CN102095381A - Method for measuring thickness of rigid transparent material with laser - Google Patents
Method for measuring thickness of rigid transparent material with laser Download PDFInfo
- Publication number
- CN102095381A CN102095381A CN 201010577880 CN201010577880A CN102095381A CN 102095381 A CN102095381 A CN 102095381A CN 201010577880 CN201010577880 CN 201010577880 CN 201010577880 A CN201010577880 A CN 201010577880A CN 102095381 A CN102095381 A CN 102095381A
- Authority
- CN
- China
- Prior art keywords
- thickness
- measured
- laser
- ccd sensor
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention provides a method for measuring the thickness of a rigid transparent material with laser. The method comprises the following steps of: 1) adjusting the position of a laser source and a vertical distance from the laser source to a roll gang, and adjusting the horizontal and the vertical distances between the laser source and a sensor so that light spots can be generated on the sensor after the laser illuminates a material to be measured; 2) when the material to be measured passes through a measuring system, detecting that the material to be measured is in a thickness measurement state, by the sensor; 3) after the laser source emits laser beams to illuminate the material to be measured, forming ribbon-shape light spots on the sensor after optical conduction, collecting a light spot image by an image acquisition card, and transmitting the image to a processor for image analysis; and 4) analyzing the light spot image on the sensor by the processor to obtain the width A of the light spots, and calculating the thickness of the measured material according to the following calculation formula in the specification. In the invention, the thickness of the measured material can be measured accurately without stopping of the production process, the measured material can not be damaged due to adoption of a contactless measurement method, and the quality of the product and the production efficiency are improved.
Description
Technical field
The present invention relates to a kind of measuring method of transparent plate material thickness, relate in particular to a kind of method of in transparent plate material moving process, carrying out thickness measure.
Background technology
In transparent plate manufacture of materials and deep-processing process, need accurately to measure the thickness of material.Domestic most of production firms still adopt traditional contact type measurement device to measure this type of material thickness at present, this measuring method sampling difficulty, and precision is not high, the labor intensive material resources, and have serious the hysteresis aspect the grasp material thickness variation situation.It is untouchable that the optical measuring method biggest advantage is that it has, and speed is fast, and sustainable the measurement can be applicable to the abominable measurement place of some environment.At present, when optical measuring method is used for the thickness on-line measurement, to catch material at stop production line or employing supplementary structure usually, make material rest in assigned address, influence production efficiency greatly with measuring.
Summary of the invention
Measure the deficiency of aspect in process of production at above-mentioned transparent plate material, the invention provides a kind of thickness measurement with laser method towards the rigidity transparent material, this thickness measuring method need not to stop the thickness that production process just can accurately be measured the transparent plate material, has improved production efficiency.
The present invention by a kind of measuring system based on optical reflection, refraction principle and CCD imaging technique, can carry out continuous non-contact measurement to the transparent plate material thickness in the moving process, described measuring system mainly comprises LASER Light Source, ccd sensor, image pick-up card and a processor.
Technical scheme of the present invention is: a kind of thickness measurement with laser method towards the rigidity transparent material may further comprise the steps:
1) above the materials conveyance roller-way, installs and measures system, this system comprises LASER Light Source, ccd sensor, image pick-up card that is connected with ccd sensor and signal processor, the position of adjusting LASER Light Source makes the laser beam emergence angle from the horizontal by miter angle, adjust the vertical range of LASER Light Source and rollgang, adjust level and vertical range between LASER Light Source and the ccd sensor, to guarantee that laser beam irradiation can produce hot spot behind measured material on ccd sensor;
2) mobile on rollgang when measured material, can be detected by ccd sensor during through measuring system, at this moment, the thickness measurement with laser system carries out parameter initialization, enters the thickness measuring state;
3) LASER Light Source gives off laser beam and shines on the measured material, forms banded hot spot after the optics conduction on ccd sensor, and image pick-up card collects light spot image, sends processor to and carries out graphical analysis;
4) treated device is analyzed the light spot image on the ccd sensor, gets the width A of glossing up, can calculate measured material thickness according to following measurement THICKNESS CALCULATION formula:
Wherein T is the measured material one-tenth-value thickness 1/10, and K is the measured material refractive index;
5) measure finish after, close lasing light emitter, wait for that next block of material passes through, repeat the process of (2)-(4).
