CN102172861A - High-speed chamfer machining method for small frequency chip - Google Patents
High-speed chamfer machining method for small frequency chip Download PDFInfo
- Publication number
- CN102172861A CN102172861A CN2010106173415A CN201010617341A CN102172861A CN 102172861 A CN102172861 A CN 102172861A CN 2010106173415 A CN2010106173415 A CN 2010106173415A CN 201010617341 A CN201010617341 A CN 201010617341A CN 102172861 A CN102172861 A CN 102172861A
- Authority
- CN
- China
- Prior art keywords
- frequency chip
- bevelling
- specially
- described step
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention provides a high-speed chamfer machining method for a small frequency chip, and is characterized by comprising the following machining steps: 1) number segmenting; 2) installing; 3) initial machining; 4) intermediate measuring; 5)calculation of added time; 6) cleaning after completing; and 7) sending to next process, namely a frequency adjusting process. The machining method greatly shortens the machining time, and decreases the machining errors.
Description
Technical field
The present invention relates to the processing of small-sized frequency chip, particularly a kind ofly be of a size of 2520,2016,1612 and the high speed bevelling processing method of once small-sized frequency chip.
Background technology
The development of modern crafts also increases day by day to the requirement of frequency chip and to rise night, in order to reduce the resistance of crystal oscillator, needs frequency chip to be processed into arc, and the concentration of energy in the time of can making vibration is at the center, thereby reduces resistance.This just requires frequency chip is carried out bevelling processing.Along with the size of frequency chip is more and more littler, also more and more stricter to the requirement of arc, the mach arcuate shape uniformity of low speed bevelling is poor, shows that mainly Δ S deviation is big, and the resistance of corresponding crystal oscillator is big and unstable.
Bevelling engineering rotating speed is 120rpm/min～160rpm/min, because the frequency chip size is little, own wt is light, and it is little to cause adding man-hour centrifugal force, long processing time, and processing back frequency chip Δ S deviation is big, reaches about 100KHz.
Summary of the invention
In order to solve the problem that is occurred in the above-mentioned background technology, the present invention proposes following technical scheme.
A kind of high speed bevelling processing method of small-sized frequency chip is characterized in that described procedure of processing is:
1) quantity is cut apart;
2) installation;
3) initial manufacture;
4) measurements in;
5) append Time Calculation;
6) clean after finishing;
7) deliver to next engineering, promptly frequency is adjusted engineering.
As preferred version, described step 1) is specially to be cut apart frequency chip by the gross according to the input quantity of each ball bucket of bevelling;
Described step 2) is specially and cuts apart in the frequency chip importing ball bucket of finishing, and add abrasive sand, be contained on the edge-falled machine;
Described step 3) is specially the initial time processing of putting down in writing according to specifications;
Described step 4) is specially the Δ S that uses special-purpose Δ S measuring instrument initial manufacture;
Described step 5) is specially according to measuring the difference calculating of back Δ S between desired value and appends the time.
Preferably, the rotating speed of described edge-falled machine is more than or equal to 200rpm/min.
Preferably, described frequency chip is of a size of 2520,2016,1612 frequency chips that reach.
The high speed bevelling processing method of a kind of small-sized frequency chip of the present invention adopts the above high speed edge-falled machine of 200rpm/min, make that frequency chip is that centrifugal force strengthens at bevelling, shortened process time, the process time of average shortening 1/3, reduced machining deviation simultaneously, the Δ S deviation of the frequency chip after guaranteeing to process is in 20KHz.
The specific embodiment
Below preferred embodiment of the present invention is described in detail, thereby protection scope of the present invention is made more explicit defining so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that.
A kind of high speed bevelling processing method of small-sized frequency chip, described procedure of processing is:
1) quantity is cut apart; 2) installation; 3) initial manufacture; 4) measurements in; 5) append Time Calculation; 6) clean after finishing; 7) deliver to next engineering, promptly frequency is adjusted engineering.
Described step 1) is specially to be cut apart frequency chip by the gross according to the input quantity of each ball bucket of bevelling;
Described step 2) is specially and cuts apart in the frequency chip importing ball bucket of finishing, and add abrasive sand, be contained on the edge-falled machine;
Described step 3) is specially the initial time processing of putting down in writing according to specifications;
Described step 4) is specially the Δ S that uses special-purpose Δ S measuring instrument initial manufacture;
Described step 5) is specially according to measuring the difference calculating of back Δ S between desired value and appends the time.
The rotating speed of described edge-falled machine is more than or equal to 200rpm/min.Described frequency chip is of a size of 2520,2016,1612 frequency chips that reach.
The above; it only is the specific embodiment of the present invention; but protection scope of the present invention is not limited thereto; any those of ordinary skill in the art are in the disclosed technical scope of the present invention; variation or the replacement that can expect without creative work are all stood and are encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.
Claims (4)
1. the high speed bevelling processing method of a small-sized frequency chip is characterized in that described procedure of processing is:
1) quantity is cut apart;
2) installation;
3) initial manufacture;
4) measurements in;
5) append Time Calculation;
6) clean after finishing;
7) deliver to next engineering, promptly frequency is adjusted engineering.
2. the high speed bevelling processing method of a kind of small-sized frequency chip according to claim 1 is characterized in that,
Described step 1) is specially to be cut apart frequency chip by the gross according to the input quantity of each ball bucket of bevelling;
Described step 2) is specially and cuts apart in the frequency chip importing ball bucket of finishing, and add abrasive sand, be contained on the edge-falled machine;
Described step 3) is specially the initial time processing of putting down in writing according to specifications;
Described step 4) is specially the Δ S (bevelling amount) that uses special-purpose Δ S measuring instrument initial manufacture;
Described step 5) is specially according to measuring the difference calculating of back Δ S between desired value and appends the time.
