CN102179592A - Method and device for soldering flux application - Google Patents
Method and device for soldering flux application Download PDFInfo
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- CN102179592A CN102179592A CN201110099208XA CN201110099208A CN102179592A CN 102179592 A CN102179592 A CN 102179592A CN 201110099208X A CN201110099208X A CN 201110099208XA CN 201110099208 A CN201110099208 A CN 201110099208A CN 102179592 A CN102179592 A CN 102179592A
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Abstract
The invention belongs to the technical field of vehicle exhaust purification, and specifically relates to a method for applying soldering fluxes to metal corrugated ribbons and a device for implementing the method, wherein the metal corrugated ribbons to which the soldering fluxes are applied are preferably used for manufacturing metal honeycomb carriers for vehicle exhaust purifiers. The device for applying soldering fluxes to metal corrugated ribbons comprises a feeding device of metal corrugated ribbons, a soldering flux application unit for positioning the metal corrugated ribbons so as to carry out soldering flux application, and a gas cooling device or a heated-air drying device for solidifying the soldering fluxes. The method for applying soldering fluxes to metal corrugated ribbons is implemented mainly through the following step: applying soldering flux powder or a mixture consisting of the soldering flux powder and a binding agent to the metal corrugated ribbons by using the soldering flux application unit so as to form soldering fluxes solidified on or adhered to the wave crests or troughs of the metal corrugated ribbons. By using the method and device provided by the invention, the defects in the prior art, that the soldering fluxes are easy to fall off in the process of soldering flux application and the application strength of the prepared product is not enough, are overcome.
Description
Technical field
The invention belongs to the motor vehicle tail-gas purifying technical field, be specifically related to a kind of method that is used on the wavy metal band, applying scolder, and the equipment of realizing this method, the wavy metal band that is applied with scolder is preferred for making the tail gas cleaner for motor-driven vehicle metal beehive carrier.
Background technology
Metal beehive carrier extensively is used in the gas extraction system of gasoline engine and diesel engine as the carrier of catalyst material, has advantages such as ignition is fast, volume is little, intensity is high, good heat resistance, obtains using the most widely in motorcycle tail gas cleaning.For to the service life of metal beehive carrier and the consideration on the use cost, metallic carrier uses the scolder applying method of specific region.
Publication number is to have described the use binding agent in the patent of invention of CN 1147780A solder powder is bonded on the metal structure.Concrete mode is earlier binding agent, bond and adhesive accelerant to be coated on the specific region of metal structure, adds solder powder on binding agent, makes solder attach on metal structure by processing.Publication number is to have described a kind of method of using the adhesive coated scolder in the patent of invention of CN 1946505A.This method is earlier to be ejected into binding agent on the metal structure by spraying technique and to form droplet-like, again by the absorption solder powder, by forming the solder-coated layer after the heat treatment.More than two kinds of existing scolder applying methods that method is representative, the main binding agent that uses is bonded to solder powder on the specific region of metal plate band or wavy metal band, coming off of different situations can appear in the solder powder that this method applies continuous distortion owing to metal structure in forming process, thereby has influence on scolder control and the working strength that makes product.
Application number is the Chinese invention patent of CN200680034080.6, and a kind of equipment and method that is used for applying hard solder on the sheet metal that forms structure at least in part is provided, and this patent is used scolder band and two kinds of solders of solder powder.Need be processed into band shape to scolder in advance when using the scolder band, the main at present vacuum quick quenching explained hereafter that adopts, processing cost will be apparently higher than making solder powder.The scolder band of making also needs further to be processed into the solder sheet that wide about 1mm is about 5mm, processing capacity and difficulty of processing very high (generally do not produce a metallic carrier and need about 1000-8000 solder sheet).Because scolder band extremely thin (0.02-0.03mm) is very high the solder sheet difficulty that is added to wavy metal band crest top piecewise, cause crossing of final products to weld or sealing-off in case control inaccurate meeting.From the binding agent aspect, when using solder sheet, this patent can use binding agent and electric welding dual mode to fix, and solder powder is to use binding agent to fix.Judge that according to equipment can only use normal temperature to bond connects, adopt the method for injection point glue to apply, aspect selection of binder, exist the bigger drawback of limitation.
Summary of the invention
The present invention is directed to that the as easy as rolling off a log not enough defective of working strength that comes off, makes product of scolder provided a kind of method that is used to apply scolder when scolder applied in the prior art, the scolder that this method applies can be firm be attached on the wavy metal band, can not come off because of the winding distortion of wavy metal band.
