CN102113130A - Photovoltaic modules manufactured using monolithic module assembly techniques - Google Patents

Photovoltaic modules manufactured using monolithic module assembly techniques Download PDF

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Publication number
CN102113130A
CN102113130A CN2009801159421A CN200980115942A CN102113130A CN 102113130 A CN102113130 A CN 102113130A CN 2009801159421 A CN2009801159421 A CN 2009801159421A CN 200980115942 A CN200980115942 A CN 200980115942A CN 102113130 A CN102113130 A CN 102113130A
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Prior art keywords
thin slice
photovoltaic module
body thin
sprayed coating
metal sprayed
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D·H·米金
J·M·吉
S·邵希玛斯
B·墨菲
J·特勒
A·M·米切尔
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
    • H01L31/0201—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising specially adapted module bus-bar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
    • H01L31/02013—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising output lead wires elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/049—Protective back sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Photovoltaic Devices (AREA)

Abstract

Provided are photovoltaic modules comprising back-contact solar cells manufactured using monolithic module assembly techniques comprising a flexible circuit comprising a back sheet and a patterned metallization. The module may comprise busses in electrical contact with the patterned metallization to extract the current. The module may alternatively comprise multilevel metallizations, lnterlayer dielectric comprising islands or dots relieves stresses due to thermal mismatch. The use of multiple cord plates enables flexible circuit layouts, thus optimizing the module. The modules preferably comprise a thermoplastic encapsulant and/or hybrid adhesive/solder materials. An ultrathin moisture barrier enables roll-to-roll processing.

Description

The photovoltaic module of using single stone module combinations technology to make
Alternately with reference to related application
The name that the application's case advocates to apply on April 29th, 2008 is called the U.S. Provisional Patent Application case sequence number the 61/048th of " Photovoltaic Modulesusing Monolithic Module Assembly ", No. 898 case is 61/093 with the U.S. Provisional Patent Application case sequence number that the name that applies on September 2nd, 2008 is called " Photovoltaic Modulesusing Monolithic Module Assembly Techniques ", the application rights and interests of No. 673 cases, and its etc. description incorporate this literary composition at this in the reference mode.
Background of invention
Invention field (technical field):
The present invention comprises the method for using single stone module combinations configuration and method to make solar module.
Description of Related Art
Notice that following discussion relates to some publications by author and Publication Year, and because the recent publication date, some publication can not be considered to respect to prior art of the present invention.In this discussion to these publications is for more complete background being provided, admitting that these publications are Prior Art and be not to be read as, to use as the purpose of judging patentability.
Silicon crystal photovoltaic solar cell is to be electrically connected to a circuit to produce the acceptable voltage of systematic function.This solar cell circuit provides other household function, for example limits the by-pass diode of its inner heating when the solar cell in this circuit is in shady place.This photovoltaic module this solar cell package in a package to carry out environmental protection.Typically, this photovoltaic module use a glass capping, polymer, and a back of the body thin slice encapsulate this solar cell circuit.Typically, this canned program is to carry out with a lamination step, and this lamination step is in a vacuum pressure and temperature to be applied on this glass/polymer/battery/polymer/back of the body lamella aggregated(particle) structure.For convenience, the mechanical strength of handling, the position that reaches this photovoltaic module of installation, this photovoltaic module generally includes the framework round this packed battery combination.Typically, this photovoltaic module also comprises one " connecting box ", is electrically connected other assembly of this complete photovoltaic system (" cable ") at this.
Typical photovoltaic module manufacturing sequence be combination, this hierarchical structure (glass, polymer, solar cell circuit, polymer, back of the body thin slice) of this solar cell circuit combination, reach the lamination of this hierarchical structure.Last step comprises installs this module frame and connecting box, and tests this module.Typically, the manufacturing of this solar cell circuit is to use automation tools (serial connection machine " stringer/tabbers ") with the smooth band line of copper (Cu) and described these solar cells electrically connect (" interconnection ").The solar cell of several series connection is to be electrically connected to form this circuit with wide Cu band (" bus ") then.These buses are brought the several points of circuit from this circuit into this connecting box, connect to offer this by-pass diode and to offer described these cables.Current main solar cell has the contact on opposing face.
The restriction of this technology is as follows:
● be difficult to automation owing to be electrically connected the technology of the solar cell of series connection, so the disposal ability of stringer/tabbers is limited and cost an arm and a leg.
● before this lamination step described these the combined solar battery circuit be quite fragile.
● this Cu band interconnection body must be narrow avoiding reflecting too many light, and can not be too thick otherwise it become too hard and applied pressure for this battery.Final result is the conductibility that limits this Cu interconnection body, and huge interconnection cognition causes power consumption.
● above restriction makes this technology be difficult to use thin silicon crystal solar cell.Use thin silicon can reduce the cost of this solar cell.
● the stress that this Cu interconnect lines causes must be enough eliminated in the space greatly between solar cell, and therefore the space that is not used between solar cell has reduced this module efficiency.
● this technology comprises a lot of steps, has therefore increased manufacturing cost.
Back contact solar cell has negative polarity contact and positive polarity contact on this back of the body surface.On identical faces, has the electrical interconnects that described these solar cells have been simplified in two kinds of polarity contacts.New assembled scheme and new modular design are achieved.In these the 5th, 951, No. 786 cases and the 5th, 972 of U.S. Patent number of incorporating in the reference mode, disclosed in No. 732 cases " single stone module combinations ", or " MMA ", it relates to the combination of carrying out this solar cell electric circuit and this lamination in identical step.Typical single stone module combinations starts from a back of the body thin slice of the electrical conductor layer with a patterning.In printed circuit board (PCB) and flexible circuit industry, it is known producing such patterning conductor layer on soft large-area substrates.This back of the body contact battery be one pick by using-place tool is placed on this back of the body thin slice.These instruments are known and have high production capacity and very accurate.During this lamination step, described these solar cells are connected on described these patterned conductor on this back of the body thin slice; This lamination package and circuit are produced with single simple automation step then.This back of the body thin slice comprises as form the scolder of this electric connection or the material of conductibility binder (being electrically connected material) during this laminating temperature-pressures cycle.This back of the body thin slice and/or battery can select to comprise an electrical insulation layer in addition, to stop the electric conductor on this back of the body thin slice and form short circuit between the electric conductor on this solar cell.One polymeric layer can be arranged between back of the body thin slice and this solar cell to encapsulate.This layer provides the low stress between this solar cell and this back of the body thin slice to bind.This encapsulated layer can provide open channel (openchannel), so that the realization that is electrically connected between described these solar cells and this conductor layer to be provided.
The advantage of single stone module combinations is as follows:
● the compound mode of one step has reduced step number and has reduced manufacturing cost.
● the plane geometry body easily is automated, and has reduced cost and improved the disposal ability of described these tools of production.
● can reduce or remove described these Cu buses, reducing module size, and then reduce cost and raise the efficiency at described these module ends.
● because this solid only is subject to this patterning techniques, so the easily quantity of described these contacts of optimization and position.These are different with stringer/tabbers, and wherein extra Cu interconnection band or contact have increased cost.Final result is to use more easily geometry kenel of this battery of optimization and interconnection body of single stone module combinations, with the performance of raising battery and module and reduce cost.
● it is following more smooth that this geometry kenel and present technology are compared, and introduces less stress by this.Therefore, can more easily use thin silicon solar cell.
