CN102169463B - Inter-integrated circuit (IIC) bus-based manufacturing information acquisition method and equipment - Google Patents

Inter-integrated circuit (IIC) bus-based manufacturing information acquisition method and equipment Download PDF

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CN102169463B
CN102169463B CN 201110108356 CN201110108356A CN102169463B CN 102169463 B CN102169463 B CN 102169463B CN 201110108356 CN201110108356 CN 201110108356 CN 201110108356 A CN201110108356 A CN 201110108356A CN 102169463 B CN102169463 B CN 102169463B
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iic
eeprom
manufacturer
manufacturing information
assigned
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CN102169463A (en
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赵志宇
钱嘉林
李星爽
段琳
张颖
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New H3C Information Technologies Co Ltd
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Hangzhou H3C Technologies Co Ltd
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Abstract

The invention discloses an inter-integrated circuit (IIC) bus-based manufacturing information acquisition method and equipment. The method comprises the following steps: when the IIC control equipment detects that an electrically erasable programmable read-only memory (EEPROM) connected with an IIC bus is on site by using the IIC bus, the IIC control equipment acquires an IIC equipment address ofthe EEPROM and the length of manufacturer manufacturing information; and the IIC control equipment acquires the manufacturer manufacturing information stored in the EEPROM through the IIC equipment address of the EEPROM, the read operation starting address and the length of the manufacturer manufacturing information. In the method and the equipment disclosed by the invention, the starting time ofdata communication equipment is shortened.

Description

A kind of acquisition methods and equipment of the manufacturing information based on iic bus
Technical field
The present invention relates to communication technical field, particularly relate to a kind of acquisition methods and equipment of the manufacturing information based on iic bus.
Background technology
IIC (Inter-Integrated Circuit, two-wire serial bus are called again I2C) bus is the twin wire universal serial bus, is used for connecting CPU (Central Processing Unit, central processing unit) and peripherals thereof.Iic bus only needs two lines, and the space of having reduced circuit board has reduced the quantity of chip pin, and iic bus supports many master controls (multimastering), and wherein any equipment that can carry out sending and receiving all can become main bus; Master control can control signal transmission and clock frequency, and a master control can only be arranged at any time.
Concrete, iic bus comprises a SDA (serial data, serial data), a SCL (serial clock, serial clock) can transmit and receive data, have the simple characteristics of connection, in the design of electronic equipment internal chip interconnects, be used widely.Iic bus is between CPU and the controlled IIC equipment, carry out two-way transmission between IIC equipment and the IIC equipment; CPU and IIC equipment are connected in parallel on the iic bus, and each IIC equipment has unique address (IIC device address), and the IIC equipment on the same iic bus is independent of one another.
Iic bus data transmission synoptic diagram as shown in Figure 1, when iic bus transmitted data, can be with the next stage: (1) incipient stage (START), when SCL was high level, SDA to low transition, began to transmit data by high level.(2) the transmission objectives IIC device address stage (Calling Address), transmit target IIC device address and read-write sign.(3) acknowledgment phase (ACK), receive target IIC device address after, send specific low level pulse to the CPU that sends data, data have been received in expression; If CPU does not receive answer signal, then be judged as target IIC equipment and do not exist or fault.(4) data phase (Data) if CPU writes IIC equipment, after then CPU receives ACK, sends data; If CPU reads IIC equipment, after then IIC equipment was sent and replied, IIC equipment sent data.(5) ending phase (STOP), when SCL was low level, SDA to the high level saltus step, finished to transmit data by low level.
In the prior art, data communications equipment is the main application fields of iic bus, CPU connects various EEPROM (Electrically Erasable Programmable Read-Only Memory by iic bus, electricallyerasable ROM (EEROM)), the equipment such as RTC (real-time clock real-time clock), temperature sensor (can contain fan governor), EEPROM is the most general IIC equipment that uses in the data communications equipment.
Centralized data communications equipment IIC as shown in Figure 2 uses synoptic diagram, CPU connects each EEPROM by iic bus, a data communication facilities can have 10 several EEPROM (but respectively on the modules such as master control borad, fixed service interface connecting-disconnecting interface module), and each EEPROM has stored manufacturer's manufacturing information (as having stored manufacturer's manufacturing information of master control borad in the master control borad EEPROM) of place module.
As shown in Figure 2, all EEPROM all are articulated on the iic bus with CPU in the current design, the access of all EEPROM all needs to have CPU to participate in, all initial work are all finished by the CPU of operational system startup software, the CPU operational system starts software, various hardware and software resources of initialization successively, wherein manufacturer's manufacturing information (must read manufacturer's manufacturing information during the system software initialization) of EEPROM is read in initialization, whether CPU is at first in place by the EEPROM of the signal detection module that is associated with module, if in place, CPU need to read corresponding manufacturer manufacturing information by iic bus from the EEPROM of different IIC interfaces; In the situation that a plurality of modules are arranged, can carry out successively aforesaid operations.
But, because the access of EEPROM need to have CPU to participate in, iic bus is bus (frequency is the 10-100kHz magnitude) at a slow speed, then CPU reads the data volume of manufacturer's manufacturing information about 10-100kByte, therefore can cause CPU to read manufacturer's manufacturing information 10s of surpassing consuming time, CPU participates in the read operation of manufacturer's manufacturing information of EEPROM for a long time, affects the toggle speed of data communications equipment.
