CN203542878U - Guide wheel structure used for cutting silicon wafer - Google Patents
Guide wheel structure used for cutting silicon wafer Download PDFInfo
- Publication number
- CN203542878U CN203542878U CN201320673381.0U CN201320673381U CN203542878U CN 203542878 U CN203542878 U CN 203542878U CN 201320673381 U CN201320673381 U CN 201320673381U CN 203542878 U CN203542878 U CN 203542878U
- Authority
- CN
- China
- Prior art keywords
- guide wheel
- buffer areas
- wheel structure
- wire
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 19
- 239000010703 silicon Substances 0.000 title claims abstract description 19
- 230000003139 buffering effect Effects 0.000 claims description 12
- 229910000831 Steel Inorganic materials 0.000 abstract description 21
- 239000010959 steel Substances 0.000 abstract description 21
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 230000006378 damage Effects 0.000 abstract description 6
- 239000011247 coating layer Substances 0.000 abstract description 3
- 230000009191 jumping Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 206010060820 Joint injury Diseases 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 208000022542 ankle injury Diseases 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 206010044565 Tremor Diseases 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model discloses a guide wheel structure used for cutting a silicon wafer. The guide wheel structure comprises a grooving area located in the middle of a guide wheel, the two ends of the grooving area of the guide wheel are provided with buffer areas without grooves, steps are arranged on the outer sides of the buffer areas respectively, and the steps are higher than guide wheel wire grooves. According to the guide wheel structure used for cutting the silicon wafer, the width of the buffer areas arranged at the two ends of the guide wheel is increased, and buffer ranges are enlarged, so that a first steel wire or more steel wires of a wire net have larger buffer areas after disengaging from the wire grooves, and the possibility that the steel wires fall off from a guide wheel coating layer to a metal flange and then cut and damage the flange is reduced to some extent. In addition, the steps higher than the horizontal plane of the wire grooves are additionally arranged on the outer sides of the buffer areas, the steel wires are blocked by the steps and limited into the buffer areas after disengaging from the wire grooves to the buffer areas due to the factors such as the breaking or unstable tension, and the damage, caused when the steel wires fall off to the metal flange, to the flange is reduced further.
Description
Technical field
The utility model belongs to solar silicon wafers process technology, relates in particular to a kind of Guiding wheel structure for silicon chip cutting.
Background technology
Guide wheel is the equally distributed carrier of steel wire in silicon chip line is cut process, in the guide wheel wire casing that is arranged in holddown groove distance that steel wire is orderly, the bearing of cutting equipment by line drives guide wheel to rotate, and then makes steel wire in guide wheel wire casing, turn round to participate in the cutting of silicon chip with guide wheel synchronous high-speed.
Original guide wheel processing technology is not slotted at each vacant 5mm of guide wheel coating layer two ends, object is to have a buffer area after jumping out wire casing while running up for the steel wire in first wire casing of guide wheel two ends, avoid steel wire after jumping out wire casing directly landing to guide wheel two ends metal flange cause flange damage.But be subject to the impact of the extraneous factors such as tension force shakiness, broken string, warning sensitivity, the buffer area of steel wire 5mm after jumping out of wire casing cannot effectively be avoided steel wire to continue landing to guide wheel metal flange and then cause flange by steel wire ankle injury, after flange ankle injury because wound is less, can only repair by welding, but the high temperature in repair by welding process can cause guide pulley surface polyurethane-coated layer lower hardness, distortion, even can cause that the glue layer dissolving in the middle of metal flange and titanium fiber causes axle center, guide wheel two ends to depart from.
Utility model content
The purpose of this utility model is to provide a kind of Guiding wheel structure for silicon chip cutting, and it can effectively control the damage of steel wire landing to flange, the service life of having improved guide wheel.To solve the problem that in prior art, slicer internal washing exists.
For reaching this object, the utility model by the following technical solutions:
For a Guiding wheel structure for silicon chip cutting, it comprises the slotted zones that is positioned at guide wheel middle part, on described guide wheel, in the two ends of slotted zones, is provided with the buffering area of not slotting, and wherein, the outside of described buffering area is provided with step, and described step is higher than guide wheel wire casing.
Especially, the width of described buffering area is 6mm～10mm.
Especially, the height of described step is 2mm～4mm, and width is 4mm～5mm.
Especially, the height of described step is 2mm, and width is 5mm.
