the method for claim 26 is characterized in that said predetermined angular comprises 90 ° and 45 °.
28. 28, the method for claim 27 is characterized in that the octangle hypotenuse is in have an appointment 1.4 ratio of the length of scanning direction and vertical edges.
29. 29, the method for claim 26 it is characterized in that said energy is the form of white light, and said film is the elargol sheet.
30. 30, a kind of combining structure of making printed substrate, its feature comprises:

    A substrate,

    But one deck sticks on the said substrate light processing layer to the first spectral energy sensitivity of projection, and

    But be pressed in can peel off on the said light processing layer unexposed from level to level, develop, the strippable property imaging film,

    The second spectral energy sensitivity of said film reply projection,

    Thereby available low-yield drafting creates high-resolution the inspection at the plate mask.
31. 31, the structure of claim 30 is characterized in that substrate comprises that has the conductor layer substrate that can draw a design.
32. 32, the structure of claim 31, but it is characterized in that said light processing layer is one deck light resist layer.
33. 33, the structure of claim 30 it is characterized in that said first spectrum is ultraviolet light, and said second spectrum is visible light.
34. 34, the structure of claim 30 is characterized in that said substrate comprises a substrate that has surface conductor patterns.
35. 35, the structure of claim 34, but it is characterized in that said light processing layer is the permanent insulating barrier that can draw a design.
36. 36, the structure of claim 35 is characterized in that said insulating barrier is permanent wafer (PDF).
37. 37, the structure of claim 35 is characterized in that said insulating barrier solder mask material.
38. 38, the structure of claim 30, but it is characterized in that said film has the latex side at its adjacent said light processing layer.
39. 39, the structure of claim 30 is characterized in that said film is one deck dry-silver film.
40. 40, the structure of claim 30 is characterized in that said film is the film that a kind of heat can be developed.
41. 41, the structure of claim 30, but it is characterized in that said film is a kind of heat developed film, but its latex side is adjacent with said light processing layer.

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