CN204019763U - Line cutting machine guide wheel - Google Patents

Line cutting machine guide wheel Download PDF

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Publication number
CN204019763U
CN204019763U CN201420241526.4U CN201420241526U CN204019763U CN 204019763 U CN204019763 U CN 204019763U CN 201420241526 U CN201420241526 U CN 201420241526U CN 204019763 U CN204019763 U CN 204019763U
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China
Prior art keywords
straight line
angle
line
guide wheel
degree
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Expired - Fee Related
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CN201420241526.4U
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Chinese (zh)
Inventor
韩卫
王滢赞
曹中谦
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SUZHOU RUNDE NEW MATERIAL Co Ltd
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SUZHOU RUNDE NEW MATERIAL Co Ltd
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Abstract

The utility model discloses a kind of line cutting machine guide wheel.This guide wheel external peripheral surface wear-resistant coating offers wire casing parallel to each other, and wire casing forms the V-shaped groove becoming angle on the shaft section of guide wheel; The V-shaped groove of described change angle is made up of left side and right side, left and right side with wire casing center line for axial symmetry, and left and right side is folding line, folding line is made up of at least two straight lines connected successively, and along the bottom land direction extremely relative with groove top near the groove top of guide wheel external diameter, formed by the straight line of each straight line of left side and the symmetrical with it of right side, angle successively decreases, and maximum angle is no more than 90 degree, and minimum angle is not less than 30 degree.The utility model line cutting machine guide wheel long service life, cutting silicon wafer precision are high, and can cut thinner silicon chip achieve change three profit.

