CN102109114A - Bulb-shaped lamp and lighting fixture - Google Patents
Bulb-shaped lamp and lighting fixture Download PDFInfo
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- CN102109114A CN102109114A CN2010106083724A CN201010608372A CN102109114A CN 102109114 A CN102109114 A CN 102109114A CN 2010106083724 A CN2010106083724 A CN 2010106083724A CN 201010608372 A CN201010608372 A CN 201010608372A CN 102109114 A CN102109114 A CN 102109114A
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- device body
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- hole
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention relates to a bulb-shaped lamp and a lighting fixture, and the bulb-shaped lamp (1) comprises: a lighting module (2) which comprises a semiconductor lighting element (9); a metal device body (3) which comprises an installation part (14) formed at one side (3a) and a hole (17) formed to be approximately truncated-cone-shaped, wherein the lighting module (2) is installed on the installation part (14); an electric insulating resin shell (4) which is formed to be like a approximately truncated-cone-shaped cylinder, wherein the movement towards the installation part (14) is limited by the lighting module (2); an embedded recess (18) and an embedded projection (25) which are respectively formed at the inner wall side (17a) of the hole (17) of the device body (3) and the peripheral side (4c) of the resin shell (4), and are embedded together to limit the mutual rotation; a lighting circuit (5) which is contained inside the resin shell (4); and a lamp orifice (6) which is electrically connected to the lighting circuit (5).
Description
Technical field
The present invention relates to a kind of bulb-shaped lamp that uses semiconductor light-emitting elements to be used as light source (bulb shaped lamp) and the ligthing paraphernalia of described bulb-shaped lamp is installed.
Background technology
In the past, using light emitting diode to be used as in the bulb-shaped lamp of semiconductor light-emitting elements, distolateral being installed with respectively at metal lamp socket (holder) used light emitting diode (light emitting diode, LED) illuminating part of chip and cover the lampshade of described illuminating part, across insulating component socket is installed in that another of lamp socket is distolateral, and take in lamp circuit (for example, with reference to patent documentation 1) in the inboard of insulating component.
In the bulb-shaped lamp of described background technology, insulating component is for example by polybutylene terephthalate (polybutylene terephthalate, PBT) synthetic resin of resin constitutes, and forms the cup-shaped with cylindric portion, and becomes the resin enclosure of taking in lamp circuit.And insulating component makes its outer peripheral face contact with the inner peripheral surface of the recess of the inboard that is formed on lamp socket, thereby is arranged in the described recess.
[background technology document]
[patent documentation]
[patent documentation 1] Japan Patent spy opens 2009-37995 communique (6-7 page or leaf, the 2nd figure)
With regard to the bulb-shaped lamp that small-sized krypton gas (Mini krypton) bulb etc. has E17 shape socket, the space in the lamp socket is little, thereby must partly take in the lamp circuit part at socket.Yet, has and be difficult to partly take in part, and the part of taking in such as is limited at shortcoming at described socket.And, have lamp socket is maximized, be difficult to make shortcomings such as bulb-shaped lamp miniaturization and the rising of bulb-shaped lamp cost thus.
Summary of the invention
The object of the present invention is to provide a kind of bulb-shaped lamp and use the ligthing paraphernalia of described bulb-shaped lamp, described bulb-shaped lamp guarantee to take in lamp circuit resin enclosure accommodation space and can carry out the fixing of resin enclosure easily and realize the cost reduction with simple and easy formation.
The invention of technical scheme 1 described bulb-shaped lamp is characterised in that and comprises: light emitting module comprises substrate and is encapsulated in semiconductor light-emitting elements on the one side of described substrate; Metal device body, comprise and be formed on a distolateral installation portion and form from the hole of the described installation portion roughly circular cone shape that front end attenuates towards another is distolateral, and described light emitting module is installed on the described installation portion directly or indirectly, and the another side side of wherein said substrate is installed on described installation portion; The resin enclosure of electrical insulating property, form the tubular that has along the roughly circular cone shape of the outer peripheral face of the internal face in the hole of described device body, be configured in the inside in the hole of described device body, and towards the mobile restriction that is subjected to described light emitting module of described installation portion side; Chimeric recess and fitting projection, be respectively formed at the internal face in hole of described device body and described resin enclosure outer peripheral face one of them with wherein another, chimeric each other to limit mutual rotation; Lamp circuit is accommodated in the inside of described resin enclosure, and described semiconductor light-emitting elements is lit a lamp; And socket, another that is arranged on the distolateral or described resin enclosure of another of described device body is distolateral, and is electrically connected at described lamp circuit.