Another object of the present invention provides a kind of described equipment that is used to apply the method for scolder of realizing.
Above-mentioned technical problem of the present invention is implemented by the following technical programs:
A kind of equipment that is used on the wavy metal band, applying scolder, this equipment comprises: the feed arrangement that is used for the wavy metal band, be used for wavy metal band location is applied the scolder applying unit of scolder, and gas quench system or hot-air seasoning device that scolder is solidified.The scolder equipment that applies of the present invention can use pure solder powder, also can use hot-melt adhesive and normal temperature binding agent simultaneously.Apply in the scolder process, (1) joins solid-state scolder or solder attach agent composition in the material chamber earlier; (2) adding hot solder makes solder fusing become liquid; (3) liquid solder enters in the feeding chamber by the passage of bottom, material chamber, and flows out from solder nozzle by the effect of feeding blade; (4) scolder of solder nozzle outflow partly is adsorbed onto on the wavy metal band, and all the other scolders flow material return chamber again.When using the mixture of pure solder powder and solder powder and hot-melt adhesive, must use heater, therefore need gas quench system that scolder is solidified; And do not need to heat when using the mixture of solder powder and normal temperature binding agent, and need the hot-air seasoning device that scolder is solidified.Gas quench system generally can use the air blowing type of cooling, pure solder powder uses the normal temperature argon gas to cool off, hot-melt adhesive uses normal temperature argon gas or nitrogen to cool off, and the hot-air that the normal temperature binding agent uses hot-air seasoning to be installed on 50 ℃ to 100 ℃ is dried.The feeding speed of feed arrangement can be controlled to be 1 meter to 10 meters of per minute.In applying the scolder process, need charge into protective gas in the equipment scolder is protected, pure solder powder uses argon gas as protective gas, and hot-melt adhesive uses argon gas or nitrogen as protective gas, and the normal temperature binding agent does not need the using gases protection.
As preferably, described scolder applying unit comprises the material chamber and the feeding material chamber that is connected with the material chamber that are used for splendid attire solder powder or solder powder and the mixture of binding agent, establish at least one rotating vane in the feeding material chamber, the feeding material chamber top is provided with at least one discharging opening.
As preferably, the both sides and/or the bottom of described material chamber are provided with heater.The scolder equipment that applies of the present invention can use pure solder powder, also can use hot-melt adhesive and normal temperature binding agent simultaneously.When using the mixture of pure solder powder and solder powder and hot-melt adhesive, must use heater, and not need to heat during the mixture of use solder powder and normal temperature binding agent.As preferably, the temperature of heater is set at 1000 ℃ to 1200 ℃ when using pure solder powder, and device temperature is set at 100 ℃ to 700 ℃ when using hot-melt adhesive.
As preferably, described discharging opening is connected with solder nozzle, and solder nozzle is pressed close to mutually with the scolder to be applied place of wavy metal band, and the both sides of solder nozzle are interval with the stock supporting plate that is used for the support metal corrugated ribbon.The scolder rate of outflow can be regulated by the rotary speed of adjusting rotating vane in the solder nozzle.
As preferably, the bottom of described feeding material chamber has several and is used for the opening that liquid solder enters, and opening is positioned at the below of rotating vane.The opening of feeding material chamber bottom is used to finish liquid solder circulating between material chamber and feeding material chamber, liquid solder in the material chamber enters feeding material chamber by the opening of feeding material chamber bottom, under the drive of rotating vane, upwards flow from feeding material chamber's top ejection then, thereby contact fixing with the wavy metal band.
According to different solder attach modes, the scolder applying unit can be used different material manufacturings.The aluminium oxide ceramics manufacturing is used, other position use stainless steel manufacturing in the position that material chamber, feeding chamber and rotating vane etc. contacts with high-temperature solder when using pure solder powder.When using hot-melt adhesive and normal temperature binding agent, equipment adopts the manufacturing of all steel material to get final product.
Scolder applies position, solder bar number, bead width and solder thickness and can regulate according to technological requirement.Wherein scolder applies the position and the solder bar number can be determined by solder nozzle position and quantity are set.Bead width can be adjusted by changing the solder nozzle width.Applying solder thickness can control by changing scolder spray volume and wavy metal region temperature, and when scolder spray volume rising wavy metal region temperature reduced, it was big to apply the scolder quantitative change, the solder thickness thickening.