Summary of the invention
The invention provides a kind of acquisition methods and equipment of the manufacturing information based on iic bus, to improve the toggle speed of data communications equipment.
In order to achieve the above object, the invention provides a kind of acquisition methods of the manufacturing information based on the two-wire serial bus iic bus, one side of iic bus is connected with the uncertain electricallyerasable ROM (EEROM) EEPROM of quantity, opposite side is connected with the IIC opertaing device, store manufacturer's manufacturing information of place module among the described EEPROM, the method may further comprise the steps: detect EEPROM that iic bus connects when in place when described IIC opertaing device uses iic bus, described IIC opertaing device obtains the IIC device address of described EEPROM and the length of manufacturer's manufacturing information; Described IIC opertaing device obtains manufacturer's manufacturing information of storing among the described EEPROM by the length of IIC device address, read operation start address and the manufacturer's manufacturing information of described EEPROM; The process that described IIC opertaing device obtains manufacturer's manufacturing information of storing among the described EEPROM is independent of system's startup software, and starts the software parallel execution with system.
Described IIC opertaing device uses iic bus to detect the EEPROM process in place that iic bus connects, be specially: described IIC opertaing device is carried out the operation that begins to read default byte from the read operation start address to assigned I IC device address, if assigned I IC device address has ACK to reply, it is in place then to detect the EEPROM that the iic bus of assigned I IC device address connects; If assigned I IC device address does not have ACK to reply, it is not in place then to detect the EEPROM that the iic bus of assigned I IC device address connects.
Described assigned I IC device address comprises: 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, 0xAF; Described IIC opertaing device is carried out the operation that begins to read default byte from the read operation start address to assigned I IC device address, specifically comprise: described IIC opertaing device is carried out the operation that begins to read default byte from the read operation start address according to the predefined procedure between 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, the 0xAF to assigned I IC device address.
Described IIC opertaing device obtains the process of the IIC device address of described EEPROM, be specially: when the EEPROM of the iic bus connection that detects assigned I IC device address was in place, the IIC device address that described IIC opertaing device obtains described EEPROM was described assigned I IC device address.
Described IIC opertaing device obtains the process of length of manufacturer's manufacturing information of described EEPROM, when the EEPROM of the iic bus connection that detects assigned I IC device address was in place, described IIC opertaing device obtained the length of manufacturer's manufacturing information of described EEPROM by the operation of reading default byte.
Described default byte comprises 2 bytes, and these 2 bytes are byte 0 and byte 1, if read designated identification from byte 0, then obtains the length of manufacturer's manufacturing information of described EEPROM by byte 1; Otherwise, obtain the length of manufacturer's manufacturing information of described EEPROM by byte 0.
Described IIC opertaing device obtains manufacturer's manufacturing information of storing among the described EEPROM by the length of IIC device address, read operation start address and the manufacturer's manufacturing information of described EEPROM, also comprises afterwards: described IIC opertaing device stores described manufacturer manufacturing information in internal random access memory RAM or the Installed System Memory into; To be used for when CPU need to be known described manufacturer manufacturing information, in described internal RAM or Installed System Memory, reading described manufacturer manufacturing information.
Described IIC opertaing device is integrated in complex programmable logic device (CPLD) or the on-site programmable gate array FPGA, and described IIC opertaing device is independent of the CPU that operational system starts software; Perhaps, described IIC opertaing device is integrated in the nuclear of inoperative system startup software in the multi-core CPU, and this nuclear is independent of the nuclear of operational system startup software in the multi-core CPU.
The invention provides a kind of two-wire serial bus IIC opertaing device, one side of iic bus is connected with the uncertain electricallyerasable ROM (EEROM) EEPROM of quantity, opposite side is connected with described IIC opertaing device, store manufacturer's manufacturing information of place module among the described EEPROM, this equipment comprises: EEPROM detection sub-module in place is used for using iic bus to detect the situation in place of the EEPROM of iic bus connection; Core control submodule, be used for when the EEPROM that detects the iic bus connection is in place, obtain the IIC device address of described EEPROM and the length of manufacturer's manufacturing information, and the length of IIC device address, read operation start address and manufacturer's manufacturing information by described EEPROM is obtained manufacturer's manufacturing information of storing among the described EEPROM; The process of obtaining manufacturer's manufacturing information of storing among the described EEPROM is independent of system and starts software, and starts the software parallel execution with system.
Described EEPROM detection sub-module in place, concrete for carry out the operation that begins to read default byte from the read operation start address to assigned I IC device address, if assigned I IC device address has ACK to reply, it is in place to detect the EEPROM that the iic bus of assigned I IC device address connects; If assigned I IC device address does not have ACK to reply, it is not in place to detect the EEPROM that the iic bus of assigned I IC device address connects.
Described assigned I IC device address comprises: 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, 0xAF; Described EEPROM detection sub-module in place is further used for carrying out the operation that begins to read default byte from the read operation start address to assigned I IC device address according to the predefined procedure between 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, the 0xAF.
Described core control submodule, concrete being used for when the EEPROM of the iic bus connection that detects assigned I IC device address is in place, the IIC device address that obtains described EEPROM is described assigned I IC device address.