The present invention and following each as long as do not mention especially, then respectively constitute shown below in inventing.
Semiconductor light-emitting elements can be LED element or electroluminescent (Electroluminescence, EL) any element of element etc.At semiconductor light-emitting elements is under the situation of LED element, can be by surface mount device (Surface Mount Device, SMD) light-emitting component that will carry led chip and have a terminal is encapsulated on the substrate, or by chip on board (Chip On Board COB) directly is encapsulated in led chip on the substrate and is being coated with the transparent resin that is mixed with fluorophor and forms sealing resin layer etc. and all can.And the quantity that is encapsulated in the semiconductor light-emitting elements on the substrate can be one, also can be a plurality of.
Substrate can be any in metallic plate or the resin plate.At substrate is under the situation of metallic plate, is forming the dielectric film with high-termal conductivity in its one side side, and encapsulating semiconductor light-emitting elements on described dielectric film.
And substrate can be installed on the heat sink, and is installed in the installation portion of device body across described heat sink.Just, when substrate is thin plate,, guarantee the intensity of substrate by substrate is installed in heat sink.Heat sink can be formed by the metallic plate that the relatively large aluminium of thickness of slab (Al) plate or nickel (Ni) plate etc. have a high-termal conductivity." light emitting module is installed in installation portion indirectly " and is meant another side with substrate across heat sink etc. and be installed in installation portion.And " light emitting module is directly installed on installation portion " is meant that substrate is not across heat sink etc. and be installed in installation portion.At this moment, the thickness of slab of substrate is relatively large.
Light emitting module can cover the integral body of chimeric recess directly or indirectly, also can only cover the part of chimeric recess.Thus, under the effect of light emitting module, resin enclosure is restricted towards the mobile of installation portion side.
The hole can be from a distolateral installation portion of device body and connects through hole to another distolateral outer surface, also can be the hole of the degree of depth with regulation.Under the situation that is described hole, socket is arranged on another of device body across insulating materials distolateral.
Device body at one end side is installed with the lampshade that covers light emitting module, also can not have lampshade.When device body does not have lampshade, can be covered the semiconductor light-emitting elements of light emitting module at least so that it is protected by translucent resin.And lampshade can be by allowing from the material of the light transmission of semiconductor light-emitting elements radiation, for example glass or synthetic resin and form.
And device body can be provided with fin at its outer surface.
Resin enclosure is to be inserted between metal device body and the lamp circuit so that the member that both are electrically insulated, and the part with outer peripheral face can form tubular.And with regard to resin enclosure, the gap of the internal face in the hole of outer peripheral face and device body is the smaller the better, and preferred so that outer peripheral face forms with the mode that the internal face in hole contacts.And one of outer peripheral face distolaterally is meant the distolateral of resin enclosure.
Outer peripheral face is preferably the shape of the roughly circular cone shape similar to the shape of the internal face in the hole of device body, but is not limited to this, for example can be the shape of polyhedral roughly circular cone shape.
Fitting projection and chimeric recess can be separately positioned on in resin enclosure and the device body any, when one of them was arranged on the resin enclosure, another then was arranged on the device body, and is opposite, when one of them was arranged on the device body, another then was arranged on the resin enclosure.
Socket comprises that bulb that the be connected in general illumination of E17 shape or E26 shape etc. uses is with the socket on the socket.
Lamp circuit for example has the power circuit of DC current of output constant current, and utilizes wiring etc. to supply power to semiconductor light-emitting elements.Lamp circuit can support and be fixed in any in resin enclosure or the device body.