The beneficial effects of the utility model are that compared with prior art the described Guiding wheel structure for silicon chip cutting has the following advantages:
1) increase the width of guide wheel two ends buffering area, by expanding its buffering range, make first steel wire of gauze even with many steel wires, after jumping out of wire casing, have larger buffer area, reduced to a certain extent steel wire and from the landing of guide wheel coating layer, fallen the possibility of cutting damage flange to metal flange;
2) step of setting up higher than wire casing horizontal plane in buffering area outside stops, when steel wire because of broken string or factor the jumps out of wire casing such as tension force is unstable to steel wire being limited in buffer area because being subject to stopping of step behind buffer area, further reduced steel wire landing to the damage that causes flange on metal flange.
Accompanying drawing explanation
Fig. 1 is the structural representation of the Guiding wheel structure for silicon chip cutting that provides of the utility model specific embodiment 1;
Fig. 2 is the partial enlarged drawing at A place in Fig. 1.
The specific embodiment
Below in conjunction with accompanying drawing and by the specific embodiment, further illustrate the technical solution of the utility model.
Refer to shown in Fig. 1 and Fig. 2, Fig. 1 is the structural representation of the Guiding wheel structure for silicon chip cutting that provides of the utility model specific embodiment 1; Fig. 2 is the partial enlarged drawing at A place in Fig. 1.
In the present embodiment, a kind of Guiding wheel structure for silicon chip cutting comprises the slotted zones 1 that is positioned at guide wheel middle part, in described slotted zones 1, offer a plurality of guide wheel wire casings for the steel wire 4 of arranging, on described guide wheel, in slotted zones, 1 two ends are provided with the buffering area 2 of not slotting, the width of described buffering area 2 is 10mm, and the outside of described buffering area 2 is provided with step 3, and described step 3 is higher than guide wheel wire casing, and the height of described step is 2mm, width is 5mm.
The procedure of processing of the above-mentioned Guiding wheel structure for silicon chip cutting is:
1) the upper numerically controlled lathe of the guide wheel having applied (diameter is greater than 353mm) is left and taken to 1.2mm surplus and carried out rough turnly, guide wheel two ends are left and taken and are highly greater than 2mm rough turn time, and width is greater than the step of 5mm.
2) rough turn complete and check without leaving and taking 1mm surplus after abnormal carry out half finish turning, in the time of half finish turning, at guide wheel two ends, leave and take and be highly greater than 2mm equally, width is greater than the step of 5mm.
3) half finish turning complete after each parts of inspection guide wheel, confirm, after abnormal, guide wheel to be carried out to finish turning, this time to go out be highly 2mm to finish turning, the step that width is 5mm.
4) finish turning carries out tool setting after completing, and setting program gets out of the way step and surplus place normally slots.
Above embodiment has just set forth basic principle of the present utility model and characteristic; the utility model is not limited by above-mentioned example; do not departing under the prerequisite of the utility model spirit and scope; the utility model also has various variations and change, and these variations and change all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (4)
1. the Guiding wheel structure for silicon chip cutting, it comprises the slotted zones that is positioned at guide wheel middle part, on described guide wheel, in the two ends of slotted zones, is provided with the buffering area of not slotting, and it is characterized in that, the outside of described buffering area is provided with step, and described step is higher than guide wheel wire casing.
2. the Guiding wheel structure for silicon chip cutting according to claim 1, is characterized in that, the width of described buffering area is 6mm～10mm.
3. the Guiding wheel structure for silicon chip cutting according to claim 1, is characterized in that, the height of described step is 2mm～4mm, and width is 4mm～5mm.
4. the Guiding wheel structure for silicon chip cutting according to claim 3, is characterized in that, the height of described step is 2mm, and width is 5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320673381.0U CN203542878U (en) | 2013-10-29 | 2013-10-29 | Guide wheel structure used for cutting silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320673381.0U CN203542878U (en) | 2013-10-29 | 2013-10-29 | Guide wheel structure used for cutting silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203542878U true CN203542878U (en) | 2014-04-16 |
Family
ID=50461044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320673381.0U Expired - Fee Related CN203542878U (en) | 2013-10-29 | 2013-10-29 | Guide wheel structure used for cutting silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203542878U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103507175A (en) * | 2013-10-29 | 2014-01-15 | 高佳太阳能股份有限公司 | Guide pulley structure for silicon wafer cutting |
| CN104476687A (en) * | 2014-11-06 | 2015-04-01 | 江西赛维Ldk太阳能高科技有限公司 | Multi-wire cutting guide wheel and wiring method |
-
2013
- 2013-10-29 CN CN201320673381.0U patent/CN203542878U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103507175A (en) * | 2013-10-29 | 2014-01-15 | 高佳太阳能股份有限公司 | Guide pulley structure for silicon wafer cutting |
| CN104476687A (en) * | 2014-11-06 | 2015-04-01 | 江西赛维Ldk太阳能高科技有限公司 | Multi-wire cutting guide wheel and wiring method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140416 |