CN102097734A - Method for manufacturing flat connector terminals - Google Patents
Method for manufacturing flat connector terminals Download PDFInfo
- Publication number
- CN102097734A CN102097734A CN2009102633629A CN200910263362A CN102097734A CN 102097734 A CN102097734 A CN 102097734A CN 2009102633629 A CN2009102633629 A CN 2009102633629A CN 200910263362 A CN200910263362 A CN 200910263362A CN 102097734 A CN102097734 A CN 102097734A
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- copper coin
- bonder terminal
- design
- etch
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Abstract
The invention discloses a method for manufacturing flat connector terminals. In the method, connector terminals which are arranged in batches are manufactured by etching on a copper plate by the conventional circuit manufacturing process of etching after a coating film is developed and exposed, and crease mark lines among all the connector terminals as well as between the connector terminals and the edge of the copper plate are etched simultaneously, so all the connector terminals can be obtained only by breaking off the tinplated copper plate according to the crease mark lines. Compared with the conventional pressing process, the method has the advantage of saving the die sinking cost and die sinking design time; and the conventional circuit manufacturing process is a general mature process in the field of the manufacturing of circuit boards, is simple in manufacturing and short in time, and is suitable for producing products in batches.
Description
Technical field
The present invention relates to bonder terminal and make field, especially a kind of manufacture method of flat bonder terminal.
Background technology
Existing flat bonder terminal is all punching press and makes, and at the bonder terminal of different purposes different shapings, need carry out different mold designs and die sinking, and setting up cost is higher before the system, and its mold design and die sinking time are longer, are unfavorable for small lot batch manufacture.
Summary of the invention
In order to overcome above-mentioned defective, the invention provides a kind of manufacture method of flat bonder terminal, the preceding setting up cost of system of using this method making is lower, and is suitable in enormous quantities and small lot batch manufacture simultaneously.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of manufacture method of flat bonder terminal, carry out as follows:
A. open material: cut copper coin by design size;
B. a facet etch: the traditional circuit manufacture craft that the one side of copper coin is coated with film development exposure after etching by design, in copper coin one side, etch bonder terminal for a plurality of half thicknesses of arranging in batches by design of copper coin one half thickness, and in horizontal and vertical between each bonder terminal of at least one direction and each bonder terminal and copper coin do not etch crease line between the etched edge;
C. another side etching: the traditional circuit manufacture craft that the another side contraposition copper coin one side of copper coin is coated with film development exposure after etching by design, corresponding copper coin simultaneously etches the bonder terminal for a plurality of half thicknesses of arranging in batches by design of copper coin one half thickness in the copper coin another side, and in horizontal and vertical between each bonder terminal of the non-selected etched crease line etching direction of step b and each bonder terminal and copper coin do not etch between the etched edge crease line (be: if step b in each bonder terminal laterally between etch crease line, then etch crease line between each bonder terminal vertical this moment; If step b in each bonder terminal vertically between etch crease line, then this moment in each bonder terminal laterally between etch crease line; If step b laterally and vertically all etches crease line in each bonder terminal, then need not the etching crease line this moment), integrally formed each bonder terminal of bonder terminal of the half thickness that the bonder terminal of the half thickness that described copper coin simultaneously etches and described copper coin another side etch;
D. zinc-plated: as to plate one deck tin on the copper coin surface that forms each bonder terminal of arranging in batches.
The client promptly gets each bonder terminal behind the follow-up zinc-plated copper coin that fractures by each crease line.
As a further improvement on the present invention, described step b with the arrangement mode by designing the bonder terminal of arranging in batches that step c etches jointly is: mark off the identical copper coin unit of some areas on described copper coin, be placed with some bonder terminals of equal number and layout in each copper coin unit; Also be provided with step e after the described steps d:
E. cut: the copper coin unit that cuts out each electroplating surfaces with tin by design.
As a further improvement on the present invention, the tin plating technique in the described steps d is an electrotinning.