Further improvement of these options is: described LASER Light Source is two, divide and be arranged, above-mentioned 1) in adjust two LASER Light Source the position on same horizontal line, make two hot spots that can on ccd sensor, produce behind the two bundle laser beam irradiation measured materials, and hot spot is not overlapping; Above-mentioned 4) in processor analyze light spot image on the ccd sensor, draw the width A ' and the A ' ' of two hot spots respectively, can calculate measured material thickness according to following measurement THICKNESS CALCULATION formula:
Wherein T is measured material 6 one-tenth-value thickness 1/10s, and K is measured material 6 refractive indexes.
The present invention need not to stop the thickness that production process just can accurately be measured the transparent plate material, and adopts contactless measurement, does not damage measured material, has improved the quality and the production efficiency of product.
Description of drawings
Fig. 1 is ultimate principle figure of the present invention;
Optical path analysis figure when Fig. 2 tilts for measured material of the present invention;
The optical path analysis figure of Fig. 3 during for measured material left bank of the present invention;
The general system diagram of Fig. 4 thickness measurement with laser method of the present invention.
Embodiment
The present invention is described further below in conjunction with the drawings and specific embodiments.
As shown in Figure 1, after LASER Light Source 1 stationkeeping, the incident angle of laser beam
Be definite value, the material refraction angle
Different according to material composition difference, but same material
Be certain value.If the refractive index of measured material 6 is K, material thickness is T, and horizontal range is A between two parallel ray beams of the upper and lower surface reflection of material, refraction.For ease of calculating, the laser incident angle is adjusted into
Then the computing method of material thickness T are as follows at this moment:
Wherein:
Can see that from equation (1) material thickness T is directly proportional with parallel rays level interval A.If measure the value of A, just can calculate the value of T.When measuring A, the present invention has adopted ccd sensor 2.Processor obtains the A value by the light spot image of analyzing forming on the ccd sensor 2.
Above-mentioned measuring method is to calculate with the situation of measured material 6 horizontal positioned, often has following problem in the practical operation: the first, and on tinuous production, the materials conveyance platform is difficult to keep abswolute level; The second, the material moving process inevitably causes the material vibrations, departs from horizontal level.So measured material 6 thickness and the actual value calculated with above-mentioned Perfected process can produce certain deviation, and deviation is at random in this, can't be by the formula correction, but can compensate by following analysis.
Optical path analysis figure when measured material 6 left sides are higher than the right side is shown in accompanying drawing (2).Have by the triangle relation on the figure,
,
, because
So,
, promptly become big, then the refraction angle in incident angle in such cases
So,
,
, T is constant,
Increase, then A ' '〉A, again since material surface turn over certain angle no longer with ccd sensor 2 camera lens keeping parallelisms, the A ' ' that reads by ccd sensor 2 images A.Automatic checkout system can not perceive this and change, and the value of the A of substitution is bigger than actual value,
Value is pre-set, and it is littler than actual value, and therefore, it is bigger than reality to detect the material thickness T value that draws automatically.
Optical path analysis figure when measured material 6 right sides are higher than the left side is shown in accompanying drawing (3).Have by the triangle relation on the figure,
,
, because
So,
So,
,
,
Constant, A ' '＜A then.When detecting automatically, the value of the A of system's substitution is littler than actual value,
Value is bigger than reality, and therefore, the T value that calculates is than actual little.
