CN102095599A - Manipulator surface metal contamination detection method - Google Patents
Manipulator surface metal contamination detection method Download PDFInfo
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- CN102095599A CN102095599A CN2010105046249A CN201010504624A CN102095599A CN 102095599 A CN102095599 A CN 102095599A CN 2010105046249 A CN2010105046249 A CN 2010105046249A CN 201010504624 A CN201010504624 A CN 201010504624A CN 102095599 A CN102095599 A CN 102095599A
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- mechanical arm
- surface metal
- arm surface
- detection method
- metal contamination
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Abstract
The invention relates to a manipulator surface metal contamination detection method which comprises the steps: manufacturing a manipulator surface metal component sampling device; preparing and washing a volumetric flash; boiling and dipping a cleaning solvent; wiping the surface of the manipulator surface; extracting the metal components on the manipulator surface; and the detecting the manipulator surface metal contamination, wherein a sampling device comprises a holding section, and a square-head sampling section fixed on one end of the holding section; and the sampling section is made of dust-free cloth. By adopting the sampling device with the dust-free cloth sampling section for extracting the metal components on the manipulator surface, and adopting an inductively coupled plasma mass spectrometer for detecting the surface metal contamination, the method can reduce the waste of wafers so as to reduce the manufacture cost. Meanwhile, the method is convenient and simple in operation, and can improve the production efficiency.
Description
Technical field
The present invention relates to the detection method in the semi-conductor chip manufacture process, relate in particular to a kind of mechanical arm surface metal contamination detection method.
Background technology
In semiconductor fabrication processes, the making of wafer (wafer) must be passed through a plurality of programs, and wafer need transmit between each process procedure, and the transmission of wafer all is to be finished by mechanical arm usually.Thereby these transmit all there is pollution in operation to the one or more wafers in the batch-wafer potential collision hazard.Simultaneously, the complexity of semiconductor crystal circle structure is higher, and the size of semiconductor crystal circle structure is littler, and its requirement to the manufacturing environment cleanliness factor is just higher.
In order to reduce the pollution of crystal column surface, before carrying out wafer transmission operation, need that all metal contamination level is carried out on the mechanical arm surface that is used for the wafer transmission and detect.Common way is: at first, utilize the wafer front surface after polishing fully to contact with described mechanical arm.Then, the wafer with enrichment mechanical arm surface composition carries out the metal contamination level detection by inductively coupled plasma mass spectrometry instrument (ICP-MS).
But after carrying out the metal contamination level detection through the inductively coupled plasma mass spectrometry instrument, this wafer upper surface will be scratched, and seriously influence the performance and the cost yield of wafer, even increase manufacturing cost, the waste wafer.On the other hand, if do not carry out the pollution detection of mechanical arm surface metal, then the mechanical arm surface contamination inevitably causes wafer contamination, damages the reliability of device potentially.
At the problem that prior art exists, this case designer relies on the industry experience for many years of being engaged in, and the active research improvement is so there has been mechanical arm surface metal contamination detection method of the present invention.
Summary of the invention
The present invention be directed in the prior art, when the mechanical arm surface being carried out the metallic pollution detection, need to utilize the wafer after polishing to go to contact the mechanical arm surface, cause the wafer generation to scratch and waste, and operation inconvenience, defectives such as inefficiency provide a kind of mechanical arm surface metal contamination detection method.
In order to address the above problem, the invention provides a kind of mechanical arm surface metal contamination detection method, described method comprises: the preparation of mechanical arm surface metal composition sampler; The preparation of volumetric flask and cleaning; Frying in shallow oil of cleaning solvent dipped in; Mechanical arm surface wiping; The extraction of mechanical arm surface metal composition; The pollution detection of mechanical arm surface metal.Wherein, described sampler comprises grip part and the sampling portion that is fixed on grip part one end.An end that differs from the grip part of described sampling portion is the square toes structure.Described sampling portion is prepared by non-dust cloth.Described metal ingredient includes but not limited to alkaline metal and earth alkali metal.
Optionally, described cleaning solvent is a ultrapure water.
Optionally, to fry in shallow oil the time of dipping in be 2～5 minutes for described cleaning solvent.
Optionally, described wiping is to move to the upper end from the mechanical arm lower end.
Optionally, described mobile distance is 6cm.
In sum, the sampler that the sampling portion that the present invention is prepared by non-dust cloth by employing is constituted carries out the sampling of mechanical arm surface metal composition, and carry out the surface metal pollution detection by the inductively coupled plasma mass spectrometry instrument, and not only reduced the waste of wafer, saved manufacturing cost.Simultaneously, mechanical arm surface metal contamination detection method of the present invention is convenient and simple for operation, has improved production efficiency.