Described core control submodule, concrete being used for obtained the length of manufacturer's manufacturing information of described EEPROM by the operation of reading default byte when the EEPROM of the iic bus connection that detects assigned I IC device address is in place.
Described default byte comprises 2 bytes, and these 2 bytes are byte 0 and byte 1, if read designated identification from byte 0, then obtains the length of manufacturer's manufacturing information of described EEPROM by byte 1; Otherwise, obtain the length of manufacturer's manufacturing information of described EEPROM by byte 0.
This IIC opertaing device also comprises: internal RAM and Installed System Memory access submodule; Described core control submodule also is used for described manufacturer manufacturing information is stored into internal RAM or stores described manufacturer manufacturing information into Installed System Memory by Installed System Memory access submodule; Described internal RAM is used for preserving manufacturer's manufacturing information, to be used for reading described manufacturer manufacturing information in described internal RAM when CPU need to be known described manufacturer manufacturing information; Described Installed System Memory access submodule is used for storing described manufacturer manufacturing information into Installed System Memory, to be used for reading described manufacturer manufacturing information in described Installed System Memory when CPU need to be known described manufacturer manufacturing information.
Described IIC opertaing device is integrated in complex programmable logic device (CPLD) or the on-site programmable gate array FPGA, and described IIC opertaing device is independent of the CPU that operational system starts software; Perhaps, described IIC opertaing device is integrated in the nuclear of inoperative system startup software in the multi-core CPU, and this nuclear is independent of the nuclear of operational system startup software in the multi-core CPU.
Compared with prior art, the present invention has the following advantages at least: whether the system that can be independent of starts software and comes on the automatic learning iic bus each EEPROM in place, and the length of the IIC device address of EEPROM and manufacturer's manufacturing information, thereby can automatically read manufacturer's manufacturing information; The CPU operational system starts software no longer directly from reading manufacturing information the EEPROM at a slow speed, but reads manufacturer's manufacturing information from internal RAM at a high speed or Installed System Memory, shortens data communications equipment start-up time.
Description of drawings
Fig. 1 is iic bus data transmission synoptic diagram in the prior art;
Fig. 2 is that centralized data communications equipment IIC uses synoptic diagram in the prior art;
Fig. 3 is that the IIC opertaing device is integrated in synoptic diagram on logic chip or the FPGA among the present invention;
Fig. 4 is that the IIC opertaing device is integrated in synoptic diagram on the nuclear of multi-core CPU among the present invention;
Fig. 5 is the process flow figure of a kind of manufacturing information based on iic bus provided by the invention;
Fig. 6 is that the IIC device address of EEPROM in the prior art forms synoptic diagram;
Fig. 7 is that byte 0 is used for preserving the synoptic diagram of effective manufacturer manufacturing information length in the prior art;
Fig. 8 is that byte 1 is used for preserving the synoptic diagram of EEPROM total volume in the prior art;
Fig. 9 is a kind of IIC opertaing device structural representation provided by the invention.
Embodiment
The invention provides a kind of acquisition methods of the manufacturing information based on iic bus, cause the slow problem of data communications equipment toggle speed for the manufacturer's manufacturing information that reads EEPROM, by automatic loading manufacturer manufacturing information, so that obtaining of manufacturer's manufacturing information is independent of cpu system software, improve the toggle speed of data communications equipment.
Among the present invention, for data communications equipment, one side of iic bus is connected with the uncertain EEPROM of quantity, and (this EEPROM is IIC equipment, and iic bus connects at most 8 EEPROM, but whether each EEPROM is in place uncertain, therefore EEPROM quantity is uncertain), opposite side is connected with the IIC opertaing device.This IIC opertaing device can be integrated in CPLD (Complex Programmable Logic Device, CPLD) or FPGA (Field-Programmable Gate Array, field programmable gate array) in, and is independent of the CPU that operational system starts software; Also can be integrated in the nuclear of inoperative system startup software in the multi-core CPU, and this nuclear is independent of the nuclear of operational system startup software in the multi-core CPU.IIC opertaing device as shown in Figure 3 is integrated in the synoptic diagram of CPLD or FPGA and IIC opertaing device shown in Figure 4 and is integrated in synoptic diagram in the nuclear that inoperative system in the multi-core CPU starts software.
It should be noted that, need to change existing iic bus connected mode among the present invention, when the IIC opertaing device is integrated in CPLD or FPGA, iic bus one side is connected on the EEPROM of IIC equipment, opposite side is connected on the CPLD or FPGA that is integrated with the IIC opertaing device.When the IIC opertaing device is integrated in a nuclear of inoperative system startup software in the multi-core CPU, iic bus one side is connected on the EEPROM of IIC equipment, opposite side is connected to the inoperative system that is integrated with the IIC opertaing device and starts on the nuclear of software.
Among the present invention, store manufacturer's manufacturing information of place module among this EEPROM, this manufacturer's manufacturing information includes but not limited to: trade name, sequence number, the date of production, coded message, information of check code etc.Take Fig. 3 and scene shown in Figure 4 as example, the EEPROM of module includes but not limited to: memory bar EEPROM, master control borad EEPROM, optical module EEPROM and interface card EEPROM, it is manufacturer's manufacturing information of having stored memory bar among the memory bar EEPROM, stored manufacturer's manufacturing information of master control borad among the master control borad EEPROM, optical module EEPROM has stored manufacturer's manufacturing information of optical module, has stored manufacturer's manufacturing information of interface card among the interface card EEPROM.