● this circuit on this back of the body thin slice can cover almost whole surface.The conductibility of this electrical interconnects body can be therefore and very big, and body is wideer because this interconnects.Simultaneously, the conductor of this broad can be made thinner (usually less than 100 μ m) and still have lower resistance.Conductor that should be thin has more soft usually than Cu band interconnection body, reduced stress by this.
● can make the space between solar cell littler, because need not to keep this space to eliminate the stress of this thick Cu interconnection body.This improved the efficient of this module and reduced the material cost of this module (because this does not use the minimizing in zone, and the less glass of demand, polymer, and back of the body thin slice).
In the 19th European PV Solar Energy Meeting of Paris, FRA (2004), P.C.deJong, described use conductibility binder in " Single-step Laminated Full-size PV Modules Made with Back-contactedmc-Si Cells and Conductive Adhesives " literary composition and used single stone of the 36-battery module of the 156 * 156-mm battery in one 4 * 9 arrays to make up, incorporated this literary composition in the reference mode at this.This electric circuit on this back of the body thin slice is brought into a single point, can use single connecting box by this.
The invention describes and be used on big photovoltaic module and have single stone module combinations scheme of low manufacturing cost.Bigger module gets consumer reception, and has lower production cost.
Summary of the invention
The present invention is a photovoltaic module, and it comprises a plurality of back contact solar cells; One soft back of the body thin slice; Pattern metal sprayed coating on this back of the body thin slice; Be arranged on the insulating material between this pattern metal sprayed coating and described these solar cells; This insulating material suffers patterning so that forms between the splutting of this patterning and described these solar cells in desired locations electrically contacting; Reach a plurality of buses that electrically contact with this pattern metal sprayed coating.Preferably, this module further is included in the moisture barrier on this back of the body thin slice, and this moisture barrier is enough thin to cause this back of the body thin slice can carry out type continuously rolled (roll-to-roll) technology that combines with this pattern metal sprayed coating and this moisture barrier.Preferably, insulating material comprises an interlayer dielectric (ILD), preferable island district or the spot of comprising of interlayer dielectric.Preferably, at least a portion of this interlayer dielectric has met with modifying to change its outward appearance.Preferably, photovoltaic module more comprises an encapsulation, the preferable thermoplastic that comprises of this encapsulation.The preferable yarn matter layer (scrim layer) that comprises of this encapsulation, this yarn matter layer is arranged between described these solar cells and this pattern metal sprayed coating.This insulating material selectivity comprises this encapsulation.Before this module of combination, this encapsulation is that selectivity and this back of the body thin slice are integrated, and it is laminated together that selectivity uses type continuously rolled technology.Limited electrically contact preferablely provide by a material that comprises a polymer substrate and a plurality of conductive particle.Preferable one or more opening that comprises of back of the body thin slice, described these buses pass described or described these openings and extend.At least a portion of this one or more bus is preferable adjusted the band integration with one before this module of combination.
The present invention also discloses a kind of photovoltaic module, and it comprises a plurality of back contact solar cells; One first insulation back of the body thin slice; One first pattern metal sprayed coating contacts one first of this first insulation back of the body thin slice; One second pattern metal sprayed coating contacts one second of this first insulation back of the body thin slice; One insulating material is arranged between this first pattern metal sprayed coating and described these solar cells, and this insulating material is electrically contacted to form between this first pattern metal sprayed coating and described these solar cells in desired locations by patterning; Reach one second back of the body thin slice, contact this second pattern metal sprayed coating.Preferably, this second back of the body thin slice comprises a plurality of openings, and its grade is used to make this second pattern metal sprayed coating to electrically contact from the outside to this second back of the body thin slice formation.Preferably, the part of the part of this first pattern metal sprayed coating and this second pattern metal sprayed coating comprises the zones of different of a paper tinsel that coats around edge of this first insulation back of the body thin slice.Preferably, the part of this first pattern metal sprayed coating is to be connected via at least one opening in this first insulation back of the body thin slice with the part of this second pattern metal sprayed coating.This photovoltaic module selectivity further comprises the by-pass diode of a plurality of flat packages.Preferably, this photovoltaic module more is included in the moisture barrier of this second back of the body on thin slice, and this moisture barrier enough approaches to cause this back of the body thin slice can carry out type continuously rolled technology in conjunction with this second pattern metal sprayed coating and this moisture barrier.This insulating material preferably comprises an interlayer dielectric (ILD), its preferable island district or spot of comprising.At least a portion of this interlayer dielectric has suffered selective modification to change its outward appearance.Preferably, this photovoltaic module more comprises an encapsulation, its preferable thermoplastic that comprises.Preferably, this encapsulation comprises a yarn matter layer, and this yarn matter layer is arranged between described these solar cells and this pattern metal sprayed coating.This insulating material selectivity comprises this encapsulation.Before this module of combination, at least one integration of this encapsulation selectivity and described these back of the body thin slices, selectivity uses type continuously rolled technology to come lamination.Electrically contacting that this is limited is that selectivity is provided by a material that comprises a polymer substrate and a plurality of conductive particle.
The present invention also discloses a kind of photovoltaic module, and it comprises a plurality of back contact solar cells; One soft back of the body thin slice; The splutting of the patterning on this back of the body thin slice; And a plurality of island districts that comprise the ILD material, it is arranged between this pattern metal sprayed coating and described these solar cells.Preferably, this photovoltaic module more comprises a plurality of annuluses, described these annuluses comprise this ILD material, and each annulus centers on described these solar cells and this pattern metal sprayed coating, and comprise the conductive of material of described these solar cells of electrical connection and this pattern metal sprayed coating.This conductive of material selectivity comprises a polymer substrate and a plurality of conductive particle.The present invention also discloses a kind of back of the body thin slice combination that is used for a photovoltaic module, and this back of the body thin slice combination comprises a soft back of the body thin slice; One pattern metal sprayed coating; And a moisture barrier, this moisture barrier is enough thin to cause this back of the body thin slice to carry out type continuously rolled technology with this moisture barrier with this second pattern metal sprayed coating.Preferably, this moisture barrier has the thickness less than about 25 μ m, more preferably, has the thickness less than about 15 μ m, the better thickness that has less than about 10 μ m, and even better thickness with about 9 μ m.This back of the body thin slice makes up a preferable ILD or the encapsulation that is laminated to this soft back of the body thin slice or this pattern metal sprayed coating that more comprise.
The present invention also discloses a kind of photovoltaic module, comprises a plurality of back contact solar cells; One soft back of the body thin slice; Form a pattern metal sprayed coating of a plurality of circuit on this back of the body thin slice, each circuit is connected to a subclass of described these solar cells, and at least one of wherein said these circuit comprises a nonlinear circuit path; And a plurality of line plates (cord plate), in its a plurality of positions on this module, each line plate is to comprise one or more by-pass diode electrically to be used to shunt one or more described these circuit.Described these solar cell selectives comprise metallurgical grade silicon or the low-resistance silicon through upgrading.Each by-pass diode is shunted less than 20 solar cells, and better for 16 solar cells, and better for 11 solar cells, and better for 7 solar cells.