The invention has the beneficial effects as follows: adopt the traditional circuit manufacture craft etching on copper coin that is coated with film development exposure after etching to produce the bonder terminal that each is arranged in batches, etch between each bonder terminal simultaneously and bonder terminal and copper coin edge between crease line, only need the copper coin after zinc-plated be fractureed and to obtain each bonder terminal by each crease line, this manufacture method is compared traditional Sheet Metal Forming Technology and has been saved die sinking cost and design die sinking time before, the traditional circuit manufacture craft is the general maturation process that wiring board is made the field, making is simple and the time is shorter, is applicable to the production of any batch.
Embodiment
Embodiment: a kind of manufacture method of flat bonder terminal, carry out as follows:
A. open material: cut copper coin by design size;
B. a facet etch: the traditional circuit manufacture craft that the one side of copper coin is coated with film development exposure after etching by design, in copper coin one side, etch bonder terminal for a plurality of half thicknesses of arranging in batches by design of copper coin one half thickness, and in horizontal and vertical between each bonder terminal of at least one direction and each bonder terminal and copper coin do not etch crease line between the etched edge;
C. another side etching: the traditional circuit manufacture craft that the another side contraposition copper coin one side of copper coin is coated with film development exposure after etching by design, corresponding copper coin simultaneously etches the bonder terminal for a plurality of half thicknesses of arranging in batches by design of copper coin one half thickness in the copper coin another side, and in horizontal and vertical between each bonder terminal of the non-selected etched crease line etching direction of step b and each bonder terminal and copper coin do not etch between the etched edge crease line (be: if step b in each bonder terminal laterally between etch crease line, then etch crease line between each bonder terminal vertical this moment; If step b in each bonder terminal vertically between etch crease line, then this moment in each bonder terminal laterally between etch crease line; If step b laterally and vertically all etches crease line in each bonder terminal, then need not the etching crease line this moment), integrally formed each bonder terminal of bonder terminal of the half thickness that the bonder terminal of the half thickness that described copper coin simultaneously etches and described copper coin another side etch;
D. zinc-plated: as to plate one deck tin on the copper coin surface that forms each bonder terminal of arranging in batches.
The client promptly gets each bonder terminal behind the follow-up zinc-plated copper coin that fractures by each crease line.
Described step b with the arrangement mode by designing the bonder terminal of arranging in batches that step c etches jointly is: mark off the identical copper coin unit of some areas on described copper coin, be placed with some bonder terminals of equal number and layout in each copper coin unit; Also be provided with step e after the described steps d:
E. cut: the copper coin unit that cuts out each electroplating surfaces with tin by design.
Tin plating technique in the described steps d is an electrotinning.
Rolling batch punching press connector is on the market produced identical earth terminal with the also available said method of earth terminal at present; Present rolling on the market is punching press connector earth terminal in batches, its every volume is all by integrally formed two main parts of metallic plate and Cheng Liezhuan arranges between two main parts evenly spaced terminal part to be formed, the zinc-plated back of whole volume outer surface reaches to going out product in batches, after the client selects to buy certain volume product by required smallest end subdivision spacing, design die sinking voluntarily, stamp out required earth terminal, unnecessary product and calcellation after the punching press according to the spacing of required each terminal part and the length of required main part again; Be unfavorable for that on the one hand client's later stage uses, the die sinking design time is long, cost is high, and the punching press scrappage is also higher relatively, and again because the punching press scrappage, the client is difficult to calculate in advance the length of the rolling product that needs purchase, often stores goods because of over-bought causes; Stampings has caused the wasting of resources on the other hand, and production cost is higher.
Can produce identical earth terminal with this law also is arranged in the same metal frame in batches, the batch that obtains is arranged flat connector earth terminal for directly by the required specification moulding of client (it is all one-body molded by customer demand with the length of the length of the terminal part of earth terminal and interval width and main part to be each connector), some connectors are some right with earth terminal to connector with the terminal corresponding butt joint formation of terminal part with earth terminal, this some connector is connected the end correspondence with main part with earth terminal goes into some strip connectors earth terminal bar, junction between junction between the adjacent both ends subdivision and adjacent two main parts is formed with crease line respectively, each connector is fixed in the same flat metal frame with earth terminal bar two ends arranged side by side, and each connector is formed with crease line with the junction between earth terminal bar two ends and the metal frame.