As shown in Figure 5, this acquisition methods based on the manufacturing information of iic bus may further comprise the steps:
Whether the EEPROM that step 501, IIC opertaing device use iic bus (namely not needing by other signals) detection iic bus to connect is in place, if, execution in step 502, otherwise, continue execution in step 501, until detecting, finish all EEPROM that iic bus connects.In the practical application, an iic bus can connect 8 EEPROM, when needs connect more EEPROM, can realize that by many iic bus the processing procedure of every iic bus is identical, describes as an example of 8 EEPROM of the maximum connections of an iic bus example.
Concrete, the IIC device address of considering IIC interface EEPROM is positioned at fixing position, by the basic constraint condition in conjunction with the IIC transferring ACK, the IIC opertaing device can (this read operation start address be agreed address from the read operation start address to the execution of assigned I IC device address, as to arrange the read operation start address be 0 address) operation that begins to read default byte (such as 2Bytes), if assigned I IC device address has ACK to reply, it is in place then to detect the EEPROM that the iic bus of assigned I IC device address connects; If assigned I IC device address does not have ACK to reply, it is not in place then to detect the EEPROM that the iic bus of assigned I IC device address connects.
It should be noted that, this assigned I IC device address comprises: 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, 0xAF, and namely the IIC opertaing device can be carried out the operation that begins to read default byte from the read operation start address according to the predefined procedure between 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, the 0xAF to assigned I IC device address; As long as carry out the operation that begins to read default byte from the read operation start address to above-mentioned 8 IIC device addresses, execution sequence can be selected according to actual needs in the practical application.Take predefined procedure as carrying out the example that is operating as that begins to read default byte from the read operation start address to the IIC device address of 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, 0xAF successively, then this step comprises:
The IIC opertaing device is carried out the operation that begins to read default byte from the read operation start address to the IIC device address of 0xA1, if there is not ACK to reply, the EEPROM that the iic bus of assigned I IC device address 0xA1 connects is not in place, carries out the operation that begins to read default byte from the read operation start address to the IIC device address of 0xA3; If there is ACK to reply, the EEPROM that the iic bus of assigned I IC device address 0xA1 connects is in place, carry out subsequent step 502-505, after subsequent step 502-505 is complete, carry out the operation that begins to read default byte from the read operation start address to the IIC device address of 0xA3; By that analogy, until the operation of the IIC device address of 0xAF is complete, repeat no more among the present invention.
Step 502, when the EEPROM that detects the iic bus connection was in place, the IIC opertaing device obtained the IIC device address of EEPROM and the length of manufacturer's manufacturing information.
To it should be noted that manufacturer's manufacturing information of storing among the EEPROM in order reading, to need to obtain IIC device address, the length of manufacturer's manufacturing information, the read operation start address of EEPROM.The read operation start address is agreed address (be 0 address such as agreement read operation start address); The hardware design of data communications equipment is depended in the IIC device address of EEPROM, can't unify agreement; The length of manufacturer's manufacturing information also depends on the application (manufacturer's manufacturing information of each IIC equipment can be not identical) of concrete IIC equipment, can't unify agreement; Therefore the IIC opertaing device need to obtain the IIC device address of EEPROM and the length of manufacturer's manufacturing information.
The composition synoptic diagram of the IIC device address of EEPROM as shown in Figure 6, the 0b1010 of high 4bit are the unified signs of IIC interface EEPROM; (value is 0-7 to the chip selection signal that middle 3bit stipulates when being hardware design, namely on an iic bus 8 EEPROM can only be arranged at most, many iic bus of needs when connecting more EEPROM), during the design of hardware line, need to distribute different chip selection signals for the EEPROM of different IIC interfaces, last 1bit is read-write sign (is read operation when being 1, be 0 o'clock be write operation).When chip selection signal was set to 000, then the IIC device address of EEPROM was 0xA1, and when chip selection signal was set to 001, then the IIC device address of EEPROM was 0xA3, by that analogy.
In order to obtain the IIC device address of EEPROM, when the EEPROM that connects when the iic bus that detects assigned I IC device address was in place, then to obtain the IIC device address be assigned I IC device address to the IIC opertaing device.For example, when the EEPROM that connects when the iic bus of assigned I IC device address 0xA1 was in place, then the IIC device address was 0xA1.
In order to obtain the length of manufacturer's manufacturing information, when the EEPROM of the iic bus connection that detects assigned I IC device address was in place, then the IIC opertaing device obtained the length of manufacturer's manufacturing information of EEPROM by the operation of reading default byte; Default byte comprises 2 bytes, and these 2 bytes are byte 0 and byte 1, if read designated identification (as identifying 0) from byte 0, then obtains the length of manufacturer's manufacturing information of EEPROM by byte 1; Otherwise, obtain the length of manufacturer's manufacturing information of EEPROM by byte 0.