The present invention adopts the melting solder adding technique, before the wavy metal band application is added scolder, earlier equipment is preheating to uniform temperature (not needing heating when adopting the normal temperature binding agent), makes scolder be in molten state under protective atmosphere.The wavy metal band is sent on the guide track of scolder applying unit by feed arrangement, start the scolder that is used for that links to each other with rotating vane and carry motor, the scolder that makes molten state flows out and is attached on the wavy metal band from solder nozzle, and by the effect of gas quench system (during employing normal temperature binding agent is the hot-air seasoning device) scolder is solidified at the wavy metal belt surface.The scolder that this kind method applies can be firm be attached on the wavy metal band, can not come off because of the winding of wavy metal band distortion.
A kind of method that is used for applying scolder on the wavy metal band, this method comprises the steps:
A) provide at least one smooth sheet metal, this metal sheet makes the wavy metal band with crest and trough structure;
B) adopt described scolder applying unit, the mixture of solder powder or solder powder and binding agent is applied on the wavy metal band, form the scolder that curing sticks to wavy metal band crest or trough place.
As preferably, earlier solder powder is heated to molten state in the step b), the scolder that is molten state then overflows and is attached on the wavy metal band from discharging opening through the effect of rotating vane.
Existing method of adding scolder on metal structure has a common ground, just is to use binding agent or bond to make solder attach in metal structure surface.The intensity of the solder layer that the method for these bonding scolders forms can not guarantee, metal structure (particularly tai-gas clean-up catalyst metallic carrier) is in manufacture process, being coated with the scolder place and different deflections can occur of metal structure, coming off can appear in the solder powder of bonding.The welding method of this metal structure mainly is the soldering of high temperature high vacuum, use binding agent bonding scolder to make and have a large amount of volatizable material in the metal structure, in the vacuum brazing process, particularly when batch is big, can discharges a large amount of gases during heating and destroy vacuum in the stove.This phenomenon can prolong the time of brazing process and reduce brazing quality, thus the intensity of influence welding back metal structure.
Therefore, an object of the present invention is not by the effect of binding agent or bond scolder firm put on metal structure surface, main method is that the scolder of molten state is solidified in metal structure surface.The scolder that adopts this fusion method to add can not come off because of the collision and the deformation of metal structure, does not have volatile substance simultaneously and destroy vacuum in the stove in brazing process.Therefore this molten state method that adds scolder had both improved welding quality, can reduce the technology difficulty of metal structure production process again.The welding material that the method for interpolation scolder of the present invention is used can be block raw material, can avoid valuable scolder in the material unaccounted-for (MUF) of pulverizing process and the increase of technology cost.
The wavy metal band application manufactures metal beehive carrier by special canoe after adding scolder, and there is bigger distortion in the wavy metal band in forming process, therefore causes the disengaging that applies scolder easily.The solder powder of normal temperature binding agent bonding in forming process the welding powder expulsion rate generally at 20%-45%, use the disengaging rate of hot-melt adhesive welding powder to can be controlled in 5%-15%, use the scolder of molten state can solve scolder disengaging problem fully, scolder break-off can not occur in forming process.
Description of drawings
Fig. 1 is the structural representation that the present invention is used to apply the equipment of scolder;
Fig. 2 is the wavy metal band structure schematic diagram that the present invention is applied with scolder;
Fig. 3 is a solder nozzle position schematic diagram of the present invention.
Fig. 4 is the plan structure schematic diagram that the present invention is used to apply the equipment of scolder.
Label declaration: scolder 1, wavy metal band 2, liquid solder 3, rotating vane 4, stock supporting plate 6, opening 7, gas quench system 8, solder nozzle 9, feed arrangement 10, scolder applying unit 11, feeding material chamber 12, heater 13, heater 14, material chamber 15.
The specific embodiment
Below be specific embodiments of the invention; These embodiment can do further to replenish and explanation to the present invention; But the present invention is not limited to these embodiment.
Employed technology in following examples unless stated otherwise, is routine techniques known to those skilled in the art; Employed instrument and equipment, reagent etc., only this specification specifies, is that the research of this area and technical staff can be by public approach acquisition.Below be the reagent source of using in the embodiments of the invention:
Hot-melt adhesive, model: polyurethane hot melt adhesives, producer: Co., Ltd is learned in Dehua, Lip river, Shanghai;
Solder powder, model: BNi-5, producer: U.S. Wall Colmonoy company;
The normal temperature binding agent, model: Cement310, producer: U.S. Wall Colmonoy company.