Description

Line cutting machine guide wheel
Technical field
The utility model patent relates to multi-wire saw technical field, is specifically related to a kind of line cutting machine guide wheel.
Background technology
The differentiation that cutting method experienced by inner circle cutting, cylindrical cuts to multi-wire saw of the films such as silicon chip.The multi-wire saw technology generally adopted at present is sand line multi-wire saw, it utilizes diameter to be that the steel wire of 130 μm ~ 100 μm moves with the speed of about 10m/s, and spray silicon carbide-containing mortar, driven the crisp and hard materials such as the silicon-carbide particles grinding silicon in mortar by steel wire, finally reach the effect of cutting.The defects such as but this cutting technique exists, and waste mortar easily pollutes, silica flour is not recyclable, cutting efficiency.Occurred this emerging technology of diamond wire multi-wire saw thus, diamond particles is fixed on to make diamond wire on line of cut by modes such as plating and resin binders by it, is moved back and forth at a high speed form dissection by the traction of guide wheel.Owing to not needing suspension and carbonation silicon grain, the silica flour produced after cutting can reclaim use, and reduces the viscosity of cutting liquid, improves cutting efficiency, reduces section loss; Not only environmental protection but also energy-conservation.
Except the difference of line of cut, diamond wire saw technique and supporting consumptive material thereof have all continued to use the theory of original normal sands line cutting technology mostly.Such as, cutting machine also scribbles one deck polyurethane guide wheel coating for the guide wheel outer surface being wound around diamond wire, causes damage to prevent diamond wire to guide wheel; Guide wheel coating has V-type groove or U-lag to support line of cut, wherein the V-type angle of the v-groove is generally 70 ~ 90 degree, because V-shaped groove is easily processed and positioning precision is high, is the grooved be most widely used at present.In use, the V-type groove of guide wheel coating can wear and tear gradually, as shown in Figure 1; When V-type groove be deformed into no longer effectively can fix line of cut position time, need again to slot.Although the fraction of the cost of guide wheel only the line is busy cutting production cost, its performance has a strong impact on the operating efficiency of cutting products yield and board.
What needs aroused attention is, diamond wire saw has higher cutting power relative to normal sands Linear cut, can be enhanced about more than once to work piece cut efficiency, but meanwhile, the rate of wear of diamond wire to guide wheel coating V-type groove also doubles above than normal sands line.According to different type of machines and production technology, the fluting life-span of common yarn cutting is generally 500 ~ 1000 hours; By contrast, if diamond wire saw still continues to use the grooving processes of current common yarn cutting, the life-span of guide wheel coating V-type groove is only 200 ~ 400 hours.In addition, by the restriction of grooved, the silicon wafer thickness that can cut at present is the thinnest only has 180 μm, and distance diameter is that the theory of the diamond wire of 120 μm can also have certain gap by cutting silicon wafer thickness 140 μm.
Utility model content
The utility model is that the line cutting machine of representative and method for slotting guide roller thereof carry out technological innovation to diamond wire saw machine, its object is to overcome the defect existed in prior art, provides a kind of line cutting machine guide wheel with high service life.
For realizing the purpose of this utility model, the technical solution of the utility model is a kind of line cutting machine guide wheel, the wear-resistant coating of its external peripheral surface offers the parallel wire casing for arranging line of cut, wire casing forms the V-shaped groove becoming angle on the shaft section of guide wheel; The V-shaped groove of described change angle is made up of left side and right side, left and right side with wire casing center line for axial symmetry, and left and right side is folding line, folding line is made up of at least two straight lines connected successively, and along the bottom land direction extremely relative with groove top near the groove top of guide wheel external diameter, formed by the straight line of each straight line of left side and the symmetrical with it of right side, angle successively decreases, and maximum angle is no more than 90 degree, and minimum angle is not less than 30 degree.
By forming the varied angle V-shaped groove that groove top to bottom land angle successively decreases, its top can ensure that the precision of grooved and the fineness of cell wall well; Bottom can guide well line of cut especially diamond wire to the wear direction of guide wheel; Thus both ensure that the effective guide effect of varied angle V-type groove, in turn ensure that V-type groove effective service life; Varied angle V-shaped groove simultaneously owing to adopting angle to successively decrease, when identical groove depth, greatly reducing the centre distance of adjacent line of cut, providing rational solution for reducing silicon wafer thickness further.
In order to simplify structure, preferably, described folding line is made up of the first straight line near described groove top and the second straight line near described bottom land, formed by first straight line of described left side and the first straight line of described right side, angle is 60 ~ 90 degree, and formed by the second straight line of described left side and the second straight line of described right side, angle is 30 ~ 50 degree.
In order to guide effect and the service life of balanced varied angle V-shaped groove, further preferably, the groove depth that the groove depth that described first straight line is corresponding is corresponding with the second straight line is equal.
Preferably, formed by first straight line of described left side and the first straight line of described right side, angle is 70 degree, formed by second straight line of described left side and the second straight line of described right side, angle is 40 degree, and the groove depth that first, second straight line described is corresponding is 100 μm.
Can also preferably, described folding line is made up of with the second straight line being connected the first, the 3rd straight line the first straight line near described groove top, the 3rd straight line near described bottom land; Formed by first straight line of described left side and the first straight line of described right side, angle is 70 ~ 90 degree, and formed by the second straight line of described left side and the second straight line of described right side, angle is 40 ~ 60 degree; Formed by 3rd straight line of described left side and the 3rd straight line of described right side, angle is 20 ~ 35 degree.
Described wear-resistant coating is polyurethane coating.
Advantage of the present utility model and beneficial effect are: the utility model line cutting machine guide wheel makes the cell body of guide wheel be enhanced about more than once service life, thus improve the guide wheel life-span, reduce change guide wheel frequency, improve the operating efficiency of board.Meanwhile, the lines of cut such as this angle V-type groove location diamond wire more accurately, thus greatly improve cutting silicon wafer precision, improve silicon wafer thickness uniformity, improve cutting yield; Another important advantage is, varied angle V-type groove also makes slot pitch reduce, thus can cut thinner silicon chip, and the thickness of cutting silicon wafer, close to 140 μm, achieves and changes three profits.