Concrete, can expand existing SPD (Serial Presence Detect, the serial of the existence detects) method of standard among the present invention and obtain the length of manufacturer's manufacturing information.Existing DDR (Double Data Rate, Double Data Rate) SDRAM (Synchronous Dynamic Random Access Memory, Synchronous Dynamic Random Access Memory) SPD is a kind of EEPROM of IIC interface, be used for depositing manufacturer's proposed arrangement information of DDRSDRAM, as shown in table 1.For byte 0, be used for the length of manufacturer's manufacturing information of preservation EEPROM, the synoptic diagram of the length of manufacturer's manufacturing information of preservation EEPROM as shown in Figure 7; For byte 1, be used for preserving EEPROM total volume, the synoptic diagram of preservation EEPROM total volume as shown in Figure 8.
Table 1
Byte 0 The length of manufacturer's manufacturing information of EEPROM
Byte 1 The EEPROM total volume
As can be seen from Figures 7 and 8, the length of existing manufacturer manufacturing information mostly is 256Bytes most, for DDR SDRAM, manufacturing information length 256Bytes is enough in manufacturer, but for the IIC interface EEPROM of other application, the manufacturing information length 256Bytes of manufacturer also is nowhere near, therefore expanded the definition of SPD standard among the present invention, for the EEPROM of non-DDR SDRAM SPD, Byte 0 deposits 0, and the length that is used for manufacturer's manufacturing information of sign EEPROM is determined by Byte 1; Byte1 is used for the length of manufacturer's manufacturing information of preservation EEPROM, and is as shown in table 2.
Table 2
Byte 0 0 (length of manufacturer's manufacturing information of sign EEPROM is determined by Byte 1)
Byte 1 The length of manufacturer's manufacturing information of EEPROM
In sum, among the present invention, the data (by reading the data of 2 bytes) that the IIC opertaing device reads when in place by the EEPROM that detects the IIC interface can obtain the length of manufacturer's manufacturing information of EEPROM.This expanded definition compatibility DDR SDRAM and non-DDR SDRAM, the length of manufacturer's manufacturing information of the byte 0 statement EEPROM of DDR SDRAM, the length of manufacturer's manufacturing information of the byte 1 statement EEPROM of non-DDR SDRAM can obtain the length based on manufacturer's manufacturing information of DDR SDRAM and non-DDR SDRAM when therefore reading the data of 2 bytes.
Step 503, the IIC opertaing device obtains manufacturer's manufacturing information of storing among the EEPROM by the length of IIC device address, read operation start address and the manufacturer's manufacturing information of EEPROM.Among the present invention, the process (being above-mentioned step 501-step 503) that the IIC opertaing device obtains manufacturer's manufacturing information of storing among the EEPROM is independent of system's startup software, and starts the software parallel execution with system.
For example, when the EEPROM of the iic bus connection that detects 0xA1 is in place, begin with the read operation start address, obtain manufacturer's manufacturing information of storing among the EEPROM by the length of manufacturer's manufacturing information, thereby obtain manufacturer's manufacturing information corresponding to 0xA.
Step 504, the IIC opertaing device stores manufacturer's manufacturing information in internal RAM (Random Access Memory, random access memory) or the Installed System Memory into.
Step 505 in the data communications equipment start-up course, if need to obtain manufacturer's manufacturing information, is then directly obtained in RAM or the Installed System Memory internally.
Among the present invention, the IIC opertaing device can be saved in manufacturer's manufacturing information in the internal RAM (CPLD, FPGA or multi-core CPU generally are integrated in internal RAM), directly obtains manufacturer's manufacturing information among the RAM internally whenever necessary for cpu system software.For internal RAM, because BIOS (Basic Input Output System, Basic Input or Output System (BIOS)) need to obtain first SPD information ability initialization system internal memory, then internal RAM is applicable to the SPD information of obtaining in advance DDR SDRAM.
In addition, manufacturer's manufacturing information of different I IC equipment can be kept at address different in the internal RAM (these addresses are what to be made an appointment), when preserving manufacturer's manufacturing information, can preserve the first address of manufacturer's manufacturing information, and deposit and obtain complement mark, in the acquiescence internal RAM all to obtain complement mark all be not finish, after manufacturer's manufacturing information is write internal RAM, revise and obtain complement mark for finishing.
Among the present invention, consider the internal RAM limited space, for larger manufacturer's manufacturing information, the IIC opertaing device can be saved in manufacturer's manufacturing information in the Installed System Memory.Manufacturer's manufacturing information of different I IC equipment can be kept at address different in the Installed System Memory (these addresses are what to be made an appointment), when preserving manufacturer's manufacturing information, can preserve the first address of manufacturer's manufacturing information, and deposit and obtain complement mark, in the default system internal memory all to obtain complement mark all be not finish, after with manufacturer's manufacturing information writing system internal memory, revise and obtain complement mark for finishing.
In sum, among the present invention, after the data communications equipment system software starts, start software in the CPU operational system, during other various hardware and software resource of initialization, whether the system that can be independent of starts software and comes on the automatic learning iic bus each EEPROM in place, and the length of the IIC device address of EEPROM and manufacturer's manufacturing information, thereby can automatically read manufacturer's manufacturing information, be saved in internal RAM or the Installed System Memory, and above-mentioned acquisition process is independent of cpu system software, with the CPU parallel starting of operational system startup software; When cpu system software needs manufacturer's manufacturing information, the CPU operational system starts software no longer directly from reading manufacturing information the EEPROM at a slow speed, but from internal RAM at a high speed or Installed System Memory, read manufacturer's manufacturing information, adopt like this operation of work in series parallelization, shorten data communications equipment start-up time.