Target of the present invention, advantage, with the feature of novelty, and wider application will in the following detailed description, combine described these accompanying drawings and partly mention, and, have in this skill and know that usually the knowledgeable will partly know or can be learnt by practice of the present invention based on following illustration.Target of the present invention and advantage can and make up by the instrument of specifically being pointed out in the additional claim in this back and realize and obtain.
Description of drawings
Target of the present invention, advantage, with the feature of novelty, and wider application will in the following detailed description, combine described these accompanying drawings and partly mention, and, have in this skill and know that usually the knowledgeable will partly know or can be learnt by practice of the present invention based on following illustration.Target of the present invention and advantage can and make up by the instrument of specifically being pointed out in the additional claim in this back and realize and obtain.
Figure 1A is the plane graph of an embodiment that comprises the MMA module of the present invention of a total line;
Figure 1B is the sectional view of the embodiment of Figure 1A;
Fig. 1 C and Fig. 1 D are the embodiment with the Figure 1A that adds details;
Fig. 2 is the decomposition view of embodiment of the MMA module of Fig. 1;
Fig. 3 is the partial view of embodiment of the MMA module of Fig. 1;
Fig. 4 is the sectional view of one first multiple layer metal sprayed coating embodiment of the present invention;
Fig. 5 is a sectional view, and the one second multiple layer metal sprayed coating embodiment of the present invention that comprises a bilateral flexible circuit is described;
Fig. 6 and Fig. 7 are two alternate embodiments, have shown the possible interconnection topology of MMA module;
Fig. 8 A is a prior art module that comprises a single connecting box;
Fig. 8 B has shown a module that comprises a plurality of line plates, and each line plate comprises a bypass diode, is distributed on this module;
Fig. 9 shows the flat package diode that is used for multiple layer metal sprayed coating embodiment of the present invention;
Figure 10 has shown a back of the body thin slice that is covered by a pattern metal sprayed coating;
Figure 11 has shown this splutting back of the body thin slice that uses an interlayer dielectric (ILD) Figure 10 that thin slice covered that comprises through hole;
Figure 12 is the sectional view of Figure 11 or Figure 13; And
Figure 13 has shown the ILD point or the island district of placing on this splutting back of the body thin slice of Figure 10.
Embodiment
The Cu bus is integrated on single stone ground
As employed in this specification and claim, this term " bus " means a total line, total tape, bus band or is suitable for any other conductibility assembly that electric current confluxes.
In the photovoltaic module of using known battery, described these solar cell serials (string) end at the top and bottom of this module of using copper (Cu) bus band.These Cu bus bands are coated with tin or tin/silver usually and prevent and the influencing each other and improve solderability of this encapsulation.Electric current need be transmitted a very long distance (growing to half of width of this photovoltaic module) and arrive this connecting box in these module central authorities.This Cu bus band needs a very big cross-sectional area to have enough low resistances, electric current is transmitted a distance of such length with humble resistance loss.
In Figure 1A-1D in shown single stone module combinations, preferably, use the thin metallized metal sprayed coating of opposite polarity or paper tinsel 12,18 (preferably comprising copper) and with its patterning to form a circuit that is positioned on this back of the body thin slice 10, described these solar cells interconnect.Preferably, battery 20 sees through the paper tinsel 12,18 that extends through the conductibility binder 24 of the through hole 25 in interlayer dielectric (ILD) 26 and be electrically connected to patterning.This ILD provides between described these solar cells and described these metal formings and has been electrically insulated.Preferably, this module is encapsulated in the encapsulation 28.Described these profiles 22 of icon solar cell 20, the also first polarity grid line (or splutting) 30 of icon on described these back sides of described these solar cells and the position of opposite polarity grid line (or splutting) 31.
Resistance loss in described these pattern metal sprayed coatings is normally high to be accepted to being difficult to, unless use according to need a quite wide foil conductor with this electric current through this length apart from carrying to a connecting box.For fear of the demand to large tracts of land paper tinsel or other metal, total tape or bus band 14 be preferable to be covered on the narrow strips band of metal forming 16, to obtain the floor space that required cross-sectional area reduces this interconnection simultaneously.Preferably, use this cross-sectional area that has increased to be minimized in power consumption on this bus, be minimized in loss in the module efficiency and see through the floor space that minimizes this bus.This total tape also sees through the opening on this back of the body thin slice and provides easily the mode of described these battery serial gluings to this connecting box.
Fig. 2 has shown the whole module package with a copper total line of integrating.In this embodiment, have one or more openings 32 on this back of the body thin slice 34 (comprising the splutting of patterning), on this back of the body thin slice, this connecting box of gluing is come in the outside that total tape 36 is brought to this module layer pressing plate.Described these Cu buses can be combined on this back of the body thin slice in advance, or see through that a take-put type robot inserts and see through conductibility binder 38 and be adhered to this metallization and carry on the back thin slice during this list stone module combinations.Preferably, photovoltaic cell 20 is to see through the mode that picks and place to be provided with, and is attached in this pattern metal sprayed coating through conductibility binder 40.
Be purpose attractive in appearance, many PV module makers are selected to place one and are adjusted band (trim strip) ' or on this band bus, cover a shielding layer and hide inaesthetic pad or band.Typically, adjust band and comprise coloured PET or other inert polymer or textile.Adjustment can be on this Cu bus in being placed on the MMA combination with 37.Described these Cu buses selectively are trimmed to appropriate length and are attached on the band with as fully integrated sub-portfolio.This band can use a compatible binder or see through a thermosetting technology and come attached.With respect to the combinations of seven (it is perhaps more to look module size) indivedual total tapes, this sub-portfolio is reduced to a simple loading or unloading operation of two sub-portfolios-reduce number of packages by this and make up complexity with this bus portion of this MMA technology.A combination like this can be regarded as an assembly and order to various suppliers.In addition, install on this sub-portfolio in addition by-pass diode or various IC or circuit that have superiority are realized following function, for example: shade protection, module difficulty Pai Xie ﹠amp; Supervision, RFID tracking etc.This adjustment produces complete circuit with this back of the body leaf insulator with self having with the similar conductibility circuit of this MMA back of the body thin slice.Selectively, this ILD can comprise material to change its physical appearance, such as color, to change the outward appearance of this module.This coloured ILD only need be printed on from this visible zone, module front.This a example is to be presented among Fig. 1 C, and wherein coloured ILD 41 formation one center on described these solar cells, reach " pattern frame " of the total tape of selectivity, so that a more pleasing outward appearance to be provided.
Preferably, should (etc.) total line or total line suffer lamination during being combined in this module combinations.Fig. 3 has shown a plane graph of this module architectures, has excised some layers for clearly observing this framework.Wherein, the marginal position 42 that has shown described these bus bands.
The multiple layer metal sprayed coating
See through the use of the multiple layer metal sprayed coating on this back of the body thin slice as shown in FIG. 4, can under the situation of no total line, finish the function of this bus, therefore also just needn't increase area.The multiple layer metal sprayed coating refers to the metallic conductor that is electrically insulated more than two-layer or two-layer that body separated by.Described these levels see through the conductibility through hole mutual gluing on each aspect in this is electrically insulated body.The multiple layer metal sprayed coating allows one deck contact battery and electric current is sent to solar cell adjacent in this circuit, and this second layer can be in order to be sent to electric current this connecting box or other function is provided.Therefore, do not need additionally to be used for the area of bus.In this embodiment, individual layer conductive foil 44 is around described these ends of inner back of the body thin slice 46, forms a multiple layer metal sprayed coating by this, and preferably sees through the opening of carrying on the back in thin slice 50 in this outside 48 and conduct electrical currents to this connecting box.Paper tinsel 44 sees through the conductive of material 54 in the opening that is placed on ILD (and/or encapsulation) 56 and electrically contacts with solar cell 52.