Description of drawings
Fig. 1 is the sampler of mechanical arm surface metal composition of the present invention;
Fig. 2 is the process flow diagram of mechanical arm surface metal contamination detection method of the present invention.
Embodiment
By the technology contents, the structural attitude that describe the invention in detail, reached purpose and effect, described in detail below in conjunction with embodiment and conjunction with figs..
See also Fig. 1, Fig. 1 is the structural representation of the sampler 1 of mechanical arm surface metal composition.Described sampler 1 comprises grip part 11 and is fixed on the sampling portion 12 of grip part 11 1 ends.An end that differs from grip part 11 of described sampling portion 12 is the square toes structure with certain width.In the present embodiment, described sampling portion 12 adopts the non-dust cloths preparation.
See also Fig. 2, Figure 2 shows that the process flow diagram that utilizes sampler 1 to carry out the metal ingredient sampling on the mechanical arm surface.
Execution in step S21: the preparation of mechanical arm surface metal composition sampler.Described sampler 1 comprises grip part 11 and is fixed on the sampling portion 12 of grip part 11 1 ends.An end that differs from grip part 11 of described sampling portion 12 is the square toes structure with certain width.In the present embodiment, described sampling portion 12 adopts the non-dust cloths preparation.
Execution in step S22: the preparation of volumetric flask and cleaning.Described volumetric flask comprises first volumetric flask that is used for the splendid attire cleaning solvent and is used for second volumetric flask of the sampler 1 of splendid attire enrichment mechanical arm surface metal composition.Described cleaning solvent is a ultrapure water.Before extracting mechanical arm surface metal ingredient, at first clean described first volumetric flask and second volumetric flask outside with isopropyl alcohol, and with difference splendid attire ultrapure water in described first volumetric flask and second volumetric flask.
Execution in step S23: frying in shallow oil of cleaning solvent dipped in.First volumetric flask of splendid attire ultrapure waters is immersed in the sampling portion 12 of sampler 1, and soak time is 2～5 minutes, so that sampling portion 12 fully absorbs ultrapure waters, until saturated.Simultaneously, utilize the inwall of first volumetric flask to separate oversaturated ultrapure water.
Execution in step S24: mechanical arm surface wiping.Utilize sampler 1, a side of the sampling portion 12 of described sampler 1 is contacted with the lower end part on mechanical arm surface through step S22 operation, and mild mobile from lower to upper preset distance, carry out surperficial wiping.In the present embodiment, the distance that moves from lower to upper is 6 centimetres.At this moment, the wiping area S on mechanical arm surface just can learn.
Execution in step S25: the extraction of mechanical arm surface metal composition.Step S23 is finished, then the metallic element on the sampling portion 12 enrichment mechanical arm surfaces of sampler 1.And the sampler 1 of enrichment mechanical arm surface metal composition inserted second volumetric flask, and encapsulation is preserved.
Execution in step S26: mechanical arm surface metal pollution detection.Second volumetric flask with mechanical arm surface metal composition that encapsulation is preserved is inspected by ready samples, and carry out the surface metal pollution detection by the inductively coupled plasma mass spectrometry instrument.Described metallic pollution includes but not limited to alkaline metal and earth alkali metal.Described inductively coupled plasma mass spectrometry instrument detects and adopts this area gimmick commonly used.Described metal contamination level is weighed with the ratio of atom number and wiping area S.
In sum, the sampler 1 that the sampling portion 12 that the present invention is prepared by non-dust cloth by employing is constituted carries out the sampling of mechanical arm surface metal composition, and carry out the surface metal pollution detection by the inductively coupled plasma mass spectrometry instrument, and not only reduced the waste of wafer, saved manufacturing cost.Simultaneously, mechanical arm surface metal contamination detection method of the present invention is convenient and simple for operation, has improved production efficiency.
Those skilled in the art all should be appreciated that, under the situation that does not break away from the spirit or scope of the present invention, can carry out various modifications and variations to the present invention.Thereby, if when any modification or modification fall in the protection domain of appended claims and equivalent, think that the present invention contains these modifications and modification.
Claims (9)
1. mechanical arm surface metal contamination detection method, it is characterized in that: described method comprises:
The preparation of mechanical arm surface metal composition sampler;
The preparation of volumetric flask and cleaning;
Frying in shallow oil of cleaning solvent dipped in;
Mechanical arm surface wiping;
The extraction of mechanical arm surface metal composition;
The pollution detection of mechanical arm surface metal.