Embodiment 1:
A kind of equipment that is used on wavy metal band 2, applying scolder 1 shown in Fig. 1,2 and 3, this equipment comprises: the feed arrangement 10 that is used for wavy metal band 2, be used for wavy metal band 2 location are applied the scolder applying unit 11 of scolder 1, and the gas quench system 8 that scolder is solidified.Scolder applying unit 11 comprises the material chamber 15 and the feeding material chamber 12 that is connected with material chamber 15 that are used for splendid attire solder powder or solder powder and the mixture of binding agent.Fix a rotating vane 4 in the feeding material chamber 12, rotating vane 4 connects a motor, is used to control its rotation.The bottom of feeding material chamber 12 has the opening 7 that is used for feed liquor attitude scolder, and opening 7 is positioned at the below of rotating vane, and the liquid solder 3 in the material chamber 15 can flowed in feeding material chamber 12 under the stirring of rotating vane 4.
Feeding material chamber 12 tops are provided with a discharging opening.Discharging opening is connected with two solder nozzles 9, two solder nozzles 9 are positioned on the straight line, solder nozzle 9 is pressed close to mutually with scolder to be applied 1 place of wavy metal band 2, the both sides of solder nozzle 9 are interval with the stock supporting plate 6 that is used for support metal corrugated ribbon 2, as shown in Figure 4, stock supporting plate 6 is fixed on the barrel of material chamber 15.
Feed arrangement 10 is used for wavy metal band 2 translation in the horizontal direction, so that the trough of wavy metal band 2 contacts with the liquid solder of solder nozzle 9 ejections.Because the improved emphasis of feed arrangement 10 non-the present invention no longer describes in detail.
Gas quench system 8 is used to make scolder to solidify, and present embodiment is a shower nozzle that can spray refrigerating gas.Because the improved emphasis of the non-the present invention of gas quench system no longer describes in detail.
Embodiment 2:
Concrete scheme is with embodiment 1, and difference is: the gas quench system 8 that scolder is solidified changes the hot-air seasoning device into, and the hot-air seasoning device is used to provide 50 ℃ to 100 ℃ hot-air that the mixture of solder powder and normal temperature binding agent is dried.The hot-air seasoning device of present embodiment is an air-heater, because the improved emphasis of the non-the present invention of air-heater no longer describes in detail.
Embodiment 3:
Adopt the equipment of embodiment 1, select the wide solder nozzle of 10mm 9 for use, and be arranged in the scolder applying unit 11, scolder is fixed on the preposition as the mode among Fig. 3.Pure solder powder 1000g is joined in the material chamber 15, and the whole process that applies scolder is carried out under the protection of argon gas.Connect the power supply of heater 14, the heater temperature is set to 1150 ℃ and begin heating.After solder powder is fused into molten state, open the motor that links to each other with rotating vane 4 and make rotating vane 4 begin to rotate, observe scolder outflow situation in the solder nozzle 9, and the rotary speed of adjustment rotating vane 4 makes, and the scolder flow meets technological requirement in the solder nozzle.Start the feed arrangement 10 of wavy metal band, make the wavy metal band with the speed of 5 meters of per minutes stably by the top of scolder applying unit 11, the height of adjusting stock supporting plate 6 makes the trough of wavy metal band 7 contact with the liquid solder that solder nozzle 9 sprays.Open gas quench system 8, scolder is solidified at wavy metal band trough place, and firm on the wavy metal band, form the structure that scolder 1 as shown in Figure 2 combines with the wavy metal band.
Embodiment 4:
Concrete scheme is with embodiment 1, and difference is: change solder powder into solder powder and hot melting cohesion agent composition 1000g(wherein hot-melt adhesive 150g), the heater temperature is set to 230 ℃.
Embodiment 5:
Adopt the equipment of embodiment 2, select the wide solder nozzle of 10mm 9 for use, and be arranged in the scolder applying unit 11, scolder 1 is fixed on the preposition as the mode among Fig. 3.The soldering paste 1000g(that solder powder and normal temperature binding agent are mixed up is normal temperature binding agent 180g wherein) join in the material chamber 15, the whole process that applies scolder is carried out under the protection of argon gas.The motor that unlatching links to each other with rotating vane 4 makes rotating vane 4 begin to rotate, and observe scolder outflow situation in the solder nozzle 9, and the rotary speed of adjustment rotating vane 4 makes, and the scolder flow meets technological requirement in the solder nozzle.Start the feed arrangement 10 of wavy metal band, make the wavy metal band with the speed of 3 meters of per minutes stably by the top of scolder applying unit 11, the height of adjusting stock supporting plate 6 makes the trough of wavy metal band 7 contact with the liquid solder that solder nozzle 9 sprays.Open the hot-air seasoning device, scolder is solidified at wavy metal band trough place, and firm on the wavy metal band, form the structure that scolder 1 as shown in Figure 2 combines with the wavy metal band.
