Summary of the invention
The invention provides a kind of acquisition methods and equipment of the manufacturing information based on iic bus, to improve the toggle speed of data communications equipment.
In order to achieve the above object, the invention provides a kind of acquisition methods of the manufacturing information based on the two-wire serial bus iic bus, one side of iic bus is connected with the uncertain electricallyerasable ROM (EEROM) EEPROM of quantity, opposite side is connected with the IIC opertaing device, store manufacturer's manufacturing information of place module among the described EEPROM, this method may further comprise the steps: detect EEPROM that iic bus connects when on the throne when described IIC opertaing device uses iic bus, described IIC opertaing device obtains the IIC device address of described EEPROM and the length of manufacturer's manufacturing information; Described IIC opertaing device obtains manufacturer's manufacturing information of storing among the described EEPROM by the length of IIC device address, read operation start address and the manufacturer's manufacturing information of described EEPROM; The process that described IIC opertaing device obtains manufacturer's manufacturing information of storing among the described EEPROM is independent of system start-up software, and carries out with the system start-up software parallel.
Described IIC opertaing device uses iic bus to detect the EEPROM process on the throne that iic bus connects, be specially: described IIC opertaing device is carried out the operation that begins to read default byte from the read operation start address to assigned I IC device address, if assigned I IC device address has ACK to reply, it is on the throne then to detect the EEPROM that the iic bus of assigned I IC device address connects; If assigned I IC device address does not have ACK to reply, it is not on the throne then to detect the EEPROM that the iic bus of assigned I IC device address connects.
Described assigned I IC device address comprises: 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, 0xAF; Described IIC opertaing device is carried out the operation that begins to read default byte from the read operation start address to assigned I IC device address, specifically comprises: described IIC opertaing device is carried out the operation that begins to read default byte from the read operation start address according to the predefined procedure between 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, the 0xAF to assigned I IC device address.
Described IIC opertaing device obtains the process of the IIC device address of described EEPROM, be specially: when the EEPROM of the iic bus connection that detects assigned I IC device address was on the throne, the IIC device address that described IIC opertaing device obtains described EEPROM was described assigned I IC device address.
Described IIC opertaing device obtains the process of length of manufacturer's manufacturing information of described EEPROM, when the EEPROM of the iic bus connection that detects assigned I IC device address was on the throne, described IIC opertaing device obtained the length of manufacturer's manufacturing information of described EEPROM by the operation of reading default byte.
Described default byte comprises 2 bytes, and these 2 bytes are byte 0 and byte 1, if read designated identification from byte 0, then obtains the length of manufacturer's manufacturing information of described EEPROM by byte 1; Otherwise, obtain the length of manufacturer's manufacturing information of described EEPROM by byte 0.
Described IIC opertaing device obtains manufacturer's manufacturing information of storing among the described EEPROM by the length of IIC device address, read operation start address and the manufacturer's manufacturing information of described EEPROM, also comprises afterwards: described IIC opertaing device stores described manufacturer manufacturing information in internal random access memory RAM or the Installed System Memory into; To be used for when CPU need be known described manufacturer manufacturing information, in described internal RAM or Installed System Memory, reading described manufacturer manufacturing information.
Described IIC opertaing device is integrated in complex programmable logic device (CPLD) or the on-site programmable gate array FPGA, and described IIC opertaing device is independent of the CPU that operational system starts software; Perhaps, described IIC opertaing device is integrated in the nuclear of inoperative system start-up software in the multi-core CPU, and this nuclear is independent of the nuclear of operational system startup software in the multi-core CPU.
The invention provides a kind of two-wire serial bus IIC opertaing device, one side of iic bus is connected with the uncertain electricallyerasable ROM (EEROM) EEPROM of quantity, opposite side is connected with described IIC opertaing device, store manufacturer's manufacturing information of place module among the described EEPROM, this equipment comprises: EEPROM in-place detection submodule is used to use iic bus to detect the situation on the throne of the EEPROM of iic bus connection; The core controlling sub, be used for when the EEPROM that detects the iic bus connection is on the throne, obtain the IIC device address of described EEPROM and the length of manufacturer's manufacturing information, and the length of IIC device address, read operation start address and manufacturer's manufacturing information by described EEPROM is obtained manufacturer's manufacturing information of storing among the described EEPROM; The process of obtaining manufacturer's manufacturing information of storing among the described EEPROM is independent of system start-up software, and carries out with the system start-up software parallel.