By the analysis of above two kinds of situations, the present invention has designed a kind of method that adopts the double light path thickness measuring, can effectively remedy this random deviation.System architecture is shown in figure accompanying drawing 4.Two LASER Light Source 1 of symmetric position give off laser beam simultaneously, shine on the measured material 6.Two bundle laser form two ribbon hot spots on ccd sensor 2 after reflection, refraction.Image pick-up card collects light spot image, sends processor to and carries out graphical analysis.Processor is analyzed the light spot image on the ccd sensor 2, draws the width A ' and the A ' ' of two hot spots respectively, the A=(A ' that averages+A ' ')/2.Can calculate material thickness according to the THICKNESS CALCULATION formula under the measured material 6 horizontal positioned situations.Concrete computation process is as follows:
Wherein T is the material thickness value, and K is the material refractive index.
Be described in further detail implementation process of the present invention below:
(1) directly over materials conveyance roller-way 5, install and measure system, 1, one ccd sensor 2 of two LASER Light Source about comprising, ccd sensor 2 connects image pick-up card and signal processor.The position of adjusting two LASER Light Source 1 is on same horizontal line, and make the laser beam emergence angle from the horizontal by miter angle, adjust the vertical range of LASER Light Source 1 and rollgang 5, adjust level and vertical range between LASER Light Source 1 and the ccd sensor 2, guarantee that two restraint two hot spots that can produce behind the laser radiation measured materials 6 on ccd sensor 2, and hot spot is not overlapping.
(2) during online detection, measured material 6 moves on rollgang 5, and when material can be detected by ccd sensor 2 during through the thickness surveyed area, at this moment, the thickness measurement with laser device carries out parameter initialization, enters the thickness measuring state.
(3) two LASER Light Source 1 give off laser beam simultaneously, shine on the measured material 6; According to principle shown in Figure 4, two bundle laser form two ribbon hot spots on ccd sensor 2 after the optics conduction, and image pick-up card collects light spot image, sends processor to and carries out graphical analysis.
(4) processor is analyzed the light spot image on the ccd sensor 2, draw the width A ' and the A ' ' of two hot spots respectively, A=(A '+A ' ' averages)/2, can calculate material thickness according to the THICKNESS CALCULATION formula under the measured material 6 horizontal positioned situations, concrete computation process is as follows:
Wherein T is measured material 6 one-tenth-value thickness 1/10s, and K is measured material 6 refractive indexes.
(5) after one-shot measurement finishes, close two lasing light emitters, wait for that next block of material passes through, repeat (2)-(4) process.
The present invention adopts contactless measurement, does not damage measured material and can measure its thickness accurately, in measuring process, material need not stop, and has improved efficiency of measurement, adopts the double light path compensation principle, measuring error when reducing the material inclined position greatly, measuring accuracy can reach ± 0.01mm.
Claims (2)
1. thickness measurement with laser method towards the rigidity transparent material is characterized in that may further comprise the steps:
1) installation comprises LASER Light Source (1) above the materials conveyance roller-way, ccd sensor (2), the image pick-up card that is connected with ccd sensor (2) and the measuring system of signal processor, the position of adjusting LASER Light Source (1) makes the laser beam emergence angle from the horizontal by miter angle, adjust the vertical range of LASER Light Source (1) and rollgang (5), adjust level and vertical range between LASER Light Source (1) and the ccd sensor (2), behind measured material (6), can go up the generation hot spot at ccd sensor (2) to guarantee laser beam irradiation;
2) upward mobile when measured material at rollgang (5), detected by ccd sensor (2) during through measuring system, at this moment, the thickness measurement with laser system carries out parameter initialization, enters the thickness measuring state;
3) LASER Light Source (1) gives off laser beam and shines on the measured material (6), goes up the banded hot spot of formation at ccd sensor (2) after the optics conduction, and image pick-up card collects light spot image, sends processor to and carries out graphical analysis;
4) treated device is analyzed the light spot image on the ccd sensor (2), gets the width A of glossing up, calculates measured material thickness according to following measurement THICKNESS CALCULATION formula:
Wherein T is the measured material one-tenth-value thickness 1/10, and K is the measured material refractive index;
5) measure finish after, close lasing light emitter, wait for that next block of material passes through, repeat the process of (2)-(4).