Can consider several technologies that are used to produce this multiple layer metal sprayed coating of this patterned conductor on this back of the body thin slice.In one embodiment, this first conductor, insulator, and second conductor on this substrate, suffer the shop to apply and suffer patterning subsequently.Extra conductor and insulator layer can be set up in an identical manner.Lamination that this shop is applied can see through deposition, see through metal forming and thin dielectric film or the mode that sees through other are carried out.In this embodiment, this substrate as this conductor and insulator layer can comprise the material that is suitable as back of the body thin slice use outside this photovoltaic module.
In one second embodiment, described these conductor layers are spread to be applied on the opposing face of a substrate.These structures are referred to as " double-surface flexible circuit ".This substrate can comprise on this substrate and be used to be connected electrically in the conductibility through hole of described these conductors on the opposing face.Because the thin-skinned property of a pair of circuit all has electrical conductor on the two sides, an extra encapsulation and back of the body thin slice must be laminated on and provide this solar cell circuit required environmental protection on this flexible circuit.Fig. 5 has illustrated a cross section state of the thin-skinned property of a pair of circuit of a photovoltaic module.First metal foil layer 60,61 see through the opening of externally carrying on the back on the thin slice 62 64 extend with form one with the outside connection interface of gluing mutually.Preferably, paper tinsel layer the 60, the 61st, opposite polarity.The opening that first metal foil layer 60,61 sees through at least in part in this built-in electrical insulation back of the body thin slice 66 extends, to see through gluing thing 68,69 gluing to the second metal formings 70,71 respectively.Second metal forming 70,71 sees through through hole 72,73 gluings in ILD74 respectively to described these solar cell (not shown)s.
Snakelike cell arrangements
This circuit layout on this back of the body thin slice can have elasticity very much, because it only is subject to this patterning techniques.These are different with the known photovoltaic module with Cu band interconnection body, and wherein owing to this smooth Cu band interconnection body, described these batteries must be in a straight line.This circuit layout in this list stone back of the body thin slice can be designed so that electrically described these batteries of series connection are out-of-line; That is, this circuit can be done the right angle bending.Therefore these circuit are nonlinear.The latter can allow the nonlinear geometry layout of this solar cell circuit, and the two ends of this module do not need bus, and this has increased the efficient of module and has reduced cost.The design that comprises 60 solar cells 78 in the array of two kind of 6 row 10 row has been described among Fig. 6 and Fig. 7, and wherein, interconnection or the electric current path 76 of flowing through is to show with thick black line.These designs comprise a plurality of serials (string) that end at a middle position, and for example, connecting box opening 80 only needs single connecting box by this.At last, this design sees through a better simply connecting box and cable arrangements and has reduced the cost of this module.In addition, see through in the following maintenance of this battery and connect and be connected in parallel, can reduce encapsulation, glass, framework, reach the required material of back of the body thin slice.
A plurality of connecting boxes and line plate
One general scheme is to place this connecting box to the top of this module and central authorities.As mentioned above, this modes of emplacement needs the high conductance bus that electric current is sent to this connecting box.The placement of this connecting box and the description of interconnection are with respect to using Cu band bus.In this scheme, preferably, a typical copper total tape (for example in order to the known solar cell that interconnects) is connected to this metal forming at the top and bottom of this list stone back of the body thin slice of this module.For this band is passed to this connecting box, preferably, this back of the body thin slice cut removes material and the rear portion of an opening to this connecting box is provided.Utilizing slit will also be feasible with bringing this connecting box into through this back of the body thin slice.
As shown in Fig. 8 A, when only having single connecting box 82 to be used for a module, this connecting box needs relatively large next ccontaining a plurality of by-pass diodes 84 (each battery strings is exercised with a by-pass diode) and this two cables gluing body 86.As shown in Fig. 8 B, selectively use several less " connecting boxes " to replace and use single huge connecting box.Each such connecting box 87 can be less, because its preferably only ccontaining single by-pass diode 88 and selectively ccontaining single cable gluing body 89.Preferably, described these less connecting boxes are arranged near or the solar cell circuit end in position of this by-pass diode of this circuit, and the length that therefore electric current is imported described these buses of described these less connecting boxes shortens significantly.Described these a plurality of connecting boxes need this back of the body thin slice on take described these electric leads out of than multiple punching.Little connecting box like this is called as " line plate (cord plate) " sometimes, because they have the planar shape profile with a cable.One easily form be that this a plurality of line plates are provided in a single injection mould shell, handle less parts at this Assemble Duration by this.
The use of a plurality of line plates has several advantages for single stone module combinations.These a plurality of line plate schemes have reduced the length of internal bus, and this is to single stone module combinations advantageous particularly, because it can reduce even eliminate the demand to extra internal bus.As mentioned above, the geometry of this circuit layout can have more variability with the use of a plurality of line plates.The a plurality of perforation of formation are electrically connected to this solar cell circuit on the thin slice although described these line plates need be carried on the back at this, and described these line plates itself are lower than the price of a huge connecting box usually.
For the combination of a single stone back of the body thin slice and a plurality of line plates, preferably, will be exposed to this installation site at this this conductor (for example paper tinsel) layer of carrying on the back in the thin slice.One typical 60-battery module is combined in one 6 * 10 (6 row, 10 row) array and is had 3 by-pass diodes.For this design, preferably, the line plate is installed on three different positions of top of top row battery, as shown in Fig. 8 B.Preferably, a bypass diode is included in each line plate.Described these line plates of institute's gluing are also at two ends of this solar cell circuit on the opposite edges of this module.Except that this diode, these line plates also will by gluing to the positive polarity conductor and the corresponding cable of this negative polarity conductor of this module.For the battery of one 6 * 10 arrays, typically use three boxes (left, center, right), preferably, each comprises at least one by-pass diode.
Described these line plates that can use a large amount of or different how much configurations are regulating the different circuit layouts of described these solar cells, or the by-pass diode of varying number.For example, this solar cell circuit can use a non-linear snakelike layout, and wherein all serials end near the single point, as shown in FIG. 7.In this configuration, described these batteries suffer gluing in a serpentine pattern, and wherein, preferably, all serials end among this module near the heart.Preferably, this line plate crosses and reaches three batteries with all serials of access.In this connecting box, will make serial interlinkage and be interconnected in diode between each serial end.Do not need extra total tape in this configuration, this back of the body thin slice will not need to incorporate specific confluxing to the bus run of its centre into, and preferably increase module efficiency.