Described EEPROM in-place detection submodule, specifically be used for carrying out the operation that begins to read default byte from the read operation start address to assigned I IC device address, if assigned I IC device address has ACK to reply, it is on the throne to detect the EEPROM that the iic bus of assigned I IC device address connects; If assigned I IC device address does not have ACK to reply, it is not on the throne to detect the EEPROM that the iic bus of assigned I IC device address connects.
Described assigned I IC device address comprises: 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, 0xAF; Described EEPROM in-place detection submodule is further used for carrying out the operation that begins to read default byte from the read operation start address to assigned I IC device address according to the predefined procedure between 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, the 0xAF.
Described core controlling sub specifically is used for when the EEPROM of the iic bus connection that detects assigned I IC device address is on the throne, and the IIC device address that obtains described EEPROM is described assigned I IC device address.
Described core controlling sub specifically is used for obtaining the length of manufacturer's manufacturing information of described EEPROM by the operation of reading default byte when the EEPROM of the iic bus connection that detects assigned I IC device address is on the throne.
Described default byte comprises 2 bytes, and these 2 bytes are byte 0 and byte 1, if read designated identification from byte 0, then obtains the length of manufacturer's manufacturing information of described EEPROM by byte 1; Otherwise, obtain the length of manufacturer's manufacturing information of described EEPROM by byte 0.
This IIC opertaing device also comprises: internal RAM and Installed System Memory visit submodule; Described core controlling sub also is used for described manufacturer manufacturing information is stored into internal RAM or stores described manufacturer manufacturing information into Installed System Memory by Installed System Memory visit submodule; Described internal RAM is used to preserve manufacturer's manufacturing information, to be used for reading described manufacturer manufacturing information in described internal RAM when CPU need be known described manufacturer manufacturing information; Described Installed System Memory visit submodule is used for storing described manufacturer manufacturing information into Installed System Memory, to be used for reading described manufacturer manufacturing information in described Installed System Memory when CPU need be known described manufacturer manufacturing information.
Described IIC opertaing device is integrated in complex programmable logic device (CPLD) or the on-site programmable gate array FPGA, and described IIC opertaing device is independent of the CPU that operational system starts software; Perhaps, described IIC opertaing device is integrated in the nuclear of inoperative system start-up software in the multi-core CPU, and this nuclear is independent of the nuclear of operational system startup software in the multi-core CPU.
Compared with prior art, the present invention has the following advantages at least: whether can being independent of system start-up software, to learn on the iic bus each EEPROM automatically on the throne, and the length of the IIC device address of EEPROM and manufacturer's manufacturing information, thereby can read manufacturer's manufacturing information automatically; The CPU operational system starts software no longer directly from reading manufacturing information the EEPROM at a slow speed, but reads manufacturer's manufacturing information from internal RAM at a high speed or Installed System Memory, shortens data communications equipment start-up time.
Embodiment
The invention provides a kind of acquisition methods of the manufacturing information based on iic bus, cause the slow problem of data communications equipment toggle speed at the manufacturer's manufacturing information that reads EEPROM, by automatic loading manufacturer manufacturing information, make obtaining of manufacturer's manufacturing information be independent of cpu system software, improve the toggle speed of data communications equipment.
Among the present invention, at data communications equipment, one side of iic bus is connected with the uncertain EEPROM of quantity, and (this EEPROM is an IIC equipment, and iic bus connects 8 EEPROM at most, but whether each EEPROM is on the throne uncertain, therefore EEPROM quantity is uncertain), opposite side is connected with the IIC opertaing device.This IIC opertaing device can be integrated in CPLD (Complex Programmable Logic Device, CPLD) or FPGA (Field-Programmable Gate Array, field programmable gate array) in, and is independent of the CPU that operational system starts software; Also can be integrated in the nuclear of inoperative system start-up software in the multi-core CPU, and this nuclear is independent of the nuclear of operational system startup software in the multi-core CPU.IIC opertaing device as shown in Figure 3 is integrated in the synoptic diagram in the synoptic diagram of CPLD or FPGA and the nuclear that IIC opertaing device shown in Figure 4 is integrated in inoperative system start-up software in the multi-core CPU.