2. according to the described thickness measurement with laser method of claim 1 towards the rigidity transparent material, it is characterized in that described LASER Light Source (1) is two, divide and be arranged, above-mentioned 1) in adjust the position of two LASER Light Source (1) on same horizontal line, can go up two hot spots of generation at ccd sensor (2) after making two bundle laser beam irradiation measured materials (6), and hot spot is not overlapping; Above-mentioned 4) in processor analyze light spot image on the ccd sensor (2), draw the width A ' and the A ' ' of two hot spots respectively, calculate measured material thickness according to following measurement THICKNESS CALCULATION formula:
Wherein T is measured material 6 one-tenth-value thickness 1/10s, and K is measured material 6 refractive indexes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010577880 CN102095381A (en) | 2010-12-08 | 2010-12-08 | Method for measuring thickness of rigid transparent material with laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010577880 CN102095381A (en) | 2010-12-08 | 2010-12-08 | Method for measuring thickness of rigid transparent material with laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102095381A true CN102095381A (en) | 2011-06-15 |
Family
ID=44128570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010577880 Pending CN102095381A (en) | 2010-12-08 | 2010-12-08 | Method for measuring thickness of rigid transparent material with laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102095381A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103486974A (en) * | 2013-09-23 | 2014-01-01 | 中国科学院微电子研究所 | Spectrum elliptic polarization measuring device and method |
| CN103727887A (en) * | 2013-12-16 | 2014-04-16 | 大连理工大学 | Incoherent imaging glass thickness measuring method |
| CN105606034A (en) * | 2015-10-16 | 2016-05-25 | 北京奥博泰科技有限公司 | Glass thickness detection apparatus and glass thickness detection method |
| CN107026098A (en) * | 2016-01-29 | 2017-08-08 | 台湾积体电路制造股份有限公司 | Metering system and the measuring method using metering system |
| CN109827511A (en) * | 2018-12-12 | 2019-05-31 | 常州工学院 | Thickness measurement with laser is to penetrating hot spot automatic detection device and method |
| CN113405478A (en) * | 2021-06-01 | 2021-09-17 | 西安工业大学 | Transparent material thickness measuring method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5870200A (en) * | 1997-08-29 | 1999-02-09 | Becton Dickinson And Company | Apparatus for determining the thickness of an optical sample |
| JP2002005631A (en) * | 2000-06-16 | 2002-01-09 | Sumitomo Metal Ind Ltd | Method and apparatus for measuring characteristics of plate |
| CN101603817A (en) * | 2009-07-15 | 2009-12-16 | 中国科学院上海光学精密机械研究所 | The checkout equipment of thickness of glass and detection method |
| CN101620362A (en) * | 2009-06-08 | 2010-01-06 | 浙江大学 | Pore microscopic imaging device |
| CN101726253A (en) * | 2008-10-31 | 2010-06-09 | 徐熙平 | Photoelectric detection system for wall thickness of quartz tube |
-
2010
- 2010-12-08 CN CN 201010577880 patent/CN102095381A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5870200A (en) * | 1997-08-29 | 1999-02-09 | Becton Dickinson And Company | Apparatus for determining the thickness of an optical sample |
| JP2002005631A (en) * | 2000-06-16 | 2002-01-09 | Sumitomo Metal Ind Ltd | Method and apparatus for measuring characteristics of plate |
| CN101726253A (en) * | 2008-10-31 | 2010-06-09 | 徐熙平 | Photoelectric detection system for wall thickness of quartz tube |
| CN101620362A (en) * | 2009-06-08 | 2010-01-06 | 浙江大学 | Pore microscopic imaging device |