Embodiment 6: the soldering strength test
Under the condition of using core body of the same race and sheathing material canoe of the same race, method according to embodiment 3,4 and 5 applies pure welding powder scolder (solder powder), hot-melt adhesive scolder and normal temperature binding agent scolder respectively on the wavy metal band with crest and trough structure that 3 metal sheets make, and guarantees that the applied amount of solder powder is identical.Use processing mode of the same race and soldering processes that 3 wavy metal bands are made respectively and be used to make tail gas cleaner for motor-driven vehicle with metal beehive carrier and carry out pressure test.Result of the test uses the compression strength of the metallic carrier of hot-melt adhesive bonding welding powder to be 37.2MPa for to use the compression strength of pure welding powder solder metal carrier to be 42.4MPa, uses the compression strength of the metallic carrier of normal temperature binding agent bonding welding powder to be 26.3MPa.Result of the test shows, uses the method for the embodiment of the invention 3 to make product have higher intensity under the identical amount of solder condition of use, is preferred embodiment.Simultaneously in satisfying the product that same adhesion strength requires, use method of the present invention, can save the scolder of about 20%-40% when adopting pure solder powder, can save the scolder of about 5%-30% when adopting hot-melt adhesive to bond welding powder.Equipment of the present invention promptly is applicable to pure solder powder, also is applicable to the solder powder that is mixed with hot-melt adhesive scolder or normal temperature binding agent, uses comparatively extensive.
Specific embodiment described in the present invention only is that the present invention's spirit is illustrated.The technical staff of the technical field of the invention can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present invention or surmount the defined scope of appended claims.
Although the present invention has been made detailed explanation and has quoted some instantiations as proof, to those skilled in the art, only otherwise leave that the spirit and scope of the present invention can be done various variations or correction is obvious.
Claims (8)
1. equipment that is used for applying scolder (1) on wavy metal band (2) is characterized in that this equipment comprises:
The feed arrangement (10) that is used for wavy metal band (2),
Be used for wavy metal band (2) location is applied the scolder applying unit (11) of scolder (1),
And gas quench system (8) or hot-air seasoning device that scolder is solidified.
2. equipment according to claim 1, it is characterized in that: described scolder applying unit (11) comprises the material chamber (15) and the feeding material chamber (12) that is connected with material chamber (15) that are used for splendid attire solder powder or solder powder and the mixture of binding agent, establish at least one rotating vane (4) in the feeding material chamber (12), feeding material chamber (12) top is provided with at least one discharging opening.
3. equipment according to claim 2 is characterized in that: the both sides and/or the bottom of described material chamber (15) are provided with heater.
4. according to claim 2 or 3 described equipment, it is characterized in that: described discharging opening is connected with solder nozzle (9), solder nozzle (9) is located to press close to mutually with the scolder to be applied (1) of wavy metal band (2), and the both sides of solder nozzle (9) are interval with the stock supporting plate (6) that is used for support metal corrugated ribbon (2).
5. according to claim 1 or 2 or 3 described equipment, it is characterized in that: the bottom of described feeding material chamber (12) has several and is used for the opening (7) that liquid solder enters, and opening is positioned at the below of rotating vane.
6. equipment according to claim 4 is characterized in that: the bottom of described feeding material chamber (12) has several and is used for the opening (7) that liquid solder enters, and opening is positioned at the below of rotating vane.
7. a method that is used for applying scolder (1) on wavy metal band (2) is characterized in that this method comprises the steps:
A) provide at least one smooth sheet metal, this metal sheet makes the wavy metal band (2) with crest and trough structure;
B) adopt scolder applying unit as claimed in claim 2 (11), the mixture of solder powder or solder powder and binding agent is applied on the wavy metal band (2), form the scolder (1) that curing sticks to wavy metal band crest or trough place.