It should be noted that, need to change existing iic bus connected mode among the present invention, when the IIC opertaing device is integrated in CPLD or FPGA, iic bus one side is connected on the EEPROM of IIC equipment, opposite side is connected on the CPLD or FPGA that is integrated with the IIC opertaing device.When the IIC opertaing device is integrated in nuclear of inoperative system start-up software in the multi-core CPU, iic bus one side is connected on the EEPROM of IIC equipment, opposite side is connected on the nuclear of the inoperative system start-up software that is integrated with the IIC opertaing device.
Among the present invention, store manufacturer's manufacturing information of place module among this EEPROM, this manufacturer's manufacturing information includes but not limited to: trade name, sequence number, the date of production, coded message, information of check code etc.With Fig. 3 and scene shown in Figure 4 is example, the EEPROM of module includes but not limited to: memory bar EEPROM, master control borad EEPROM, optical module EEPROM and interface card EEPROM, it is manufacturer's manufacturing information of having stored memory bar among the memory bar EEPROM, stored manufacturer's manufacturing information of master control borad among the master control borad EEPROM, optical module EEPROM has stored manufacturer's manufacturing information of optical module, has stored manufacturer's manufacturing information of interface card among the interface card EEPROM.
As shown in Figure 5, this acquisition methods based on the manufacturing information of iic bus may further comprise the steps:
Whether the EEPROM that step 501, IIC opertaing device use iic bus (promptly not needing by other signals) detection iic bus to connect is on the throne, if, execution in step 502, otherwise, continue execution in step 501, until detecting, finish all EEPROM that iic bus connects.In the practical application, an iic bus can connect 8 EEPROM, when needs connect more EEPROM, can realize that the processing procedure of every iic bus is identical by many iic bus, and connecting 8 EEPROM at most with an iic bus is that example describes.
Concrete, the IIC device address of considering IIC interface EEPROM is positioned at fixing position, by basic constraint condition in conjunction with the IIC transferring ACK, the IIC opertaing device can (this read operation start address be an agreed address from the read operation start address to the execution of assigned I IC device address, as to arrange the read operation start address be 0 address) operation that begins to read default byte (as 2Bytes), if assigned I IC device address has ACK to reply, it is on the throne then to detect the EEPROM that the iic bus of assigned I IC device address connects; If assigned I IC device address does not have ACK to reply, it is not on the throne then to detect the EEPROM that the iic bus of assigned I IC device address connects.
It should be noted that, this assigned I IC device address comprises: 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, 0xAF, and promptly the IIC opertaing device can be carried out the operation that begins to read default byte from the read operation start address according to the predefined procedure between 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, the 0xAF to assigned I IC device address; As long as carry out the operation that begins to read default byte from the read operation start address to above-mentioned 8 IIC device addresses, execution sequence can be selected according to actual needs in the practical application.For carrying out the example that is operating as that begins to read default byte from the read operation start address to the IIC device address of 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, 0xAF successively, then this step comprises with predefined procedure:
The IIC opertaing device is carried out the operation that begins to read default byte from the read operation start address to the IIC device address of 0xA1, if there is not ACK to reply, the EEPROM that the iic bus of assigned I IC device address 0xA1 connects is not on the throne, carries out the operation that begins to read default byte from the read operation start address to the IIC device address of 0xA3; If there is ACK to reply, the EEPROM that the iic bus of assigned I IC device address 0xA1 connects is on the throne, carry out subsequent step 502-505, after subsequent step 502-505 is complete, carry out the operation that begins to read default byte from the read operation start address to the IIC device address of 0xA3; By that analogy, until the operation of the IIC device address of 0xAF is complete, repeat no more among the present invention.
Step 502, when the EEPROM that detects the iic bus connection was on the throne, the IIC opertaing device obtained the IIC device address of EEPROM and the length of manufacturer's manufacturing information.