According to the present invention, because of being embedded in chimeric recess, fitting projection is entrenched togather each other, so stoped resin enclosure to rotate to direction along the internal face in the hole of device body.And, be light emitting module to be installed to installation portion in the mode that covers chimeric recess, so fitting projection is stayed in the chimeric recess, stoped from the other end side direction one distolateral direction of resin enclosure and moved.Thus, resin enclosure is fixed in device body under the state in the hole that is accommodated in device body.
And the hole shape of device body becomes roughly circular cone shape, and resin enclosure forms the tubular of its outer peripheral face along the roughly circular cone shape of the internal face in hole, thereby the change of the inner space of resin enclosure is big, thus the space of guaranteeing to take in lamp circuit.
The invention of technical scheme 2 described bulb-shaped lamps is according to the invention of technical scheme 1 described bulb-shaped lamp, it is characterized in that: the hole shape of described device body becomes the through hole from described installation portion perforation to another distolateral outer surface, another of described resin enclosure is distolateral to be formed on from the outstanding laterally protuberance of another distolateral outer surface of described device body, and at described protuberance described socket is being set.
Described socket is to have the insulation distance of regulation and to be arranged on described protuberance with described device body.
And, when another distolateral outer surface at device body, when between the edge portion of through hole and resin enclosure, having the gap, can to described gap for example painting synthetic resin to block described gap.Thus, prevent the inside in the hole of intrusion device bodies such as moisture or dust, thereby bulb-shaped lamp can be used for the dusty place etc. at many places such as the moisture in outdoor, bathroom etc. or workshop etc.
According to the present invention, because of socket being installed in from the outstanding laterally protuberance of another distolateral outer surface of device body, so need not between metal device body and socket, insulating materials to be set.
The invention of technical scheme 3 described ligthing paraphernalias is characterised in that and comprises: according to technical scheme 1 or 2 described bulb-shaped lamps; And apparatus body, having the bulb socket, the socket of wherein said bulb-shaped lamp is installed on described bulb socket.
Ligthing paraphernalia can be ceiling imbedded shape, ceiling the ligthing paraphernalia that use semiconductor light-emitting elements that shape and ceiling hang the ligthing paraphernalia etc. of shape is used as light source directly is installed.
According to the present invention, provide a kind of can operation technique scheme 1 or the ligthing paraphernalia of 2 described bulb-shaped lamps.
[effect of invention]
Invention according to technical scheme 1, with one of them of the outer peripheral face of the internal face in the hole that is respectively formed at device body and resin enclosure and another chimeric recess and the chimeric each other simple formation of fitting projection wherein, stop resin enclosure with respect to device body rotation or move forward and backward, thereby need not to utilize adhesive material that resin enclosure is fixed in device body, thus, can realize the reduction of cost that resin enclosure is fixed, thereby can form bulb-shaped lamp at an easy rate, and because of the outer peripheral face that forms resin enclosure shape along the roughly circular cone shape of the internal face in the hole of device body, so can guarantee to take in the broad space of lamp circuit, thereby can realize the miniaturization of bulb-shaped lamp in the inside of resin enclosure.
Invention according to technical scheme 2, protuberance at the resin enclosure of giving prominence to laterally from another distolateral outer surface of device body is being provided with socket, thereby need not between socket and device body to insert insulating materials and just can carry out the installation of socket easily, thus, can form bulb-shaped lamp at an easy rate.
According to the invention of technical scheme 3, can provide a kind of because of the accommodation space of guaranteeing lamp circuit in the inside of resin enclosure and can the cheap bulb-shaped lamp that forms is installed, so can be small-sized and the ligthing paraphernalia of cheap formation.
Description of drawings
Fig. 1 is the profilograph of the bulb-shaped lamp of expression example 1 of the present invention.
Fig. 2 is the side view of the bulb-shaped lamp of expression example 1 of the present invention.
Fig. 3 is that expression is from the device body of the bulb-shaped lamp of a distolateral observed example 1 of the present invention and the front view of lamp circuit.
Fig. 4 is the exploded perspective view of the bulb-shaped lamp of example 1 of the present invention.
Fig. 5 is the profilograph of the ligthing paraphernalia of expression example 2 of the present invention.