This guide wheel can be used for the aspects such as solar silicon wafers cutting, semi-conductor silicon chip cutting, sapphire wafer cutting, ceramic material cutting after being assemblied in linear incision machine, be specially adapted to the crystal cutting high value, breakable various fragile material different hardness.
Accompanying drawing explanation
Fig. 1 is cross section structure and the wear process schematic diagram thereof of the wear-resistant coating of traditional line cutting machine guide wheel;
Fig. 2 is the structural representation of the utility model line cutting machine guide wheel;
Fig. 3 is a kind of structural representation of the wire casing grooved of the utility model line cutting machine guide wheel;
Fig. 4 is the partial enlarged drawing at A place in Fig. 3;
Fig. 5 is the structure change schematic diagram of wire casing grooved in grooving tool process of the utility model line cutting machine guide wheel;
Fig. 6 is cross section structure and the wear process schematic diagram thereof of the wear-resistant coating of the utility model line cutting machine guide wheel;
Fig. 7 is the another kind of structural representation of the wire casing grooved of the utility model line cutting machine guide wheel;
Fig. 8 is the partial enlarged drawing at A place in Fig. 7.
In figure: 1, wear-resistant coating; 2, wire casing; 21, left side; 22, right side; 23, groove top; 24, bottom land; 211 and 221, the first straight line; 212 and 222, the second straight line; 213 and 223, the 3rd straight line.
Detailed description of the invention
Below in conjunction with accompanying drawing, detailed description of the invention of the present utility model is further described.Following examples only for clearly the technical solution of the utility model being described, and can not limit protection domain of the present utility model with this.
The utility model is a kind of line cutting machine guide wheel, as shown in Figures 2 to 4, the polyurethane wear resistant coating 1 of its external peripheral surface offers the parallel wire casing 2 for arranging line of cut, and wire casing 2 forms the V-shaped groove becoming angle on the shaft section of guide wheel; The V-shaped groove of this change angle is made up of left side 21 and right side 22, left and right side 21,22 with wire casing 2 center line for axial symmetry, and left and right side 21,22 is folding line, folding line is made up of at least two straight lines connected successively, and along the groove top 23 near guide wheel external diameter to bottom land 24 direction relative with groove top 23, formed by the straight line of each straight line of left side 21 and the symmetrical with it of right side 22, angle successively decreases, and maximum angle is no more than 90 degree, and minimum angle is not less than 30 degree.
The grooving method of above-mentioned line cutting machine guide wheel, as shown in Figure 5, comprises the following steps: linear incision machine guide wheel is rotated with 500 ~ 1000 revs/min of speed around its central shaft; In the guide wheel polyurethane wear resistant coating of linear cutting machine, process wire casing with grooving tool, wire casing is the V-shaped groove becoming angle at the shaft section of guide wheel; The V-shaped groove of this change angle is slotted successively by the V-arrangement cutter of different cone angle from large to small, expand groove at least one times forms, expand groove and refer to that the bottom land after fluting or expansion groove is slotted again, high accuracy machining tool is utilized to control the position of tool tip error of the V-arrangement cutter of fluting and expansion groove within 2 μm, wherein the cone angle of V-arrangement cutter is maximum is no more than 90 degree, is minimumly not less than 30 degree.Diamond cutter or specific alloy cutter is selected according to grooving parameters.The type selecting of cutter, the determination of production technology will be determined according to polyurethane performance and grooved.In Fig. 5, the direction of arrow represents that cutter head moves towards.
The structure becoming angle V-shaped groove can be specifically, as shown in Figure 3 and Figure 4, the folding line of left side 21 is made up of the first straight line 211 near groove top 23 and the second straight line 212 near bottom land 24, the folding line of right side 22 is made up of the first straight line 221 near groove top 23 and the second straight line 222 near bottom land 24, formed by first straight line 211,221, angle is 60 ~ 90 degree, and formed by the second straight line 212,222, angle is 30 ~ 50 degree.During such fluting, become the grooving tool that the V-shaped groove of angle is 60 ~ 90 degree by cone angle and slot, then the grooving tool being 30 ~ 50 degree by cone angle expands groove further and forms.
In order to guide effect and the service life of balanced varied angle V-shaped groove, the groove depth of the first straight line 211,221 correspondence and the second straight line 212,222 corresponding groove depths are equal.During fluting, design groove depth is equal with expansion groove depth.
According to practical work experience, formed by first straight line 211,221, angle is preferably 70 degree, formed by second straight line 212,222, angle is preferably 40 degree, the groove depth of the first straight line 211,221 correspondence is 100 μm, when the groove depth of the second straight line 212,222 correspondence is 100 μm, the service life of guide wheel and guide effect reach best synergism.Take diamond wire as line of cut be example, its diameter is about 120 μm, and the slot opening on design groove top 23 is 211 μm.During fluting, become the grooving tool fluting that the V-shaped groove of angle is 70 degree by cone angle, then the grooving tool being 40 degree by cone angle expands groove further and forms, groove depth and expand groove depth and be all designed to 100 μm.
Adopt this structural design, as shown in Figure 6, the top of varied angle V-shaped groove can ensure that the precision of grooved and the fineness of cell wall well, improves Position location accuracy and improves silicon chip cutting thickness uniformity; Bottom can guide line of cut to the wear direction of guide wheel well, increases substantially the guide wheel life-span, reduces the frequent time changing guide wheel.Meanwhile, for diamond wire saw, diamond wire saw silicon wafer thickness can be 140 μm in theory, but diamond wire diameter is generally 120 μm instantly, makes can only be cut to 180 μm at present by grooved restriction; The utility model can make the axial width of V-shaped groove reduce, thus can cut thinner silicon chip, provides rational solution for reducing silicon wafer thickness.
In order to improve the service life of varied angle V-shaped groove further, the structure becoming the V-shaped groove of angle can also be, as shown in Figure 7 and Figure 8, the folding line of left side 21 is made up of with the second straight line 212 being connected the first, the 3rd straight line 211,213 the first straight line 211 near groove top 23, the 3rd straight line 213 near bottom land 24; The folding line of right side 22 is made up of with the second straight line 222 being connected the first, the 3rd straight line 221,223 the first straight line 221 near groove top 23, the 3rd straight line 223 near bottom land 24; Formed by first straight line 211,221, angle is 70 ~ 90 degree, and formed by the second straight line 212,222, angle is 40 ~ 60 degree, and formed by the 3rd straight line 213,223, angle is 20 ~ 35 degree.During such fluting, become the V-arrangement cutter that the V-shaped groove of angle is 70 ~ 90 degree by cone angle and slot, then the V-arrangement cutter being 40 ~ 60 degree, 20 ~ 35 degree by cone angle expands groove further and forms.
The above is only preferred embodiment of the present utility model; should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model know-why; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.