Alternatively design snakelike circuit joint line plate is terminated on a plurality of points.In this embodiment, snakelike circuit can comprise extra by-pass diode.Known module has the solar cell of long linear serial on the length direction across this module.Generally speaking, unique convenient position of inserting by-pass diode is the end in this module, the feasible a large amount of battery of series connection in each by-pass diode usually, for example for a typical module (settling 10 batteries in 6 serials separately) with 60 batteries, each by-pass diode has 20 batteries.Solar cell must have a reverse breakdown voltage greater than the voltage summation in the serial, and if a battery in this serial is covered (shaded), will lose the output of whole piece serial probably.In this embodiment of the present invention, snakelike circuit can have quite short serial by comprising the line plate across the by-pass diode of each serial in a plurality of zones on this module, making (that is, less battery) in each by-pass diode.For example, optionally design this circuit, make and use a bypass diode across per 6 batteries.This measure can cause the low-cost low-resistance silicon (for example, the metallurgical grade silicon through upgrading) of the low reverse breakdown voltage of solar cell energy using tendency to be made.In addition, when single battery is covered, can improve the production of energy owing to lose less power; Only lose the power of shorter serial.Preferably, have at each by-pass diode to be less than 20 solar cells, and better each by-pass diode has less than 16 solar cells, and better each by-pass diode has less than 7 solar cells.
Flat package diode is integrated
One typical photovoltaic module is through which floor different material of storehouse to reach in a laminating technology they to be sealed.One typical photovoltaic module lamination shop is applied and is started from a glass flake.On this glass flake, placed an ethylene vinyl acetate (EVA) thin slice.EVA is a kind of transparent polymer of soft thermosetting.Except EVA, also can use the material of other kind to encapsulate as this.At the top of this EVA, placed a series of battery serial.In general, each serial is made up of a series of solar cell of in series interconnection.In case described these batteries are placed on this EVA, with described these beginnings and the end cell of bus lappet (tabbing) gluing to each serial, wherein described these independent serials of each serial interlinkage.This bus gluing mode generally is by individual other metal tape institute construction, typically comprises by tin or copper that tin/silver covered.After this interconnection action is finished, another EVA thin layer suffer the shop apply described these above serial and extend to this glass edge.At last, spread above the EVA at this and to apply a backing material thin slice, extend to equally or exceed this glass scope.During the lamination of this second layer EVA back of the body thin slice, will make through hole and take described these bands out of to be used for outside contact.
Typically, a module will be made up of several serials of series connection.One " bypass " diode is placed between each serial in parallel with the solar cell of this serial.The purpose of this diode is when this serial non-conducting (in the example at shade), allows to walk around this band from other the band and the electric current of this circuit external.These diodes normally are installed in the connecting box.Typically, these diodes are the casing devices that disperse, normally axial packet type.Typically, each serial is by single diode protection, and this diode enough greatly to conduct the whole electric currents in this serial, reaches can bear the whole voltages that produced by this serial solar cell under the state of reverse biased.
Diode with planar shape profile may directly be combined on this flexible circuit in single stone module combinations.In an embodiment shown in Figure 9, preferably, the diode 90 of flat package is to be used in order to protection to comprise on this flexible circuit of described these battery serials of metal forming 92.Preferably, use to have a plurality of flat package diode that the overall electric current capacity is equal to or greater than this belt current, this helps heat load is dispersed on the big zone.Described these flat package diodes can be placed on the back of the body thin slice 94 during this list stone module combinations technology and be combined in this module.Perhaps, described these diodes can be the bare semiconductor crystal grain that is attached to this flexible circuit in the mode that is similar to described these solar cells in the MMA combination.Perhaps, as previously mentioned, described these flat package diodes can be and are incorporated on the sub-portfolio that comprises described these total tapes.
Being electrically insulated of this flexible circuit and solar cell
This circuit of this rear surface and described these conductors on this solar cell must be electrically insulated to prevent short circuit.Typically, this encapsulation between this battery and this back of the body thin slice circuit has enough dielectric strengths and realizes this function.Yet its thickness may be very inhomogeneous, because this vacuum/pressurized lamination step can produce very thin zone.In addition, the placement deposited or this solar cell of the shop of this electrical attach material may inaccuracy.Using electrical insulation layer on this flexible circuit or on this solar cell, bigger tolerance to be provided and to have reduced the possibility of aforesaid electric short circuit.
Typically, use this MMA back of the body thin slice of technology construction of being developed by the flexible circuit industry.One metal forming typically is Copper Foil, is gluing to a loading material.The most general loading material is Polyimide film (Kapton) and polyester.Use etching resistance agent that circuit is carried out patterning subsequently, described these etching resistance agent see through little shadow technology or directly see through wire mark and round patterning.Subsequently, typically, see through an etch process this unnecessary metal forming is removed.Final step in this technology is to use a welding enclosure or epiphragma that one protective layer shop is applied on this metal forming.The pattern that use to cover this metal is spread deposited, and this pattern covered, and to locate be that institute is desired and the zone of this Metal Contact.Selectively, can spread deposited these materials by wire mark.
Preferably, the present invention uses the MMA back of the body thin slice that comprises a copper metal forming, and this copper metal forming suffers gluing to thin insulating loading material and is to be patterned to allow the tandem interconnection of back contact solar cell.Preferably, this metal forming is covered by a material, and this material preferably is a polymeric material, and it prevents that as an insulator this battery from contacting in the position of not expected with this paper tinsel.This covering refers to this ILD or interlayer dielectric.Typically, this ILD applies and is patterned by wire mark shop, to locate to form through hole at described these battery gluings to this metal forming by this.
Typically, this ILD layer is printed to a continuous thin slice, except the open area of described these solar cells of needs contact, this ILD layer covers this metal forming fully and centers on loading material.These opening diameters are generally several millimeters and directly corresponding described these contacts on described these solar cells.
At Assemble Duration, the action of this I LD of encapsulation just can produce shear stress between this metal forming and ILD on this whole back of the body thin slice, and reason is not matching of its grade thermal coefficient of expansion (CTE).This does not match and then can cause at this ILD and lost efficacy along with the past of time with gluing between the metal forming and finally separate.When the module of using the construction of MMA back of the body thin slice is subjected to thermal cycle test (typically, the temperature of this module circulates) or damp and hot test when (typically, 85 ℃ and 85% relative humidity) between-40 ℃ and 85 ℃, promptly can expose this inefficacy mechanism rapidly.
Metal forming 102a, 102b, the 102c of Figure 10 explanation patterning on carrier thin film 104.Typically, this foils preferably comprises the polyester foil (for example, PET or Mylar) of one 100 to 250 μ m, though this paper tinsel can comprise any appropriate insulation body, but its be soft and gluing to this metal, such as Kapton or PVFE.This metal forming preferably comprises one 35 microns soft copper paper tinsels, yet can use any metal or alloy, selectively comprises a top finishing layer, such as silver, tin or organic welding protecting agent (Organic soldering preservative, OSP).Preferably, such top finishing layer extremely thin (typically, less than about 1000nm).
Figure 11 has illustrated to have a typical module that is printed on the continuous ILD thin slice 106 on this metal forming, and comprises via openings 108, the metal forming below said these batteries contacts.The appearance profile 110 of the metal forming below also having shown and the appearance profile 112 of described these solar cells are placed on going up of this ILD as them.
Figure 12 with a cross section formal specification should the combination.The metal forming 102 of patterning is placed on the carrier thin film 104.ILD114,115 is placed between metal forming 102 and the solar cell 116.Opening 118 in ILD has held conductibility binder 120, conductibility binder 120 with solar cell 116 electric gluings to metal forming 102.Therefore ILD114,115 is limited in described these opening 118 places with conductibility binder 120.In this embodiment shown in Figure 11, opening 118 is corresponding with through hole 108, and ILD114,115 comprises a continuous thin slice.