1: bulb-shaped lamp 2: light emitting module
3: device body 3a: device body one distolateral
3b: another of device body distolateral 4: resin enclosure
4a: a distolateral 4b of resin enclosure: another of resin enclosure is distolateral
4c: the outer peripheral face 4d of resin enclosure: the internal face of resin enclosure
5: lamp circuit 6: socket
7,30: substrate 7a: the one side of substrate
7b: the another side 7c encapsulation of substrate
8: illuminating part
9: as the led chip of semiconductor light-emitting elements
10: sealing resin 11: heat sink
12: main part 12a: main part one distolateral
12b: the distolateral 12c of another of main part: main part outer surface
13: fin 14: installation portion
15: lampshade 15b: another of lampshade is distolateral
16: lampshade installation portion 17: as the through hole in hole
17a: the internal face 18 in hole: chimeric recess
19: screw 20,28: groove
21: installing plate 22,23: gap
24: fitting portion 25: fitting projection
26: protuberance 27: base plate
29,29: inserting hole 30a: substrate one is distolateral
30b: substrate another distolateral 31: electronic component
32a～32c: support plate 33: housing section
34: insulation division 35: eyelet portion
36: ligthing paraphernalia 37: ceiling
38: apparatus body 39: the bulb socket
40: lid 41: flat spring/opening
42: opening T1: transformer
The specific embodiment
Below, with reference to accompanying drawing one embodiment of the present invention is described.
In the present invention, the hole shape of device body becomes roughly circular cone shape, and the resin enclosure of taking in lamp circuit forms the tubular that has along the roughly circular cone shape of the outer peripheral face of the internal face in the hole of device body.And, the outer peripheral face of the internal face in the hole of device body and resin enclosure one of them with wherein forming chimeric recess and fitting projection respectively on another.By fitting projection is embedded in chimeric recess so that they are chimeric, resin enclosure is fixed in device body and can or move forward and backward with respect to the device body rotation, and can guarantee to take in the inside of resin enclosure the big accommodation space of lamp circuit.
[example 1]
Fig. 1 to Fig. 4 represents example 1 of the present invention, and Fig. 1 is the profilograph of bulb-shaped lamp, and Fig. 2 is the side view of bulb-shaped lamp, and Fig. 3 is from the device body of a distolateral observed bulb-shaped lamp and the front view of lamp circuit, and Fig. 4 is the exploded perspective view of bulb-shaped lamp.
Among Fig. 1, bulb-shaped lamp 1 comprises light emitting module 2, device body 3, resin enclosure 4, lamp circuit 5 and socket 6 and constitutes.And shown in following, chimeric recess 18 is formed on device body 3, and fitting projection 25 is formed on resin enclosure 4.
Illuminating part 8 has the led chip that for example sends blue light 9 as semiconductor light-emitting elements, and described led chip 9 is encapsulated on the substrate 7 in COB (Chip On board) mode.Just, led chip 9 is encapsulated on the encapsulation 7c of substrate 7 across the not shown insulating barrier with high-termal conductivity, and is forming with dome-shaped covering and seal the sealing resin 10 of for example poly-silicon-oxygen resin etc. of described led chip 9.Sneaking in the sealing resin 10 and excited by a part and radiate the yellow fluorophor of sodium yellow from the blue light of led chip 9.Therefore, the surface of sealing resin 10 is the light-emitting area of illuminating part 8, and radiates white light from described light-emitting area.
And, on the another side 7b of substrate 7, heat sink 11 is installed.Heat sink 11 by the metallic plate with high-termal conductivity for example aluminium (Al) plate constitute, for example form circle, and utilize the adhesive material of high-termal conductivity to be bonded on the substrate 7.Heat sink 11 will be accompanied by the heat that light a lamp (luminous) of led chip 9 produced and begin conduction from substrate 7, and described heat is conducted to device body 3.