Further, the CPU operational system starts software and read manufacturer's manufacturing information from internal RAM at a high speed or Installed System Memory, with from EEPROM at a slow speed, read manufacturing information and compare, significantly improve the access speed (being brought up to more than the 1Gbps by 100kbps) of cpu system software; Shorten data communications equipment start-up time (having shortened between 5% to 40%); Strengthen the stability of data communications equipment forwarding performance; Applied widely, use the electronic equipment of iic bus all can use technical scheme provided by the invention; Need not CPU and participate in, realizability is strong, and logical design is simple; The user experiences, and need not the user and understands data communications equipment design realization, need not special points for attention.
Based on the inventive concept same with said method, the present invention also provides a kind of IIC opertaing device, one side of iic bus is connected with the uncertain EEPROM of quantity, opposite side is connected with the IIC opertaing device, store manufacturer's manufacturing information of place module among the EEPROM, the IIC opertaing device is integrated among CPLD or the FPGA, and is independent of the CPU that operational system starts software; Or, the IIC opertaing device is integrated in the nuclear of inoperative system startup software in the multi-core CPU, and be independent of the nuclear of operational system startup software in the multi-core CPU, as shown in Figure 9, this equipment comprises EEPROM detection sub-module 11 in place, core control submodule 12, internal RAM 13, Installed System Memory access submodule 14 and IIC access interface submodule 15.
This IIC access interface submodule 15 is used for realization to the access of EEPROM, and the EEPROM that EEPROM detection sub-module 11 in place and core control submodule 12 can call 15 pairs of IIC interfaces of IIC access interface submodule carries out read operation; In the access process to EEPROM, the length of IIC device address and manufacturer's manufacturing information is issued by EEPROM detection sub-module 11 in place and core control submodule 12, and the read operation start address of accessed EEPROM is fixed as the 0th byte that is begun by the IIC device address.
EEPROM detection sub-module 11 in place is used for using iic bus to detect the situation in place of the EEPROM of iic bus connection; EEPROM detection sub-module 11 in place, concrete for carry out the operation that begins to read default byte from the read operation start address to assigned I IC device address, if assigned I IC device address has ACK to reply, it is in place to detect the EEPROM that the iic bus of assigned I IC device address connects; If assigned I IC device address does not have ACK to reply, it is not in place to detect the EEPROM that the iic bus of assigned I IC device address connects.
Assigned I IC device address comprises: 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, 0xAF; EEPROM detection sub-module 11 in place is further used for carrying out the operation that begins to read default byte from the read operation start address to assigned I IC device address according to the predefined procedure between 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, the 0xAF.
Core control submodule 12, be used for when the EEPROM that detects the iic bus connection is in place, obtain the IIC device address of EEPROM and the length of manufacturer's manufacturing information, and the length of IIC device address, read operation start address and manufacturer's manufacturing information by EEPROM is obtained manufacturer's manufacturing information of storing among the EEPROM; The process of obtaining manufacturer's manufacturing information of storing among the EEPROM is independent of system and starts software, and starts the software parallel execution with system.
Core control submodule 12, concrete being used for when the EEPROM of the iic bus connection that detects assigned I IC device address is in place, the IIC device address that obtains EEPROM is assigned I IC device address; When the EEPROM of the iic bus connection that detects assigned I IC device address is in place, obtain the length of manufacturer's manufacturing information of EEPROM by the operation of reading default byte; Default byte comprises 2 bytes, and these 2 bytes are byte 0 and byte 1, if read designated identification from byte 0, then obtains the length of manufacturer's manufacturing information of EEPROM by byte 1; Otherwise, obtain the length of manufacturer's manufacturing information of EEPROM by byte 0.
Concrete, after the IIC opertaing device powers on, EEPROM detection sub-module 11 in place issues and (can be set to 000 by DDR SDRAM SPD chip selection signal in the design of hardware line to IIC device address 0xA1, the IIC device address is 0xA1, with the information that reads at first SPD to BIOS initialization DDR internal memory) EEPROM read the action of two bytes to IIC access interface submodule 15; And after detecting EEPROM corresponding to 0xA1 and returning ACK, know that EEPROM is in place, two bytes (byte 0 and byte 1) that get access to are reported core control submodule 12, after parsing the length of manufacturer's manufacturing information by core control submodule 12, EEPROM for the IIC device address issues the operation of the length of reading manufacturer's manufacturing information to IIC access interface submodule 15, after IIC access interface submodule 15 is finished the IIC read operation, the data (being manufacturer's manufacturing information) of obtaining are reported core control submodule 12.After manufacturer's manufacturing information of finishing this EEPROM obtained, core control submodule 12 triggered EEPROM detection sub-module 11 in place and detects next IIC device address 0xA3, the like, finish 0xAF until detect.
Further, if many iic bus are arranged, EEPROM detection sub-module 11 in place also needs to search for successively according to every iic bus.In addition, EEPROM detection sub-module 11 in place detects 0xA1 and does not reply ACK, illustrates that then the EEPROM of the IIC interface that the 0xA1 address is corresponding does not exist, and this EEPROM detection sub-module 11 in place detects 0xA3 automatically, the like.