Therefore, if the surface area of minimizing and contacted this ILD of this metal forming, then described these shear stress between this ILD and metal also will reduce, and this ILD will be difficult for from this metal forming layering.For reducing the area of this continuous ILD layer, preferably, this ILD comprises discrete island district, has reduced the area with contacted each the discrete island district of this metal forming by this.What this patterning was claimed is dot matrix ILD layer.Figure 13 has illustrated and has been printed to a little on carrier thin film 104 and metal forming 102 or the ILD in island district 122.Preferably, this ILD is printed on the zone (gluing pad area 124) of described these EWT battery gluings to following metal forming, is similar to the through hole 108 in a continuous ILD thin slice.Therefore, preferably, described these ILD points are configured to around each gluing pad area (with Any shape), reserve enough dead zones and hold this conductibility binder and prevent that its diffusion is too far away and avoid making battery to form shunting.Therefore, this ILD is limited in this gluing pad opening part with this conductibility binder.According to this embodiment, in Figure 12, opening 118 is corresponding to gluing pad district 124, and ILD114,115 comprises spot or island district, and solar cell 116 is arranged on it.Preferably, the annulus that comprises ILD gets deeply stuck in the district around each gluing pad area setting to produce one, to limit during with this back of the body thin slice in conjunction with described these batteries in order to the diffusion of described these battery gluings to this conductibility binder of this metallic film.
Preferably, this bit patterns is designed to the top that the part at each edge of each solar cell at least always drops on the post of this ILD, and arrangement orientation that no matter should back of the body thin slice and rotation are why.Preferably, the off normal of this placement and rotation is defined in the situation that still has good position contacting between this EWT and this back of the body thin slice.Preferably, the area in the island district of each separation is 1mm at least 2Yet the size in this ILD island district can change because of needs on this back of the body thin slice.Preferably, the thickness of this ILD is similar in appearance to the thickness when being printed to a continuous film.This ILD material selectively comprises a soft tectal welding enclosure, and it can be by UV or hot curing.
In another embodiment, except that this flexible circuit, or replace this flexible circuit, this electrical insulation layer (ILD) can be placed on this battery.Can use wire mark or correlation technique to spread and apply this ILD, and can use the material that is used for flexible circuit that is similar to ILD.The advantage of this placement be print step on the less battery can be more accurate than the printing step on a bigger flexible circuit.In addition, it can only be positioned over the zone (for example, compared to the opposite polarity grid line of adjacent circuit layer) that need be electrically insulated, and it has avoided described these stress of being associated with this ILD on this wide back of the body thin slice.
In another embodiment that is electrically insulated is provided, can in this encapsulated layer, use a yarn material." yarn matter (scrim) " refers to a separating slices of glass fibre or associated materials.Usually this yarn matter is holey, and this encapsulating material can be flowed through this yarn matter and gluing to this battery and this back of the body thin slice by this.This yarn matter can be used as a separating layer or integrates in advance with this encapsulation.This yarn matter reduce in the skew of battery during the lamination and prevent to become during this is encapsulated in this vacuum/pressurized lamination too thin-prevent from by this to carry on the back electrical short circuit between the thin slice at this battery and this flexible circuit.
The thermoplasticity encapsulation
Typical photovoltaic module is to use a continuous laminated process to come construction.This technology starts from a glass flake, and it will become the front of this module.This glass is down towards a horizontal surface of an encapsulation thin slice, and typically, an EVA thin slice is placed on that this is on glass.On this EVA top, placed a series of battery serial and welded together at the interconnection body of the head and the tail of described these serials.Then another EVA thin slice being placed on described these batteries, then is a back of the body thin slice, is typically a Tedlar (Tedlar)/polyester (Polyester) paper tinsel, wherein faces described these batteries with polyester.Subsequently, whole package is placed in the neutralizing layer depressor with this package gluing together.
This MMA module combinations technology is very different.It starts from a back of the body thin slice, and this circuit or cell interconnect body have been incorporated on this back of the body thin slice and can be by maybe can't help an interlayer dielectric (ILD) covering; This combination is to integrate or MMA back of the body thin slice.Before described these batteries being placed on this integration back of the body thin slice, an encapsulation thin slice can be placed on this integration back of the body thin slice.This thin slice preferably comprises opening (being preferably by punch forming), and it sees through the shop at this and apply a conductive material (such as a conductibility binder), so that described these cell interconnects are carried on the back thin slice to this corresponding to described these through holes or gluing pad opening.Preferably, be to see through making of a masterplate to be used for this conductibility binder shop is applied to this back of the body thin slice.In case during the appropriate location of described these battery positions on this encapsulated layer, preferably, another encapsulated layer will be spread and apply on described these batteries, and at last cover glass shop is applied on this second package layer.Subsequently, typically, this whole package through be heated and pressure with described these layers gluing together.
Single stone module combinations need this electric connection material during this lamination step gluing to this flexible circuit and this solar cell.Time-the pressures cycle of this lamination step is mainly determined by the attribute of this encapsulation.This electric connection material most possibly be a conductibility binder or with the low melting point welding material of this typical case's laminating temperature compatibility.Be used for the thermosetting polymer that the most general encapsulation of photovoltaic module is made up of ethylene vinyl acetate (EVA).This EVA melts between this thermosetting stage of reaction and flows, and discharges various chemical substances and gas-these all can disturb the ability of this electric connection material gluing to this flexible circuit or solar cell during this curing reaction.Also very soft (the low elasticity coefficient) of this EVA so that most stress transfer to this electric connection material and gluing body-this can make the reliability of this photovoltaic module reduce.At last, EVA has weak relatively cohesive force for the glass in this photovoltaic module and other material.If this module is used a saturating wet back of the body thin slice, then can this cohesive force be reduced during damp and hot being exposed to.
In single stone module combinations, this conducting shell in this back of the body thin slice has covered should the surface most of and has been a splendid gas and a moisture barrier.In the conventional mass production only partly this EVA of thermosetting maximize the production capacity of this lamination step and minimize production cost.Consider based on reliability, when using airtight or do not wet package thoroughly, during this lamination step, need this EVA of full solidification.Problem is that partly solidified EVA will continue during use to solidify and produces gas, and if this back of the body thin slice be air-locked, then bubble can accumulate in this package.
Thermoplastic also is used as encapsulation such as ionomer, polyethylene butyraldehyde (PVB), Polyurethane, ethylene copolymer, polyethylene, organosilicon or similar material and uses in photovoltaic module.Compared to the thermosetting EVA encapsulation that the module of using single stone module combinations to be made up is more generally adopted, the thermoplasticity encapsulation provides following advantage.
● because using thermoplastic to carry out not having chemical reaction during the lamination, one thermoplasticity encapsulation will provide the environment of homogeneous more chemically, and during this lamination step, will more can not disturb the gluing of this electric connection material (such as a conductibility binder), it is unique for this MMA technology of the present invention.
● it is ageing that a thermoplastic polymer can have a wider processing, a laminating technology can be designed to by this more can with the demand compatibility of described these electrical attach material, and be not only and this encapsulation compatible.
● thermoplastic polymer can harder (higher elasticity coefficient), and the more stress in this package is to be present in this encapsulation by this, rather than in the electric connection of this key.
● the thermoplasticity encapsulation has splendid cohesive force to the glass in this photovoltaic lamination and other interface, the stress that this this key that has reduced transmission once more electrically connects, and the reliability of having promoted whole package.