And, at the central portion of the installation portion 14 of main part 12, forming as connecting from installation portion 14 to the through hole 17 in the hole of the outer surface 12c of another distolateral 12b.Described through hole 17 form along with from installation portion 14 towards another distolateral 12b and the roughly circular cone shape that the diminishing front end of diameter attenuates.And, forming the chimeric recess 18 of four limit shapes in the edge portion of the through hole 17 of installation portion 14.Chimeric recess 18 is a plurality of uniformly-spaced to be formed with around through hole 17.For example, as shown in Figure 3, around through hole 17, forming two chimeric recesses 18 with 180 ° interval and mode toward each other.And, forming a plurality of in order to the screw 19 that heat sink 11 spiral shells are solid at installation portion 14.In addition, forming along the groove 20 of the ring-type of the surrounding wall portion of lampshade installation portion 16 at installation portion 14.
Among Fig. 1, not shown screw threads is connected in the not shown screw 19 of installation portion 14 across heat sink 11.Thus, heat sink 11 is installed on installation portion 14.Herein, heat sink 11 is blocked through hole 17, and forms the size that covers chimeric recess 18.Just, the another side 7b of the substrate 7 of light emitting module 2 is installed across heat sink 11 on installation portion 14, and light emitting module 2 is installed.In addition, heat sink 11 is preferably formed the size for the whole zone that covers chimeric recess 18, but also can form the size of a part that covers chimeric recess 18.
And, chimeric the installing plate 21 that surrounds light emitting module 2 and heat sink 11 in the groove 20 of installation portion 14.Between the surrounding wall portion of installing plate 21 and lampshade installation portion 16, forming gap 22.The upper surface of the upper surface of installing plate 21 and lampshade installation portion 16 becomes same planar.
The synthetic resin of the electrical insulating property of resin enclosure 4 bent polybutylene terephthalate (PBT) resins etc. and forming.And, form outer peripheral face 4c near the internal face 17a of through hole 17 and along the shape of the internal face 17a of through hole 17.Just, the part with outer peripheral face 4c forms the roughly tubular of circular cone shape.And, in the edge portion of the distolateral 4a of outer peripheral face 4c, forming outstanding laterally fitting projection 25 from outer peripheral face 4c.As shown in Figure 4, described fitting projection 25 forms for example quadrangle of the thickness with regulation, is formed with two with 180 ° interval and mode toward each other around the opening edge portion of outer peripheral face 4c.Just, fitting projection 25 is provided with corresponding to the chimeric recess 18 of device body 3, and as shown in Figure 3, is embedded in chimeric recess 18.By making fitting projection 25 and chimeric recess 18 chimeric each other, thereby resin enclosure 4 is disposed at the inside of the through hole 17 of device body 3.
Fitting projection 25 forms shape or the size that is embedded in chimeric recess 18, and as shown in Figure 1, the mode that can not collide with heat sink 11 forms.Just, form not can be from chimeric recess 18 to installation portion 14 outstanding shape or size for fitting projection 25.Resin enclosure 4 is by being embedded in fitting projection 25 the chimeric recess 18 of device body 3, and fitting projection 25 and chimeric recess 18 are chimeric each other to limit mutual rotation, are fixed in device body 3 thus.
And another distolateral 4b of the outer peripheral face 4c of resin enclosure 4 is outstanding laterally from the outer surface 12c of another distolateral 3b of device body 3, and is forming the protuberance cylindraceous 26 at the end at another distolateral 4b.The external diameter of protuberance 26 dwindles a little than the diameter of another distolateral 4b of resin enclosure 4.For example utilize riveted joint and socket 6 is being set at protuberance 26.And, forming groove 28 on the base plate 27 of protuberance 26, lamp circuit 5 is supported on described groove 28.And, as shown in Figure 3, the slotting inserting hole 29,29 that leads to the not shown lead-in wire of lamp circuit 5 and socket 6 electric connections is being set in base plate 27.
And, substrate 30 as shown in Figure 1, be embedded in resin enclosure 4 base plate 27 groove 28 and be supported on base plate 27.And, as shown in Figure 3, support plate 32a～32c is installed on substrate 30.Support plate 32a～32c utilizes adhesive material to anchor at the internal face 4d of resin enclosure 4.Like this, as shown in Figure 1, lamp circuit 5 is accommodated in the inside of resin enclosure 4, and is fixed in resin enclosure 4.Lamp circuit 5 utilizes not shown lead-in wire and is connected on the substrate 7 of socket 6 and light emitting module 2.