Among the present invention, core control submodule 12 also is used for manufacturer's manufacturing information is stored into internal RAM 13 or stores manufacturer's manufacturing information into Installed System Memory by Installed System Memory access submodule 14, at this moment:
Internal RAM 13 be used for to be preserved manufacturer's manufacturing information, to be used for reading manufacturer's manufacturing information as CPU (cpu system software) in the time of need to knowing manufacturer's manufacturing information in internal RAM 13; Manufacturer's manufacturing information of different I IC equipment can be kept at addresses different in the internal RAM 13, when preserving manufacturer's manufacturing information, can preserve the first address of manufacturer's manufacturing information, and deposit and obtain complement mark, in the acquiescence internal RAM 13 all to obtain complement mark all be not finish, after manufacturer's manufacturing information is write internal RAM 13, revise and obtain complement mark for finishing.
Installed System Memory access submodule 14 is used for storing manufacturer's manufacturing information into Installed System Memory, to be used for reading manufacturer's manufacturing information in Installed System Memory when CPU need to be known manufacturer's manufacturing information.Because internal RAM 13 limited spaces if larger manufacturer's manufacturing information is arranged, then need to be saved in the Installed System Memory; Core control submodule 12 is to realize the manufacturer's manufacturing information that obtains is saved in the Installed System Memory by Installed System Memory access submodule 14.Manufacturer's manufacturing information of different I IC equipment can be kept at addresses different in the Installed System Memory, when preserving manufacturer's manufacturing information, can preserve the first address of manufacturer's manufacturing information, and deposit and obtain complement mark, in the default system internal memory all to obtain complement mark all be not finish, after with manufacturer's manufacturing information writing system internal memory, revise and obtain complement mark for finishing.
The modules of apparatus of the present invention can be integrated in one, and also can separate deployment.Above-mentioned module can be merged into a module, also can further split into a plurality of submodules.
Through the above description of the embodiments, those skilled in the art can be well understood to the present invention and can realize by hardware, also can realize by the mode that software adds necessary general hardware platform.Based on such understanding, technical scheme of the present invention can embody with the form of software product, it (can be CD-ROM that this software product can be stored in a non-volatile memory medium, USB flash disk, portable hard drive etc.) in, comprise some instructions with so that computer equipment (can be personal computer, server, the perhaps network equipment etc.) carry out the described method of each embodiment of the present invention.
It will be appreciated by those skilled in the art that accompanying drawing is the synoptic diagram of a preferred embodiment, the module in the accompanying drawing or flow process might not be that enforcement the present invention is necessary.
It will be appreciated by those skilled in the art that the module in the device among the embodiment can be distributed in the device of embodiment according to the embodiment description, also can carry out respective change and be arranged in the one or more devices that are different from present embodiment.The module of above-described embodiment can be merged into a module, also can further split into a plurality of submodules.
The invention described above sequence number does not represent the quality of embodiment just to description.
More than disclosed only be several specific embodiment of the present invention, still, the present invention is not limited thereto, the changes that any person skilled in the art can think of all should fall into protection scope of the present invention.

Claims (14)

1. acquisition methods based on the manufacturing information of two-wire serial bus iic bus, one side of iic bus is connected with the uncertain electricallyerasable ROM (EEROM) EEPROM of quantity, opposite side is connected with the IIC opertaing device, store manufacturer's manufacturing information of place module among the described EEPROM, it is characterized in that the method may further comprise the steps:
Detect EEPROM that iic bus connects when in place when described IIC opertaing device uses iic bus, described IIC opertaing device obtains the IIC device address of described EEPROM and the length of manufacturer's manufacturing information;
Described IIC opertaing device obtains manufacturer's manufacturing information of storing among the described EEPROM by the length of IIC device address, read operation start address and the manufacturer's manufacturing information of described EEPROM;
The process that described IIC opertaing device obtains manufacturer's manufacturing information of storing among the described EEPROM is independent of system's startup software, and starts the software parallel execution with system;
Wherein, described IIC opertaing device uses iic bus to detect the EEPROM process in place that iic bus connects, and is specially:
Described IIC opertaing device is carried out the operation that begins to read default byte from the read operation start address to assigned I IC device address, if assigned I IC device address has ACK to reply, it is in place then to detect the EEPROM that the iic bus of assigned I IC device address connects; If assigned I IC device address does not have ACK to reply, it is not in place then to detect the EEPROM that the iic bus of assigned I IC device address connects.
2. the method for claim 1 is characterized in that, described assigned I IC device address comprises: 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, 0xAF;
Described IIC opertaing device is carried out the operation that begins to read default byte from the read operation start address to assigned I IC device address, specifically comprise:
Described IIC opertaing device is carried out the operation that begins to read default byte from the read operation start address according to the predefined procedure between 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, the 0xAF to assigned I IC device address.
3. method as claimed in claim 1 or 2 is characterized in that, described IIC opertaing device obtains the process of the IIC device address of described EEPROM, is specially:
When the EEPROM of the iic bus connection that detects assigned I IC device address was in place, the IIC device address that described IIC opertaing device obtains described EEPROM was described assigned I IC device address.