● owing to do not have chemical reaction and product, the thermoplasticity encapsulation has better compatibility with back of the body thin slice airtight and that do not wet thoroughly.
● compared to EVA, thermoplasticity encapsulation is easier to integrate with this battery and/or back of the body thin slice simplifies combination.This thermoplastic can be repeated to bring to and be higher than fusing point and this material is lowered one's standard or status, and a thermosetting material can lose the ability of other material of gluing significantly after thermosetting reaction is finished.
In another embodiment, this encapsulation can be comprised on this MMA back of the body thin slice or with this MMA back of the body thin slice and integrate.See through the step of getting rid of patterning and this package layer of layout, promptly further simplified this MMA group technology.This encapsulated layer can be laminated to this back of the body thin slice by type continuously rolled technology (roll-to-roll processing).In another kind of embodiment, this encapsulation is integrated with described these batteries.
Mixed adhesive/the scolder that is used for photovoltaic module
Single stone module combinations can use electrical conduction binder and/or scolder to be used as electrically connecting material.These materials must be during this lamination step gluing, this usually occurs under the spike temperature that is lower than 200 ℃.Typically, electrically conducting binder is made up of the polymer substrate with conductive particle (epoxy resin, organosilicon, polyimide, acrylic acid, Polyurethane etc.).Typically, described these conductive particle comprise silver.Electrically the conduction binder may need specific Treatment of Metal Surface (for example, silver-plated or golden) to avoid corrosion effect and promote good cohesive force.Electrically the shortcoming of conduction binder be gluing to lip-deep difficulty, this special metal surface-treated cost, this electrically conducts the processing ageing (life-span after entering room temperature is limited) of binder, in time degeneration under heat and humidity.High-temperature solder is disadvantageous, because required high curing temperature is incompatible with described these polymer that are used for this encapsulation and are used for this back of the body thin slice.Solder, as tin: bismuth or indium-base alloy are compatible with typical laminating temperature then, but also are difficult for wetting other metal surface and normally frangible.
One has a composite material of electrical conduction binder and both attributes of a solder, is made up of a polymer substrate of the particulate that metal alloy constituted with low melting point (that is solder).This polymer substrate provides this bonding characteristic and a soft durable matrix, and the fusing of this solder particulate and backflow provide low interface resistance and low overall resistance.
Integrate with the moisture barrier of MMA back of the body thin slice
Usually it is favourable using a moisture barrier layer at this back of the body thin slice.Moisture can cause corrosion and make material or the degeneration of interface cohesive force.On this back of the body thin slice, add the moisture that a moisture barrier layer can reduce significantly and almost this photovoltaic module is invaded in elimination, eliminate the degradation modes relevant by this with moisture.Glass in the front is a splendid moisture barrier, so the normally bigger problem of moisture of invading from the rear surface.The most general moisture barrier that is used for the rear surface in photovoltaic module comprises a glass (this cause module very heavy and expensive) or an aluminium foil.Typically, this aluminium foil is that 25 to 50 μ m are thick.The thin film dielectric film also is used as moisture barrier.Typically, described these films directly are placed on the polymer flake and are integrated in the back of the body thin slice framework of this photovoltaic module.
In photovoltaic module combination (MMA), it is favourable incorporating a moisture barrier in this back of the body thin slice.This moisture barrier allows widely Treatment of Metal Surface and includes the electrical conductivity material in limit of consideration, provides the corrosion of the large-area Cu paper tinsel that generally is used for this circuit layer and the protection of oxidation, and has improved the reliability of whole package.
This MMA back of the body thin slice by this flexible circuit layer (substrate, metallic circuit and the body layer that is electrically insulated) and the exterior layer that is used for electrically reaching environmental protection formed.Typically, this external environment condition protective layer is a fluorinated polymer, for example is used for the anti-scratch DuPontTedlar that injures electric insulation on a thick relatively polyester layer, yet also can uses other various materials.One moisture barrier layer, for example the aluminium of 25 to 50 μ m can be included in this outside back of the body thin slice to improve aforesaid environmental protection.Preferably, this flexible circuit sees through a laminating technology gluing to this outside back of the body thin slice.Preferably, for reducing production costs, this lamination is the type continuously rolled technology under atmospheric environment.
Using the framework of aluminium foil in this outside back of the body thin slice is firm on environmental performance and the tool height reliability, but it is not manufactured especially easily.Employed each MMA back of the body thin slice must individually make up in one vacuum/neutralizing layer depressor this flexible circuit layer is incorporated into this exterior layer in working as front module.The production capacity of this technology is low and higher than type continuously rolled lamination price.In general, type continuously rolled technology is to be unusable on this MMA back of the body thin slice that uses moisture barrier, because the aluminium that this MMA back of the body thin slice comprises the copper of 35 to the 50 μ m that are used for this circuit and is used for 25 to 50 μ m of moisture barrier is too hard for type continuously rolled technology.
For addressing this problem, people's expectation has one of moisture barrier and has more soft MMA back of the body thin slice framework.In one embodiment, a soft MMA back of the body thin slice uses a thinner aluminium foil, and the thickness of this aluminium foil is less than about 25 μ m, more preferably less than about 15 μ m, more preferably less than about 10 μ m, best near 9 μ m.If can be processed in type continuously rolled technology, then can consider to use thinner paper tinsel.In this embodiment, this aluminium foil suffers gluing to the substrate that is used for this exterior layer-such as the polyester (PET) of 250 μ m.The DuPont Tedlar (PVF) of one fluorinated polymer-for example, be gluing on this aluminium foil to be used for environmental protection.This copper layer preferably comprises a paper tinsel, can use a type continuously rolled technology gluing this opposing face to this PET.This this PET that helps to harden is to prevent the tearing of this aluminium foil.In case this Cu paper tinsel suffers gluing to this PVF/AL/PET composite material, can use the typical type continuously rolled technology of present use to handle on this MMA back of the body thin slice, to form this circuit.Selectively, can use a film moisture barrier to substitute and to approach aluminium foil, the performance efficiency when producing to promote MMA back of the body thin slice.
Although described the present invention in detail in conjunction with these specific preferred embodiments, other embodiment can reach same result.In this skill, have and know that usually the knowledgeable, variation of the present invention and modification are conspicuous, and the invention is intended to contain all these modifications and equivalent.Be intended to make the reader to understand that described these are preferable and can select embodiment in these disclosed various configurations, rather than restriction the present invention or restriction claim.All patents cited above, reference, and whole disclosure of publication incorporate this literary composition in the reference mode.

Claims (45)

1. photovoltaic module, it comprises:
A plurality of back contact solar cells;
One soft back of the body thin slice;
One pattern metal sprayed coating, the position is on this back of the body thin slice;
One insulating material is arranged between this pattern metal sprayed coating and described these solar cells, and this insulating material is electrically contacted to make to form between this pattern metal sprayed coating and described these solar cells in a plurality of desired locations by patterning; And
A plurality of buses, itself and this pattern metal sprayed coating electrically contacts.
2. photovoltaic module as claimed in claim 1 more is included in the moisture barrier on this back of the body thin slice, and this moisture barrier is enough thin to cause this back of the body thin slice can carry out type continuously rolled technology in conjunction with this pattern metal sprayed coating and this moisture barrier.