And lamp circuit 5 constitutes ac voltage rectifier level and smooth, and constant current is supplied to light emitting module 2.The led chip 9 of light emitting module 2 is by being supplied to constant current and lighting a lamp (luminous).And, radiate white light from illuminating part 8, the light diffusion takes place and radiates to space outerpace in described white light through lampshade 15.
The bulb-shaped lamp 1 of Gou Chenging is installed in the bulb of ligthing paraphernalia with afterwards switching on the socket in this way, lamp circuit 5 actions this moment, thereby constant current (electric power) is supplied to a plurality of led chips 9 of light emitting module 2, a plurality of led chips 9 are lit a lamp (luminous), and the white light that radiates from illuminating part 8 radiates to space outerpace from lampshade 15 after lampshade 15 diffusions.
Then, the effect of example 1 of the present invention is narrated.
The inside of resin enclosure 4 is taken in and is fixing with lamp circuit 5, and is being provided with on the protuberance 26 under the state of socket 6, is inserted into the through hole 17 of device body 3 towards another distolateral 3b from a distolateral 3a side of device body 3.And, the fitting projection 25 of edge portion that is formed on a distolateral 4a of resin enclosure 4 is embedded in the chimeric recess 18 of device body 3.At this moment, fitting projection 25 is not to embed from the outstanding modes of the installation portion 14 of device body 3.Resin enclosure 4 limits mutual moving by fitting projection 25 and chimeric recess 18 are chimeric each other, thereby under the state of the through hole 17 that is accommodated in device body 3, be fixed in device body 3, and another distolateral 4b and protuberance 26 are outstanding laterally from another distolateral 3b of device body 3.
And, after utilizing lead-in wire that lamp circuit 5 and light emitting module 2 are electrically connected, will be fixed at the screw 19 of the installation portion 14 that is formed on device body 3 with light emitting module 2 incorporate heat sinks 11.Light emitting module 2 is installed on installation portion 14 in the mode of the chimeric recess 18 of heat sink 11 cladding system bodies 3.
Then, the fitting portion 24 of lampshade 15 is embedded in gap 22 between lampshade installation portion 16 and the installing plate 21 and coating adhesive material.Thus, to cover the mode of light emitting module 2, lampshade 15 is installed at a distolateral 3a of device body 3.
As above-mentioned, the fitting projection 25 of resin enclosure 4 is embedded in the chimeric recess 18 of device body 3, covers chimeric recess 18 with light emitting module 2 incorporate heat sinks 11.Thus, fitting projection 25 is stayed in the chimeric recess 18, rotates (rotation) to stop resin enclosure 4 to the direction along the internal face 17a of the through hole 17 of device body 3, and prevention from another distolateral 4b to the direction of a distolateral 4a just fore-and-aft direction move.Therefore, need not to utilize adhesive material that resin enclosure 4 is fixed in device body 3, be embedded in the chimeric recess 18 of device body 3 with the fitting projection 25 of resin enclosure 4, the simple formation that fitting projection 25 and chimeric recess 18 are chimeric each other just can be accommodated in resin enclosure 4 in the through hole 17 of device body 3 and is fixed in device body 3.Thus, can realize the reduction of cost that resin enclosure 4 is fixed, thereby can form bulb-shaped lamp 1 at an easy rate.
And, the through hole 17 of device body 3 forms the roughly shape of circular cone shape, resin enclosure 4 forms the tubular of its outer peripheral face 4c along the roughly circular cone shape of the internal face 17a of through hole 17, thereby the increase of the inner space of resin enclosure 4, can guarantee to take in the accommodation space of lamp circuit 5.Thus, need not to increase the profile separately of the main part 12 of resin enclosure 4 and device body 3, for example can form the size of small-sized krypton filled lamp bubble, thereby can realize the miniaturization of bulb-shaped lamp 1.