8. method according to claim 7 is characterized in that: earlier solder powder is heated to molten state in the step b), the scolder that is molten state then overflows and is attached on the wavy metal band (2) from discharging opening through the effect of rotating vane (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110099208XA CN102179592A (en) | 2011-04-20 | 2011-04-20 | Method and device for soldering flux application |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110099208XA CN102179592A (en) | 2011-04-20 | 2011-04-20 | Method and device for soldering flux application |
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| CN102179592A true CN102179592A (en) | 2011-09-14 |
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| CN201110099208XA Pending CN102179592A (en) | 2011-04-20 | 2011-04-20 | Method and device for soldering flux application |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102744538A (en) * | 2012-06-11 | 2012-10-24 | 丁胜康 | Device for removing paste from wave crest for metal honeycomb carrier |
| CN102861962A (en) * | 2012-09-29 | 2013-01-09 | 夏琦 | Method for coating brazing materials on metal carrier |
| CN102922069A (en) * | 2012-11-03 | 2013-02-13 | 台州欧信环保净化器有限公司 | Method for welding metal honeycomb carrier |
| CN102950356A (en) * | 2012-11-12 | 2013-03-06 | 台州欧信环保净化器有限公司 | Device and method for adding solder wires on plain films of metal honeycomb carrier |
| CN102962541A (en) * | 2012-11-03 | 2013-03-13 | 台州欧信环保净化器有限公司 | Equipment and method for coating soldering paste on metallic honeycomb carrier corrugated sheet |
| CN104275536A (en) * | 2014-08-13 | 2015-01-14 | 浙江海洋学院 | Oil tank reinforcement core processing equipment |
| CN110202235A (en) * | 2019-06-17 | 2019-09-06 | 宁波金田铜管有限公司 | A kind of automatic spraying plating solder machine for pipe fitting |
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| CN101267907A (en) * | 2005-09-16 | 2008-09-17 | 排放技术有限公司 | Method and device for brazing material application |
| CN101293297A (en) * | 2008-06-17 | 2008-10-29 | 杨国金 | Reaction jet welding device and uses thereof |
| CN202037394U (en) * | 2011-04-20 | 2011-11-16 | 浙江天泽环境科技有限公司 | Device for adding solder |
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| EP1475150A2 (en) * | 2000-10-10 | 2004-11-10 | Nippon Steel Corporation | Honeycomb body manufacturing method |
| CN101267907A (en) * | 2005-09-16 | 2008-09-17 | 排放技术有限公司 | Method and device for brazing material application |
| CN101003103A (en) * | 2006-01-17 | 2007-07-25 | 株式会社田村制作所 | Solder groove and welding device |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102744538A (en) * | 2012-06-11 | 2012-10-24 | 丁胜康 | Device for removing paste from wave crest for metal honeycomb carrier |
| CN102744538B (en) * | 2012-06-11 | 2015-01-21 | 台州欧信环保净化器有限公司 | Device for removing paste from wave crest for metal honeycomb carrier |
| CN102861962A (en) * | 2012-09-29 | 2013-01-09 | 夏琦 | Method for coating brazing materials on metal carrier |
| CN102922069A (en) * | 2012-11-03 | 2013-02-13 | 台州欧信环保净化器有限公司 | Method for welding metal honeycomb carrier |
| CN102962541A (en) * | 2012-11-03 | 2013-03-13 | 台州欧信环保净化器有限公司 | Equipment and method for coating soldering paste on metallic honeycomb carrier corrugated sheet |
| CN102922069B (en) * | 2012-11-03 | 2015-12-09 | 台州欧信环保净化器有限公司 | A kind of method of metal beehive carrier welding |
| CN102950356A (en) * | 2012-11-12 | 2013-03-06 | 台州欧信环保净化器有限公司 | Device and method for adding solder wires on plain films of metal honeycomb carrier |
| CN102950356B (en) * | 2012-11-12 | 2015-08-26 | 台州欧信环保净化器有限公司 | Metal beehive carrier plain film adds the Apparatus for () and method therefor of welding wire |
| CN104275536A (en) * | 2014-08-13 | 2015-01-14 | 浙江海洋学院 | Oil tank reinforcement core processing equipment |
| CN110202235A (en) * | 2019-06-17 | 2019-09-06 | 宁波金田铜管有限公司 | A kind of automatic spraying plating solder machine for pipe fitting |
| CN110202235B (en) * | 2019-06-17 | 2021-06-11 | 宁波金田铜管有限公司 | Automatic spray welding machine for pipe fitting |
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Application publication date: 20110914 |