To it should be noted that manufacturer's manufacturing information of storing among the EEPROM in order reading, to need to obtain IIC device address, the length of manufacturer's manufacturing information, the read operation start address of EEPROM.The read operation start address is agreed address (is 0 address as agreement read operation start address); The hardware design of data communications equipment is depended in the IIC device address of EEPROM, can't unify agreement; The length of manufacturer's manufacturing information also depends on the application (manufacturer's manufacturing information of each IIC equipment can be inequality) of concrete IIC equipment, can't unify agreement; Therefore the IIC opertaing device need obtain the IIC device address of EEPROM and the length of manufacturer's manufacturing information.
The composition synoptic diagram of the IIC device address of EEPROM as shown in Figure 6, the 0b1010 of high 4bit are the unified signs of IIC interface EEPROM; (value is 0-7 to the chip selection signal that middle 3bit stipulates when being hardware design, promptly on an iic bus 8 EEPROM can only be arranged at most, many iic bus of needs when connecting more EEPROM), during the design of hardware line, need distribute different chip selection signals for the EEPROM of different IIC interfaces, last 1bit is read-write sign (is read operation when being 1, be 0 o'clock be write operation).When chip selection signal was set to 000, then the IIC device address of EEPROM was 0xA1, and when chip selection signal was set to 001, then the IIC device address of EEPROM was 0xA3, by that analogy.
In order to obtain the IIC device address of EEPROM, when the EEPROM that connects when the iic bus that detects assigned I IC device address was on the throne, then to obtain the IIC device address be assigned I IC device address to the IIC opertaing device.For example, when the EEPROM that connects when the iic bus of assigned I IC device address 0xA1 was on the throne, then the IIC device address was 0xA1.
In order to obtain the length of manufacturer's manufacturing information, when the EEPROM of the iic bus connection that detects assigned I IC device address was on the throne, then the IIC opertaing device obtained the length of manufacturer's manufacturing information of EEPROM by the operation of reading default byte; Default byte comprises 2 bytes, and these 2 bytes are byte 0 and byte 1, if read designated identification (as identifying 0) from byte 0, then obtains the length of manufacturer's manufacturing information of EEPROM by byte 1; Otherwise, obtain the length of manufacturer's manufacturing information of EEPROM by byte 0.
Concrete, can expand existing SPD (Serial Presence Detect, the serial of the existence detects) method of standard among the present invention and obtain the length of manufacturer's manufacturing information.Existing DDR (Double Data Rate, Double Data Rate) SDRAM (Synchronous Dynamic Random Access Memory, Synchronous Dynamic Random Access Memory) SPD is a kind of EEPROM of IIC interface, is used to deposit manufacturer's proposed arrangement information of DDRSDRAM, and is as shown in table 1.For byte 0, be used to preserve the length of manufacturer's manufacturing information of EEPROM, the synoptic diagram of the length of manufacturer's manufacturing information of preservation EEPROM as shown in Figure 7; For byte 1, be used to preserve the EEPROM total volume, the synoptic diagram of preservation EEPROM total volume as shown in Figure 8.
Table 1
Byte?0 |
The length of manufacturer's manufacturing information of EEPROM |
Byte?1 |
The EEPROM total volume |
As can be seen from Figures 7 and 8, the length of existing manufacturer manufacturing information mostly is 256Bytes most, for DDR SDRAM, manufacturing information length 256Bytes is enough in manufacturer, but for the IIC interface EEPROM of other application, the manufacturing information length 256Bytes of manufacturer also is nowhere near, therefore expanded the definition of SPD standard among the present invention, for the EEPROM of non-DDR SDRAM SPD, Byte 0 deposits 0, and the length of manufacturer's manufacturing information that is used to identify EEPROM is by Byte 1 decision; Byte1 is used to preserve the length of manufacturer's manufacturing information of EEPROM, and is as shown in table 2.