And, distolateral 4b of another of resin enclosure 4 and the protuberance 26 that is arranged on described another distolateral 4b are outstanding laterally from the outer surface 12c of another distolateral 3b of device body 3, and at described protuberance 26 socket 6 is being set, thereby is need not between described socket 6 and metal device body 3 to insert insulating materials and just can easily carry out the installation of socket 6.Therefore, can cut down the cost of insulating materials, reduce the set-up time of socket 6, thereby can form bulb-shaped lamp 1 at an easy rate.
In addition, bulb-shaped lamp 1 is that chimeric recess 18 is formed on device body 3, and fitting projection 25 is formed on resin enclosure 4, but also can respectively chimeric recess 18 be formed on resin enclosure 4 sides, and fitting projection 25 is formed on device body 3 sides.
And the hole shape of device body 3 becomes through hole 17, but described hole also can be recess.Even if in the case, be embedded in the chimeric recess 18 of device body 3 by fitting projection 25, and resin enclosure 4 can be taken in and be fixed in the described recess of device body 3 resin enclosure 4.And socket 6 is installed on another distolateral 3b of device body 3 across insulating materials.
[example 2]
Fig. 5 is the profilograph of the ligthing paraphernalia of expression example 2 of the present invention.In addition, for part mark same-sign identical and omission explanation with Fig. 2.
Ligthing paraphernalia 36 shown in Figure 5 is to use the following illuminator (down light) of bulb-shaped lamp shown in Figure 21, and is embedded in ceiling 37.And, form in profile and setting bulb on the apparatus body 38 roughly cylindraceous at the end with socket 39.Apparatus body 38 utilizes lid 40 and the flat spring 41,41 that is wholely set with apparatus body 38, and is held on ceiling 37, thereby is fixed on the ceiling 37.And bulb is with bulb-shaped lamp 1 is installed on the socket 39.
When bulb was switched on socket 39, the lamp circuit 5 of bulb-shaped lamp 1 moved, and supplies power to the led chip 9 of each illuminating part 8 of light emitting module 2.Thus, led chip 9 is lit a lamp, and radiates white light from each illuminating part 8, and radiates the white light that forms through the light diffusion from the outer surface of lampshade 15.Described diffused light becomes direct sunshine and by the reverberation that inner surface reflected of apparatus body 38, and from the opening 42 of lid 40 to the lower face side outgoing.
Bulb-shaped lamp 1 can form small-sized bulb-shaped lamp, and can form at an easy rate.Therefore, ligthing paraphernalia 36 can be provided on the building that space narrow and small ceiling 37 grades are set, and can provide at an easy rate.
[industrial utilization possibility]
The present invention is applicable to being installed in bulb with the bulb-shaped lamp on the socket and use ceiling imbedded shape, the ceiling of described bulb-shaped lamp directly to install in the ligthing paraphernalia that shape and ceiling hang shape etc.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (3)
1. bulb-shaped lamp is characterized in that comprising:
Light emitting module comprises substrate and is encapsulated in semiconductor light-emitting elements on the one side of described substrate;
Metal device body, comprise and be formed on a distolateral installation portion and form from the hole of the described installation portion roughly circular cone shape that front end attenuates towards another is distolateral, and described light emitting module is installed on the described installation portion directly or indirectly, and the another side side of wherein said substrate is installed on described installation portion;
The resin enclosure of electrical insulating property, form the tubular that has along the roughly circular cone shape of the outer peripheral face of the internal face in the hole of described device body, and be configured in the inside in the hole of described device body, wherein said resin enclosure is towards the mobile restriction that is subjected to described light emitting module of described installation portion side;
Chimeric recess and fitting projection, be respectively formed at the internal face in hole of described device body and described resin enclosure outer peripheral face one of them with wherein another, chimeric each other to limit mutual rotation;
Lamp circuit is accommodated in the inside of described resin enclosure, and described semiconductor light-emitting elements is lit a lamp; And
Socket, another that is arranged on the distolateral or described resin enclosure of another of described device body is distolateral, and is electrically connected at described lamp circuit.
