CN102130216A - 薄膜太阳电池用槽加工工具及其角度限制结构 - Google Patents

薄膜太阳电池用槽加工工具及其角度限制结构 Download PDF

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Publication number
CN102130216A
CN102130216A CN2011100026506A CN201110002650A CN102130216A CN 102130216 A CN102130216 A CN 102130216A CN 2011100026506 A CN2011100026506 A CN 2011100026506A CN 201110002650 A CN201110002650 A CN 201110002650A CN 102130216 A CN102130216 A CN 102130216A
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CN
China
Prior art keywords
tool
groove
tool body
film solar
solar cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011100026506A
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English (en)
Chinese (zh)
Inventor
曾山正信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN102130216A publication Critical patent/CN102130216A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/137—Batch treatment of the devices
    • H10F71/1375—Apparatus for automatic interconnection of photovoltaic cells in a module
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/02—Other than completely through work thickness
    • Y10T83/0304—Grooving
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9457—Joint or connection
    • Y10T83/9488—Adjustable

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Photovoltaic Devices (AREA)
CN2011100026506A 2010-01-08 2011-01-07 薄膜太阳电池用槽加工工具及其角度限制结构 Pending CN102130216A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-002498 2010-01-08
JP2010002498A JP2011142236A (ja) 2010-01-08 2010-01-08 薄膜太陽電池用の溝加工ツール及びその角度規制構造

Publications (1)

Publication Number Publication Date
CN102130216A true CN102130216A (zh) 2011-07-20

Family

ID=43825397

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011100026506A Pending CN102130216A (zh) 2010-01-08 2011-01-07 薄膜太阳电池用槽加工工具及其角度限制结构

Country Status (6)

Country Link
US (1) US20110167978A1 (https=)
EP (1) EP2343172A1 (https=)
JP (1) JP2011142236A (https=)
KR (1) KR20110081761A (https=)
CN (1) CN102130216A (https=)
TW (1) TW201128797A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103029156A (zh) * 2011-09-28 2013-04-10 三星钻石工业股份有限公司 基板的槽加工装置
CN103029155A (zh) * 2011-09-28 2013-04-10 三星钻石工业股份有限公司 基板的槽加工工具
CN104078529A (zh) * 2013-03-26 2014-10-01 三星钻石工业股份有限公司 沟槽加工工具、及使用其的沟槽加工装置
CN105322053A (zh) * 2014-05-29 2016-02-10 三星钻石工业股份有限公司 工具保持器及槽加工装置
TWI650876B (zh) * 2014-03-28 2019-02-11 日商三星鑽石工業股份有限公司 溝槽加工工具及安裝有該溝槽加工工具之刻劃裝置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103600371A (zh) * 2013-12-02 2014-02-26 吴中区甪直渡岘工艺品厂 一种角度可调模版夹具
JP6582743B2 (ja) * 2015-08-27 2019-10-02 三星ダイヤモンド工業株式会社 切断ツールおよび刃物
CN107053316A (zh) * 2017-06-22 2017-08-18 浙江美力凯光电科技有限公司 一种安全型自动裁切机
CN109545902B (zh) * 2018-12-10 2024-07-30 蚌埠凯盛工程技术有限公司 一种太阳能薄膜电池基板的识别装置
US12495804B2 (en) * 2024-02-27 2025-12-16 Hundred Machinery Enterprise Co., Ltd. Cutting, forming, and adjusting device for food processing machine
CN119188876B (zh) * 2024-11-27 2025-02-28 泉州市多乐油脂科技有限公司 一种人造奶油加工用分切设备及其分切方法

Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2000315809A (ja) * 1999-03-04 2000-11-14 Matsushita Electric Ind Co Ltd 集積型薄膜太陽電池の製造方法およびパターニング装置
US20090039061A1 (en) * 2005-02-02 2009-02-12 Mitsuboshi Diamond Industrial., Ltd. Fine processing method for a material of sintered diamond with a laser beam, a cutter wheel for a substrate made of a brittle material and its producing method thereof