Table 2
Byte?0 |
0 (length of manufacturer's manufacturing information of sign EEPROM is by Byte 1 decision) |
Byte?1 |
The length of manufacturer's manufacturing information of EEPROM |
In sum, among the present invention, the data (by reading the data of 2 bytes) that the IIC opertaing device is read when on the throne by the EEPROM that detects the IIC interface can obtain the length of manufacturer's manufacturing information of EEPROM.This expanded definition compatibility DDR SDRAM and non-DDR SDRAM, the length of manufacturer's manufacturing information of the byte 0 statement EEPROM of DDR SDRAM, the length of manufacturer's manufacturing information of the byte 1 statement EEPROM of non-DDR SDRAM can obtain the length based on manufacturer's manufacturing information of DDR SDRAM and non-DDR SDRAM when therefore reading the data of 2 bytes.
Step 503, the IIC opertaing device obtains manufacturer's manufacturing information of storing among the EEPROM by the length of IIC device address, read operation start address and the manufacturer's manufacturing information of EEPROM.Among the present invention, the process (being above-mentioned step 501-step 503) that the IIC opertaing device obtains manufacturer's manufacturing information of storing among the EEPROM is independent of system start-up software, and carries out with the system start-up software parallel.
For example, when the EEPROM of the iic bus connection that detects 0xA1 is on the throne, begin, obtain manufacturer's manufacturing information of storing among the EEPROM by the length of manufacturer's manufacturing information, thereby obtain manufacturer's manufacturing information of 0xA correspondence with the read operation start address.
Step 504, the IIC opertaing device stores manufacturer's manufacturing information in internal RAM (Random Access Memory, random access memory) or the Installed System Memory into.
Step 505 in the data communications equipment start-up course, is obtained manufacturer's manufacturing information if desired, then directly obtains in RAM or the Installed System Memory internally.
Among the present invention, the IIC opertaing device can be saved in manufacturer's manufacturing information in the internal RAM (CPLD, FPGA or multi-core CPU generally are integrated in internal RAM), directly obtains manufacturer's manufacturing information among the RAM internally whenever necessary for cpu system software.For internal RAM, because BIOS (Basic Input Output System, Basic Input or Output System (BIOS)) need obtain SPD information ability initialization system internal memory earlier, then internal RAM is applicable to the SPD information of obtaining DDR SDRAM in advance.
In addition, manufacturer's manufacturing information of different I IC equipment can be kept at address different in the internal RAM (these addresses are what to be made an appointment), when preserving manufacturer's manufacturing information, can preserve the first address of manufacturer's manufacturing information, and deposit and obtain complement mark, in the acquiescence internal RAM all to obtain complement mark all be not finish, after manufacturer's manufacturing information is write internal RAM, revise and obtain complement mark for finishing.
Among the present invention, consider that the internal RAM space is limited, at bigger manufacturer's manufacturing information, the IIC opertaing device can be saved in manufacturer's manufacturing information in the Installed System Memory.Manufacturer's manufacturing information of different I IC equipment can be kept at address different in the Installed System Memory (these addresses are what to be made an appointment), when preserving manufacturer's manufacturing information, can preserve the first address of manufacturer's manufacturing information, and deposit and obtain complement mark, in the default system internal memory all to obtain complement mark all be not finish, after with manufacturer's manufacturing information writing system internal memory, revise and obtain complement mark for finishing.
In sum, among the present invention, after the data communications equipment system software starts, start software in the CPU operational system, during other various hardware and software resource of initialization, whether can being independent of system start-up software, to learn on the iic bus each EEPROM automatically on the throne, and the length of the IIC device address of EEPROM and manufacturer's manufacturing information, thereby can read manufacturer's manufacturing information automatically, be saved in internal RAM or the Installed System Memory, and above-mentioned acquisition process is independent of cpu system software, with the CPU parallel starting of operational system startup software; When cpu system software needs manufacturer's manufacturing information, the CPU operational system starts software no longer directly from reading manufacturing information the EEPROM at a slow speed, but from internal RAM at a high speed or Installed System Memory, read manufacturer's manufacturing information, adopt the operation of work in series parallelization like this, shorten data communications equipment start-up time.