3. photovoltaic module as claimed in claim 1, wherein this insulating material comprises an interlayer dielectric (ILD).
4. photovoltaic module as claimed in claim 3, wherein this interlayer dielectric comprises a plurality of islands district or a plurality of spot.
5. photovoltaic module as claimed in claim 3, wherein at least a portion of this interlayer dielectric has met with modifying to change its outward appearance.
6. photovoltaic module as claimed in claim 1 more comprises an encapsulation.
7. photovoltaic module as claimed in claim 6, wherein this encapsulation comprises a thermoplastic.
8. photovoltaic module as claimed in claim 6, wherein this encapsulation comprises a yarn matter layer (scrimlayer), and this yarn matter layer is arranged between described these solar cells and this pattern metal sprayed coating.
9. photovoltaic module as claimed in claim 6, wherein this insulating material comprises this encapsulation.
10. photovoltaic module as claimed in claim 6, wherein this encapsulation is to integrate with this back of the body thin slice before this module of combination.
11. photovoltaic module as claimed in claim 10, wherein this encapsulation and this back of the body thin slice are to use type continuously rolled technology and are laminated together.
12. photovoltaic module as claimed in claim 1, electrically contacting that wherein this is limited provided by a material that comprises a polymer substrate and a plurality of conductive particle.
13. photovoltaic module as claimed in claim 1, wherein this back of the body thin slice comprises one or more opening, and described these buses are passed described or described these openings and extended.
14. photovoltaic module as claimed in claim 1, at least a portion wherein said or described these buses are to adjust band (trim strip) integration with one before this module of combination.
15. a photovoltaic module, it comprises:
A plurality of back contact solar cells;
One first insulation back of the body thin slice
One first pattern metal sprayed coating contacts one first of this first insulation back of the body thin slice;
One second pattern metal sprayed coating contacts one second of this first insulation back of the body thin slice;
One insulating material is arranged between this first pattern metal sprayed coating and described these solar cells, and this insulating material is electrically contacted to make to form between this first pattern metal sprayed coating and described these solar cells in a plurality of desired locations by patterning; And
One second back of the body thin slice contacts this second pattern metal sprayed coating.
16. photovoltaic module as claimed in claim 15, wherein, this second back of the body thin slice comprises a plurality of openings, and described these openings are used to make this second pattern metal sprayed coating to electrically contact from the outside to this second back of the body thin slice formation.
17. photovoltaic module as claimed in claim 15, wherein the part of the part of this first pattern metal sprayed coating and this second pattern metal sprayed coating comprises the zones of different of a paper tinsel that coats around edge of this first insulation back of the body thin slice.
18. photovoltaic module as claimed in claim 15, wherein the part of this first pattern metal sprayed coating is to be connected via at least one opening in this first insulation back of the body thin slice with the part of this second pattern metal sprayed coating.
19. photovoltaic module as claimed in claim 15 more comprises the by-pass diode of a plurality of flat packages.
20. photovoltaic module as claimed in claim 15 more is included in the moisture barrier of this second back of the body on thin slice, this moisture barrier enough approaches to cause this back of the body thin slice can carry out type continuously rolled technology in conjunction with this second pattern metal sprayed coating and this moisture barrier.
21. photovoltaic module as claimed in claim 15, wherein this insulating material comprises an interlayer dielectric (ILD).
22. photovoltaic module as claimed in claim 21, wherein this interlayer dielectric comprises island district or spot.
23. photovoltaic module as claimed in claim 21, wherein at least a portion of this interlayer dielectric has met with modifying to change its outward appearance.
24. photovoltaic module as claimed in claim 15 more comprises an encapsulation.
25. photovoltaic module as claimed in claim 24, wherein this encapsulation comprises a thermoplastic.
26. photovoltaic module as claimed in claim 24, wherein this encapsulation comprises a yarn matter layer, and this yarn matter layer is arranged between described these solar cells and this pattern metal sprayed coating.
27. photovoltaic module as claimed in claim 24, wherein this insulating material comprises this encapsulation.
28. photovoltaic module as claimed in claim 24, wherein this encapsulation is to integrate with this at least one back of the body thin slice before this module of combination.
29. photovoltaic module as claimed in claim 28, wherein this encapsulation is to use type continuously rolled technology to be laminated to this at least one back of the body thin slice.
30. photovoltaic module as claimed in claim 15, electrically contacting that wherein this is limited provided by a material that comprises a polymer substrate and a plurality of conductive particle.
31. a photovoltaic module, it comprises:
A plurality of back contact solar cells;
One soft back of the body thin slice;
One pattern metal sprayed coating, the position is on this back of the body thin slice; And
A plurality of island districts that comprise an interlayer dielectric material are placed between this pattern metal sprayed coating and described these solar cells.
32. photovoltaic module as claimed in claim 31, more comprise a plurality of annuluses, described these annuluses comprise this interlayer dielectric material, each annulus centers on described these solar cells and this pattern metal sprayed coating, and comprises a conductive of material that is electrically connected described these solar cells and this pattern metal sprayed coating.
33. photovoltaic module as claimed in claim 32, wherein this conductive of material comprises a polymer substrate and a plurality of conductive particle.
34. a back of the body thin slice combination that is used for a photovoltaic module, this back of the body thin slice combination comprises:
One soft back of the body thin slice;
One pattern metal sprayed coating; And
One moisture barrier, it is enough thin to cause this back of the body thin slice can carry out the type continuously rolled technology that combines with this second pattern metal sprayed coating and this moisture barrier.
35. back of the body thin slice combination as claimed in claim 34, wherein the thickness of this moisture barrier is less than about 25 μ m.
36. back of the body thin slice combination as claimed in claim 35, the thickness of this moisture barrier is less than about 15 μ m.
37. back of the body thin slice combination as claimed in claim 36, the thickness of this moisture barrier is less than about 10 μ m.
38. back of the body thin slice combination as claimed in claim 37, the thickness of this moisture barrier is about 9 μ m.
39. back of the body thin slice combination as claimed in claim 34 more comprises an interlayer dielectric or an encapsulation, it is laminated to this soft back of the body thin slice or this pattern metal sprayed coating.
40. a photovoltaic module comprises:
A plurality of back contact solar cells;
One soft back of the body thin slice;
One pattern metal sprayed coating, position are on this back of the body thin slice and form a plurality of circuit, and each circuit connects a subclass of described these solar cells, and at least one in wherein said these circuit comprises a nonlinear circuit path; And
A plurality of line plates (cord plate), in a plurality of positions of position on this module, each line plate is to comprise one or more by-pass diode electrically to shunt one or more described these circuit.
41. photovoltaic module as claimed in claim 40, wherein said these solar cells comprise metallurgical grade silicon or low-resistance silicon through upgrading.
42. photovoltaic module as claimed in claim 40, wherein each by-pass diode shunting is less than 20 solar cells.
43. photovoltaic module as claimed in claim 42, wherein each by-pass diode shunting is less than 16 solar cells.
44. photovoltaic module as claimed in claim 43, wherein each by-pass diode shunting is less than 11 solar cells.
45. photovoltaic module as claimed in claim 44, wherein each by-pass diode shunting is less than 7 solar cells.
CN2009801159421A 2008-04-29 2009-04-29 Photovoltaic modules manufactured using monolithic module assembly techniques Pending CN102113130A (en)

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