3. the high speed bevelling processing method of a kind of small-sized frequency chip according to claim 1 and 2 is characterized in that the rotating speed of described edge-falled machine is more than or equal to 200rpm/min.
4. the high speed bevelling processing method of a kind of small-sized frequency chip according to claim 1 and 2 is characterized in that, described frequency chip is of a size of 2520,2016,1612 frequency chips that reach.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106173415A CN102172861A (en) | 2010-12-31 | 2010-12-31 | High-speed chamfer machining method for small frequency chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106173415A CN102172861A (en) | 2010-12-31 | 2010-12-31 | High-speed chamfer machining method for small frequency chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102172861A true CN102172861A (en) | 2011-09-07 |
Family
ID=44516203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010106173415A Pending CN102172861A (en) | 2010-12-31 | 2010-12-31 | High-speed chamfer machining method for small frequency chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102172861A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103293227A (en) * | 2013-05-17 | 2013-09-11 | 廊坊中电熊猫晶体科技有限公司 | Method for measuring bevel edge realization effect of piezoelectric quartz crystal chip |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10060696A1 (en) * | 2000-12-07 | 2002-06-27 | Wacker Chemie Gmbh | Method by which edges of brittle hard materials may be ground has the tool subjected to ultrasonic frequencies |
| CN1787181A (en) * | 2004-12-08 | 2006-06-14 | 中国电子科技集团公司第四十六研究所 | Method for processing chip capable of improving semiconductor chip geometric parameter |
| CN1901172A (en) * | 2005-07-21 | 2007-01-24 | 硅电子股份公司 | Semiconductor wafer and process for producing a semiconductor wafer |
| CN101121246A (en) * | 2006-08-11 | 2008-02-13 | 中芯国际集成电路制造(上海)有限公司 | Method for controlling chemical and mechanical grinding endpoint |
| CN101722449A (en) * | 2008-10-24 | 2010-06-09 | 北京中科三环高技术股份有限公司 | Method for chamfering permanent magnet material |
-
2010
- 2010-12-31 CN CN2010106173415A patent/CN102172861A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10060696A1 (en) * | 2000-12-07 | 2002-06-27 | Wacker Chemie Gmbh | Method by which edges of brittle hard materials may be ground has the tool subjected to ultrasonic frequencies |
| CN1787181A (en) * | 2004-12-08 | 2006-06-14 | 中国电子科技集团公司第四十六研究所 | Method for processing chip capable of improving semiconductor chip geometric parameter |
| CN1901172A (en) * | 2005-07-21 | 2007-01-24 | 硅电子股份公司 | Semiconductor wafer and process for producing a semiconductor wafer |
| CN101121246A (en) * | 2006-08-11 | 2008-02-13 | 中芯国际集成电路制造(上海)有限公司 | Method for controlling chemical and mechanical grinding endpoint |
| CN101722449A (en) * | 2008-10-24 | 2010-06-09 | 北京中科三环高技术股份有限公司 | Method for chamfering permanent magnet material |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103293227A (en) * | 2013-05-17 | 2013-09-11 | 廊坊中电熊猫晶体科技有限公司 | Method for measuring bevel edge realization effect of piezoelectric quartz crystal chip |
| CN103293227B (en) * | 2013-05-17 | 2015-02-18 | 廊坊中电熊猫晶体科技有限公司 | Method for measuring bevel edge realization effect of piezoelectric quartz crystal chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103381543B (en) | Method for manufacturing major diameter enclosed impeller | |
| CN103645676A (en) | Method of realizing workpiece zero point following based on macroprogram | |
| CN105252233A (en) | Machining method for aero-engine high-temperature alloy counterweight blade | |
| CN103551929A (en) | Fabricating method for milling cutter | |
| CN102347275B (en) | Method for sharpening blade of scribing machine | |
| CN102172861A (en) | High-speed chamfer machining method for small frequency chip | |
| CN103394774B (en) | The restorative procedure that during online production tubing and casing external screw thread, compact distance is less than normal | |
| CN102689164A (en) | Processing process of titanium alloy ring groove rivet with big length-to-diameter ratio | |
| CN104985244B (en) | Method of the large-scale rotor of helical lobe compressor flank profil face along helix milling line by line | |
| CN102463515A (en) | One-step form grinding method for double races | |
| CN102126053B (en) | Gear grinding processing method | |
| CN104384873A (en) | A method for machining a tooth profile of a chain wheel | |
| CN204075254U (en) | A kind of wiper insert | |
| CN104669076A (en) | Method for machining back angle of arc-shaped shovel of end mill | |
| CN104128741B (en) | The working method of fixed scroll | |
| CN102142823A (en) | Quartz tuning fork machining method | |
| CN102626901B (en) | Numerical control machining method for ball polishing wheel | |
| CN201889500U (en) | Disk type milling cutter for precision machining | |
| CN104959915A (en) | Grinding wheel automatic compensation system and method for glass machining center | |
| CN204019763U (en) | Line cutting machine guide wheel | |
| CN102172909B (en) | Method for datum location of forged parts during numerical control machining | |
| CN204108855U (en) | A kind of Novel diamond emery wheel | |
| CN203542878U (en) | Guide wheel structure used for cutting silicon wafer | |
| CN110270890A (en) | A kind of aircraft skin polishing process | |
| CN203509961U (en) | Crush grinding spliced grinding wheel and centerless grinding machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| DD01 | Delivery of document by public notice |
Addressee: Ren Jianfeng Document name: Notification of Publication and of Entering the Substantive Examination Stage of the Application for Invention |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110907 |