2. bulb-shaped lamp according to claim 1 is characterized in that:
The hole shape of described device body becomes the through hole from described installation portion perforation to another distolateral outer surface, another of described resin enclosure is distolateral to be formed on from the outstanding laterally protuberance of another distolateral outer surface of described device body, and at described protuberance described socket is being set.
3. ligthing paraphernalia is characterized in that comprising:
Bulb-shaped lamp according to claim 1 and 2; And
Apparatus body has the bulb socket, and the socket of wherein said bulb-shaped lamp is installed on described bulb socket.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009292643A JP5532299B2 (en) | 2009-12-24 | 2009-12-24 | Light bulb shaped lamp and lighting equipment |
| JP2009-292643 | 2009-12-24 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310303645.8A Division CN103486463A (en) | 2009-12-24 | 2010-12-23 | Bulb-shaped lamp and lighting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102109114A true CN102109114A (en) | 2011-06-29 |
| CN102109114B CN102109114B (en) | 2014-07-30 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310303645.8A Pending CN103486463A (en) | 2009-12-24 | 2010-12-23 | Bulb-shaped lamp and lighting device |
| CN201010608372.4A Active CN102109114B (en) | 2009-12-24 | 2010-12-23 | Bulb-shaped lamp and lighting fixture |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310303645.8A Pending CN103486463A (en) | 2009-12-24 | 2010-12-23 | Bulb-shaped lamp and lighting device |
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| Country | Link |
|---|---|
| JP (1) | JP5532299B2 (en) |
| CN (2) | CN103486463A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110081354A (en) * | 2019-04-28 | 2019-08-02 | 浙江长兴金盛光电科技有限公司 | A kind of LED light |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5822068B2 (en) * | 2011-09-22 | 2015-11-24 | 東芝ライテック株式会社 | Lighting device |
| JP5772474B2 (en) * | 2011-10-07 | 2015-09-02 | 岩崎電気株式会社 | lamp |
| JP5536955B2 (en) * | 2012-02-23 | 2014-07-02 | パナソニック株式会社 | lamp |
| US8894252B2 (en) * | 2013-04-19 | 2014-11-25 | Technical Consumer Products, Inc. | Filament LED lamp |
| JP6108224B2 (en) * | 2013-05-29 | 2017-04-05 | パナソニックＩｐマネジメント株式会社 | lamp |
| JP6288965B2 (en) * | 2013-07-10 | 2018-03-07 | 三菱電機株式会社 | Storage member for lighting device and lighting device |
| JP2015207480A (en) * | 2014-04-22 | 2015-11-19 | アイリスオーヤマ株式会社 | Led lighting fixture |
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| CN201180976Y (en) * | 2008-04-23 | 2009-01-14 | 王义宏 | Heat conduction and radiation structure of luminous diode lamp |
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| CN201302117Y (en) * | 2008-11-26 | 2009-09-02 | 西安电子科技大学创新数码股份有限公司 | Led lighting bulb |
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| JP5300707B2 (en) * | 2009-12-14 | 2013-09-25 | シャープ株式会社 | Lighting device |
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| CN101165396A (en) * | 2006-10-20 | 2008-04-23 | 电灯专利信托有限公司 | Semiconductor lamp |
| JP2009037995A (en) * | 2007-07-06 | 2009-02-19 | Toshiba Lighting & Technology Corp | Bulb type led lamp and illuminating device |
| CN201180976Y (en) * | 2008-04-23 | 2009-01-14 | 王义宏 | Heat conduction and radiation structure of luminous diode lamp |
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| DE202008016868U1 (en) * | 2008-12-19 | 2009-03-19 | Osram Gesellschaft mit beschränkter Haftung | lamp |
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| CN110081354A (en) * | 2019-04-28 | 2019-08-02 | 浙江长兴金盛光电科技有限公司 | A kind of LED light |
| CN110081354B (en) * | 2019-04-28 | 2023-12-26 | 浙江长兴金盛光电科技有限公司 | LED lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103486463A (en) | 2014-01-01 |
| JP5532299B2 (en) | 2014-06-25 |
| JP2011134568A (en) | 2011-07-07 |
| CN102109114B (en) | 2014-07-30 |
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