Further, the CPU operational system starts software and read manufacturer's manufacturing information from internal RAM at a high speed or Installed System Memory, with from EEPROM at a slow speed, read manufacturing information and compare, significantly improve the access speed (bringing up to more than the 1Gbps) of cpu system software by 100kbps; Shorten data communications equipment start-up time (having shortened between 5% to 40%); Strengthen the stability of data communications equipment forwarding performance; Applied widely, use the electronic equipment of iic bus all can use technical scheme provided by the invention; Need not CPU and participate in, realizability is strong, and logical design is simple; The user experiences, and need not the user and understands data communications equipment design realization, need not special points for attention.
Based on the inventive concept same with said method, the present invention also provides a kind of IIC opertaing device, one side of iic bus is connected with the uncertain EEPROM of quantity, opposite side is connected with the IIC opertaing device, store manufacturer's manufacturing information of place module among the EEPROM, the IIC opertaing device is integrated among CPLD or the FPGA, and is independent of the CPU that operational system starts software; Or, the IIC opertaing device is integrated in the nuclear of inoperative system start-up software in the multi-core CPU, and be independent of the nuclear of operational system startup software in the multi-core CPU, as shown in Figure 9, this equipment comprises EEPROM in-place detection submodule 11, core controlling sub 12, internal RAM 13, Installed System Memory visit submodule 14 and IIC access interface submodule 15.
This IIC access interface submodule 15 is used to realize the visit to EEPROM, and the EEPROM that EEPROM in-place detection submodule 11 and core controlling sub 12 can be called 15 pairs of IIC interfaces of IIC access interface submodule carries out read operation; In the access process to EEPROM, the length of IIC device address and manufacturer's manufacturing information is issued by EEPROM in-place detection submodule 11 and core controlling sub 12, and the read operation start address of accessed EEPROM is fixed as the 0th byte that is begun by the IIC device address.
EEPROM in-place detection submodule 11 is used to use iic bus to detect the situation on the throne of the EEPROM of iic bus connection; EEPROM in-place detection submodule 11, specifically be used for carrying out the operation that begins to read default byte from the read operation start address to assigned I IC device address, if assigned I IC device address has ACK to reply, it is on the throne to detect the EEPROM that the iic bus of assigned I IC device address connects; If assigned I IC device address does not have ACK to reply, it is not on the throne to detect the EEPROM that the iic bus of assigned I IC device address connects.
Assigned I IC device address comprises: 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, 0xAF; EEPROM in-place detection submodule 11 is further used for carrying out the operation that begins to read default byte from the read operation start address to assigned I IC device address according to the predefined procedure between 0xA1,0xA3,0xA5,0xA7,0xA9,0xAB, 0xAD, the 0xAF.
Core controlling sub 12, be used for when the EEPROM that detects the iic bus connection is on the throne, obtain the IIC device address of EEPROM and the length of manufacturer's manufacturing information, and the length of IIC device address, read operation start address and manufacturer's manufacturing information by EEPROM is obtained manufacturer's manufacturing information of storing among the EEPROM; The process of obtaining manufacturer's manufacturing information of storing among the EEPROM is independent of system start-up software, and carries out with the system start-up software parallel.
Core controlling sub 12 specifically is used for when the EEPROM of the iic bus connection that detects assigned I IC device address is on the throne, and the IIC device address that obtains EEPROM is assigned I IC device address; When the EEPROM of the iic bus connection that detects assigned I IC device address is on the throne, obtain the length of manufacturer's manufacturing information of EEPROM by the operation of reading default byte; Default byte comprises 2 bytes, and these 2 bytes are byte 0 and byte 1, if read designated identification from byte 0, then obtains the length of manufacturer's manufacturing information of EEPROM by byte 1; Otherwise, obtain the length of manufacturer's manufacturing information of EEPROM by byte 0.