| CN101603817A (en) * | 2009-07-15 | 2009-12-16 | 中国科学院上海光学精密机械研究所 | The checkout equipment of thickness of glass and detection method |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103486974A (en) * | 2013-09-23 | 2014-01-01 | 中国科学院微电子研究所 | Spectrum elliptic polarization measuring device and method |
| CN103486974B (en) * | 2013-09-23 | 2016-04-13 | 中国科学院微电子研究所 | A kind of Spectroscopic Ellipsometry measurement mechanism and method |
| CN103727887A (en) * | 2013-12-16 | 2014-04-16 | 大连理工大学 | Incoherent imaging glass thickness measuring method |
| CN103727887B (en) * | 2013-12-16 | 2016-07-06 | 大连理工大学 | Incoherent imaging glass thickness measuring method |
| CN105606034A (en) * | 2015-10-16 | 2016-05-25 | 北京奥博泰科技有限公司 | Glass thickness detection apparatus and glass thickness detection method |
| CN107026098A (en) * | 2016-01-29 | 2017-08-08 | 台湾积体电路制造股份有限公司 | Metering system and the measuring method using metering system |
| CN107026098B (en) * | 2016-01-29 | 2019-09-24 | 台湾积体电路制造股份有限公司 | Metering system and the measurement method for using metering system |
| CN109827511A (en) * | 2018-12-12 | 2019-05-31 | 常州工学院 | Thickness measurement with laser is to penetrating hot spot automatic detection device and method |
| CN113405478A (en) * | 2021-06-01 | 2021-09-17 | 西安工业大学 | Transparent material thickness measuring method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102095381A (en) | Method for measuring thickness of rigid transparent material with laser | |
| JP3197529B2 (en) | Non-contact measurement method of wheel alignment characteristics and its measurement device | |
| US7570372B2 (en) | Optical device for measuring the thickness of an at least partially transparent medium | |
| CN101576376B (en) | Method and system for laser detection of shape of charge level | |
| US5714763A (en) | Method and apparatus for optical alignment of a measuring head in an X-Y plane | |
| TWI426227B (en) | Measuring method for topography of moving specimen and a measuring apparatus thereof | |
| CN101363725B (en) | Detection device for roughness of surface | |
| CN101373134B (en) | Method for measuring thickness of wire-shaped narrowband filtering PSD thermal radiation plate | |
| CN106767452A (en) | A kind of wood-based product's width detecting and its detection method | |
| CA2766843A1 (en) | Method and apparatus for the contactless determination of the thickness of a web of material, including correction of the alignment error | |
| CN105783746A (en) | Wooden product thickness detection system and detection method thereof | |
| CN110736721B (en) | Glass plate refractive index uniformity detection device and detection method based on diffraction grating | |
| CN102072710A (en) | Optical angle measuring device and angle measuring method | |
| US10317198B2 (en) | Three-dimensional mapping of a wafer | |
| BE1014355A3 (en) | METHOD AND DEVICE FOR MEASURING DISTANCES ON SHINY METAL STRIPS. | |
| CN102445854A (en) | Workpiece stage vertical position measuring system | |
| JP4864734B2 (en) | Optical displacement sensor and displacement measuring apparatus using the same | |
| CN103727887A (en) | Incoherent imaging glass thickness measuring method | |
| CN201322610Y (en) | Device for testing roughness of surface | |
| KR20140012250A (en) | Apparatus and method for measuring the defect of glass substrate | |
| CN201104222Y (en) | Laser measurement system for continuous casting billet bulging deformation | |
| KR101179952B1 (en) | 3-demensional measureing system using a noncontact type probe simultaneously | |
| CN108802056A (en) | Optical element phase-type defectoscopy device and detection method | |
| CN103983215B (en) | Improved device for measuring area of aperture diaphragm of monitoring system with effective area method | |
| CN102346384B (en) | Method for regulating optimum focal plane for silicon chip and exposure device thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20110615 |