Claims (6)

1. a line cutting machine guide wheel, is characterized in that: the wear-resistant coating of its external peripheral surface offers the parallel wire casing for arranging line of cut, and wire casing forms the V-shaped groove becoming angle on the shaft section of guide wheel; The V-shaped groove of described change angle is made up of left side and right side, left and right side with wire casing center line for axial symmetry, and left and right side is folding line, folding line is made up of at least two straight lines connected successively, and along the bottom land direction extremely relative with groove top near the groove top of guide wheel external diameter, formed by the straight line of each straight line of left side and the symmetrical with it of right side, angle successively decreases, and maximum angle is no more than 90 degree, and minimum angle is not less than 30 degree.
2. line cutting machine guide wheel as claimed in claim 1, it is characterized in that: described folding line is made up of the first straight line near described groove top and the second straight line near described bottom land, formed by first straight line of described left side and the first straight line of described right side, angle is 60 ~ 90 degree, and formed by the second straight line of described left side and the second straight line of described right side, angle is 30 ~ 50 degree.
3. line cutting machine guide wheel as claimed in claim 2, is characterized in that: the groove depth that described first straight line the is corresponding groove depth corresponding with the second straight line is equal.
4. line cutting machine guide wheel as claimed in claim 2, it is characterized in that: formed by the first straight line of described left side and the first straight line of described right side, angle is 70 degree, formed by second straight line of described left side and the second straight line of described right side, angle is 40 degree, and the groove depth that first, second straight line described is corresponding is 100 μm.
5. line cutting machine guide wheel as claimed in claim 1, is characterized in that: described folding line is made up of with the second straight line being connected the first, the 3rd straight line the first straight line near described groove top, the 3rd straight line near described bottom land; Formed by first straight line of described left side and the first straight line of described right side, angle is 70 ~ 90 degree, and formed by the second straight line of described left side and the second straight line of described right side, angle is 40 ~ 60 degree; Formed by 3rd straight line of described left side and the 3rd straight line of described right side, angle is 20 ~ 35 degree.
6. the line cutting machine guide wheel as described in claim 1 to 5 any one, is characterized in that: described wear-resistant coating is polyurethane coating.
CN201420241526.4U 2014-05-12 2014-05-12 Line cutting machine guide wheel Expired - Fee Related CN204019763U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420241526.4U CN204019763U (en) 2014-05-12 2014-05-12 Line cutting machine guide wheel

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Application Number Priority Date Filing Date Title
CN201420241526.4U CN204019763U (en) 2014-05-12 2014-05-12 Line cutting machine guide wheel

Publications (1)

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CN204019763U true CN204019763U (en) 2014-12-17

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106493629A (en) * 2016-11-14 2017-03-15 陈红玲 The replaceable guide wheel assembly of abrasive wire sawing equipment
CN106493628A (en) * 2016-11-13 2017-03-15 陈红玲 Abrasive wire sawing equipment guide wheel

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106493628A (en) * 2016-11-13 2017-03-15 陈红玲 Abrasive wire sawing equipment guide wheel
CN106493629A (en) * 2016-11-14 2017-03-15 陈红玲 The replaceable guide wheel assembly of abrasive wire sawing equipment

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Addressee: SUZHOU RUNDE NEW MATERIAL CO., LTD.

Document name: Notification to Go Through Formalities of Registration

C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP02 Change in the address of a patent holder

Address after: Suzhou City, Jiangsu province 215600 Bauhinia Zhangjiagang City Economic Development Zone No. 28 Suzhou Road, red new material Co. Ltd.

Patentee after: SUZHOU RUNDE NEW MATERIAL CO., LTD.

Address before: Suzhou City, Jiangsu province 215600 Zhangjiagang Yang Tang Village Suzhou Runde New Material Co. Ltd.

Patentee before: SUZHOU RUNDE NEW MATERIAL CO., LTD.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141217

Termination date: 20190512