Concrete, after the IIC opertaing device powers on, EEPROM in-place detection submodule 11 issues and (can be set to 000 by DDR SDRAM SPD chip selection signal in the design of hardware line to IIC device address 0xA1, the IIC device address is 0xA1, gives BIOS initialization DDR internal memory with the information that reads SPD at first) the EEPROM action of reading two bytes give IIC access interface submodule 15; And after the EEPROM that detects the 0xA1 correspondence returns ACK, know that EEPROM is on the throne, two bytes (byte 0 and byte 1) that get access to are reported core controlling sub 12, parse the length of manufacturer's manufacturing information by core controlling sub 12 after, EEPROM at the IIC device address issues the operation of the length of reading manufacturer's manufacturing information to IIC access interface submodule 15, after IIC access interface submodule 15 is finished the IIC read operation, the data of obtaining (being manufacturer's manufacturing information) are reported core controlling sub 12.After manufacturer's manufacturing information of finishing this EEPROM obtained, core controlling sub 12 triggered EEPROM in-place detection submodule 11 and detects next IIC device address 0xA3, and the like, finish 0xAF up to detection.
Further, if many iic bus are arranged, EEPROM in-place detection submodule 11 also needs to search for successively according to every iic bus.In addition, EEPROM in-place detection submodule 11 detects 0xA1 and does not reply ACK, illustrates that then the EEPROM of the IIC interface of 0xA1 address correspondence does not exist, and this EEPROM in-place detection submodule 11 detects 0xA3 automatically, and the like.
Among the present invention, core controlling sub 12 also is used for manufacturer's manufacturing information is stored into internal RAM 13 or stores manufacturer's manufacturing information into Installed System Memory by Installed System Memory visit submodule 14, at this moment:
Internal RAM 13 is used to preserve manufacturer's manufacturing information, to be used for reading manufacturer's manufacturing information as CPU (cpu system software) in the time of need knowing manufacturer's manufacturing information in internal RAM 13; Manufacturer's manufacturing information of different I IC equipment can be kept at addresses different in the internal RAM 13, when preserving manufacturer's manufacturing information, can preserve the first address of manufacturer's manufacturing information, and deposit and obtain complement mark, in the acquiescence internal RAM 13 all to obtain complement mark all be not finish, after manufacturer's manufacturing information is write internal RAM 13, revise and obtain complement mark for finishing.
Installed System Memory visit submodule 14 is used for storing manufacturer's manufacturing information into Installed System Memory, to be used for reading manufacturer's manufacturing information in Installed System Memory when CPU need be known manufacturer's manufacturing information.Because internal RAM 13 spaces are limited, if bigger manufacturer's manufacturing information is arranged, then need to be saved in the Installed System Memory; Core controlling sub 12 is to realize the manufacturer's manufacturing information that obtains is saved in the Installed System Memory by Installed System Memory visit submodule 14.Manufacturer's manufacturing information of different I IC equipment can be kept at addresses different in the Installed System Memory, when preserving manufacturer's manufacturing information, can preserve the first address of manufacturer's manufacturing information, and deposit and obtain complement mark, in the default system internal memory all to obtain complement mark all be not finish, after with manufacturer's manufacturing information writing system internal memory, revise and obtain complement mark for finishing.
Each module of apparatus of the present invention can be integrated in one, and also can separate deployment.Above-mentioned module can be merged into a module, also can further split into a plurality of submodules.
Through the above description of the embodiments, those skilled in the art can be well understood to the present invention and can realize by hardware, also can realize by the mode that software adds necessary general hardware platform.Based on such understanding, technical scheme of the present invention can embody with the form of software product, it (can be CD-ROM that this software product can be stored in a non-volatile memory medium, USB flash disk, portable hard drive etc.) in, comprise some instructions with so that computer equipment (can be personal computer, server, the perhaps network equipment etc.) carry out the described method of each embodiment of the present invention.
It will be appreciated by those skilled in the art that accompanying drawing is the synoptic diagram of a preferred embodiment, module in the accompanying drawing or flow process might not be that enforcement the present invention is necessary.
It will be appreciated by those skilled in the art that the module in the device among the embodiment can be distributed in the device of embodiment according to the embodiment description, also can carry out respective change and be arranged in the one or more devices that are different from present embodiment.The module of the foregoing description can be merged into a module, also can further split into a plurality of submodules.
The invention described above sequence number is not represented the quality of embodiment just to description.
More than disclosed only be several specific embodiment of the present invention, still, the present invention is not limited thereto, any those skilled in the art can think variation all should fall into protection scope of the present invention.