4. method as claimed in claim 1 or 2 is characterized in that, described IIC opertaing device obtains the process of length of manufacturer's manufacturing information of described EEPROM, is specially:
When the EEPROM of the iic bus connection that detects assigned I IC device address was in place, described IIC opertaing device obtained the length of manufacturer's manufacturing information of described EEPROM by the operation of reading default byte.
5. method as claimed in claim 4 is characterized in that, described default byte comprises 2 bytes, and these 2 bytes are byte 0 and byte 1, if read designated identification from byte 0, then obtains the length of manufacturer's manufacturing information of described EEPROM by byte 1; Otherwise, obtain the length of manufacturer's manufacturing information of described EEPROM by byte 0.
6. the method for claim 1, it is characterized in that, described IIC opertaing device obtains manufacturer's manufacturing information of storing among the described EEPROM by the length of IIC device address, read operation start address and the manufacturer's manufacturing information of described EEPROM, also comprises afterwards:
Described IIC opertaing device stores described manufacturer manufacturing information in internal random access memory RAM or the Installed System Memory into; To be used for when CPU need to be known described manufacturer manufacturing information, in described internal RAM or Installed System Memory, reading described manufacturer manufacturing information.
7. the method for claim 1 is characterized in that, described IIC opertaing device is integrated in complex programmable logic device (CPLD) or the on-site programmable gate array FPGA, and described IIC opertaing device is independent of the CPU that operational system starts software; Perhaps,
Described IIC opertaing device is integrated in the nuclear of inoperative system startup software in the multi-core CPU, and this nuclear is independent of the nuclear of operational system startup software in the multi-core CPU.
8. two-wire serial bus IIC opertaing device, one side of iic bus is connected with the uncertain electricallyerasable ROM (EEROM) EEPROM of quantity, and opposite side is connected with described IIC opertaing device, stores manufacturer's manufacturing information of place module among the described EEPROM, it is characterized in that this equipment comprises:
EEPROM detection sub-module in place is used for using iic bus to detect the situation in place of the EEPROM of iic bus connection;
Core control submodule, be used for when the EEPROM that detects the iic bus connection is in place, obtain the IIC device address of described EEPROM and the length of manufacturer's manufacturing information, and the length of IIC device address, read operation start address and manufacturer's manufacturing information by described EEPROM is obtained manufacturer's manufacturing information of storing among the described EEPROM;
The process of obtaining manufacturer's manufacturing information of storing among the described EEPROM is independent of system and starts software, and starts the software parallel execution with system;
Wherein, described EEPROM detection sub-module in place, concrete being used for carried out the operation that begins to read default byte from the read operation start address to assigned I IC device address, if assigned I IC device address has ACK to reply, it is in place to detect the EEPROM that the iic bus of assigned I IC device address connects; If assigned I IC device address does not have ACK to reply, it is not in place to detect the EEPROM that the iic bus of assigned I IC device address connects.
9. IIC opertaing device as claimed in claim 8 is characterized in that, described assigned I IC device address comprises: 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, 0xAF;
Described EEPROM detection sub-module in place is further used for carrying out the operation that begins to read default byte from the read operation start address to assigned I IC device address according to the predefined procedure between 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, the 0xAF.
10. IIC opertaing device as claimed in claim 8 or 9 is characterized in that,
Described core control submodule, concrete being used for when the EEPROM of the iic bus connection that detects assigned I IC device address is in place, the IIC device address that obtains described EEPROM is described assigned I IC device address.
11. the IIC opertaing device is characterized in that as claimed in claim 8 or 9,
Described core control submodule, concrete being used for obtained the length of manufacturer's manufacturing information of described EEPROM by the operation of reading default byte when the EEPROM of the iic bus connection that detects assigned I IC device address is in place.
12. IIC opertaing device as claimed in claim 11, it is characterized in that described default byte comprises 2 bytes, these 2 bytes are byte 0 and byte 1, if read designated identification from byte 0, then obtain the length of manufacturer's manufacturing information of described EEPROM by byte 1; Otherwise, obtain the length of manufacturer's manufacturing information of described EEPROM by byte 0.
13. IIC opertaing device as claimed in claim 8 is characterized in that, this IIC opertaing device also comprises: internal RAM and Installed System Memory access submodule;
Described core control submodule also is used for described manufacturer manufacturing information is stored into internal RAM or stores described manufacturer manufacturing information into Installed System Memory by Installed System Memory access submodule;
Described internal RAM is used for preserving manufacturer's manufacturing information, to be used for reading described manufacturer manufacturing information in described internal RAM when CPU need to be known described manufacturer manufacturing information;
Described Installed System Memory access submodule is used for storing described manufacturer manufacturing information into Installed System Memory, to be used for reading described manufacturer manufacturing information in described Installed System Memory when CPU need to be known described manufacturer manufacturing information.
14. IIC opertaing device as claimed in claim 8 is characterized in that, described IIC opertaing device is integrated in complex programmable logic device (CPLD) or the on-site programmable gate array FPGA, and described IIC opertaing device is independent of the CPU that operational system starts software; Perhaps,
Described IIC opertaing device is integrated in the nuclear of inoperative system startup software in the multi-core CPU, and this nuclear is independent of the nuclear of operational system startup software in the multi-core CPU.
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