2. mechanical arm surface metal contamination detection method as claimed in claim 1 is characterized in that: described sampler comprises the grip part and is fixed on the sampling portion of grip part one end.
3. mechanical arm surface metal contamination detection method as claimed in claim 2 is characterized in that: an end that differs from the grip part of described sampling portion is the square toes structure.
4. mechanical arm surface metal contamination detection method as claimed in claim 2 is characterized in that: described sampling portion is prepared by non-dust cloth.
5. mechanical arm surface metal contamination detection method as claimed in claim 1 is characterized in that: described cleaning solvent is a ultrapure water.
6. mechanical arm surface metal contamination detection method as claimed in claim 1 is characterized in that: it is 2～5 minutes that described cleaning solvent is fried in shallow oil the time of dipping in.
7. mechanical arm surface metal contamination detection method as claimed in claim 1 is characterized in that: described wiping is to move to the upper end from the mechanical arm lower end.
8. mechanical arm surface metal contamination detection method as claimed in claim 7 is characterized in that: described mobile distance is 6cm.
9. mechanical arm surface metal contamination detection method as claimed in claim 7, it is characterized in that: described metal ingredient includes but not limited to alkaline metal and earth alkali metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105046249A CN102095599A (en) | 2010-10-12 | 2010-10-12 | Manipulator surface metal contamination detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105046249A CN102095599A (en) | 2010-10-12 | 2010-10-12 | Manipulator surface metal contamination detection method |
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| CN102095599A true CN102095599A (en) | 2011-06-15 |
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| CN2010105046249A Pending CN102095599A (en) | 2010-10-12 | 2010-10-12 | Manipulator surface metal contamination detection method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103165407A (en) * | 2011-12-14 | 2013-06-19 | 有研半导体材料股份有限公司 | Technology and device for surface treatment and corrosion of silicon slice surface sample preparation |
| CN104820010A (en) * | 2015-04-10 | 2015-08-05 | 中国环境科学研究院 | Rapid qualitative and quantitative analytical detection method of contaminants on children's hands |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59125086A (en) * | 1982-12-29 | 1984-07-19 | Chubu Electric Power Co Inc | Numerically evaluating method of wiping efficiency |
| USH901H (en) * | 1989-09-13 | 1991-03-05 | The United States Of America As Represented By The Secretary Of The Army | Method of identifying the composition of a material sample |
| JPH0915170A (en) * | 1995-06-29 | 1997-01-17 | Hitachi Cable Ltd | Measuring method of quantity of sticking powderlike material |
| US20020035869A1 (en) * | 2000-09-26 | 2002-03-28 | General Electric Company | Surface cleanliness measurement procedure |
| JP2008286770A (en) * | 2007-05-18 | 2008-11-27 | Cell 12:Kk | Bacteria wipe inspection device, and high-accuracy inspection and detecting method for bacteria or the like, improved in detection accuracy and preventing cross contamination |
-
2010
- 2010-10-12 CN CN2010105046249A patent/CN102095599A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59125086A (en) * | 1982-12-29 | 1984-07-19 | Chubu Electric Power Co Inc | Numerically evaluating method of wiping efficiency |
| USH901H (en) * | 1989-09-13 | 1991-03-05 | The United States Of America As Represented By The Secretary Of The Army | Method of identifying the composition of a material sample |
| JPH0915170A (en) * | 1995-06-29 | 1997-01-17 | Hitachi Cable Ltd | Measuring method of quantity of sticking powderlike material |
| US20020035869A1 (en) * | 2000-09-26 | 2002-03-28 | General Electric Company | Surface cleanliness measurement procedure |
| JP2008286770A (en) * | 2007-05-18 | 2008-11-27 | Cell 12:Kk | Bacteria wipe inspection device, and high-accuracy inspection and detecting method for bacteria or the like, improved in detection accuracy and preventing cross contamination |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103165407A (en) * | 2011-12-14 | 2013-06-19 | 有研半导体材料股份有限公司 | Technology and device for surface treatment and corrosion of silicon slice surface sample preparation |
| CN103165407B (en) * | 2011-12-14 | 2016-04-06 | 有研半导体材料有限公司 | A kind of for the surface treatment of silicon slice surface sample preparation and the technique of corrosion and device |
| CN104820010A (en) * | 2015-04-10 | 2015-08-05 | 中国环境科学研究院 | Rapid qualitative and quantitative analytical detection method of contaminants on children's hands |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140516 |
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Effective date of registration: 20140516 Address after: 201203 Shanghai Zhangjiang hi tech park Zuchongzhi Road No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Zhangjiang hi tech Park No. 818 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
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Application publication date: 20110615 |