The crease line that junction between junction between the described adjacent both ends subdivision and adjacent two main parts forms respectively both can be arranged in the same one side of described metal frame, can lay respectively in the two sides of described metal frame again.
Each connector is all one-body molded by customer demand with the length of the length of the terminal part of earth terminal and interval width and main part, can not exist existing product to need punching press and the waste part that contains, has saved production cost; Each connector is right with connecting into the terminal correspondence of terminal part respectively between the earth terminal; End correspondence with main part connects slivering again, each bar product is arranged in side by side in the same metal frame and realizes producing in batches, be provided with crease line between the coupling part of each connector with earth terminal again, only need to get final product the intact independent connector earth terminal of taking by this section of crease line, there is not the follow-up situation that needs the die sinking punching press of existing product, can not produce scrappage because of punching press yet, the client only need provide connector to get final product with the quantity and the size of earth terminal, can not produce the phenomenon of storing goods, product uses more convenient.
Claims (3)
1. the manufacture method of a flat bonder terminal is characterized in that: carry out as follows:
A. open material: cut copper coin by design size;
B. a facet etch: the traditional circuit manufacture craft that the one side of copper coin is coated with film development exposure after etching by design, in copper coin one side, etch bonder terminal for a plurality of half thicknesses of arranging in batches by design of copper coin one half thickness, and in horizontal and vertical between each bonder terminal of at least one direction and each bonder terminal and copper coin do not etch crease line between the etched edge;
C. another side etching: the traditional circuit manufacture craft that the another side contraposition copper coin one side of copper coin is coated with film development exposure after etching by design, corresponding copper coin simultaneously etches the bonder terminal for a plurality of half thicknesses of arranging in batches by design of copper coin one half thickness in the copper coin another side, and in horizontal and vertical between each bonder terminal of the non-selected etched crease line etching direction of step b and each bonder terminal and copper coin do not etch crease line between the etched edge, integrally formed each bonder terminal of bonder terminal of the half thickness that the bonder terminal of the half thickness that described copper coin simultaneously etches and described copper coin another side etch;
D. zinc-plated: as to plate one deck tin on the copper coin surface that forms each bonder terminal of arranging in batches.
2. the manufacture method of flat bonder terminal according to claim 1, it is characterized in that: described step b with the arrangement mode by designing the bonder terminal of arranging in batches that step c etches jointly is: mark off the identical copper coin unit of some areas on described copper coin, be placed with some bonder terminals of equal number and layout in each copper coin unit; Also be provided with step e after the described steps d:
E. cut: the copper coin unit that cuts out each electroplating surfaces with tin by design.
3. the manufacture method of flat bonder terminal according to claim 1 and 2, it is characterized in that: the tin plating technique in the described steps d is an electrotinning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102633629A CN102097734A (en) | 2009-12-14 | 2009-12-14 | Method for manufacturing flat connector terminals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102633629A CN102097734A (en) | 2009-12-14 | 2009-12-14 | Method for manufacturing flat connector terminals |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102097734A true CN102097734A (en) | 2011-06-15 |
Family
ID=44130659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102633629A Pending CN102097734A (en) | 2009-12-14 | 2009-12-14 | Method for manufacturing flat connector terminals |
Country Status (1)
| Country | Link |
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| CN (1) | CN102097734A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106207583A (en) * | 2014-12-02 | 2016-12-07 | 现代自动车株式会社 | Negative connector and the method being used for manufacturing this negative connector |
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| JPH04133453A (en) * | 1990-09-26 | 1992-05-07 | Nec Corp | Lead frame for semiconductor device use |
| JPH07176678A (en) * | 1993-12-20 | 1995-07-14 | Sony Corp | Lead frame for semiconductor device |
| US5977615A (en) * | 1996-12-24 | 1999-11-02 | Matsushita Electronics Corporation | Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device |
| US6177718B1 (en) * | 1998-04-28 | 2001-01-23 | Kabushiki Kaisha Toshiba | Resin-sealed semiconductor device |
| US6208020B1 (en) * | 1999-02-24 | 2001-03-27 | Matsushita Electronics Corporation | Leadframe for use in manufacturing a resin-molded semiconductor device |
| JP2001189410A (en) * | 1999-12-27 | 2001-07-10 | Hitachi Ltd | Semiconductor device and manufacturing method therefor |
| US20020121670A1 (en) * | 2001-03-01 | 2002-09-05 | Matsushita Electric Industrial Co., Ltd. | Lead frame |
| US20030001244A1 (en) * | 2001-06-27 | 2003-01-02 | Matsushita Electric Industrial Co., Ltd. | Lead frame, resin-sealed semiconductor device, and method for fabricating the same |
| US20030015775A1 (en) * | 2001-07-23 | 2003-01-23 | Matsushita Electric Industrial Co., Ltd. | Resin-encapsulation semiconductor device and method for fabricating the same |
| CN1512574A (en) * | 2002-12-26 | 2004-07-14 | ��ʽ���������Ƽ� | Semiconductor device and its producing method |
| CN101147295A (en) * | 2005-03-25 | 2008-03-19 | 东丽株式会社 | Planar antenna and method for manufacturing same |
| CN101308830A (en) * | 2007-05-18 | 2008-11-19 | 飞思卡尔半导体（中国）有限公司 | Lead frame for semiconductor encapsulation |
-
2009
- 2009-12-14 CN CN2009102633629A patent/CN102097734A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04133453A (en) * | 1990-09-26 | 1992-05-07 | Nec Corp | Lead frame for semiconductor device use |
| JPH07176678A (en) * | 1993-12-20 | 1995-07-14 | Sony Corp | Lead frame for semiconductor device |
| US5977615A (en) * | 1996-12-24 | 1999-11-02 | Matsushita Electronics Corporation | Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device |
| US6177718B1 (en) * | 1998-04-28 | 2001-01-23 | Kabushiki Kaisha Toshiba | Resin-sealed semiconductor device |
| US6208020B1 (en) * | 1999-02-24 | 2001-03-27 | Matsushita Electronics Corporation | Leadframe for use in manufacturing a resin-molded semiconductor device |
| JP2001189410A (en) * | 1999-12-27 | 2001-07-10 | Hitachi Ltd | Semiconductor device and manufacturing method therefor |
| US20020121670A1 (en) * | 2001-03-01 | 2002-09-05 | Matsushita Electric Industrial Co., Ltd. | Lead frame |
| US20030001244A1 (en) * | 2001-06-27 | 2003-01-02 | Matsushita Electric Industrial Co., Ltd. | Lead frame, resin-sealed semiconductor device, and method for fabricating the same |
| US20030015775A1 (en) * | 2001-07-23 | 2003-01-23 | Matsushita Electric Industrial Co., Ltd. | Resin-encapsulation semiconductor device and method for fabricating the same |
| CN1512574A (en) * | 2002-12-26 | 2004-07-14 | ��ʽ���������Ƽ� | Semiconductor device and its producing method |
| CN101147295A (en) * | 2005-03-25 | 2008-03-19 | 东丽株式会社 | Planar antenna and method for manufacturing same |
| CN101308830A (en) * | 2007-05-18 | 2008-11-19 | 飞思卡尔半导体（中国）有限公司 | Lead frame for semiconductor encapsulation |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106207583A (en) * | 2014-12-02 | 2016-12-07 | 现代自动车株式会社 | Negative connector and the method being used for manufacturing this negative connector |
| CN106207583B (en) * | 2014-12-02 | 2019-08-09 | 现代自动车株式会社 | Negative connector and method for manufacturing the negative connector |
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Application publication date: 20110615 |