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US1179753A (en) * 1916-01-19 1916-04-18 Harry Percival Parrock Tool.
US2431566A (en) * 1945-05-23 1947-11-25 John F Kopczynski Die
US4732069A (en) * 1987-05-08 1988-03-22 Gerber Scientific Products, Inc. Knife and knife holder assembly
US5046389A (en) * 1989-12-06 1991-09-10 Micron Technology, Inc. Universal punch block apparatus
JPH0680509U (ja) * 1993-04-26 1994-11-15 大昭和精機株式会社 サイドロック式工具チャック
JPH10328922A (ja) * 1997-06-02 1998-12-15 Canon Inc 細溝加工方法及び装置及び細溝加工用切刃及び切刃保持装置
JP2002033498A (ja) 2000-07-17 2002-01-31 Matsushita Electric Ind Co Ltd 集積型薄膜太陽電池の製造方法およびパターニング装置
JP2004306209A (ja) * 2003-04-08 2004-11-04 Mst Corporation 旋削工具ホルダ
US9132567B2 (en) * 2007-03-23 2015-09-15 Dayton Progress Corporation Tools with a thermo-mechanically modified working region and methods of forming such tools
JP5114115B2 (ja) * 2007-07-03 2013-01-09 株式会社ディスコ バイトユニット
CN201168796Y (zh) * 2008-02-04 2008-12-24 映钒企业有限公司 组合式车刀结构
WO2009145058A1 (ja) * 2008-05-26 2009-12-03 三星ダイヤモンド工業株式会社 薄膜太陽電池のスクライブ装置
JP2010002498A (ja) 2008-06-18 2010-01-07 Sony Corp パネルおよび駆動制御方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000315809A (ja) * 1999-03-04 2000-11-14 Matsushita Electric Ind Co Ltd 集積型薄膜太陽電池の製造方法およびパターニング装置
US20090039061A1 (en) * 2005-02-02 2009-02-12 Mitsuboshi Diamond Industrial., Ltd. Fine processing method for a material of sintered diamond with a laser beam, a cutter wheel for a substrate made of a brittle material and its producing method thereof

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103029156A (zh) * 2011-09-28 2013-04-10 三星钻石工业股份有限公司 基板的槽加工装置
CN103029155A (zh) * 2011-09-28 2013-04-10 三星钻石工业股份有限公司 基板的槽加工工具
CN103029155B (zh) * 2011-09-28 2015-05-20 三星钻石工业股份有限公司 基板的槽加工工具
CN103029156B (zh) * 2011-09-28 2016-04-06 三星钻石工业股份有限公司 基板的槽加工装置
CN104078529A (zh) * 2013-03-26 2014-10-01 三星钻石工业股份有限公司 沟槽加工工具、及使用其的沟槽加工装置
TWI576322B (zh) * 2013-03-26 2017-04-01 三星鑽石工業股份有限公司 Trench processing tools, and the use of its trench processing device
CN104078529B (zh) * 2013-03-26 2017-04-12 三星钻石工业股份有限公司 沟槽加工工具、及使用其的沟槽加工装置
TWI650876B (zh) * 2014-03-28 2019-02-11 日商三星鑽石工業股份有限公司 溝槽加工工具及安裝有該溝槽加工工具之刻劃裝置
CN105322053A (zh) * 2014-05-29 2016-02-10 三星钻石工业股份有限公司 工具保持器及槽加工装置
CN105322053B (zh) * 2014-05-29 2017-11-14 三星钻石工业股份有限公司 工具保持器及槽加工装置

Also Published As

Publication number Publication date
JP2011142236A (ja) 2011-07-21
TW201128797A (en) 2011-08-16
KR20110081761A (ko) 2011-07-14
US20110167978A1 (en) 2011-07-14
EP2343172A1 (en) 2011-07-13

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Application publication date: 20110720